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Dell PowerEdge R660xs: руководство по обслуживанию
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Dell PowerEdge R660xs: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions

The image shows system dimensions.

Table 1. PowerEdgeR660xs chassis dimensionsThis table provides the dimensions of the system:
Drives Xa Xb Y Za Zb Zc
10 or 4 SATA/SAS/NVMe drives 482 mm (18.976 inches) 434.0 mm (17.08 inches) 42.8 mm (1.685 inches) 35.84 mm (1.41 inches)With bezel

22 mm (0.86 inches)Without bezel

677.1 mm (26.65 inches)

Ear to rear wall

712.95 mm (28.05 inches)

Ear to PSU handle without velcro strap

8 NVMe drives
8 SATA/SAS drives or No backplane configuration 482 mm (18.976 inches) 434.0 mm (17.08 inches) 42.8 mm (1.685 inches) 35.84 mm (1.41 inches)With bezel

22 mm (0.86 inches)Without bezel

626.42 mm (24.66 inches)

Ear to rear wall

661.37 mm (26.03 inches)

Ear to PSU handle without velcro strap

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R660xs system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
10 x 2.5-inch 18.74 kg (41.31 pound)
4 x 3.5-inch 19.45 Kg (55.33 pound)
8 x 2.5-inch 18.25 kg (40.23 pound)
No backplane configuration 15.38 kg (33.90 pound)
Table 2. PowerEdge system weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight Description
40 pounds - 70 pounds Recommend two person to lift
70 pounds- 120 pounds Recommend three person to lift
≥ 121 pounds Recommend to use a server-lift

Processor specifications

Table 1. PowerEdge R660xs processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
Up to two 5th Generation Intel Xeon Scalable processors with up to 28 cores and 4th Generation Intel Xeon Scalable processors with up to 32 cores Up to two

PSU specifications

The PowerEdgeR660xssystem supports up to two AC or DC power supply units (PSUs).

Table 1. R660xs PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) AC Voltage DC Voltage Current (A)
100–120 V 200–240 V 277 V 240 V 336 V - (48 V — 60 V)
600 W mixed mode Platinum 2250 50/60 600 W 600 W N/A N/A N/A N/A 7.1 A - 3.6 A
N/A N/A N/A N/A N/A 600 W N/A N/A 2.9 A
700 W mixed mode HLAC Titanium 2625 50/60 N/A 700 W N/A N/A N/A N/A 4.1 A
N/A N/A N/A N/A N/A 700 W N/A N/A 3.4 A
800 W mixed mode Platinum 3000 50/60 800 W 800 W N/A N/A N/A N/A 9.2 A - 4.7 A
N/A N/A N/A N/A N/A 800 W N/A N/A 3.8 A
1100 W -48 V DC N/A 4265 N/A N/A N/A N/A N/A N/A 1100 W 27 A
1100 W mixed mode Titanium 4125 50/60 1050 W 1100 W N/A N/A N/A N/A 12 A - 6.3 A
N/A N/A N/A N/A N/A 1100 W N/A N/A 5.2 A
1400 W mixed mode Titanium 5250 50/60 1050 W 1400 W N/A N/A N/A N/A 12 A - 8 A
N/A N/A N/A N/A N/A 1400 W N/A N/A 6.5 A
1400 W mixed mode Platinum 5250 50/60 1050 W 1400 W N/A N/A N/A N/A 12 A - 8 A
N/A N/A N/A N/A N/A 1400 W N/A N/A 6.6 A
1400 W 277 V AC and HVDC Titanium 5250 50/60 N/A N/A 1400 W N/A N/A N/A 5.8 A
5250 N/A N/A N/A N/A N/A 1400 W N/A 5.17 A
1800 W mixed mode HLAC Titanium 6610 50/60 N/A 1800 W N/A N/A N/A N/A 10 A
N/A N/A N/A N/A N/A 1800 W N/A N/A 8.2 A
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:HLAC stands for High-Line AC, with a range of 200 - 240V AC. HVDC stands for High-Voltage DC, with 336V DC.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.
Figure 1. PSU power cords
this image shows list of PSU power cords
Figure 2. APP 2006G1 power cord

This image shows APP 2006G1power cord.

Figure 3. Lotes DC PSU connector

This images shows Lotes DC PSU connector

Table 2. PSU power cordsThe table lists the PSU power cords list .
Form factor Output Power cord
Redundant 60 mm 600 W Mixed Mode C13
700 W Mixed Mode HLAC C13
800 W Mixed Mode C13
1100 W Mixed Mode C13
1100 W -48 V DC Lotes DC PSU connector
1400 W Mixed Mode C13
1400 W 277 VAC and HVDC APP 2006G1
1800 W Mixed Mode HLAC C15
NOTE:C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

Supported operating systems

The PowerEdge R660xs system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware vSAN/ESXi

For more information, go to Operating System Manuals.

Cooling fan specifications

The PowerEdgeR660xssystem supports up to seven, hot-swappable Standard fans (STD) and High performance (HPR) gold grade fans.

Figure 1. Hot swappable Standard fan
This image shows Hot swappable Standard fan.
Figure 2. Hot swappable High performance (HPR) gold grade fan
This image shows Hot swappable High performance (HPR) gold grade fan.

System battery specifications

The PowerEdge R660xs system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R660xs system supports up to three PCI express (PCIe) Gen 5 expansion cards.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot Riser PCIe slot height PCIe slot length PCIe slot width
Slot 1 Riser 1a Low Profile Half length x16
Riser 1b Low Profile Half length x8
Slot 2 and 3 Riser 2a Low Profile Half length x8 + x8
Slot 3 Riser 2c Low Profile Half length x16
Slot 2 Riser 2d Low Profile Half length x8
Riser 2e Low Profile Half length x16

Memory specifications

The PowerEdge R660xs system supports the following memory specifications for optimized operation.
Table 1. Memory specifications for 4th Generation Intel Xeon Scalable ProcessorsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum memory capacity Maximum memory capacity Minimum memory capacity Maximum memory capacity
RDIMM Single rank 16 GB 16 GB 128 GB 32 GB 256 GB
Dual rank 32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB
Table 2. Memory module sockets for 4th Generation Intel Xeon Scalable ProcessorsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
16, 288-pin 4000 MT/s, 4400 MT/s, 4800 MT/s
Table 3. Memory specifications for 5th Generation Intel Xeon Scalable ProcessorsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum memory capacity Maximum memory capacity Minimum memory capacity Maximum memory capacity
RDIMM Single rank 16 GB 16 GB 128 GB 32 GB 256 GB
Dual rank 32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB
96 GB 96 GB 768 GB 192 GB 1.5 TB
Table 4. Memory module sockets for 5th Generation Intel Xeon Scalable ProcessorsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
16, 288-pin 4000 MT/s, 4400 MT/s, 4800 MT/s, 5200 MT/s, 5600 MT/s
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:The processor may reduce the performance of the rated DIMM speed.

Storage controller specifications

The PowerEdge R660xs system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers
  • PERC H965i
  • PERC H755N
  • PERC H755
  • PERC H355
  • HBA355i
  • HBA465i
External controllers
  • HBA355e
  • HBA465e
  • HBA965e
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 1, 2 x M.2 SSDs
  • USB
Software RAID
  • S160

Drives

The PowerEdge R660xs system supports:
  • 0 drive
  • Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) drives
  • Up to 8 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives
  • Up to 10 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives
  • Up to 2 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives on rear of the system
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support > Browse all products > Infrastructure > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

NIC port specifications

The PowerEdge R660xs system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM 1 GB x 2
OCP card (OCP 3.0) (Optional) 1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4

Serial connector specifications

The PowerEdge R660xs system supports one optional card type serial connector on rear of the system, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The process to install the optional serial connector card is similar to an expansion card filler bracket.

USB ports specifications

Table 1. PowerEdge R660xs system USB ports specifications The following table shows the USB ports specifications :
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 2.0-compliant port One Internal USB 3.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0-compliant port) One USB 3.0-compliant port One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
NOTE:The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.
NOTE:The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

VGA ports specifications

The PowerEdge R660xs system supports two DB-15 VGA ports, one each on the front and rear panels of the system.

Video specifications

The PowerEdge R660xs system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options for the systemThis table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support.
Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Operational climatic range for category A2 Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C (10.4°F) minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Operational climatic range for category A3 Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C (10.4°F) minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Operational climatic range for category A4 Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Continuous Operation Specifications for Rugged Environment This table describes the operational climatic range for category A4.
Operational climatic range for category A4 Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
Table 5. Common Environmental Specifications for ASHRAE A2, A3, A4, and Rugged This table describes the shared requirements across all categories.
Environmental Specifications for ASHRAE A2, A3, A4, and Rugged Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40°C to 65°C (-104°F to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 6. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 7. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.

Table 8. Particulate and gaseous contamination specifications This table shows particulate and gaseous contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE:The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust zinc whiskers, or other conductive particles.
NOTE: This condition applies to data center and non-data center environments.
Corrosive dust

Air must be free of corrosive dust.

Residual dust present in the air must have a deliquescent point less than 60% relative humidity.

NOTE:This condition applies to data center and non-data center environments.
Table 9. Gaseous contamination specificationsThis table shows gaseous contamination specifications
Gaseous contamination Specification
Copper coupon corrosion rate <300A/month per class G1 as defines by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200A/month as defined by ANSI/ISA71.04-2013

Thermal restrictions

Table 1. Thermal restriction matrix for processor and fans This table describes the thermal restriction for processor and fans.
Configuration / Processor TDP No Backplane 4 x 3.5-inch SAS/SATA 8 x 2.5-inch SAS3/SATA
Rear Storage Rear 3 LP Rear 3 LP 1 LP + 2 Rear drives Rear 3 LP Rear 1 LP + 2 Rear drives
125 W STD fan

STD HSK

45 °C

STD fan

STD HSK

40 °C

STD fan

STD HSK

35 °C

STD fan

STD HSK

40 °C

HPR (Gold) fan

STD HSK

35 °C

135 W STD fan

STD HSK

45 °C

STD fan

STD HSK

40 °C

STD fan

STD HSK

35 °C

STD fan

STD HSK

40 °C

HPR (Gold) fan

STD HSK

35 °C

150 W STD fan

STD HSK

40 °C

STD fan

STD HSK

40 °C

STD fan

STD HSK

35 °C

STD fan

STD HSK

40 °C

HPR (Gold) fan

STD HSK

35 °C

165 W STD fan

HPR HSK

40 °C

STD fan

HPR HSK

35 °C

STD fan

HPR HSK

35 °C

STD fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

185 W STD fan

HPR HSK

40 °C

STD fan

HPR HSK

35 °C

STD fan

HPR HSK

35 °C

STD fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

195 W STD fan

HPR HSK

35 °C

STD fan

HPR HSK

35 °C

STD fan

HPR HSK

35 °C

****HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

205 W STD fan

HPR HSK

35 °C

STD fan

HPR HSK

35 °C

STD fan

HPR HSK

35 °C

STD fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

225 W STD fan

HPR HSK

35 °C

* * HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

Table 2. Thermal restriction matrix for processor and fans This table describes the thermal restriction for processor and fans.
Configuration / Processor TDP 10 x 2.5-inch SAS4/SATA 8 x 2.5-inch NVMe 10 x 2.5-inch NVMe
Rear Storage Rear 3 LP 1 LP + 2 Rear drives Rear 3 LP 1 LP + 2 Rear drives Rear 3 LP 1 LP + 2 Rear drives
125 W HPR (Gold) fan

STD HSK

40 °C

HPR (Gold) fan

STD HSK

35 °C

HPR (Gold) fan

STD HSK

40 °C

HPR (Gold) fan

STD HSK

35 °C

HPR (Gold) fan

STD HSK

40 °C

HPR (Gold) fan

STD HSK

35 °C

135 W HPR (Gold) fan

STD HSK

40 °C

HPR (Gold) fan

STD HSK

35 °C

HPR (Gold) fan

STD HSK

40 °C

HPR (Gold) fan

STD HSK

35 °C

HPR (Gold) fan

STD HSK

40 °C

HPR (Gold) fan

STD HSK

35 °C

150 W HPR (Gold) fan

STD HSK

40 °C

HPR (Gold) fan

STD HSK

35 °C

HPR (Gold) fan

STD HSK

40 °C

HPR (Gold) fan

STD HSK

35 °C

HPR (Gold) fan

STD HSK

40 °C

HPR (Gold) fan

STD HSK

35 °C

165 W HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

185 W HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

35 °C

195 W HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

30 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

30 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

30 °C

205 W HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

30 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

30 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

30 °C

225 W HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

30 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

30 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

30 °C

NOTE:

** 5x fans is required for 1xProcessor without rear drive configuration.

*** 7xfans is required for 2xProcessors configuration and 1xProcessor with rear drive configuration.

**** Intel 6434/6526Y/6534 CPU would need HPR Gold Fan to support in this configuration.

4x3.5" SAS/SATA config only support DIMM up to 96G with 5th Gen Intel Xeon processors.

Table 3. Thermal restriction matrix for processor and fans with TDP > 205 W, 225 WThis table describes the thermal restriction for processor and fans.
Front storage module Configuration with Restrictions No Backplane 2 x 3.5-inch SAS/SATA 4 x 2.5-inch SAS3/SATA
Drives No HDD 0 ~ 1 HDD 0 ~ 3
Rear Storage Rear 3 LP PCIe 1 + OCP only. PCIe 2,PCIe 3 and BOSS are not supported 1 LP + 2 Rear drives Rear 3 LP Rear 1 LP + 2 Rear drives
225 W * STD fan

HPR HSK

35 °C

STD fan

HPR HSK

30 °C

* *
250 W STD fan

HPR HSK

35 °C

STD fan

HPR HSK

35 °C

STD fan

HPR HSK

30 °C

HPR (Gold) fan

STD HSK

35 °C

HPR (Gold) fan

STD HSK

35 °C

Table 4. Thermal restriction matrix for processor and fans with TDP > 205 W, 225 WThis table describes the thermal restriction for processor and fans.
Front storage module Configuration with Restrictions 6 x 2.5-inch SAS4/SATA 4 x 2.5-inch NVMe 4 x 2.5-inch NVMe
Drives HDD 0 ~ 5 HDD 0 ~ 3 HDD 0 ~ 3
Rear Storage Rear 3 LP 1 LP + 2 Rear drives Rear 3 LP 1 LP + 2 Rear drives Rear 3 LP 1 LP + 2 Rear drives
225 W * * * * * *
250 W HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

30 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

30 °C

HPR (Gold) fan

HPR HSK

35 °C

HPR (Gold) fan

HPR HSK

30 °C

NOTE:

* Configs supported in the "without HW restriction thermal restriction table"

** Except cold aisle configuration: 5 fans is required for 1 x Processor + without rear drive configuration

*** Except cold aisle configuration: 7 fans is required for 2 x Processors configuration. and 1 x Processor + rear drive configuration

2 x3.5" SAS/SATA config only support DIMM up to 96G with 5th Gen Intel Xeon processors.

Table 5. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
LP Low Profile
HPR (Gold) High performance (gold grade)
HSK Heat sink

Thermal Restriction for ASHRAE A2/A3/A4

Table 6. No BP Configuration with iDRACThis table describes the No BP Configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted. Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant) Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
  • STD Fan is required.
  • STD HSK is required for CPU Base TDP <=150W
  • HPR HSK is required for CPU Base TDP >150W
  • 2-processor all configs or 1-processor with Rear storage module config requires 7x fans
  • 1-processor without Rear storage module config requires 5x fans
  • 100G PCIe NIC could not support MFS1S00-VxxE (spec 75C) transceiver
  • 100G OCP3.0 NIC could only support optic transceiver with thermal spec 85C and power <=2.5W ( DPN:4WGYD)
  • 25G OCP3.0 NIC with 4 ports or PCIe cooling tier higher than or equal to 5 could only support optic transceiver with thermal spec 85C and power <=1.2W ( DPN: M14MK)
  • 25G OCP3.0 NIC with PCIe cooling tier lower than 5 could not support spec 70C optic transceiver with power higher than 1.2W ( DPN: 0YR96)
  • H965e cannot be installed on PCIe slot 1
  • Not support CPU Base TDP > 185W
  • STD Fan is required.
  • STD HSK is required for CPU Base TDP <=150W
  • HPR HSK is required for CPU Base TDP >150W.
  • Not support BOSS M.2 Module
  • Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards
  • Not support NIC consuming power >= 25W.
  • Not Support Config with Rear storage module
  • Not support OCP transfer rate >25G or cooling tier > 9
  • Optic Transceiver with spec 85C is required
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure
  • Not support CPU Base TDP > 135W
  • STD Fan and STD HSK is required.
  • Not support BOSS M.2 Module
  • Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards
  • Not support NIC consuming power >= 25W. Or PCIe cooling Tier> 5
  • Not Support Config with Rear storage module
  • Not support OCP3.0 transfer rate >25G or OCP3.0 cooling tier > 6
  • Optic Transceiver with spec 85C is required.
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure
Table 7. 4 x 3.5-inch SAS/SATA Configuration with iDRACThis table describes the 4 x 3.5-inch SAS/SATA Configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted. Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant) Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
  • STD Fan is required.
  • STD HSK is required for CPU Base TDP <=150W
  • HPR HSK is required for CPU Base TDP >150W
  • 2-processor all configs or 1-processor with Rear storage module config requires 7x fans
  • 1-processor without Rear storage module config requires 5x fans
  • HW restriction is required for CPU Base TDP >205W
    • Front storage moduleonly support 2x3.5 at HDD#0, HDD1 and HDD Blank F3F7V x 2 are required at HDD#2 and HDD#3
    • RIO only support PCIe1 and OCP3.0. Could not support BOSS, PCIe2 and PCIe3.
    • With Rear storage module config only support max. 30C ambient.
  • Only support DDR5 DIMM up to 96 G.B
  • 100G PCIe NIC could not support MFS1S00-VxxE (spec 75C) transceiver.
  • 100G PCIe and OCP3.0 NIC could only support optic transceiver with thermal Spec 85C and power <=2.5W
  • 25G PCIe NIC could only support optic transceiver with thermal Spec 85C and power <=1.2W
  • 25G OCP3.0 NIC with 4 ports or PCIe cooling tier higher than 5 could only support optic transceiver with thermal spec 85C and power <=1.2W
  • 25G OCP3.0 NIC with PCIe cooling tier lower than or equal to 5 could not support thermal spec 70C optic transceiver with power higher than 1.2W
  • The following SAS drives could NOT support in Rear storage module. (But could support in front SM)
    • Kioxia PM6 SAS all capacities
    • SATA SSD, Hynix SE5031 all capacities or thermal spec <70C
  • H965e cannot be installed on PCIe slot 1
  • Not support CPU Base TDP > 150W
  • STD Fan is required.
  • STD HSK is required
  • Not support BOSS M.2 Module
  • Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards
  • Not support NIC consuming power >= 25W.
  • Not Support Config with Rear storage module
  • Not support OCP transfer rate >25G or cooling tier > 10
  • Optic Transceiver with spec 85C is required
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure
  • Not support
Table 8. 8 x 2.5-inch SAS3/SATA Configuration with iDRACThis table describes the 8 x 2.5-inch SAS3/SATA Configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted. Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant) Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
  • STD Fan is required for CPU Base TDP<=205W
  • HPR Gold (VHP) Fan is required for CPU Base TDP>205W and Intel 6434/ 6526Y/6534 CPU base TDP 195W.
  • STD HSK is required for CPU Base TDP <=150W
  • HPR HSK is required for CPU Base TDP >150W
  • 2-processor all configs or 1-processor with Rear storage module config requires 7x fans
  • 1-processor without Rear storage module config requires 5x fans
  • HW restriction is required for CPU Base TDP >225W
    • Front storage moduleonly support 4x2.5"SAS/SATA drives at HDD#0~3, and HDD Bracket GG6M3 x1 and M8KTX x1 are required at empty HDD bay
  • 100G PCIe and OCP3.0 NIC could only support optic transceiver with thermal Spec 85C and power <=2.5W
  • 25G PCIe NIC could only support optic transceiver with thermal Spec 85C and power <=1.2W
  • 25G OCP3.0 NIC with 4 ports or PCIe cooling tier higher than 5 could only support optic transceiver with thermal spec 85C and power <=1.2W
  • 25G OCP3.0 NIC with PCIe cooling tier lower than or equal to 5 could not support thermal spec 70C optic transceiver with power higher than 1.2W
  • The following SAS drives could NOT support in Rear storage module. (But could support in front storage)
    • Kioxia PM6 SAS all capacities
    • SATA SSD, Hynix SE5031 all capacities or thermal spec <70C
  • H965e cannot be installed on PCIe slot 1
  • Not support CPU Base TDP > 150W
  • STD Fan is required.
  • STD HSK is required
  • Not support BOSS M.2 Module
  • Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards
  • Not support NIC consuming power >= 25W.
  • Not Support Config with Rear storage module
  • Not support OCP transfer rate >25G or cooling tier > 10
  • Optic Transceiver with spec 85C is required
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure
  • Not support
Table 9. 10 x 2.5-inch SAS4/SATA Configuration with iDRACThis table describes the 10 x 2.5-inch SAS4/SATA Configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted. Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant) Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
  • HPR Gold (VHP) Fan is required for all configurations
  • STD HSK is required for CPU Base TDP <=150W
  • HPR HSK is required for CPU Base TDP >150W
  • 2-processor all configs or 1-processor with Rear storage module config requires 7x fans
  • 1-processor without Rear storage module config requires 5x fans
  • HW restriction is required for CPU Base TDP >225W
    • Front storage moduleonly support 6x2.5"SAS/SATA drives at HDD#0~5, and HDD Bracket GG6M3 x2 are required at empty HDD bay.
  • 100G PCIe and OCP3.0 NIC could only support optic transceiver with thermal Spec 85C and power <=2.5W
  • 25G PCIe NIC could not support thermal spec 70C optic transceiver with power higher than 1.2W ·
  • 25G OCP3.0 NIC with 4 ports or PCIe cooling tier higher 5 could only support optic transceiver with thermal spec 85C and power <=1.2W
  • 25G OCP3.0 NIC with PCIe cooling tier lower than or equal to 5 could not support thermal spec 70C optic transceiver with power higher than 1.2W
  • With Rear storage module config only support max. 30C ambient when CPU Base TDP>=205W
  • The following SAS drives could NOT support in Rear storage module. (But could support in front storage)
    • Kioxia PM6 SAS all capacities
    • SATA SSD, Hynix SE5031 all capacities or thermal spec <70C
  • Not support CPU Base TDP > 150W

  • ·

    HPR Gold (VHP) Fan is required.

  • STD HSK is required
  • Not support BOSS M.2 Module
  • Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards
  • Not support NIC consuming power >= 25W.
  • Not Support Config with Rear storage module
  • Not support OCP transfer rate >25G or cooling tier > 10
  • Optic Transceiver with spec 85C is required
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure
  • Not support
Table 10. 8 x 2.5-inch NVMe configuration with iDRACThis table describes the 8 x 2.5-inch NVMe configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted. Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant) Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
  • HPR Gold (VHP) Fan is required for all configurations
  • STD HSK is required for CPU Base TDP <=150W
  • HPR HSK is required for CPU Base TDP >150W
  • 2-processor all configs or 1-processor with Rear storage module config requires 7x fans
  • 1-processor without Rear storage module config requires 5x fans
  • HW restriction is required for CPU Base TDP >225W
    • Front storage moduleonly support 4x2.5"NVMe at HDD#0~3, and HDD Bracket GG6M3 x3 are required at empty HDD bay.
  • 100G PCIe and OCP3.0 NIC could only support optic transceiver with thermal spec 85C and power <=2.5W
  • 25G OCP3.0 NIC with 4 ports or PCIe cooling tier higher 5 could only support optic transceiver with thermal spec 85C and power <=1.2W
  • 25G OCP3.0 NIC with PCIe cooling tier lower than or equal to 5 could not support thermal spec 70C optic transceiver with power higher than 1.2W
  • With Rear storage module config only support max. 30C ambient when CPU Base TDP>=205W
  • The following NVMe drives could NOT support in Rear storage module. (But could support in front storage)
    • Samsung PM1735a/PM1735 Capacities > 6.4TB
    • Samsung PM1733a/PM1733 Capacities > 7.68TB
    • Skhynix PE8010 capacity > 960 GB
    • Kioxia CM6 all capacities
    • Redtail NVMe all capacities
    • Skhynix PE8110 capacity > 960 GB
  • Not support CPU Base TDP > 150W
  • HPR Gold (VHP) Fan is required.
  • STD HSK is required
  • Not support BOSS M.2 Module
  • Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards
  • Not support NIC consuming power >= 25W.
  • Not Support Config with Rear storage module
  • Not support OCP transfer rate >25G or cooling tier > 10
  • Optic Transceiver with spec 85C is required
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure
  • Not support
Table 11. 10 x 2.5-inch NVMe configuration with iDRACThis table describes the 10 x 2.5-inch NVMe configuration with iDRAC.
Dell PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted. Dell PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant) Dell PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
  • HPR Gold (VHP) Fan is required for all configurations
  • STD HSK is required for CPU Base TDP <=150W
  • HPR HSK is required for CPU Base TDP >150W
  • 2-processor all configs or 1-processor with Rear storage module config requires 7x fans
  • 1-processor without Rear storage module config requires 5x fans
  • HW restriction is required for CPU Base TDP >225W
    • Front storage moduleonly support 4x2.5"NVMe at HDD#0~3, and HDD Bracket GG6M3 x3 are required at empty HDD bay. .
  • 100G PCIe NIC could not support MFS1S00-VxxE (spec 75C) transceiver but could support optic transceiver with thermal spec 70C and 85C.
  • 100G PCIe and OCP3.0 NIC could only support optic transceiver with thermal spec 85C and power <=2.5W
  • 25G OCP3.0 NIC with 4 ports or PCIe cooling tier higher 5 could only support optic transceiver with thermal spec 85C and power <=1.2W
  • 25G OCP3.0 NIC with PCIe cooling tier lower than or equal to 5 could not support thermal spec 70C optic transceiver with power higher than 1.2W
  • With Rear storage module config only support max. 30C ambient when CPU Base TDP>=205W
  • The following NVMe drives could NOT support in Rear storage module. (But could support in front storage)
    • Samsung PM1735a/PM1735 Capacities > 6.4TB
    • Samsung PM1733a/PM1733 Capacities > 7.68TB
    • Skhynix PE8010 Capacity > 960 GB
    • Kioxia CM6 all capacities
    • Redtail NVMe all capacities
    • Skhynix PE8110 capacity > 960 GB
  • Not support CPU Base TDP > 150W
  • HPR Gold (VHP) Fan is required.
  • STD HSK is required
  • Not support BOSS M.2 Module
  • Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards
  • Not support NIC consuming power >= 25W.
  • Not Support Config with Rear storage module
  • Not support OCP transfer rate >25G or cooling tier > 10
  • Optic Transceiver with spec 85C is required
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure
  • Not support
Table 12. Thermal Solution ConfigurationThis table describes the Thermal Solution Configuration.
Configurations Rear drive configurations Processor (TDP) Fan type Heat sink type Air Shroud Memory Blank Processor Blank Fan Counts Fan Blank
4 x 3.5-inch drives without rear drives TDP <= 150 W STD fan STD HSK Yes No Only required on processor 2 for 1 processor Configuration 7 x fans for 2 processors and 1xProcessor + Rear HDD Configuration

5 x fans for 1 processors Configuration + W/O Rear HDDs Config
  

 Only required on fan Slot 1 and slot 2 for 5x Fans configuration
150 W < TDP <= 205 W STD fan HPR HSK
with rear dries TDP <= 150 W STD fan STD HSK Yes
150 W < TDP <= 205 W HPR HSK
8 x 2.5-inch SAS/SATA drives without rear drives TDP <= 150 W STD fan STD HSK No
150 W < TDP <= 205 W **STD fan HPR HSK
205 W < TDP <= 225 W HPR Gold Fan (VHP) HPR HSK
8 x 2.5-inch SAS/SATA drives with rear dries TDP <= 150 W HPR Gold Fan (VHP) STD HSK Yes
150 W < TDP <= 225 W HPR HSK
10 x 2.5-inch SAS4/SATA drives without rear drives TDP <= 150 W HPR Gold Fan (VHP) STD HSK No
150 W < TDP <= 225 W HPR HSK
with rear dries TDP <= 150 W HPR Gold Fan (VHP) STD HSK Yes
150 W < TDP <= 225 W HPR HSK
8 and 10 x 2.5-inch NVMe drives without rear drives TDP <= 150 W HPR Gold Fan (VHP) STD HSK Yes
150 W < TDP <= 225 W HPR HSK
8 and 10 x 2.5-inch NVMe drives with rear dries TDP <= 150 W HPR Gold Fan (VHP) STD HSK Yes
150 W < TDP <= 225 W HPR HSK
No Backplane without rear drives TDP <= 150 W STD fan STD HSK No
150 W < TDP <= 250 W HPR HSK