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Dell PowerEdge R6625: руководство по обслуживанию
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Dell PowerEdge R6625: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEge R7625 system.
Table 1. PowerEdgeR6625 chassis dimensionsThis table provides the dimensions of the system: R6625
Drives Xa Xb Y Za with bezel Za without bezel Zb Zc
0 drive482.0 mm (18.97 inches)434.0 mm (17.08 inches)42.8 mm (1.685 inches)35.84 mm (1.4 inches)With bezel22.0 mm (0.87 inches)Without bezel700.7 mm (27.58 inches)Ear to rear wall736.29 mm (28.99 inches)Ear to PSU handle
4 drives, 8 drives, 10 drives482.0 mm (18.97 inches)434.0 mm (17.08 inches)42.8 mm (1.685 inches)35.84 mm (1.4 inches)With bezel22.0 mm (0.87 inches)Without bezel751.48 mm (29.59 inches)Ear to rear wall787.05 mm (30.99 inches)Ear to PSU handle
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R6625 system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
A server with fully populated drives 20.4 kg (44.97 lb)
A server without drives and PSU installed 15.8 kg (34.83 lb)

Processor specifications

Table 1. PowerEdge R6625 processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
AMD EPYC 4th Generation 9004 Series processor Up to two

PSU specifications

The PowerEdgeR6625system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) Voltage AC DC Current (A)
High line wattage Low line wattage
800 W Mixed Mode Platinum 3000 50/60 100-240 V AC 800 W 800 W N/A 9.2-4.7 A
3000 N/A 240 V DC N/A N/A 800 W 3.8A
1100 W Mixed Mode Titanium 4125 50/60 100-240 V AC 1100 W 1050 W N/A 12-6.3 A
4125 N/A 240 V DC N/A N/A 1100 W 5.2 A
1100 W DC N/A 4265 N/A -48-(-60V) DC N/A N/A 1100 W 27 A
1400 W Mixed Mode Platinum 5250 50/60 100-240 V AC 1400 W 1050 W N/A 12-8
5250 N/A 240 V DC N/A N/A 1400 W 6.6
Titanium 5250 50/60 100-240 V AC 1400 W 1050 W N/A 12-8
5250 N/A 240 V DC N/A N/A 1400 W 6.5
Titanium 5250 50/60 277 V AC 1400 W 1050 W N/A 5.8
5250 N/A 336 V DC N/A N/A 1400 W 5.17
1800 W Mixed Mode Titanium 6610 50/60 200-240V AC 1800 W N/A N/A 10 A
6610 N/A 240V DC N/A N/A 1800 W 8.2 A
NOTE:If a system with AC 1400 W/1100 W PSUs operate at low line 100-120 V AC, then the power rating per PSU is derated to 1050 W.
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.
NOTE:
  • HLAC stands for High-Line AC, with a range of 200 - 240 V AC.
  • HVDC stands for High-Voltage DC, with 336 V DC.
Figure 1. PSU power cords
this image shows list of PSU power cords
Figure 2. APP 2006G1 power cable

this image shows list of PSU power cord

Table 2. PSU power cordsThe table lists the PSU power cords list .
Form factor Output Power cord
Redundant 60 mm 800 W AC C13
1100 W AC C13
1100 W -48 LVDC C13
1400 W AC C13
1400 W mixed mode 277 Vac and HVDC APP 2006G1
1800 W AC C15
NOTE:C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

Cooling fan specifications

The PowerEdgeR6625system supports up to four sets of standard or high-performance gold (HPR Gold) cooling fans.
NOTE:The R6625 includes dual fan module form factor. One set of fan module includes two fan body with one fan connector.
NOTE: R6625 allows use of Standard (STD) fans or High Performance Gold (HPR Gold) fans based on certain CPU TDP and drive configurations. HPR Gold fans provide a higher air flow rate through the system. For certain single CPU configurations only 3 sets of fan modules are required and in such configurations a fan blank is required to block fan bay 1.
Table 1. Cooling fan specificationsCooling fan specifications:
Fan type Abbreviation Also known as Label color Label image
Standard fan STD STD No label
Figure 1. Standard fan
This image shows Standard fan module.
High Performance Gold fan HPR Gold Very High Performance High Performance Gold Grade
NOTE:The new cooling fans come with the High Performance Gold Grade label. While the older cooling fans have the High Performance label.
Figure 2. HPR Gold fan
This image shows the High performance (Gold grade) fan
NOTE:For more information about the supported fan configuration or matrix, see Thermal Restriction Matrix.

Supported operating systems

The PowerEdge R6625 system supports the following operating system:

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
  • Citrix XenServer

For more information, go to OS support.

System battery specifications

The PowerEdge R6625 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R6625 system supports up to 4 x PCIe Slots (with x8 or x16 lanes) and three PCI express (PCIe), both Gen 4 and Gen 5 expansion cards.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
Configurations Expansion card riser PCIe slots Processor connection Height Length Slot width
Config1. R2A+R3A Riser 2A Slot 1 Processor 1 Low Profile Half Length x16
Slot 2 Processor 2 Low Profile Half Length x16
Riser 3A Slot 3 Processor 2 Low Profile Half Length x16
Config2. R2P + R3P Riser 2P Slot 1 Processor 1 Low Profile Half Length x16 (Gen5)
Slot 2 Processor 2 Low Profile Half Length x16
Riser 3P Slot 3 Processor 2 Low Profile Half Length x16 (Gen5)
Config3. R1P + R4P Riser 1P Slot 1 Processor 1 Full Height Half Length x16 (Gen5)
Riser 4P Slot 2 Processor 2 Full Height Half Length x16 (Gen5)
Config4. R2Q Riser 2Q Slot 1 Processor 1 Low Profile Half Length x16 (Gen5)
Slot 2 Processor 2 Low Profile Half Length x16 (Gen5)
Config5. R3P Riser 3P Slot 3 Processor 2 Low Profile Half Length x16 (Gen5)
Config6. R2S + R3S Riser 2S Slot 1 Processor 1 Low Profile Half Length x16 (Gen5)
Riser 3S Slot 3 Processor 2 Low Profile Half Length x16 (Gen5)
Config7. R2A Riser 2A Slot 1 Processor 1 Low Profile Half Length x16
Config8. R2A + R4 - E3 Paddle card Riser 2A Slot 1 Processor 1 Low Profile Half Length x16
Riser 2A Slot 2 Processor 2 Low Profile Half Length x16

Memory specifications

The PowerEdge R6625 system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single Processor Dual Processor
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
RDIMM Single Rank 16 GB 16 GB 192 GB 32 GB 384 GB
Dual Rank 32 GB 32 GB 384 GB 64 GB 768 GB
64 GB 64 GB 768 GB 128 GB 1.5 TB
96 GB 96 GB 1.15 TB 192 GB 2.3 TB
Quad Rank 128 GB 128 GB 1.5 TB 256 GB 3 TB
Octa Rank 256 GB 256 GB 3 TB 512 GB 6 TB
NOTE:256 GB RDIMM is not supported in 4 x 3.5-inch chassis configuration.
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module slots Speed
24, 288-pin 4800 MT/s
NOTE:DDR4 DIMM memory is not supported.
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:Do not mix DIMM module types within a memory channel. All must be RDIMM or 3DS RDIMM module types with same ECC configuration.
NOTE:Do not mix x4 and x8 DIMMs with a memory channel.

Storage controller specifications

The PowerEdge R6625 system supports the following controller card:
Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller card
Internal controller
  • PERC H755
  • PERC H755N
  • PERC H965i
  • PERC H355
External controllers
  • HBA355e
  • PERC H965e
  • HBA465e
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 SSDs
Software RAID
  • S160
SAS Hot Bus adapter
  • HBA355i
  • HBA465i

Drives

The PowerEdge R6625 system supports:
  • 4 x 3.5-inch hot-swappable SAS or SATA drives.
  • 8 x 2.5-inch NVMe SSD drives.
  • 10 x 2.5-inch hot-swappable SAS, SATA, or NVMe drives.
  • 14 x E3.S hot-swappable E3.S NVMe direct/ RAID SSD drives.
  • 16 x E3.S hot-swappable E3.S NVMe direct/ RAID SSD drives.
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

Table 1. PowerEdge R6625 USB specificationsThe following table shows the USB specifications for the system:
Front Rear Internal (optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 3.0-compliant port One Internal USB 3.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0-compliant port) One USB 2.0-compliant ports One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NIC port specifications

The PowerEdge R6625 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM card (optional) 1 GbE x 2
OCP card (OCP 3.0) (optional) 1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4
Management Interface Card (MIC) to support Dell Data Processing Unit (DPU) card (optional) 25 GbE x 2 or 100 GbE x 2
NOTE:The system allows either LOM card or an OCP card or both to be installed in the system.
NOTE: On the system board, the supported OCP PCIe width is x8; when x16 PCIe width is ins talled, it is downgraded to x8.
NOTE:The system allows either LOM card or MIC card to be installed in the system.

Serial connector specifications

The PowerEdge R6625 system supports one serial port on the system board, which is Data Terminal Equipment (DTE), 16550-compliant.

The optional serial connector card is installed similar to an expansion card filler bracket.

VGA ports specifications

The PowerEdge R6625 system supports two DB-15 VGA port one each on the front and back panel.

Video specifications

The PowerEdge R6625 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Excursion Limited Operation 5-35°C (41-95°F) Continuous Operation
35-40°C (95-104°F) 10% Annual Runtime
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Excursion Limited Operation 5-35°C (41-95°F) Continuous Operation
35-40°C (95-104°F) 10% Annual Runtime
40-45°C (104-113°F) 1% Annual Runtime
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Common Environmental Specifications for ASHRAE A2, A3 and A4 This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-40 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 7. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity
NOTE:This condition applies to data center and non-data center environments.
Table 8. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment) Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Notes
T-type HSK Air-cool HSK
Table 2. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HPR Gold High Performance Gold
HSK Heat sink
LP Low profile
FH Full height
Table 3. Thermal restriction matrix for air cooling configuration The table describes thermal restriction matrix for the PowerEdge R6625 system.
Configuration 4 x 3.5-inch SAS 10 x 2.5-inch SAS 16 E3 14 E3 No fPERC 8 x 2.5-inch NVMe No BP Ambient Temperature
Rear configuration 3 LP/ 2 FH Rear E3 3 LP/ 2 FH Rear 2 x 2.5-inch SAS Rear E3 3 LP/ 2 FH 2LP 2LP 3 LP/ 2 FH 2LP 3 LP
CPU TDP CPU cTDP Max Model Core Count Fan Type
210 W 240 W 9334 32 STD Fan STD Fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C
200 W 240 W 9254 24 STD Fan STD Fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C
200 W 240 W 9224 24 STD Fan STD Fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C
200 W 240 W 9124 16 STD Fan STD Fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C
290 W 300 W 9634 84 STD Fan* STD Fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan HPR Gold fan HPR Gold fan 35°C
290 W 300 W 9454 48 STD Fan* STD Fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan HPR Gold fan HPR Gold fan 35°C
280 W 300 W 9534 64 STD Fan* STD Fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan HPR Gold fan HPR Gold fan 35°C
280 W 300 W 9354 32 STD Fan* STD Fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan HPR Gold fan HPR Gold fan 35°C
320 W 400 W 9174F 16 N/A N/A N/A N/A N/A N/A HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* 35°C
320 W 400 W 9274F 24 N/A N/A N/A N/A N/A N/A HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* 35°C
320 W 400 W 9374F 32 N/A N/A N/A N/A N/A N/A HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* 35°C
360 W 400 W 9474F 48 N/A N/A N/A N/A N/A N/A N/A HPR Gold fan* HPR Gold fan* HPR Gold fan* 35°C
360 W 400 W 9554 64 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A 35°C
360 W 400 W 9654 96 N/A N/A N/A N/A N/A N/A HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* 35°C
360 W 400 W 9734 112 N/A N/A N/A N/A N/A N/A HPR Gold fan* HPR Gold fan* HPR Gold fan* HPR Gold fan* 35°C
360 W 400 W 9754 128 N/A N/A N/A N/A N/A N/A N/A HPR Gold fan* HPR Gold fan* HPR Gold fan* 35°C
NOTE:
  • * Supported ambient temperature is 30°C.
  • Three dual fan modules are required for single processor, and four dual fan modules are required for dual processor system.
  • All air-cooling configurations require CPU shroud.
  • OCP Shroud is required to be installed with No Riser Configuration (RC0) when OCP card is present.
  • For CPU power > 240 W, DIMM Blank is required to be installed in all empty DIMM slots. For single processor configuration, it follows the same rule for DIMM blanks support.
  • For single processor configuration with 3 sets of fan, Fan1 location requires fan blank to be installed if there is no fan.
  • For air cooling with 2 x 2.5-inch rear drive configuration, it is required to install Rear Drive Shroud in the system.
Table 4. Thermal restriction matrix for memory configuration The table describes thermal restriction matrix for the PowerEdge R6625 system.
NOTE: For CPU power > 240 W, DIMM Blank is required to be installed in all empty DIMM slots.
Configuration 4 x 3.5-inch SAS 10 x 2.5-inch SAS 16 E3 14 E3 8 x 2.5-inch NVMe No BP
Rear configuration 3 LP/ 2 FH Rear E3 3 LP/ 2 FH Rear 2 x 2.5-inch SAS 3 LP/ 2 FH 2LP 2LP 3 LP/ 2 FH 2LP 3 LP
DIMM Configuration STD Fan HPR Gold fan
16 GB RDIMM 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
32 GB RDIMM 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
64 GB RDIMM 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
96 GB RDIMM 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
128 GB RDIMM N/A N/A 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
256 GB RDIMM N/A N/A 30°C 30°C 30°C 30°C 30°C 30°C 30°C 30°C

Thermal restriction for Direct Liquid Cooling

There are no thermal restriction to support all processors for liquid cooling configuration.

NOTE:DIMM blank is not required for liquid cooling configuration. DLC does not support single processor configuration.

Extended Ambient Temperature Guidelines

The below tables provides the extended ambient temperature guidelines for various configurations listed below.

Table 1. Extended Ambient Temperature Guideline: 10 x 2.5-inch storage configuration The table below shows the extended temperature guideline for a 10 x 2.5-inch chassis.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted. Dell PowerEdge Server Extended Ambient 40°C Operating Support (ASHRAE A3 compliant) Dell PowerEdge Server Extended Ambient 45°C Operating Support (ASHRAE A4 compliant)
CPU > 300 W are not supported 64 Gb or greater capacity RDIMMs are not supported 64 Gb or greater capacity RDIMMs are not supported
Maximum 30°C for CPU > 240 W CPU > 195 W are not supported CPU > 155 W are not supported
Rear drives are not supported Rear drives are not supported
2.5-inch NVMe storage are not supported 2.5-inch NVMe storage are not supported
A2 GPU is not supported BOSS-N1 is not supported
Two power supplies are required. System performance may be reduced in the event of a PSU failure A2 GPU is not supported
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported Two power supplies are required. System performance may be reduced in the event of a PSU failure
85°C active optics cable or DAC cable is required Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported
OCP 3.0 are not supported
85°C active optics cable or DAC cable is required
Table 2. Extended Ambient Temperature Guideline: No Backplane Configuration The table below shows the extended temperature guideline for no backplane chassis.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted. Dell PowerEdge Server Extended Ambient 40°C Operating Support (ASHRAE A3 compliant) Dell PowerEdge Server Extended Ambient 45°C Operating Support (ASHRAE A4 compliant)
Maximum 30°C for CPU > 300 W 64 Gb or greater capacity RDIMMs are not supported 64 Gb or greater capacity RDIMMs are not supported
CPU > 240 W are not supported CPU > 195 W are not supported
A2 GPU is not supported BOSS-N1 is not supported
Two power supplies are required. System performance may be reduced in the event of a PSU failure A2 GPU is not supported
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported. Two power supplies are required. System performance may be reduced in the event of a PSU failure
85°C active optics cable or DAC cable is required Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
OCP 3.0 are not supported
85°C active optics cable or DAC cable is required
Table 3. Extended Ambient Temperature Guideline: Smart Flow 8 x 2.5-inch storage configuration The table below shows the extended temperature guideline for a 8 x 2.5-inch chassis.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted. Dell PowerEdge Server Extended Ambient 40°C Operating Support (ASHRAE A3 compliant) Dell PowerEdge Server Extended Ambient 45°C Operating Support (ASHRAE A4 compliant)
Maximum 30°C for CPU > 300 W 64 Gb or greater capacity RDIMMs are not supported 64 Gb or greater capacity RDIMMs are not supported
CPU > 240 W are not supported CPU > 195 W are not supported
2.5-inch NVMe storage are not supported 2.5-inch NVMe storage are not supported
A2 GPU is not supported BOSS-N1 is not supported
Two power supplies are required. System performance may be reduced in the event of a PSU failure A2 GPU is not supported
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported Two power supplies are required. System performance may be reduced in the event of a PSU failure
85°C active optics cable or DAC cable is required Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported
OCP 3.0 are not supported
85°C active optics cable or DAC cable is required
Table 4. Extended Ambient Temperature Guideline: 4 x 3.5-inch storage configuration The table below shows the extended temperature guideline for a 4 x 3.5-inch chassis.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted. Dell PowerEdge Server Extended Ambient 40°C Operating Support (ASHRAE A3 compliant) Dell PowerEdge Server Extended Ambient 45°C Operating Support (ASHRAE A4 compliant)
CPU > 300W are not supported 32 Gb or greater capacity RDIMMs are not supported 32 Gb or greater capacity RDIMMs are not supported
Maximum 30°C for CPU > 240W CPU > 195 W are not supported CPU > 155 W are not supported
Rear drives are not supported Rear drives are not supported
A2 GPU is not supported BOSS-N1 is not supported
Two power supplies are required. System performance may be reduced in the event of a PSU failure A2 GPU is not supported
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported Two power supplies are required. System performance may be reduced in the event of a PSU failure
85°C active optics cable or DAC cable is required Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported
85°C active optics cable or DAC cable is required
OCP 3.0 are not supported
Table 5. Extended Ambient Temperature Guideline: Direct Liquid Cooling (DLC) The table below shows the extended temperature guideline for DLC.
Dell PowerEdge Server Extended Ambient 40°C Operating Support (ASHRAE A3 compliant) Dell PowerEdge Server Extended Ambient 45°C Operating Support (ASHRAE A4 compliant)
Rear drives are not supported Rear drives are not supported
64 Gb or greater capacity RDIMMs are not supported 64 Gb or greater capacity RDIMMs are not supported
A2 GPU is not supported BOSS-N1 is not supported
Two power supplies are required. System performance may be reduced in the event of a PSU failure A2 GPU is not supported
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported Two power supplies are required. System performance may be reduced in the event of a PSU failure
85°C active optics cable or DAC cable is required Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported
OCP 3.0 are not supported
85°C active optics cable or DAC cable is required
Table 6. Extended Ambient Temperature Guideline: EDSFF Chassis The table below shows the extended temperature guideline for EDSFF Chassis
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted. Dell PowerEdge Server Extended Ambient 40°C Operating Support (ASHRAE A3 compliant) Dell PowerEdge Server Extended Ambient 45°C Operating Support (ASHRAE A4 compliant)
CPU > 300W are not supported 64 Gb or greater capacity RDIMMs are not supported 32 Gb or greater capacity RDIMMs are not supported
Maximum 30°C for CPU > 240W CPU > 195 W are not supported CPU > 195 W are not supported
NVMe storage is not supported 2.5-inch NVMe storage is not supported
A2 GPU is not supported BOSS-N1 is not supported
Two power supplies are required. System performance may be reduced in the event of a PSU failure A2 GPU is not supported
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported Two power supplies are required. System performance may be reduced in the event of a PSU failure
85°C active optics cable is required Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported
85°C active optics cable is required
OCP 3.0 are not supported