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Dell PowerEdge R7415: технические характеристики и спецификации

System dimensions

Figure 1. Dimensions of the PowerEdgeR7415 system
This image shows dimensions of the systemPowerEdgeR7415
Table 1. Dimensions of the PowerEdgeR7415 systemThis table gives details of the dimensions of the PowerEdgeR7415 system
XaXbYZa (with bezel)Za (without bezel)Zb* Zc
482 mm (18.97 inches)434 mm (17.08 inches)86.8 mm (3.41 inches)35.84 mm (1.41 inches)22 mm (0.87 inches)647.07 mm (25.47 inches) 681.755 mm (26.84 inches)

* - Zb goes to the nominal rear wall external surface where the system board I/O connectors are located.

Chassis weight

Table 1. Chassis weightThe table below shows the maximum weight of the PowerEdge R7415.
SystemMaximum weight (with all drives/SSDs)
8 x 3.5 inch24.4 kg (53.79 lb)
12 x 3.5 inch26.61 kg (58.66 lb)
12 x 3.5 inch + 2 x 3.5 inch (rear)28.21 kg (62.19 lb)
24 x 2.5 inch23.22 kg (51.19 lb)

Processor specifications

The PowerEdge R7415 system support one AMD EPYC™ processor.
Table 1. Supported Processors for R7415The following table lists the AMD processors supported by the PowerEdge R7415.
Processor number TDP (W) Core count
AMD 7601 180 W 32
AMD 7551P 180 W 32
AMD 7451 180 W 24
AMD 7401P 155 W 24
AMD 7351P 155 W 16
AMD 7281 155 W 16
AMD 7251 120 W 8

Supported operating systems

The R7415 supports the following operating systems:

  • Microsoft Windows Server® with Hyper-V
  • Red Hat® Enterprise Linux
  • SUSE® Linux Enterprise Server

Virtualization options:

  • VMware® ESXi 6.7
NOTE:For more information about the specific versions and additions, go to Supported OS.

PSU specifications

The PowerEdge R7415 system supports the following AC or DC power supply units (PSU).
Table 1. PSU specificationsThe table below are the specifications for power supplies.
PSU Class Heat dissipation (maximum) Frequency Voltage
1600 W AC Platinum 6000 BTU/hr 50/60 Hz 100–240 V AC, autoranging
1100 W AC Platinum 4100 BTU/hr 50/60 Hz  100–240 V AC, autoranging
1100 W HVDC Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC autoranging and 200–380 V DC
1100 W DC Platinum 4416 BTU/hr N/A (-(48–60)) V DC
750 W AC Titanium 2843 BTU/hr 50/60 Hz  200–240 V AC, autoranging
750 W AC Platinum 2891 BTU/hr 50/60 Hz  100–240 V AC, autoranging
750 W Mixed Mode HVDC(for China only) Platinum 2891 BTU/hr N/A 100–240 V AC autoranging and 240 V DC
750 W Mixed Mode AC Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC
750 W Mixed Mode DC (for China only) Platinum 2891 BTU/hr N/A 240 V DC
495 W AC Platinum 1908 BTU/hr 50/60 Hz  100–240 V AC, autoranging
450 W AC Bronze 1871 BTU/hr 50/60 Hz  100–240 V AC, autoranging
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 230 V.
NOTE:If a system with 1600 W AC PSU operates at low line 100-120 V AC, then the power rating per PSU is derated to 800 W.
NOTE:If a system with 1100 W AC PSU or 1100 W mixed mode PSU operates at low line 100-120 V AC, then the power rating per PSU is derated to 1050 W.

System battery specifications

The PowerEdge R7415 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion bus specifications

The PowerEdge R7415 system supports PCI Express (PCIe) Gen3 expansion cards, which need to be installed on the system board using expansion card risers. This system supports low profile, full height, and 2U expansion card risers.
Table 1. Expansion card riser configurationsThis table provides information about the expansion card riser configuration for PowerEdge R7415 system.
Expansion card riser PCIe slots on the riser Processor connection Height Length Slot width
Riser-1B (2U riser) Slot 2 Processor 1 Full Height Full Length x16
Riser-1B (2U riser) Slot 3 Processor 1 Full Height Full Length x16
Riser-1A (low profile riser right) Slot 2 Processor 1 Low Profile Half Length x16
Riser-3A (low profile riser left) Slot 3 Processor 1 Low Profile Half Length x16
NOTE:The expansion-card slots are not hot-swappable.

Memory specifications

The PowerEdge R7415 system supports 16 DDR4 DIMM (registered DIMM (RDIMM) and load reduced DIMM (LRDIMM)) slots. Supported memory bus frequencies are 2666 MT/s, 2400 MT/s, 2133 MT/s, and 1866 MT/s.
Table 1. Memory specificationsThe table below shows the memory specifications.
Memory module sockets Memory capacity Minimum RAM Maximum RAM
Sixteen 288-pin
  • 8GB, 16GB, or 32GB single rank or dual rank (RDIMMs)
  • 64GB quad rank(LRDIMMs)
  • 8 GB with single processor
  • 1 TB with a single processor
NOTE:For optimal performance, populate one DIMM per channel with DDR4-2666 memory modules on the first slot of each memory channel. The first slot of each channel can be identified as the DIMM slots with white latches. For example, 64 GB system memory capacity can be divided into 8 x 8 GB DIMM slots.

Drives

The PowerEdge R7415 system supports:
  • Up to 8 x 3.5 inch (SAS, SATA or Nearline SAS) front accessible drives in slots 0 to 7

    or

  • Up to 12 x 3.5 inch (SAS, SATA or Nearline SAS) front accessible drives in slots 0 to 11

    or

  • Up to 12 x 3.5 inch (SAS, SATA or Nearline SAS) front accessible drives in slots 0 to 11 + up to 2 x 3.5 inch (SAS, SATA or Nearline SAS) rear accessible drives in slots 12 to 13

    or

  • Up to 24 x 2.5 inch (SAS, SATA or Nearline SAS) front accessible drives in slots 0 to 23

    or

  • Up to 12 x 2.5 inch (SAS, SATA or Nearline SAS) front accessible drives in slots 0 to 11 and up to 12 x 2.5 inch NVMe drives in 12 universal slots 12 to 23

    or

  • Up to 24 x 2.5 inch NVMe drives in bay 0 (slot 0 to 11) and bay 1 (slots 0 to 11)

    or

  • Up to 8 x 2.5 inch (SAS, SATA or Nearline SAS) front accessible drives in Universal slots 0 to 7 (Bay 0) and up to 16 x 2.5 inch NVMe drives in bay 0 (slots 8 to 11) and bay 1 (slots 0 to 11)
NOTE:Hot swap for the NVMe drives is supported for your system. For more information on correct usage and technical specifications, see the Dell PowerEdge Express Flash NVMe PCIe SSD 2.5 inch Small Form Factor User's Guide at Dell.com/support/manuals > All Products > Server, Storage, & Networking > Dell Adapters page.
NOTE:Universal slots that support SAS, SATA hard drives/SSDs, or NVMe drives in the same slot.

USB ports

The PowerEdge R7415 system supports:
  • USB 2.0-compliant port on the front panel
  • USB 3.0-compliant port on the back panel
  • USB 3.0-compliant internal port

The following table provides more information about the USB specifications:

Table 1. USB specificationsThe table below shows the USB specifications for the PowerEdge R7415 system.
Front panel Back panel Internal USB
Three USB 2.0-compliant port (One iDRAC Direct (Micro-AB USB) port + two USB 2.0 port)
NOTE:The Micro-AB USB 2.0-compliant port on the front panel can be used only as an iDRAC Direct or a management port.
Two USB 3.0-compliant port One internal USB 3.0 port

NIC ports

The PowerEdge R7415 system supports two Network Interface Controller (NIC) ports on the back panel, which have two 1 Gbps configuration.
NOTE:You can install up to four PCIe add-on NIC cards.
NOTE:For information about Linux network performance settings, see the Linux® Network Tuning Guide for AMD EPYC™ Processor Based Servers AMD tuning guide.

Serial connector

The serial connector connects a serial device to the system. The PowerEdge R7415 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge R7415 system supports two 15-pin VGA ports one each on the front and back panels.

Internal Dual SD Module

The PowerEdge R7415 system supports two optional flash memory card slots with an internal dual MicroSD module.
NOTE: One card slot is dedicated for redundancy.

Video specifications

The PowerEdge R7415 system supports Matrox G200eW3 graphics card with 16 MB capacity.
Table 1. Supported video resolution optionsThis table describes the supported video resolution options
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32
NOTE:1920 x 1080 and 1920 x 1200 resolutions are only supported in reduced blanking mode.

Environmental specifications

NOTE:For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on support.dell.com.
Table 1. Temperature specificationsThe table below shows the optimal working temperature specifications.
Temperature Specifications
Storage –40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Fresh air For information about fresh air, see the Expanded Operating Temperature section.
Maximum temperature gradient (operating and storage) 20°C/h (68°F/h)
Table 2. Relative humidity specificationsThe table below shows the relative humidity specification during operations and storage.
Relative humidity Specifications
Storage 5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating 10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.
Table 3. Maximum vibration specificationsThe table below shows the maximum vibration specifications during operations and storage.
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Table 4. Maximum shock specificationsThe table below shows the maximum shock specifications during operations and storage.
Maximum shock Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Table 5. Maximum altitude specificationsThe table below shows the maximum altitude specifications during operations and storage.
Maximum altitude Specifications
Operating

30482000 m (10,0006560 ft)

Storage 12,000 m (39,370 ft)
Table 6. Operating temperature derating specificationsThe table below shows the operating temperature derating specifications.
Operating temperature derating Specifications
Up to 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
35°C to 40°C (95°F to 104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
40°C to 45°C (104°F to 113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate <200 Å/month as defined by AHSRAE TC9.9.
NOTE:Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Standard operating temperature

Table 1. Standard operating temperature specificationsThe standard operating temperature for altitude less than 950 metres or 3117 feet ranges from 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Standard operating temperature Specifications
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.

Expanded operating temperature

Table 1. Expanded operating temperature specificationsWhen the system is in continuous operation, the expanded operating temperature ranges from 10°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 40°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft). When the system is operating at < 1% of annual operating hours, the expanded operating temperature is –5°C to 45°C at 5% to 90% RH with 29°C dew point.

NOTE: Outside the standard operating temperature (10°C to 40°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

Expanded operating temperature Specifications
Continuous operation 5°C to 40°C at 5% to 85% RH with 29°C dew point.
NOTE:Outside the standard operating temperature (10°C to 40°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C.

For temperatures between 35°C and 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).

≤ 1% of annual operating hours –5°C to 45°C at 5% to 90% RH with 29°C dew point.
NOTE:Outside the standard operating temperature (10°C to 40°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours.

For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE:When operating in the expanded temperature range, system performance may be impacted.
NOTE:When operating in the expanded temperature range, ambient temperature warnings may be reported on the bezel's LCD panel and in the System Event Log.

Expanded operating temperature restrictions

  • Do not perform a cold startup below 5°C.
  • The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
  • Redundant power supply configuration is required.
  • GPGPU card is not supported.
  • Rear drive configuration is not supported.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • 180 W CPU is not supported.
  • Cabled PSU is not supported.

Thermal restriction matrix

Table 1. Thermal restriction matrix for R7415This table describes the thermal restriction for R7415.
Storage configuration Front 8 x 3.5-inch drive 12 x 3.5-inch drive 12 x 3.5-inch drive 24 x 2.5-inch drive 24 x 2.5-inch drive with NVMe
Storage configuration Rear N/A N/A 2 x 3.5-inch drive N/A N/A
Fan type Standard fan Standard fan High performance fan Standard fan High performance fan
CPU heat sink type 1.5U heat sink 1.5U heat sink 2U heat sink 1.5U heat sink 1.5U heat sink
Processor number TDP (W) Core count Ambient = 35°C Ambient = 35°C Ambient = 35°C Ambient = 35°C Ambient = 35°C Ambient = 30°C
AMD 7601 180 W 32 Yes Yes Yes Yes Yes Yes
AMD 7551P 180 W 32 Yes Yes Yes Yes Yes Yes
AMD 7451 180 W 24 Yes Yes Yes Yes Yes Yes
AMD 7401P 155 W/170 W 24 Yes Yes Yes Yes Yes Yes
AMD 7351P 155 W/170 W 16 Yes Yes Yes Yes Yes Yes
AMD 7251 120 W 8 Yes Yes Yes Yes Yes Yes
AMD 7281 155 W/170 W 16 Yes Yes Yes Yes Yes Yes
AMD 7261 155 W/170 W 8 Yes Yes Yes Yes Yes Yes

Other thermal restrictions

The list below are other thermal restrictions:

  1. Mellanox CX4 and CX5 only support up to 35°C ambient.