Dell PowerEdge R6715: руководство по обслуживанию

Chassis dimensions

Chassis dimensions are provided.

This image shows chassis dimension for the PowerEge R6715. — Figure 1. Chassis dimensions

Table 1. Chassis dimensionsThis table provides the dimensions of the system:
Drives	Xa	Xb	Y	Za (with bezel)	Za (without bezel)	Zb	Zc
All drive configurations	482.0 mm (18.97 inches)	434.0 mm (17.08 inches)	42.8 mm (1.68 inches)	42.8 mm (1.68 inches)	28.96 mm (1.14 inches)	750.6 mm (29.55 inches) without bezel	786.14 mm (30.95 inches) Ear to PSU handle

NOTE:Zb is the nominal rear wall external surface where the HPM board I/O connectors reside.

System weight

Table 1. PowerEdge R6715 system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives/SSDs)
4 x 3.5-inch SAS/SATA drives	RC4 (3 x 16 FH) : 19.54 kg (43.07 lb) RC5 (2 x 16 LP + 2nd OCP) : 19.41 kg (42.79 lb)
8 x 2.5-inch Universal SSDs	19.96 kg (44.00 lb)
8 x U.2 SSDs	20.78 kg ( 45.81 lb)
10 x 2.5-inch SAS/SATA drives	21.19 kg ( 46.71 lb)
10 x 2.5-inch with 4 x Universal drives	21.09 kg ( 46.49 lb)
16 x EDSFF E3.S Gen5 NVMe drives	21.09 kg (46.49 lb)
20 x EDSFF E3.S Gen5 NVMe + rear 2 x EDSFF E3.S Gen5 NVMe drives	20.25 kg ( 46.64 lb)

Table 2. PowerEdge R6715 weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight	Description
40–70 lb	Recommend two people to lift
70–120 lb	Recommend three people to lift
≥ 121 lb	Recommend to use a server-lift

Memory specifications

The PowerEdge R6715 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Dual processor
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity
RDIMM	Single rank	16 GB	16 GB	384 GB
	Dual rank	32 GB	32 GB	768 GB
		64 GB	64 GB	1.5 TB
		96 GB	96 GB	2.3 TB
		128 GB	128 GB	3 TB
	Eight rank	256 GB	256 GB	6 TB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
24, DDR5 DIMM slots	5200 MT/s, 4000 MT/s

NOTE:Memory DIMM slots are not hot pluggable.

NOTE:The processor may reduce the performance of the rated DIMM speed.

Processor specifications

Table 1. PowerEdge R6715 processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
5^th Generation AMD EPYC 9005 Series processor	One

PSU specifications

The PowerEdgeR6715system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	Input voltage	Current (A)
1800 W Titanium *	Titanium	6750	50/60	200-240 Vac	9.8-8.2
1800 W Titanium *	N/A	6750	N/A	240 Vdc	8.2
1500 W Titanium	Titanium	5625	50/60	100-240 Vac	12-8.2
1500 W Titanium	N/A	5625	N/A	240 Vdc	6.8
1500 W 277 Vac & HVDC	Titanium	5625	50/60	277 Vac	6.1
1500 W 277 Vac & HVDC	N/A	5625	N/A	336 Vdc	4.91
1400 W -48 Vdc	Telco	5310	N/A	(-48) - (-60) Vdc	33
1100 W Titanium	Titanium	4125	50/60	100-240 Vac	12-6.1
1100 W Titanium	N/A	4125	N/A	240 Vdc	5.1
1100 W Platinum	Platinum	4125	50/60	100-240 Vac	12-6.1
1100 W Platinum	N/A	4125	N/A	240 Vdc	5.1
800 W Titanium	Titanium	3000	50/60	100-240 Vac	9.2-4.5
800 W Titanium	N/A	3000	N/A	240 Vdc	3.7
800 W Platinum	Platinum	3000	50/60	100-240 Vac	9.2-4.5
800 W Platinum	N/A	3000	N/A	240 Vdc	3.7

NOTE: If a system with AC 1500 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is d e-rated to 1050 W.

NOTE:This document provides a comprehensive list of product features. However, features marked with an asterisk (*) may not be available at launch but introduced in future updates. Please note that this document does not confirm the availability or release timeline of any feature. For the most accurate and up-to-date information on feature availability, please refer to the product configurator page on dell.com.

NOTE:* Feature not available at product launch in November,2025. Please refer to the product configurator page on Dell.com to confirm feature availability.

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

NOTE: If a system with AC 1500 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is d e-rated to 1050 W.

This image shows the PSU power cord — Figure 1. C13 power cord

This image shows the DC PSU power cord — Figure 2. DC PSU power cord

Table 2. PSU power cablesThe table lists the PSU power cables list .
Form factor	Output	Power cable
Redundant 60 mm	1800 W Titanium mixed mode *	C13
Redundant 60 mm	1500 W Titanium mixed mode	C13
Redundant 60 mm	1500 W 277 Vac and HVDC	APP/Saf-D-Grid
Redundant 60 mm	1400 W Telco	DC power cable
Redundant 60 mm	1100 W Titanium mixed mode	C13
Redundant 60 mm	1100 W Platinum mixed mode	C13
Redundant 60 mm	800 W Titanium mixed mode	C13
Redundant 60 mm	800 W Platinum mixed mode	C13

NOTE:*Feature not available at product launch in November,2025. Please refer to the product configurator page on Dell.com to confirm feature availability.

Cooling fan specifications

The PowerEdgeR6715system supports up to four sets high-performance silver (HPR SLVR) hot-swappable cooling fans, each consisting of a dual fan module.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Also known as	Label color	Label image
High performance (HPR) silver fans	HPR SLVR	HPR	Silver	Figure 1. High performance silver fans
Standard (STD) fans	STD	STD	No label	Figure 2. Standard fans

NOTE:Cooling fans rotate at slower speed, even while the system is in standby mode, and the fan speed varies in response to changes in the ambient temperature.

Expansion card riser specifications

The PowerEdge R6715 system support up to two low-profile Gen5 PCIe slots on the HPM board.

Table 1. Expansion card slots supported on the HPM boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Expansion card riser	Processor connection	Height	Length	Slot width
Slot 1	Riser 2	Processor 0	Low Profile/ Full Height	Half Length	x16
Slot 2	R2k (second OCP)	Processor 0	SFF	SFF	x16
Slot 3	BOSS	Processor 0	BOSS Flatbread carrier		x4
Slot 4	Riser 4	Processor 0	Low Profile /Full Height	Half Length	x16
Slot 5	OCP	Processor 0	SFF	SFF	x16

Storage controller specifications

The PowerEdge R6715 system supports the following controller cards:

Table 1. Storage controller cards This table provides the controller cards that are supported on the system:
Supported storage controller cards
Internal controllers PERC H365i PERC H965i PERC H975i HBA465e H965e
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS)

NOTE:For the ESXi operating system, H975i is supported on 9.0 or later versions.

Drives

The PowerEdge R6715 system supports:

No backplane configuration
Up to 4 x 3.5-inch SAS/SATA drives
Up to 8 x 2.5-inch SAS/SATA/NVME drives
Up to 8 x U.2 NVMe SSDs
Up to 10 x 2.5-inch SAS/SATA drives
Up to 10 x 2.5-inch SAS/SATA with 4 x U.2 drives
Up to 16 x EDSFF E3.S Gen5 NVMe drives
Up to 20 x EDSFF E3.S Gen5 NVMe + rear 2 x EDSFF E3.S Gen5 NVMe drives

NOTE: For more information about how to hot swap NVMe PCIe SSD device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

GPU Specifications

The PowerEdge R6715 system supports one of the following GPU configurations:

Up to 3 x 70W single-width cards (x16 PCIe)

DPU Specifications

The PowerEdge R6715 platform accommodates Data Processing Units (DPUs). These units are system-on-chip solutions that combine ARM cores, high-performance NICs, and programmable acceleration engines to offload and accelerate data center infrastructure services.

Table 1. Supported Data Processing Units(DPU) CardsThis table describes the feature and the specifications for the supported DPU cards in R6715
Feature	NVIDIA BlueField-3 2x200 GbE B3220	NVIDIA BlueField-3 1x400 GbE B3140H *
Type	Data Processing Units (DPU)	Data Processing Units (DPU)
Networking	2 x 200 GbE	1x400 GbE
Form Factor	FHHL	FHHL
Interface	PCIe Gen5 x16	PCIe Gen5 x16
Power Consumption	150 W	75 W
Compatible Risers	RC 3(Slot 1)	TBD

NOTE: This document provides a comprehensive list of product features. However, features marked with an asterisk (*) may not be available at launch but introduced in future updates. Please note that this document does not confirm the availability or release timeline of any feature. For the most accurate and up-to-date information on feature availability, please refer to the product configurator page on dell.com.

NOTE:* Feature not available at product launch in November,2025. Please refer to the product configurator page on Dell.com to confirm feature availability.

System battery specifications

The PowerEdge R6715 system uses one CR 2032 3.0-V lithium coin cell battery.

Supported operating systems

The PowerEdge R6715 system supports the following operating systems:

Microsoft Windows Server with Hyper-V
Canonical Ubuntu Server LTS
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi

For specifications and interoperability details, see OS support.

NIC port specifications

The PowerEdge R6715 system supports one 10/100/1000 Mbps BMC Ethernet, up to three PCIe Add-in cards, up to two fibre channel HBA cards, and two optional Open Compute Project (OCP) cards.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
Datacenter-Secure Control Module (DC-SCM)	1 Gb Dedicated BMC Ethernet port x1
2 x OCP NIC 3.0 card	200GbE x 2 (configurable to 400GbE x1), 100 GbE x 2, 25 GbE x 2, 25 GbE x 4 , 10 GbE x 4, 10 GbE x 2, 1 GbE x 4
PCIe Add-in Card (AIC) NIC	400 GbE x 1, 100 Gbe x 2
Fibre channel HBA	FC32, FC64

NOTE:The system allows either DS-SCM or an OCP NIC card or both to be installed in the system.

NOTE:On the HPM board, the supported OCP NIC PCIe width is x8; when x16 PCIe width is installed, it is downgraded to x8.

NOTE:The system allows either DS-SCM or a MIC card to be installed in the system.

USB ports specifications

Table 1. Systems USB SpecificationsThe below table shows systems USB specifications.
Front		Rear		Internal
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0 Type-A (optional LCP KVM)	1	USB 3.1 Type-A	1	USB x.3.1 Type-A	1
USB 2.0 Type-C (HOST/BMC Direct)	1	USB 3.1 Type-A	1	USB x.3.1 Type-A	1

VGA ports specifications

The PowerEdge R6715 system supports DB-15 VGA port on the rear I/O board.

Video specifications

Table 1. Supported video resolution optionsThis table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

NOTE:RB—Reduced Blanking for digital displays requiring less blank time. This was introduced for signal integrity improvements by reducing pixel clock rates for VGA analog input devices.

Environmental specifications

Environmental certifications and operational climatic ranges are provided.

Additional information about environmental certifications is available in the Product Environmental Datasheet.

Table 1. Operational climatic range for category A2 This table describes the operational climatic range for category A2.
Item	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing always)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude derating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Operational climatic range for category A3 This table describes the operational climatic range for category A3.
Item	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing always)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude derating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Operational climatic range for category A4 This table describes the operational climatic range for category A4.
Item	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing always)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude derating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Shared requirements This table describes the requirements that are shared across all environmental categories
Item	Allowable continuous operations
Maximum Temperature Gradient (applies to both operation and nonoperation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
Non-Operational Temperature Limits	-40°C to 65°C (-40°F to 149°F) applicable for air cooling configuration -40°C to -5°C (-40°F to 23°F) applicable for DLC configuration NOTE: Liquid filled components, or systems/solutions containing liquid filled components are limited to approximately 5°C above their freeze point. At this time the only authorized liquid coolant is Recohem PG25 with a freeze point between -9°C and -13°C, therefore the lower non-operational temperature limit is -5°C. Components and systems/solutions that can contain liquid but do not at the time of testing shall be tested to the -40°C lower non-operational temperature limit.
Non-Operational Humidity Limits (Non-Condensing always)	5% to 95%RH with 27°C (80.6°F) maximum dew point.
Maximum Non-Operational Altitude	12,000 meters (39,370 ft)
Maximum Operational Altitude	3,048 meters (10,000 ft)

Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively run shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively run shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively run shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Six consecutively run shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard
HPR (Silver)	High performance Silver (HPR SLVR) fan
HPR (Gold)	High performance Gold (HPR GOLD) fan
HSK	Heat sink
LP	Low profile
FH	Full height
DLC	Direct Liquid Cooling

Table 2. Heat sink thermal restriction matrixThis table describes the processor and heat sink restriction matrix.
Heat sink	Processor TDP
C-type HSK	Supports all air cooling

Table 3. R6715 thermal restriction Air cooling matrixThis table shows R6715 thermal restriction Air cooling matrix
Supported at 35°C					R6715 Air Cooling
Configuration					No Backplane	8 x 2.5-inch	16 x EDSFF E3.S NVMe
Rear storage					No rear Drive	No rear Drive	No rear Drive
CPU	CPU	cTDP	Max cTDP	Core Count	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9015	125	155	8	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9115	125	155	16	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9135	200	240	16	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9255	200	240	24	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9335	280	300	32	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9355p	280	300	32	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) STD Fan (9P02K)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9175F	320	400	16	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9275F	320	400	24	Not Supported	Not Supported	Not Supported
	9375F	320	400	32	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9475F	400	400	48	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9555P	360	400	64	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9575F	400	400	64	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9655P	320	400	96	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9745	400	400	128	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9825	390	400	144	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
	9845	390	400	160	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)	C Type HSK (8W71V) HPR Silver Fan (J7DTN)
Memory	16 GB RDIMM				STD Fan (9P02K)	STD Fan (9P02K)	HPR Sliver Fan (J7DTN)
	32 GB RDIMM				STD Fan (9P02K)	STD Fan (9P02K)	HPR Sliver Fan (J7DTN)
	64 GB RDIMM				STD Fan (9P02K)	STD Fan (9P02K)	HPR Sliver Fan (J7DTN)
	96 GB RDIMM				HPR Sliver Fan (J7DTN)	HPR Sliver Fan (J7DTN)	HPR Sliver Fan (J7DTN)
	128 GB RDIMM				HPR Sliver Fan (J7DTN)	HPR Sliver Fan (J7DTN)	HPR Sliver Fan (J7DTN)
	256 GB RDIMM				HPR Silver Fan (J7DTN)	HPR Silver Fan (J7DTN)	HPR Silver Fan (J7DTN)

NOTE:The AMD 400w 24c 9275F can’t be supported by air cooling based on current test result.

NOTE:The configuration's ambient temperature is dictated by its critical component. For example, if the processor's ambient temperature is 35°C, the DIMM is 35°C, and the GPU is 30°C, the configuration's ambient temperature can only be 30°C.

NOTE:Rear HDD configurations do not support drive capacities of 30TB or higher.

R6715 thermal restriction Liquid cooling matrix

No thermal restriction requirement for all CPUs with liquid cooling supported config.

Thermal air restrictions

Fresh air environment

Two PSUs are required in redundant mode, however a single PSU failure is not supported.
PCIe SSD is not supported.
128 GB or greater capacity DIMMs are not supported.
GPU and FPGA are not supported.
CPU TDP equal or greater than 180 W are not supported.
Rear drives are not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.

Table 1. Air cooling configuration thermal restriction for AHSRAE A3 and A4This table provides information about ASHRAE A3 and A4 restrictions for air cooling configuration.
ASHRAE	A3/40°C (104°F)	A4/45°C (113°F)
Front storage	Support at 2.5” SATA/SAS x 8 configuration only
Fan type	HPR Sliver Fan J7DTN is required.
CPU	CPU TDP > 240 W is not supported.	CPU TDP > 200W are not supported
Memory	128 GB and higher capacity RDIMMS are not supported.
PCIe card	Non-Dell qualified peripheral cards and consuming power greater than 25 W are not supported.
GPU	GPU cards are not supported.
Rear storage	Not supported
OCP	Supported with 85°C (185°F) active optic cable.
PSU	Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
BOSS	Supported	Not Supported

Table 2. Liquid cooling configuration thermal restriction for AHSRAE A3 and A4This table provides information about ASHRAE A3 and A4 restrictions for air cooling configuration.
ASHRAE	A3/40°C (104°F)	A4/45°C (113°F)
Front storage	3.5’’ / E.3 config is not supported
Fan type	HPR Gold Fan (7F0CF) or up are required
Memory	128GB and higher Capacity RDIMMS are not supported.
PCISSD	Not Supported
PCIe card	Non-Dell qualified peripheral cards and consuming power greater than 25 W are not supported.
GPU	GPU cards are not supported.
Rear storage	Not supported
OCP	Supported with 85°C (185°F) active optic cable.	Not supported
PSU	Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
BOSS	Supported	Not supported