Определяем
Сегодня покупают
ГлавнаяСправочникиDellRack Servers
Dell PowerEdge R6725: руководство по обслуживанию
← Вернуться назад
Нужна помощь с конфигурацией?
Пришлите SKU, спецификацию или список требований. Специалист Apltech проверит совместимость компонентов и найдёт актуальные артикулы
Получить консультацию →

Dell PowerEdge R6725: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEge R6725 system.
Table 1. PowerEdgeR6725 chassis dimensionsThis table provides the dimensions of the system:
Drives Xa Xb Y Za Zb Zc
All configurations482.0 mm (18.97 inches)434.0 mm (17.08 inches)42.8 mm (1.68 inches)31.75 mm (1.25 inches)With bezel28.96 mm (1.14 inches)Without bezel750.6 mm (29.55 inches)Ear to rear wall786.14 mm (30.95 inches)Ear to PSU handle
NOTE:Zb is the nominal rear wall external surface where the HPM I/O connectors reside.

System weight

Table 1. PowerEdge R6725 system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
No backplane 17.06 kg (37.61 lb)
4 x 3.5-inch SAS/SATA 19.72 kg(43.48 lb)
8 x 2.5-inch Universal or U.2 21.34 kg (47.05 lb)
10 x 2.5-inch SAS/SATA 19.93 kg (43.94 lb)
10 x 2.5-inch with 4 x Universal 19.93 kg (43.94 lb)
8 x EDSFF E3.S Gen5 NVMe 18.48 kg (40.74 lb)
16 x EDSFF E3.S Gen5 NVMe 19.99 kg (44.07 lb)
20 x EDSFF E3.S Gen5 NVMe + rear 2 x EDSFF E3.S Gen5 NVMe 21.08 kg (46.47 lb)
Table 2. PowerEdge R6725 weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight Description
40–70 lb Recommend two people to lift
70–120 lb Recommend three people to lift
≥ 121 lb Recommend to use a server-lift

Memory specifications

The PowerEdge R6725 system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Dual processor
Minimum system capacity Maximum system capacity
RDIMM Dual rank 16 GB 32 GB 384 GB
32 GB 64 GB 768 GB
64 GB 128 GB 1.5 TB
96 GB 192 GB 2.3 TB
128 GB 256 GB 3 TB
256 GB 512 GB 6.14 GB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
24, 288-pin, One DIMM Per Channel 6400 MT/s (1 DPC)
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:The processor may reduce the performance of the rated DIMM speed.

Processor specifications

Table 1. PowerEdge R6725 processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
5th Generation AMD EPYC 9005 Series processor Two

PSU specifications

The PowerEdgeR6725system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) Input voltageCurrent (A)
1800 W AC*Titanium675050/60200-240 Vac9.8-8.2
1800 W HVDC*N/A6750N/A240 Vdc8.2
1500 W AC Titanium 5625 50/60 100-240 Vac12-8.2
1500 W HVDCN/A 5625 N/A 240 Vdc6.8
1500 W XLACTitanium 5625 50/60 277 Vac6.1
1500 W XHVDCN/A 5625 N/A 336 Vdc4.91
1400 W -48 VN/A5310N/A(-48)–(-60) Vdc33
1100 W AC Titanium410050/60100-240 Vac12-6.1
1100 W HVDCN/A4100N/A240 Vdc5.1
1100 W ACPlatinum410050/60100-240 Vac12-6.1
1100 W HVDCN/A4100N/A240 Vdc5.1
800 W ACTitanium300050/60100-240 Vac9.2-4.5
800 W HVDCN/A3000N/A240 Vdc3.7
800 W ACPlatinum300050/60100-240 Vac9.2-4.5
800 W HVDCN/A3000N/A240 Vdc3.7
NOTE: If a system with AC 1500 W and 1100 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is derated to 1050 W.
Figure 1. C13 PSU power cords
This image shows the C13 power cord
Figure 2. DC PSU power cord
This image shows the DC PSU power cord
Table 2. PSU power cablesThe table lists the PSU power cables list .
Form factor Output Power cable
Redundant 60 mm 1800 W Titanium*C13
Redundant 60 mm 1500 W Titanium mixed mode C13
Redundant 60 mm 1500 W 277 Vac and HVDCAPP/Saf-D-Grid
Redundant 60 mm1400 W -48 VDC power cable
Redundant 60 mm 1100 W Titanium mixed mode C13
Redundant 60 mm 1100 W Platinum mixed modeC13
Redundant 60 mm 800 W Titanium mixed mode C13
Redundant 60 mm 800 W Platinum mixed modeC13
NOTE:This document provides a comprehensive list of product features. However, features marked with an asterisk (*) may not be available at launch but introduced in future updates. Please note that this document does not confirm the availability or release timeline of any feature. For the most accurate and up-to-date information on feature availability, please refer to the product configurator page on dell.com.
NOTE:*Feature not available at product launch in November,2025. Please refer to the product configurator page on Dell.com to confirm feature availability.

Cooling fan specifications

The PowerEdgeR6725system supports up to four sets of high-performance silver (HPR SLVR) hot-swappable cooling fans, Standard (STD) cooling fans, and high-performance platinum (HPR PLTM) cooling fans, each consisting of a dual fan module.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
High performance (HPR) silver fans HPR SLVR HPR SLVR Silver
Figure 1. High performance silver fans
This image shows HPR SLVR fan
Standard (STD) fans STDSTD No label
Figure 2. Standard fans
This image shows the standard fans
High performance (HPR) platinum fansHPR PLTM HPR PLTMPlatinum
Figure 3. High performance (HPR) platinum fan
This image shows the high performance (HPR) platinum fan
NOTE:Cooling fans rotate at slower speed, even while the system is in standby mode, and the fan speed varies in response to changes in the ambient temperature.

Expansion card riser specifications

The PowerEdge R6725 system supports up to three PCI express (PCIe) slots (3 Gen5 slots) on the HPM board.
Table 1. Expansion card slots supported on the HPM boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot Expansion card riser Processor connection Height Length Slot width
Slot 1 Riser 2 Processor 2 Low Profile / full height Half Length x16
Slot 2 OCP Processor 2 SFF SFF x16
Slot 3 BOSS Flatbread Processor 1 BOSS Flatbread carrier x 4
Slot 4 Riser 4 Processor 1 Low Profile / full height Half Length x16
Slot 5 OCP Processor 1 SFF SFF x16

Storage controller specifications

The PowerEdge R6725 system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers
  • PERC H365i
  • PERC H965i
  • PERC H975i
  • HBA465e
  • H965e
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS)
NOTE:For the ESXi operating system, H975i is supported on 9.0 or later versions.

Drives

The PowerEdge R6725 system supports:
  • No backplane configuration.
  • 4 x 3.5-inch SAS/SATA
  • 8 x 2.5-inch SAS/SATA/NVMe
  • 10 x 2.5-inch SAS/SATA
  • 10 x 2.5-inch with 4 x U.2
  • 8 x EDSFF E3.S Gen5 NVMe
  • 16 x EDSFF E3.S Gen5 NVMe
  • 20 x EDSFF E3.S Gen5 NVMe + Rear 2 x EDSFF E3.S Gen5 NVMe
NOTE: For more information about how to hot swap NVMe PCIe SSD device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

GPU Specifications

The PowerEdge R6725 system supports one of the following GPU configurations:
  • Up to 3 x 75 W single-width GPUs

DPU Specifications

The PowerEdge R6725 platform accommodates Data Processing Units (DPUs). These units are system-on-chip solutions that combine ARM cores, high-performance NICs, and programmable acceleration engines to offload and accelerate data center infrastructure services.

Table 1. Supported Data Processing Units(DPU) CardsThis table describes the feature and the specifications for the supported DPU cards in R6725
Feature NVIDIA BlueField-3 2x200 GbE B3220 NVIDIA BlueField-3 1x400 GbE B3140H *
Type Data Processing Units (DPU) Data Processing Units (DPU)
Networking 2 x 200 GbE 1x400 GbE
Form Factor FHHL FHHL
Interface PCIe Gen5 x16 PCIe Gen5 x16
Power Consumption 150 W 75 W
Compatible Risers RC 3(Slots 1,4) TBD
NOTE: This document provides a comprehensive list of product features. However, features marked with an asterisk (*) may not be available at launch but introduced in future updates. Please note that this document does not confirm the availability or release timeline of any feature. For the most accurate and up-to-date information on feature availability, please refer to the product configurator page on dell.com.
NOTE:* Feature not available at product launch in November,2025. Please refer to the product configurator page on Dell.com to confirm feature availability.

System battery specifications

The PowerEdge R6725 system uses one CR 2032 3.0-V lithium coin cell battery.

Supported operating systems

The PowerEdge R6725 system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • VMware ESXi
  • SUSE Linux Enterprise Server
For specifications and interoperability details, see OS support.

NIC port specifications

The PowerEdge R6725 system supports one 10/100/1000 Mbps BMC Ethernet, up to three PCIe Add-in cards, up to two fiber channel HBA cards, and two optional Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
Datacenter-Secure Control Module (DC-SCM) 1 Gb dedicated BMC Ethernet port x1
OCP NIC 3.0 card 200 GbE x 2 (configurable as 400 GbE x 1), 100 GbE x 2, 25 GbE x 2, 25 GbE x 4, 10 GbE x 2, 1 GbE x 2
PCIe Add-in Card (AIC) NIC 200 GbE x 2 (configurable as 400 GbE x 1), 100 GbE x 2
Fibre channel HBA FC64, FC32
NOTE:The system allows either DC-SCM or an OCP NIC card or both to be installed in the system.
NOTE:The system allows either DC-SCM card or MIC card to be installed in the system.

USB ports specifications

Table 1. PowerEdge R6725 USB specificationsThe following table shows the USB specifications for the system:
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 3.1-compliant ports Two Internal USB 3.1-compliant port One
USB Type C dual-mode host/iDRAC Direct port One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

VGA ports specifications

The PowerEdge R6725 system supports DB-15 port on the rear I/O board of the Datacenter Secure Control Module (DC-SCM).

Video specifications

Table 1. Supported video resolution optionsThis table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32
NOTE:RB—Reduced Blanking for digital displays requiring less blank time. This was introduced for signal integrity improvements by reducing pixel clock rates for VGA analog input devices.

Environmental specifications

NOTE:For additional information about environmental certifications, see the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.
Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing always) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude derating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 ft) above 900 m (2953 ft).
Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing always) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude derating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 ft) above 900 m (2953 ft).
Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing always) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude derating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 ft) above 900 m (2953 ft).
Table 4. Common Environmental Specifications for ASHRAE A2, A3, A4, and Rugged This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and nonoperation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Nonoperational temperature limits
  • -40°C to 65°C (-40°F to 149°F) applicable for air cooling configuration
  • -40°C to -5°C (-40°F to 23°F**) applicable for DLC configuration
NOTE:** Liquid filled components, or systems/solutions containing liquid filled components are limited to approximately 5°C above their freeze point. At this time the only authorized liquid coolant is Recohem PG25 with a freeze point between -9°C and -13°C, therefore the lower non-operational temperature limit is -5°C. Components and systems/solutions that can contain liquid but do not at the time of testing shall be tested to the -40°C lower non-operational temperature limit.
Nonoperational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum nonoperational altitude 12,000 meters (39,370 ft)
Maximum operational altitude 3,048 meters (10,000 ft)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz (all operation orientations)
Storage 1.38 Grms at 7 Hz to 250 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively run shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment) Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HPR (Silver) High-performance Silver (HPR SLVR) fan
HSK Heat sink
LP Low profile
FH Full height
DLC Direct Liquid Cooling
HPM Host Processor Module
Table 2. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Processor TDP
T-type HSK Supports all TDP
Table 3. Thermal restriction matrixThe following table shows the thermal restriction matrix.
Legend Support at 35°C R6725 Air cooling
Max 30°C support
Storage configuration 8x 2.5" SmartFlow 8x E3.s No BP 16x E3s 4x 3.5" 10x 2.5" 20x E3.s + rear 2xE3.S
Storage configuration reference no. C02-02, C02-03 C02-04, C02-05 C03-02 C0 C05-02, C05-03 C01 C04-01, C04-02,

C04-04, C04-05

 C06
CPU group TDP (W) cTDP (W) Model Core count Production OPN
C 125 120-155 9015 8 100-000001553 STD Fan STD Fan STD Fan STD Fan STD Fan HPR SILVER Fan STD Fan HPR SILVER Fan
125 120-155 9115 16 100-000001552 STD Fan STD Fan STD Fan STD Fan STD Fan HPR SILVER Fan STD Fan HPR SILVER Fan
B 210 200-240 9335 32 100-000001149 STD Fan STD Fan STD Fan STD Fan STD Fan HPR SILVER Fan STD Fan HPR PLTM Fan
200 200-240 9255 24 100-000000694 STD Fan STD Fan STD Fan STD Fan STD Fan HPR SILVER Fan STD Fan HPR PLTM Fan
200 200-240 9135 16 100-000001150 STD Fan STD Fan STD Fan STD Fan STD Fan HPR SILVER Fan STD Fan HPR PLTM Fan
A 280 240-300 9355 32 100-000001148 HPR SILVER Fan HPR SILVER Fan HPR SILVER Fan HPR SILVER Fan HPR SILVER Fan **HPR SILVER Fan HPR SILVER Fan **HPR PLTM Fan
E 320 320-400 9175F 16 100-000001145 HPR PLTM Fan **HPR SILVER Fan HPR PLTM Fan HPR SILVER Fan HPR PLTM Fan Require DLC HPR SILVER Fan HPR PLTM Fan
320 320-400 9275F 24 100-000001144 HPR PLTM Fan **HPR SILVER Fan HPR PLTM Fan HPR SILVER Fan HPR PLTM Fan Require DLC HPR SILVER Fan HPR PLTM Fan
320 320-400 9375F 32 100-000001197 HPR PLTM Fan **HPR SILVER Fan HPR PLTM Fan HPR SILVER Fan HPR PLTM Fan Require DLC **HPR SILVER Fan **HPR PLTM Fan
400 320-400 9475F 48 100-000001143 HPR PLTM Fan **HPR SILVER Fan HPR PLTM Fan HPR SILVER Fan HPR PLTM Fan Require DLC **HPR SILVER Fan **HPR PLTM Fan
360 320-400 9555 64 100-000001142 HPR PLTM Fan **HPR SILVER Fan HPR PLTM Fan HPR SILVER Fan HPR PLTM Fan Require DLC **HPR SILVER Fan **HPR PLTM Fan
400 320-400 9575F 64 100-000001554 HPR PLTM Fan **HPR SILVER Fan HPR PLTM Fan HPR SILVER Fan HPR PLTM Fan Require DLC **HPR SILVER Fan **HPR PLTM Fan
400 320-400 9655 96 100-000000674 HPR PLTM Fan **HPR SILVER Fan HPR PLTM Fan HPR SILVER Fan HPR PLTM Fan Require DLC **HPR SILVER Fan **HPR PLTM Fan
400 320-400 9745 128 100-000001460 HPR PLTM Fan **HPR SILVER Fan HPR PLTM Fan HPR SILVER Fan HPR PLTM Fan Require DLC **HPR SILVER Fan **HPR PLTM Fan
390 320-400 9825 144 100-000000837 HPR PLTM Fan **HPR SILVER Fan HPR PLTM Fan HPR SILVER Fan HPR PLTM Fan Require DLC **HPR SILVER Fan **HPR PLTM Fan
390 320-400 9845 160 100-000001458 HPR PLTM Fan **HPR SILVER Fan HPR PLTM Fan HPR SILVER Fan HPR PLTM Fan Require DLC **HPR SILVER Fan **HPR PLTM Fan
G 500 450-500 9965 192 **HPR PLTM Fan **HPR PLTM Fan Require DLC **HPR PLTM Fan **HPR PLTM Fan **HPR PLTM Fan Require DLC Require DLC Require DLC
450-500 500 9755 128 **HPR PLTM Fan **HPR PLTM Fan Require DLC **HPR PLTM Fan **HPR PLTM Fan **HPR PLTM Fan Require DLC Require DLC Require DLC
NOTE:** Components that support max 30°C.
NOTE:Components without asteriks support max 35°C.

Thermal air restrictions

Table 1. No backplane configurationThe following table shows the no backplane configuration.
ASHRAE ASHRAE A2 ASHRAE A3/40°C (104°F) A4/45°C (113°F)
CPU Maximum 30°C for CPU > 400 W CPU > 240 W is not supported. CPU > 195 W is not supported.
HPR silver fan N/A HPR Silver Fan is needed. HPR Silver Fan is needed.
Memory N/A 64G or greater capacity RDIMMs are not supported. 64G or greater capacity RDIMMs are not supported.
GPU N/A GPU is not supported. GPU is not supported.
PSU N/A Two power supplies are required. System performance may be reduced in the event of a PSU failure. Two power supplies are required. System performance may be reduced in the event of a PSU failure.
PCIe card N/A Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported. Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
OCP N/A 85°C active optics or DAC cable is required. OCP NICs are not supported. 85°C active optics or DAC cable is required.
BOSS N1 N/A N/A BOSS N1 is not supported.
Table 2. 4 x 3.5-inch SAS/SATAThe following table shows the 4 x 3.5-inch SAS/SATA drives.
ASHRAE ASHRAE A2 ASHRAE A3/40°C (104°F) A4/45°C (113°F)
CPU
  • Maximum 30°C for CPU > 300 W
  • CPU > 400 W is not supported.
 CPU > 195 W is not supported. Not supported
HPR silver fan N/A HPR Silver Fan is needed. Not supported
Memory N/A 64G or greater capacity RDIMMs are not supported. Not supported
GPU N/A GPU is not supported. Not supported
PSU N/A Two power supplies are required. System performance may be reduced in the event of a PSU failure. Not supported
PCIe card N/A Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported. Not supported
OCP N/A 85°C active optics or DAC cable is required. Not supported
BOSS N1 N/A N/A Not supported
Table 3. 8 x 2.5-inch Universal or U.2The following table shows the 8 x 2.5-inch Universal drives.
ASHRAE ASHRAE A2 ASHRAE A3/40°C (104°F) A4/45°C (113°F)
CPU
  • Maximum 30°C for CPU > 400 W with C02-02 and C02-03 configurations.
  • Maximum 30°C for CPU > 300 W with C02-04 and C02-05 configurations.
  • CPU > 400 W with C02-04 and C02-05 configuration is not supported.
 CPU > 240 W is not supported. CPU > 195 W is not supported.
HPR silver fan N/A HPR Silver Fan is needed. HPR Silver Fan is needed.
Memory N/A 64G or greater capacity RDIMMs are not supported. 64G or greater capacity RDIMMs are not supported.
GPU N/A GPU is not supported. GPU is not supported.
PSU N/A Two power supplies are required. System performance may be reduced in the event of a PSU failure. Two power supplies are required. System performance may be reduced in the event of a PSU failure.
PCIe card N/A Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported. Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
OCP N/A 85°C active optics or DAC cable is required. OCP NICs are not supported. 85°C active optics or DAC cable is required.
BOSS N1 N/A N/A BOSS N1 is not supported.
Table 4. 8 x EDSFF E3.S Gen5 NVMe The following table shows the 8 x EDSFF E3.S Gen5 NVMe drives.
ASHRAE ASHRAE A2 ASHRAE A3/40°C (104°F) A4/45°C (113°F)
CPU Maximum 30°C for CPU > 400 W CPU > 240 W is not supported. Not supported
HPR silver fan N/A HPR Silver Fan is needed. Not supported
Memory N/A 64G or greater capacity RDIMMs are not supported. Not supported
GPU N/A GPU is not supported. Not supported
PSU N/A Two power supplies are required. System performance may be reduced in the event of a PSU failure. Not supported
PCIe card N/A Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported. Not supported
OCP N/A 85°C active optics or DAC cable is required. Not supported
BOSS N1 N/A N/A Not supported
Table 5. 10 x 2.5-inch SAS/SATAThe following table shows the 10 x 2.5-inch SAS/SATA drives.
ASHRAE ASHRAE A2 ASHRAE A3/40°C (104°F) A4/45°C (113°F)
CPU
  • Maximum 30°C for CPU > 300 W
  • CPU > 400 W is not supported.
 CPU > 195 W is not supported. Not supported
HPR silver fan N/A HPR Silver Fan is needed. Not supported
Memory N/A 64G or greater capacity RDIMMs are not supported. Not supported
GPU N/A GPU is not supported. Not supported
PSU N/A Two power supplies are required. System performance may be reduced in the event of a PSU failure. Not supported
PCIe card N/A Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported. Not supported
OCP N/A 85°C active optics or DAC cable is required. Not supported
BOSS N1 N/A N/A Not supported
Table 6. 16 x EDSFF E3.S Gen5 NVMeThe following table shows the 16 x EDSFF E3.S Gen5 NVMe drives.
ASHRAE ASHRAE A2 ASHRAE A3/40°C (104°F) A4/45°C (113°F)
CPU Maximum 30°C for CPU > 400 W CPU > 240 W is not supported. Not supported
HPR silver fan N/A HPR Silver Fan is needed. Not supported
Memory N/A 64G or greater capacity RDIMMs are not supported. Not supported
GPU N/A GPU is not supported. Not supported
PSU N/A Two power supplies are required. System performance may be reduced in the event of a PSU failure. Not supported
PCIe card N/A Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported. Not supported
OCP N/A 85°C active optics or DAC cable is required. Not supported
BOSS N1 N/A N/A Not supported
Table 7. 20 x EDSFF E3.S Gen5 NVMe + rear 2 x EDSFF E3.S Gen5 NVMeThe following table shows the 20 x EDSFF E3.S Gen5 NVMe + rear 2 x EDSFF E3.S Gen5 NVMe.
ASHRAE ASHRAE A2 ASHRAE A3/40°C (104°F) A4/45°C (113°F)
CPU
  • Maximum 30°C for CPU > 300 W
  • CPU > 400 W is not supported.
 CPU > 240 W is not supported. Not supported
HPR silver fan N/A HPR Silver Fan is needed. Not supported
Memory N/A 64G or greater capacity RDIMMs are not supported. Not supported
GPU N/A GPU is not supported. Not supported
PSU N/A Two power supplies are required. System performance may be reduced in the event of a PSU failure. Not supported
PCIe card N/A Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported. Not supported
OCP N/A 85°C active optics or DAC cable is required. Not supported
BOSS N1 N/A N/A Not supported
NOTE:Maximum 30°C for CPU > 300 W.