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Dell PowerEdge R6615: руководство по обслуживанию
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Dell PowerEdge R6615: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEge R7625 system.
Table 1. PowerEdgeR6615 chassis dimensionsThis table provides the dimensions of the system:
Drives Xa Xb Y Za with bezel Za without bezel Zb Zc
0 drive482.0 mm (18.97 inches)434.0 mm (17.08 inches)42.8 mm (1.685 inches)35.84 mm (1.4 inches)With bezel22.0 mm (0.87 inches)Without bezel700.7 mm (27.58 inches)Ear to rear wall736.29 mm (28.99 inches)Ear to PSU handle
4 drives, 8 drives, 10 drives482.0 mm (18.97 inches)434.0 mm (17.08 inches)42.8 mm (1.685 inches)35.84 mm (1.4 inches)With bezel22.0 mm (0.87 inches)Without bezel751.48 mm (29.59 inches)Ear to rear wall787.05 mm (30.99 inches)Ear to PSU handle
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R6615 system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
A server with fully populated drives 20.2 kg (44.53 lb)
A server without drives and PSU installed 17.4 kg (38.36 lb)

Processor specifications

Table 1. PowerEdge R6615 processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
AMD EPYC 4th Generation 9004 Series processor One

PSU specifications

The PowerEdgeR6615system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) AC Voltage DC Voltage Current (A)
200—240 V 100—120 V 277 V 240 V - (48—60) V 336 V
700 W mixed mode Titanium 2625 50/60 700 W N/A N/A N/A N/A N/A 4.1
2625 N/A N/A N/A N/A 700 W N/A N/A 3.4
800 W mixed mode Platinum 3000 50/60 800 W 800 W N/A N/A N/A N/A 9.2—4.7
3000 N/A N/A N/A N/A 800 W N/A N/A 3.8
1100 W mixed mode Titanium 4100 50/60 1100 W 1050 W N/A N/A N/A N/A 12—6.3
4100 N/A N/A N/A N/A 1100 W N/A N/A 5.2
1400 W mixed mode Platinum 5250 50/60 1400 W 1050 W N/A N/A N/A N/A 12—8
5250 N/A N/A N/A N/A 1400 W N/A N/A 6.6
Titanium 5250 50/60 1400 W 1050 W N/A N/A N/A N/A 12—8
5250 N/A N/A N/A N/A 1400 W N/A N/A 6.5
Titanium 5250 50/60 1400 W 1050 W 1400 W N/A N/A N/A 5.8
5250 N/A N/A N/A N/A 1400 W N/A 1400 W 5.17
1800 W mixed mode Titanium 6750 50/60 1800 N/A N/A N/A N/A N/A 10
6750 N/A N/A N/A N/A 1800 W N/A N/A 8.2
1100 W -48 V DC N/A 4265 N/A N/A N/A N/A N/A 1100 W N/A 27
NOTE: If a system with AC 1400 W or 1100 W PSUs operate at low line 100-120 V AC, then the power rating per PSU is derated to 1050 W.
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.
NOTE:
  • HLAC stands for High-Line AC, with a range of 200 - 240 V AC.
  • HVDC stands for High-Voltage DC, with 336 V DC.
Figure 1. PSU power cables

this image shows list of PSU power cords

Figure 2. APP 2006G1 power cable

this image shows list of PSU power cord

Table 2. PSU power cords This table lists the PSU power cords list .
Form factor Output Power cable
Redundant 60 mm 700 W mixed mode HLAC C13
800 W mixed mode C13
1100 W mixed mode C13
1400 W mixed mode C13
1400 W mixed mode 277 Vac and HVDC APP 2006G1
1800 W mixed mode HLAC C15
NOTE:C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

Cooling fan specifications

The PowerEdgeR6615system supports up to four high performance gold (HPR Gold) cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
Standard fans STD STD fans No labelThis shows the Standard fan image.
High Performance Gold fansHPR Gold VHP fans Goldthis image shows HPR Gold fan

Supported operating systems

The PowerEdge R6615 system supports the following operating system:

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
  • Citrix XenServer

For more information, go to OS support.

System battery specifications

The PowerEdge R6615 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R6615 system supports up to three PCI express (PCIe) (two Full Height or three Low Profile Gen 4/Gen 5 capable + OCP) Gen5 slots on the system board.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot Expansion card riser Processor Connection Height Length Slot width
Slot 1 R1Q Processor 1 Full Height Half Length x16 (Gen 5)
Slot 1 R2A Processor 1 Low Profile Half Length x8 (Gen 4)
Slot 2 Processor 1 Low Profile Half Length x8 (Gen 4)
Slot 1 R2T Processor 1 Low Profile Half Length x16 (Gen 5)
Slot 2 Processor 1 Low Profile Half Length x16 (Gen 4)
Slot 1 R2U Processor 1 Low Profile Half Length x16 (Gen 5)
Slot 3 R3A Processor 1 Low Profile Half Length x16 (Gen 4)
Slot 3 R3P Processor 1 Low Profile Half Length x16 (Gen 5)
Slot 3 R3S Processor 1 Low Profile Half Length x16 (Gen 5)
Slot 2 R4P Processor 1 Full Height Half Length x16 (Gen 5)

PCIe Riser Configuration

The following table describes the supported expansion cards configuration.

Table 1. PCIe Riser ConfigurationThe table shows the PCIe riser configuration.
Config Number RSR Configuration Number of CPUs PERC type supported Rear Storage Possible x8 CPU 1, Slot 1 LP x8 CPU 1, Slot 2 LP x16 CPU 1, Slot 1 LP x16 CPU 1, Slot 2 LP x16 CPU 1, Slot 3 LP x16 CPU 1, Slot 1 FH x16 CPU 1, Slot 2 FH
0 No RSR 1 Front PERC No 0 0 0 0 0 0 0
1 R2A+R3A 1 Front PERC No 1 (Gen 4) 1 (Gen 4) 0 0 1 (Gen 4) 0 0
2 R2T+R3P 1 Front PERC No 0 0 1 (Gen 5) 1 (Gen 4) 1 (Gen 5) 0 0
3 R1Q +R4P 1 Front PERC No 0 0 0 0 0 1 (Gen 5) 1 (Gen 5)
4 R2T 1 Front PERC No 0 0 1 (Gen 5) 1 (Gen 4) 0 0 0
5 R3P 1 Front PERC Yes 0 0 0 0 1 (Gen 5) 0 0
6 R2A 1 Front PERC No 1 (Gen 4) 1 (Gen 4) 0 0 0 0 0
7 R2U+R3S 1 Front PERC Yes 0 0 1 (Gen 5) 0 1 (Gen 5) 0 0
8 R2T+R3A 1 Front PERC Yes 0 0 1 (Gen 5) 1 (Gen 4) 1 (Gen 4) 0 0
NOTE:The expansion-card slots are not hot-swappable.

Memory specifications

The PowerEdge R6615 system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single Processor
Minimum system capacity Maximum system capacity
DDR5 RDIMM Single rank 16 GB 16 GB 192 GB
Dual rank 32 GB 32 GB 384 GB
Dual rank 64 GB 64 GB 768 GB
Dual rank 96 GB 96 GB 1152 GB
Dual rank 128 GB 128 GB 1536 GB
Quad rank 128 GB 128 GB 1536 GB
Octa rank 256 GB 256 GB 3076 GB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
12, 288-pin 6400 MT/s
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:Memory DIMMs used must be of the same type and capacity. Mixing of different capacity DIMMs are not supported.
NOTE:The speed of 6400 MT/s will be clocked down to match the system CPU max DDR frequency (1 DPC) at 4800 MT/s. For more information, refer R6615 Technical Guide at PowerEdge Manuals.

Storage controller specifications

The PowerEdge R6615 system supports the following controller cards:
Table 1. Storage controller cards This table provides the storage controller cards supported on the system:
Supported storage controller card
Internal controller
  • PERC H965i
  • PERC H755N
  • PERC H755
  • PERC H355
External controllers
  • HBA355e
  • PERC H965e
  • HBA465e
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSDs
Software RAID
  • S160
SAS Hot Bus adapter
  • HBA355i
  • HBA465i

Drives

The PowerEdge R6615 system supports:
  • 4 x 3.5-inch hot-swappable SAS or SATA drives
  • 8 x 2.5-inch hot-swappable NVMe drives
  • 10 x 2.5-inch hot-swappable SAS, SATA or NVMe drives
  • 14 x EDSFF E3.S NVMe Gen5 drives
  • 16 x EDSFF E3.S NVMe Gen5 drives
  • 2 x 2.5-inch hot-swappable SAS, SATA rear drives
  • 2 x EDSFF E3.S NVMe Gen5 rear drives
  • Zero drive
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

Table 1. PowerEdgeR6615 USB specificationsThe following table shows the USB specifications for the system:
Front Rear Internal (optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 3.0-compliant port One Internal USB 3.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0-compliant port) One USB 2.0-compliant ports One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
Figure 1. R6615 Front USB

R6615 Front USB.

Figure 2. R6615 Rear USB

R6615 Rear USB.

Figure 3. Internal USB Port

Internal USB Port.

NIC port specifications

The PowerEdge R6615 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM card (optional) 1 GB x 2
OCP card 3.0 (optional) 1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4, 50 GbE x 2, 100 GbE x 2
Management Interface Card (MIC) to support Dell Data Processing Unit (DPU) card (optional) 25 GbE x 2, or 100 GbE x 2
NOTE:The system allows either LOM card or an OCP card or both to be installed in the system.
NOTE:On the system board, the supported OCP PCIe width is x8; when x16 PCIe width is installed, it is downgraded to x8.
NOTE:The system allows either LOM card or MIC card to be installed in the system.

Serial connector specifications

The PowerEdge R6615 system supports one serial port on the system board, which is Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

VGA ports specifications

The PowerEdge R6615 system supports DB-15 VGA port on the front panel and on the rear I/O board (optional for Direct Liquid Cooling)..

Video specifications

The PowerEdge R6615 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support.
Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10 to 35°C (50 to 95°F) with no direct sunlight on the platform
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5 to 40°C (41 to 104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature Specifications
Allowable operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5 to 45°C (41 to 113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Common Environmental Specifications This table describes the shared requirements across all environmental categories.
Allowable operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-40 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,050 meters (10,006 feet)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 7. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity
NOTE:This condition applies to data center and non-data center environments.
Table 8. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment) Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard performance
HPR Gold High performance (gold grade)
EXT. HSK. External Heat sink
LP Low profile
FH Full height
DLC Direct liquid cooling
Table 2. Air cooling: Thermal restriction matrix (non-GPU) The table describes the thermal restriction matrix for the PowerEdge R6615 system.
Configuration No BP 8 x 2.5-inch U.2 4 x 3.5-inch 10 x 2.5-inch SAS 10 x 2.5-inch NVMe

16 x E3.S

14 x E3.S
Rear storage No Rear Drives No Rear Drives No Rear Drives E3.S x 2 No Rear Drives 2.5-inch SAS x 2 E3.S x 2 No Rear Drives E3.S x 2 No Rear Drives
cTDP Model Core Count
CPU TDP/cTDP 240 W 9334 32 35°C 35°C 35°C 30°C 35°C 35°C 35°C 35°C 35°C 35°C
240 W 9224 24 35°C 35°C 35°C 30°C 35°C 35°C 35°C 35°C 35°C 35°C
240 W 9254 24 35°C 35°C 35°C 30°C 35°C 35°C 35°C 35°C 35°C 35°C
240 W 9124 16 35°C 35°C 35°C 30°C 35°C 35°C 35°C 35°C 35°C 35°C
300 W 9634 84 35°C 35°C Not Supported 30°C 30°C 30°C 30°C 30°C 30°C
300 W 9534 64 35°C 35°C 30°C 30°C 30°C 30°C 30°C 30°C
300 W 9454/9454P 48 35°C 35°C 30°C 30°C 30°C 30°C 30°C 30°C
300 W 9354/9354P 32 35°C 35°C 30°C 30°C 30°C 30°C 30°C 30°C
400 W 9654/9654P 96 30°C 30°C Require DLC Not Supported Not Supported
400 W 9554/9554P 64 Require DLC
400 W 9474F 48
400 W 9374F 32 30°C 30°C
400 W 9274F 21 30°C 30°C 30°C
400 W 9174F 16 30°C 30°C 30°C
400 W 9754 128 Require DLC Not Supported
400 W 9734 112 30°C 30°C 30°C
400 W 9684X 96 Require DLC Not Supported
400 W 9384X 32 30°C 30°C 30°C
400 W 9184X 16 30°C 30°C 30°C
Memory 16 GB RDIMM 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
32 GB RDIMM 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
64 GB RDIMM 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
96 GB RDIMM 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
128 GB RDIMM 35°C 35°C 35°C 30°C 35°C 35°C 35°C 35°C 35°C 35°C
256 GB RDIMM 35°C 35°C 30°C Not Supported 35°C 30°C 30°C 35°C 30°C 35°C
Table 3. Air cooling: Thermal restriction matrix (GPU Configuration) The table describes the thermal restriction matrix for the PowerEdge R6615 system with GPU.
Configuration No BP 8 x 2.5-inch U.2 4 x 3.5-inch 10 x 2.5-inch

16 x E3.S

14 x E3.S
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives No Rear Drives
cTDP
CPU TDP/cTDP 240 W Not Supported 35°C 30°C 35°C 35°C
300 W 30°C Not Supported 30°C 30°C
400 W Not Supported
Memory 16 GB RDIMM 35°C 30°C 35°C 35°C
32 GB RDIMM 35°C 30°C 35°C 35°C
64 GB RDIMM 35°C 30°C 35°C 35°C
96 GB RDIMM 35°C 30°C 35°C 35°C
128 GB RDIMM 35°C 30°C 35°C 35°C
256 GB RDIMM 35°C 30°C 35°C 35°C
NOTE:For fan type selection, refer the solution strategy under cooling components.

Thermal air restrictions

Table 1. ASHRAE A3/A4 environment - Air coolingThe table shows the ASHRAE A3/A4 environment - Air cooling.
ASHRAE ASHRAE A3/40°C ASHRAE A4/45°C
Front Storage

3.5” config. is not supported

2.5” x 10 is not supported

NVME not supported

E3.S config. is not supported
Fan type HPR Gold fans are required
CPU CPU TDP > 240 W are not supported CPU TDP > 200 W are not supported
Memory 128 GB and higher capacity RDIMMS are not supported.
PCIe card Non-Dell qualified peripheral cards and consuming power greater than 25 W are not supported
GPU GPU cards are not supported
Rear storage Not Supported
OCP Support with 85C active optic cable Not Supported
PSU Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure
BOSS-N1 Supported Not Supported
Table 2. ASHRAE A3/A4 environment - Liquid coolingThe table shows the ASHRAE A3/A4 environment - Liquid cooling.
ASHRAE ASHRAE A3/40°C ASHRAE A4/45°C
Front Storage

3.5” config. is not supported

NVMe is not supported

E3.S config. is not supported
Fan type HPR Gold fans are required
Memory 128 GB and higher capacity RDIMMS are not supported.
PCIe card Non-Dell qualified peripheral cards and consuming power greater than 25 W are not supported
GPU GPU cards are not supported
Rear storage Not Supported
OCP Support with 85C active optic cable Not Supported
PSU Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure
BOSS-N1 Supported Not Supported