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Dell PowerEdge R670: руководство по обслуживанию
Chassis I/O Configuration
Dell Servers offer choices for the
location of Networking Interface and Systems Management cable connections.
Rear I/O (Input/Output) is the most common configuration.
With Rear I/O network connections are at the rear of the Server. Systems management
cables are connected at the rear by a dedicated port or a selectable shared port
with a network interface controller. The power supplies and power cables are at the
rear of the Server.
Figure 1. Rear I/O configurations. This image shows the Rear I/O configurations for R670 system.
NOTE: Sample chassis
configurations; these may not match your configuration.
Front I/O (Input/Output) is an option where PCIe risers and
OCP network interface controllers are in the front of the Server. Systems management
cables are connected at the front of the server by a dedicated port or a selectable
shared port with a network interface controller. The power button and system status
indicators are at the front of the Server.
Figure 2. Front I/O configurations. This image shows the Front I/O configurations for R670 system.
NOTE: Sample chassis
configurations; these may not match your configuration.
Both configurations have their benefits, but the most common reason for choosing
Front I/O is the desire to connect I/O and Systems Management cables to the front of
the server. There are certain rack infrastructure products that take advantage of a
front I/O location.
Chassis dimensions
Figure 1. Chassis dimensions
Table 1. PowerEdgeR670 chassis dimensionsThis table provides the dimensions of the system:
Drives
Xa
Xb
Y
Za
Zb
Zc
8 drives x E3.S
(Front I/O)
482.0 mm (18.98 inches)
434.0 mm (17.09 inches)
42.8 mm (1.69 inches)
43.3 mm (1.70 inches)
Without bezel
750.57 mm (29.55 inches)Ear to rear wall
786.14 mm (30.95 inches)Ear to PSU handle
8 x 2.5-inch with RIO
10 x 2.5-inch with RIO
16 x EDSFF E3.S drive
20 x EDSFF E3.S drive
0 Drives
482.0 mm (18.98 inches)
434.0 mm (17.09 inches)
42.8 mm (1.69 inches)
30.78 mm (1.21 inches) with bezel
29 mm (1.14 inches) Without bezel
750.57 mm (29.55 inches)Ear to rear wall
786.14 mm (30.95 inches)Ear to PSU handle
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.
System weight
Table 1. PowerEdgeR670system weightThe table below shows the maximum weight of the system.
System configuration
Maximum weight (with all drives/SSDs)
8 x EDSFF E3.S
20.42 kg (45.02 lb)
8 x 2.5-inch SATA drives
19.26 kg (42.46 lb)
8 x 2.5-inch Universal
19.26 kg (42.46 lb)
10 x 2.5-inch SATA drives
19.7 kg (43.43 lb)
16 x EDSFF E3.S drives
19.58 kg (43.16 lb)
20 x EDSFF E3.S drives
20.18 kg (44.48 lb)
0 Drive
17.18 kg (37.87 lb)
Table 2. PowerEdgeR670 weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight
Description
40–70 lb
Recommend two people to lift.
70-120 lb
Recommend three people to lift.
≥ 121 lb
Recommend to use a server-lift.
Processor specifications
Table 1. PowerEdgeR670 processor specifications This table provides processor specifications for the system.
Supported processor
Number of processors supported
Intel® Xeon® 6 E-Core
processor
Two
Intel® Xeon® 6 P-Core processor
Two
Table 2. Minimum Firmware version requirement for
Intel® Xeon® 6 P-Core ProcessorsThe below table describes the supported firmware version based on different
processors.
Processors
iDRAC
BIOS
FPGA
6787P
1.20.25.00
1.2.6
107.114.104
6767P
6760P
6747P
6740P
6736P
6737P
6730P
6530P
6527P
6520P
6724P
6517P
6515P
6505P
6714P
6507P
Data is not available for the Topic
Cooling fan specifications
The
PowerEdgeR670system supports up to 4 set high-performance silver (HPR SLVR) or Standard (STD) hot-swappable cooling fans, each consisting of a dual fan module.
Table 1. Cooling fan specificationsCooling fan specifications
Fan type
Abbreviation
Label color
Label image
High performance Silver (HPR SLVR) fans
HPR SLVR
Silver
Standard (STD) fans
STD
Standard
NOTE:Cooling fans rotate at a slower speed, even while the system is in standby mode, and the fan speed varies in response to changes in the ambient temperature.
PSU specifications
The
PowerEdgeR670system supports up to two AC or DC power supply units (PSUs).
Table 1. R670 PSU specifications This table describes PSU specifications for the system.
PSU
Class
Heat dissipation (maximum) (BTU/hr)
Frequency (Hz)
AC Voltage
DC Voltage
Current (A)
200—240 V
100—120 V
277 V
240 V
- (48—60) V
336 V
800 W mixed mode
Platinum
3000
50/60
800 W
800 W
N/A
N/A
N/A
N/A
9.2—4.5
N/A
3000
N/A
N/A
N/A
N/A
800 W
N/A
N/A
3.7
Titanium
3000
50/60
800 W
800 W
N/A
N/A
N/A
N/A
9.2—4.5
N/A
3000
N/A
N/A
N/A
N/A
800 W
N/A
N/A
3.7
1100 W mixed mode
Platinum
4125
50/60
1100 W
1050 W
N/A
N/A
N/A
N/A
12—6.1
N/A
4125
N/A
N/A
N/A
N/A
1100 W
N/A
N/A
5.1
Titanium
4125
50/60
1100 W
1050 W
N/A
N/A
N/A
N/A
12—6.1
N/A
4125
N/A
N/A
N/A
N/A
1100 W
N/A
N/A
5.1
1400 W -48 VDC*
Titanium
5310
N/A
N/A
N/A
N/A
N/A
1400 W
N/A
33
1500 W mixed mode
Titanium
5625
50/60
1500 W
1050 W
N/A
N/A
N/A
N/A
12.1—8.2
N/A
5625
N/A
N/A
N/A
N/A
1500 W
N/A
N/A
6.8
1500 W 277Vac & HVDC*
Titanium
5625
N/A
N/A
N/A
N/A
1500 W
N/A
N/A
6.8
1800 W HLAC Titanium*
Titanium
6750
50/60
1800 W
N/A
N/A
N/A
N/A
N/A
9.8—8.2
1800 W HVDC*
N/A
6750
N/A
N/A
N/A
N/A
1800 W
N/A
N/A
8.2
NOTE:PowerEdgeR670 supports up to two mixed mode power supplies with non-redundancy (1+0, 2+0), as the iDRAC does not calculate system power consumption.
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at
Dell.com/calc.
Figure 1. PSU power cordsFigure 2. Lotes DC PSU
connector
Table 2. PSU power cordsThe table lists the PSU power cords list .
Form factor
Output
Power cord
60 mm
800 W Mixed Mode
C13
1100 W Mixed Mode
C13
1400 W -48 VDC*
Lotes RN5T2
1500 W Mixed Mode
C13
1800 W HLAC*
C13
NOTE: *Feature not available at product launch in June, 2025.
Please refer to the product configurator page on Dell.com to confirm feature
availability.
Supported operating system
The PowerEdgeR670system supports the following operating systems:
Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi
Dell NativeEdge OS*
NOTE:*Features marked with an asterisk (*) may not be available at
product launch. Please refer to the product configurator page on Dell.com to confirm feature
availability.
For specifications and interoperability details, see
OS support.
System battery specifications
The
PowerEdgeR670system uses one
CR 2032 3.0-V lithium coin cell battery.
Expansion card riser specifications
The PowerEdgeR670system supports up to two PCI express (PCIe) slots (Gen5 slots), OCP NIC and BOSS on the system board.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot
Expansion card riser
Processor connection
Height
Length
Slot width
Slot 1
R2b
Processor 1
Full Height
Half Length
x16
R2c
Processor 1
Low Profile
Half Length
x16
R2e
Processor 1
Low Profile
Half Length
x16
R2f
Processor 1
Low Profile
Half Length
x16
Slot 2
R2c
Processor 1
Low Profile
Half Length
x16
R2f (OCP)
Processor 1
N/A
N/A
x16
Slot 3
BOSS (Rear)
Processor 0
N/A
N/A
x4
Slot 4
R4b
Processor 0
Full Height
Half Length
x16
R4a
Processor 0
Low Profile
Half Length
x16
Slot 5
OCP
Processor 0
N/A
N/A
x16
Slot 31
RF1a
Processor 0
Full Height
Half Length
x16
RF1b (front OCP)
Processor 0
N/A
N/A
x16
Slot 32
RF1a (front Riser 1a)
Processor 1
Full Height
Half Length
x16
RF1b (front OCP)
Processor 1
N/A
N/A
x16
Slot 34
BOSS (front)
Processor 0
N/A
N/A
x4
Memory specifications
The PowerEdgeR670system supports the following memory specifications for
optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type
Rank
Capacity
Dual processors
Intel® Xeon 6 E- core
processor
Intel® Xeon 6 P-
core processor
Minimum system capacity
Maximum system capacity
Minimum system capacity
Maximum system capacity
RDIMM
1 R
16 GB
N/A
N/A
32 GB
256 GB
2 R
32 GB
64 GB
512 GB
64 GB
1 TB
64 GB
1 TB
2 TB
512 GB
2 TB
96 GB
N/A
N/A
1.5 TB
3 TB
128 GB
N/A
N/A
2 TB
4 TB
8 R
256 GB
N/A
N/A
8 TB
8 TB
NOTE:Only 32 GB allowed for 1 DIMM per
processor for E- core processors with limited features.
NOTE:Only 16 GB or 32 GB allowed for 1 DIMM per processor for P-
core processors with limited features.
NOTE: Memory
mirroring is supported only on P- core processors.
NOTE: Fault resilient mode (FRM) is supported only on P- core processors with 8 or 16
DIMMs per processor.
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets
Speed
32, 288-pin
6400 MT/s
NOTE:Memory DIMM slots are not hot
pluggable.
NOTE:The processor may reduce the
performance of the rated DIMM speed.
NOTE:DIMM mixing configurations are not
allowed. All DIMM slots must be populated with the exact same DIMMs (one Dell PN).
Storage controller specifications
The PowerEdgeR670system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards that are supported on
the system:
Supported storage
controller cards
Internal
controllers:
H965i Front DC-MHS
H365i Front DC-MHS
H975i Front DC-MHS
External controllers
H965e
HBA465e
Internal Boot
Boot Optimized
Storage Subsystem (BOSS-N1 DC-MHS): HWRAID 1, 2 x M.2 NVMe
SSDs or
M.2 Interposer
board (DC-MHS): 2 x M.2 NVMe SSDs or
USB
Software RAID: N/A
SAS Hot Bus Adapters
(HBA): HBA465e
NOTE: For the ESXi operating system, H975i is supported
on 9.0 or later versions.
Drives
The
PowerEdgeR670system supports:
Up to 8 x EDSFF E3.SNVMe drives
Up to 16 x EDSFF E3.S NVMe drives
Up to 20 x EDSFF E3.S NVMe drives
Up to 2 x EDSFF E3.S NVMe drives in the rear
Up to 8 x 2.5-inch SAS/SATA/ NVMe drives
Up to 8 x 2.5-inch Universal drives
Up to 10 x 2.5-inch SAS/SATA drives
NOTE: For more information about how to hot swap NVMe PCIe SSD device, see the
Dell Express Flash NVMe PCIe SSD User's Guide at
Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure
> Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product
> Documentation
> Manuals and Documents.
GPU Specifications
The
PowerEdgeR670system supports
Up to three NVIDIA L4 24 GB 72 W single-width GPUs
NOTE:The system supports up to 75 W of PCIe slot power without the use of an extra auxiliary power cable.
DPU Specifications
The PowerEdge R670 platform accommodates Data Processing
Units (DPUs). These units are system-on-chip solutions that combine ARM cores,
high-performance NICs, and programmable acceleration engines to offload and accelerate data
center infrastructure services.
Table 1. Supported Data Processing Units(DPU)
CardsThis table describes the feature and the specifications for the supported DPU cards in
R670
Feature
NVIDIA BlueField-3 2 x 200 GbE B3220
NVIDIA BlueFIeld-3 1 x 400 GbE B3140H
Type
Data Processing Units (DPU)
Data Processing Units (DPU)
Networking
2 x 200 GbE
1 x 400 GbE
Form Factor
FHHL
FHHL
Interface
PCIe Gen5 x16
PCIe Gen5 x16
Power Consumption
150 W
75 W
Compatible Risers
RC 1 (Slots 31,32), RC 5 (Slots 4,1)
RC 1 (Slots 31,32), RC 5 (Slots 4,1)
NIC port specifications
The PowerEdgeR670system supports Network Interface Controller (NIC) ports embedded on the Open Compute Project (OCP) NIC cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature
Specifications
OCP NIC 3.0 card
1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4, 100 GbE x 2
NOTE:The OCP NIC card is installed at the front or rear of the system, depending on the system I/O configuration.
Serial connector specifications
The PowerEdgeR670system system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant
.
The optional serial connector card is available only in front I/O configuration.
Top USB port on DC-SCM supports external DB9 Dongle.
USB ports specifications
Table 1. PowerEdgeR670 USB specificationsThe following table shows the USB specifications for the system:
Front
Rear
Internal
USB port type
No. of ports
USB port type
No. of ports
USB port type
No. of ports
USB 2.0-compliant port
One (optional)
USB 3.1-compliant ports
Two
Internal USB 3.1-compliant port
One
USB 2.0 Type C port
One
VGA ports specifications
The PowerEdgeR670system supports DB-15 VGA port on the rear I/O Datacenter Secure Control Module (DC-SCM).
Video specifications
The PowerEdgeR670system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution
Refresh rate (Hz)
Color depth (bits)
1024 x 768
60
8, 16, 32
1280 x 800
60
8, 16, 32
1280 x 1024
60
8, 16, 32
1360 x 768
60
8, 16, 32
1440 x 900
60
8, 16, 32
1600 x 900
60
8, 16, 32
1600 x 1200
60
8, 16, 32
1680 x 1050
60
8, 16, 32
1920 x 1080
60
8, 16, 32
1920 x 1200
60
8, 16, 32
Environmental specifications
NOTE:For additional information about environmental certifications, refer to the
Product Environmental Datasheet located with the
Manuals & Documents on
Dell Support.
Table 1. Continuous Operation
Specifications for ASHRAE A2 This table describes the operational climatic range for category
A2.
Operational/non-operational conditions
Allowable operations
Maximum temperature gradient (applies to both operation and
non-operation)
20 °C in an hour* (36 °F in an hour) and 5 °C in 15 minutes (9 °F
in 15 minutes), 5 °C in an hour* (9 °F in an hour) for tape
hardware.
Non-operational temperature limits
-40(-5)** to 65 °C (-40(23)** to 149 °F)
Non-operational humidity limits (non-condensing at all
times)
5% to 95% RH with 27 °C (80.6 °F) maximum dew point.
Maximum non-operational altitude
12,000 meters (39,370 feet)
Maximum operational altitude
3050 meters (10,006 feet)
Battery storage
See appendix C
NOTE:* Per ASHRAE thermal guidelines, these are not instantaneous
rates of temperature change.
NOTE:** Liquid filled components, or systems/solutions containing
liquid filled components are limited to approximately 5 °C above their freeze point.
At this time, the only authorized liquid coolant is Recochem PG25 with a freeze
point between -9 °C and -13 °C, therefore the lower non-operational temperature
limit is -5 °C. Components and systems/solutions that can contain liquid but do not
at the time of testing shall be tested to the -40 °C lower non-operational
temperature limit.
Table 2. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.38 Grms at 7 Hz to 250 Hz for 15 minutes (all six sides tested).
Maximum vibration
Specifications
Operating
0.21 Grms at 5 Hz to 500 Hz (all operation orientations)
Storage
1.38 Grms at 7 Hz to 250 Hz for 15 minutes (all six sides tested)
Table 3. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse
Specifications
Operating
Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage
Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination
Specifications
Air filtration: Conventional Data Center only
Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)
Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments
Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
