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Dell PowerEdge R660: руководство по обслуживанию
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Dell PowerEdge R660: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEge R7525 system.
Table 1. PowerEdgeR660 chassis dimensionsThis table provides the dimensions of the system:
Drives Xa Xb Y Za Zb Zc
10 drives482.0 mm (18.97 inches)434.0 mm (17.08 inches)42.8 mm (1.68 inches)35.84 mm (1.41 inches)With bezel, 22 mm (0.86 inches)Without bezel751.47 mm (29.6 inches)Ear to rear wall787.04 mm (30.99 inches)Ear to PSU handle
0 drives482.0 mm (18.97 inches)434.0 mm (17.08 inches)42.8 mm (1.68 inches)35.84 mm (1.41 inches)With bezel, 22 mm (0.86 inches)Without bezel700.7 mm (27.5 inches)Ear to rear wall736.27 mm (28.99 inches)Ear to PSU handle
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R660 system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
A server with fully populated drives 22.51 kg (49.62 lb)
A server without drives installed 18.5 kg (40.78 lb)

Processor specifications

Table 1. PowerEdge R660 processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
4th Gen Intel® Xeon® Scalable or Intel® Xeon® Max Processors or 5th Gen Intel® Xeon® Scalable Processors Up to two
Table 2. Minimum Firmware version requirementThe below table describes the supported firmware versions based on different processors.
Processors iDRAC BIOS CPLD
8462Y+ 6.10.39.00 1.2.1 1.0.5
6458Q
6448Y
6444Y
6442Y
6438Y+
6438N
6438M
6434
6428N
6426Y
6421N
5420+
5418Y
5418N
5416S
5415+
5412U
5411N
4416+
4410Y
3408U
9480 6.10.80.00 1.3.2 1.0.5
9470
9460
9462
Table 3. Minimum Firmware version requirement for 5th Gen Intel® Xeon® Scalable ProcessorsMinimum Firmware version requirement for 5th Gen Intel® Xeon® Scalable Processors
Processors iDRAC BIOS CPLD
5th Gen Intel® Xeon® Scalable Processors 7.10.05.00 2.0.0 N/A

PSU specifications

The PowerEdgeR660system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) AC Voltage DC Voltage Current (A)
200–240 V 100–120 V 277 V 240 V - (48 - 60) V 336 V
700 W mixed mode HLAC Titanium 2625 50/60 700 W N/A N/A N/A N/A N/A 4.1
N/A 2625 N/A N/A N/A 700 W N/A N/A 3.4
800 W mixed mode Platinum 3000 50/60 800 W 800 W N/A N/A N/A N/A 9.2 - 4.7
N/A 3000 N/A N/A N/A 800 W N/A N/A 3.8
1100 W mixed mode Titanium 4100 50/60 1100 W 1050 W N/A N/A N/A N/A 12 - 6.3
N/A 4100 N/A N/A N/A 1100 W N/A N/A 5.2
1400 W mixed mode Platinum 5250 50/60 1400 W 1050 W N/A N/A N/A N/A 12 - 8
N/A 5250 N/A N/A N/A 1400 W N/A N/A 6.6
1400 W mixed mode Titanium 5250 50/60 1400 W 1050 WN/A N/A N/A N/A 12—8
N/A 5250 N/A N/A N/A N/A 1400 W N/A N/A 6.5
1800 W mixed mode HLAC Titanium 6750 50/60 1800 W N/A N/A N/A N/A N/A 10
N/A 6750 N/A N/A N/A 1800 W N/A N/A 8.2
800 W -48 V DC N/A 3103 N/A N/A N/A N/A N/A 800 W N/A 23.5
1100 W -48 V DC N/A 4265 N/A N/A N/A N/A N/A 1100 W N/A 27
1400 W mixed mode 277 VAC and HVDC Titanium 5250 50/60 N/A N/A 1400 W N/A N/A N/A 5.8
5250 N/A N/A N/A N/A N/A N/A 1400 W 5.17
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.
NOTE:If a system with AC 1400 W or 1100 W PSUs operates at low line 100-120 V AC, then the power rating per PSU is degraded to 1050 W.
Figure 1. PSU power cables
this image shows list of PSU power cablesthis image shows the -48Vdc connector
The image shwos the APP power cord.

Table 2. PSU power cablesThe table lists the PSU power cables list .
Form factor Output Power cord
Redundant 60 mm 700 W mixed mode HLAC C13
800 W mixed mode C13
800 W -48 V DC LOTES APOW0097
1100 W mixed mode C13
1100 W -48 V DC C13
1400 W mixed mode C13
1800 W mixed mode HLAC C15
1400 W 277 VAC and HVDC APP 2006G1
NOTE:C13 power cable combined with C14 to C15 jumper power cable can be used to adapt 1800 W PSU.
NOTE:
  • HLAC stands for High-Line AC, with a range of 200 - 240 V AC
  • HVDC stands for High-Voltage DC, with 336 V DC

Cooling fan specifications

The PowerEdgeR660system supports up to four sets of standard (STD) cooling fans or four sets of High performance gold (HPR GOLD) cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Label color Label image
Standard fans STD No labelThis shows the Standard fan image.
High performance Gold fans HPR Gold Goldthis image shows gold fan

Supported operating systemsR660

The PowerEdge R660 system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
NOTE:Intel Xeon® 6300 series CPUs do not support Windows Server 2019.

For more information, go to Operating System Manuals.

System battery specifications

The PowerEdge R660 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R660 system supports up to three PCI express (PCIe), (six full length and 10 low profile) slots on the system board.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
- With Regular shroud R1P R2A R2P R2Q R2R R2S R3A R3P R3Q R3R R3S R4P
Slot 1 Full height, 3/4 Length, Half Length x16 (Gen5) - - - - - - - - - - -
Slot 1 Low profile, Half Length - x16 (Gen4) x16 (Gen5) x16 (Gen5) x8 (Gen5) x16 (Gen5) - - - - - -
Slot 2 Low profile, Half Length - x16 (Gen4) x16 (Gen4) x16 (Gen5) x16 (Gen4) - - - - - - -
Slot 2 Full height, 3/4 Length, Half Length - - - - - - - - - - - x16 (Gen5)
Slot 3 Low profile, Half Length - - - - - - x16 (Gen4) x16 (Gen5) x16 (Gen5) (SNAPI) x8 (Gen5) x16 (Gen5) -

Memory specifications

The PowerEdge R660 system supports the following memory specifications for optimized operation.
Table 1. Memory specifications for 4th Gen Intel® Xeon® Scalable or Intel® Xeon® Max ProcessorsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
DDR5 RDIMM Single rank 16 GB 16 GB 256 GB 32 GB 512 GB
Dual rank 32 GB 32 GB 512 GB 64 GB 1 TB
Dual rank 64 GB 64 GB 1 TB 128 GB 2 TB
Quad rank 128 GB 128 GB 2 TB 256 GB 4 TB
Octa rank 256 GB 256 GB 4 TB 512 GB 8 TB
Table 2. Memory module sockets 4th Gen Intel® Xeon® Scalable or Intel® Xeon® Max ProcessorsThe table below shows the memory module sockets for the system:
Memory module sockets Rated DIMM Speed
32 (288-pin) 4800 MT/s or 4400 MT/s
Table 3. Memory specifications for 5th Gen Intel® Xeon® Scalable ProcessorsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
DDR5 RDIMM Single rank 16 GB 16 GB 256 GB 32 GB 512 GB
Dual rank 32 GB 32 GB 512 GB 64 GB 1 TB
Dual rank 64 GB 64 GB 1 TB 128 GB 2 TB
Dual rank 96 GB 96 GB 1.5 TB 192 GB 3 TB
Quad rank 128 GB 128 GB 2 TB 256 GB 4 TB
Table 4. Memory module sockets for 5th Gen Intel® Xeon® Scalable ProcessorsThe table below shows the memory module sockets for the system:
Memory module sockets Rated DIMM Speed
32 (288-pin) 6400MT/s(1DPC), or 5600 MT/s (1DPC)
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:6400/5600 MT/s RDIMMs are applicable for 5th Gen Intel® Xeon® Scalable Processors..
NOTE:The processor may reduce the performance of the rated DIMM speed.
NOTE: Quad rank (4R) 128 GB has reached EOL.

Storage controller specifications

The PowerEdge R660 system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers
  • PERC H965i
  • PERC H755
  • PERC H755N
  • PERC H355
External controllers
  • HBA355e
  • PERC H965e
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS N1): HWRAID 2 x M.2 NVMe SSDs
  • USB
Software RAID
  • S160
SAS Host Bus Adapters (HBA)
  • HBA355i
  • HBA465i

Drives

The PowerEdge R660 system supports:
  • 8 x 2.5-inch, hot-swappable SAS, SATA, or NVMe drives.
  • 10 x 2.5-inch, hot-swappable SAS, SATA, or NVMe drives.
  • 14 x EDSFF E3.S, hot-swappable NVMe drives.
  • 16 x EDSFF E3.S, hot-swappable NVMe drives.
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support > Browse all products > Infrastructure > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

NIC port specifications

The PowerEdge R660 system supports up to two Netwodk Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) card and up to four ports integrated on the Open Compute Project (OCP) card.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM card (optional) 1 GbE x 2
OCP card (OCP 3.0) (optional) 1GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4, 100GbE x 2
Management Interface Card (MIC) to support {Varref: 16G_Dell}Dell Data Processing Unit (DPU) card (optional) 25 GbE x 2 or 100 GbE x 2
NOTE:The system allows either LOM card or an OCP card or both to be installed in the system.
NOTE:On the MS system board, the supported OCP PCIe width is x8; when x16 PCIe width is installed, it is downgraded to x8.
NOTE:A 100 GbE OCP card of PCIe width x16 can be used by connecting the OCP cable from SL11_CPU1_PB7 to SL13_CPU1_PB7 on the MAX system board.
NOTE:For storage configurations that already use the SL11_CPU1_PB7 or SL13_CPU1_PB7 connector on the Max system board, there is a restriction on supporting OCP cable.
NOTE:The system allows either LOM card or MIC card to be installed in the system.

Serial connector specifications

The PowerEdge R660 system supports one serial port on the system board, which is Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

USB ports specifications

Table 1. PowerEdge R660 USB specificationsThe following table shows the USB specifications for the system:
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 2.0-compliant port One Internal USB 3.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0-compliant port) One USB 3.0-compliant port One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

VGA ports specifications

The PowerEdge R660 system supports DB-15 VGA port on front panel and on rear I/O board (optional for Direct Liquid Cooling configuration).

Video specifications

The PowerEdge R660 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1152 x 864 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1400 x 1050 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support.
Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature Specifications
Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Common Environmental Specifications for ASHRAE A2, A3, A4 This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C ( -40 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,050 meters (10,006 feet)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment) Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Processor TDP
STD HSK ≤ 185 W
L-type HSK > 185 W
Table 2. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HPR (Gold) High performance (gold grade)
HSK Heat sink
LP Low profile
FH Full height
DLC Direct Liquid Cooling
Table 3. Thermal restriction matrix for air cooled configurationThe table describes thermal restriction matrix:
Configuration No Backplane 8 x 2.5-inch NVMe /SAS/SATA 10 x 2.5-inch SAS/SATA 10 x 2.5-inch SAS/SATA 10 x 2.5-inch NVMe 10 x 2.5-inch NVMe 16 x EDSFF E3.S 14 x EDSFF E3.S Ambient temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives 2 x 2.5-inch No Rear Drives 2 x 2.5-inch No Rear Drives 2 x EDSFF E3.S
CPU TDP/cTDP T-Case max center (°C) Fan
125 W 79 (174.2°F) STD fan STD fan STD fan HPR Gold fan STD fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
150 W 78 (172.4°F)/79 (174.2°F) STD fan STD fan STD fan HPR Gold fan STD fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
165 W 82 (179.6°F)/84 (183.2°F) STD fan STD fan STD fan HPR Gold fan STD fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
185 W 80 (176°F)/81 (177.8°F)/85 (185°F) STD fan STD fan STD fan HPR Gold fan STD fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
195 W 64 (147.2°F) HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
205 W 76 (168.8°F)/84 (183.2°F)/85 (185°F) HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
225 W 79 (174.2°F) HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
250 W 76 (172.4°F) HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
270 W 75 (167°F) HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan* HPR Gold fan HPR Gold fan* HPR Gold fan HPR Gold fan* 35°C (95°F)
270 W 71 (159.8°F) HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan* HPR Gold fan HPR Gold fan* HPR Gold fan HPR Gold fan* 35°C (95°F)
300 W 81 (177.8°F) HPR Gold fan HPR Gold fan HPR Gold fan* Required DLC HPR Gold fan* Required DLC HPR Gold fan* Required DLC 35°C (95°F)
300 W 76 (172.4°F) HPR Gold fan HPR Gold fan HPR Gold fan* Required DLC HPR Gold fan* Required DLC HPR Gold fan* Required DLC 35°C (95°F)
300 W 77 (170.6°F) HPR Gold fan HPR Gold fan HPR Gold fan* Required DLC HPR Gold fan* Required DLC HPR Gold fan* Required DLC 35°C (95°F)
300 W 75 (172.4°F) HPR Gold fan HPR Gold fan HPR Gold fan* Required DLC HPR Gold fan* Required DLC HPR Gold fan* Required DLC 35°C (95°F)
300 W 76 (172.4°F) HPR Gold fan HPR Gold fan HPR Gold fan* Required DLC HPR Gold fan* Required DLC HPR Gold fan* Required DLC 35°C (95°F)
350 W 79 (174.2°F) HPR Gold fan* HPR Gold fan* Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
350 W 57 (134.6°F) HPR Gold fan* HPR Gold fan* Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
350 W 66 (150.8°F) Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
350 W 77/79 (170.6/174.2°F) HPR Gold fan* HPR Gold fan* Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
350 W 77/77 (170.6/170.6°F) HPR Gold fan* HPR Gold fan* Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
350 W 64/77 (147.2/170.6°F) Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
350 W 64/76 (147.2/168.8°F) Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
NOTE:
  • *Supported ambient temperature is 30°C (86°F) .
  • Required DLC requires <30°C (86°F)

Thermal restriction matrix for 5th Gen Intel® Xeon® Scalable Processors

Table 4. Thermal restriction matrix for air cooled configurationThe table describes the thermal restriction matrix:
Front Configuration No BP SAS/ SATA 8x2.5"(Smart Flow) NVMe/ 10x2.5" SAS/SATA 10x2.5" NVMe 16 x EDSFF E3.S 14 x EDSFF E3.S
-Rear Configuration 3xLP/ 2xFH 2xLP/ 3xLP/ 2xFH 3xLP/2xFH Rear 2x2.5"SAS/SATA 3xLP 3xLP/2xFH Rear 2x2.5"NVMe Rear 2xE3 3xLP/ 2xFH 3xLP/2xFH 2 x EDSFF E3.S
Any (RC0, RC1, RC2, RC3) Any Non- Rear 2x2.5" (RC0, RC1, RC2, RC3) Rear 2x2.5" (RC7) Any (RC1) Non- Rear 2x2.5" (RC0, RC1, RC2, RC3) Rear 2x2.5" (RC7) Rear E3 (RC9) Any (RC0,RC1,RC2,RC3.RC10) Non- Rear 2x2.5" (RC0,RC0,RC1,RC2,RC3, Rear E3 (RC9)
TDP Core Count Tcase Spec DIMM<=128 GB DIMM<=128 GB Tcase Spec
125 W1 8 84 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
150 W1 12 84 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
150 W1 16 79 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
185 W1 28 89 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
195 W1 8 64 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
195 W1 16 82 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
250 W1 24 83 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
250 W1 32 83 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
250 W1 32 83 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
300 W 2 32 81 35°C 35°C 30°C N/A N/A 30°C N/A N/A N/A 30°C N/A
270 W 2 60 74 35°C 35°C 35°C 30°C 30°C 35°C 30°C 30°C 30°C 35°C 30°C
300 W 2 48 78 35°C 35°C 30°C N/A N/A 30°C N/A N/A N/A 30°C N/A
350 W 2 48 81 30°C 30°C N/A N/A N/A N/A N/A N/A N/A N/A N/A
350 W 2 60 81 30°C 30°C N/A N/A N/A N/A N/A N/A N/A N/A N/A
350 W 2 64 81 30°C 30°C N/A N/A N/A N/A N/A N/A N/A N/A N/A
Table 5. Thermal restriction for memoryThe table describes thermal restriction matrix:
Configuration No Backplane 8 x 2.5-inch NVMe /SAS/SATA 10x 2.5-inch SAS/SATA 10x 2.5-inch SAS/SATA 10 x 2.5-inch NVMe 10 x 2.5-inch NVMe 16 x EDSFF E3.S 14 x EDSFF E3.S
Rear storage No Rear Drives No Rear Drives No Rear Drives 2 x 2.5-inch No Rear Drives 2 x 2.5-inch No Rear Drives 2 x EDSFF E3.S
256 GB RDIMM 35°C (95°F) 35°C (95°F) 30°C (86°F)
NOTE: 30°C (86°F) for CPU>250W (CPU<=250W could support 35°C (95°F) )
30°C (86°F)
NOTE: 30°C (86°F) for CPU>225W (CPU<=225W could support 35°C (95°F) )
30°C (86°F)
NOTE: 30°C (86°F) for CPU>250W (CPU<=250W could support 35°C (95°F) )
30°C (86°F)
NOTE: 30°C (86°F) for CPU>225W (CPU<=225W could support 35°C (95°F) )
35°C (95°F) 35°C (95°F)
NOTE:
  • Install all fan modules for single CPU configuration.
    NOTE: Not required for 8 x 2.5-inch NVMe /SAS/SATA configuration.
  • All air-cooling configurations require a CPU shroud.
  • Install PCH shroud for no riser configuration.
  • Install Rear drive shroud for air-cooling with 2 x 2.5-inch rear drive configuration.
  • Install A2 blank on R1p riser for FH riser configuration with A2 GPU.
  • Install DIMM blanks in all empty DIMM slots for STD CPU heat sink or CPU TDP >=250W.
Table 6. Thermal restriction for L4 GPUThe table describes thermal restriction matrix:
Configuration No Backplane 8 x 2.5-inch NVMe /SAS/SATA 10x 2.5-inch SAS/SATA 10x 2.5-inch SAS/SATA 10 x 2.5-inch NVMe 10 x 2.5-inch NVMe 10 x 2.5-inch NVMe 16 x EDSFF E3.S 14 x EDSFF E3.S
Rear storage No Rear Drives No Rear Drives No Rear Drives 2 x 2.5-inch No Rear Drives 2 x 2.5-inch 2 x EDSFF E3.S No Rear Drives 2 x EDSFF E3.S
L4 GPU CPU>270 W not supported CPU>270 W not supported CPU>225 W not supported CPU>205 W not supported CPU>225 W not supported CPU>205 W not supported CPU>225 W not supported CPU>225 W not supported CPU>205 W not supported
NOTE:
  • Installation of the GPU blank is necessary for the FH riser configuration (RC3) with an LP GPU card on R1P in order to stop the system's airflow.
  • No additional thermal restriction to support in R1p+R4p (2x FHs) and R2q riser.
  • For 3x LPs configuration, no additional thermal restriction to support 2x L4 GPUs in slot 1 and slot 2, and non-GPU card in slot 3.
  • For 3x LPs configuration with 3x L4 GPU cards, it requires additional CPU SKUs to support restriction.
  • For No BP and 8 x 2.5 inch configurations, CPU TDP higher than 270 W are not supported with 3x L4 GPUs.
  • For 10x2.5 inch and 16 x EDSFF E3.S configurations, CPU TDP higher than 225 W are not supported with 3x L4 GPUs.
  • For 10x2.5 inch and 16 x EDSFF E3.S configurations with rear drive configurations, CPU TDP higher than 205W are not supported.

Thermal air restrictions

ASHRAE A2 environment

  • CPU > 300W are not supported in 10 x 2.5 inch storage configuration.
  • CPU > 270W are not supported in 10 x 2.5 inch storage with rear drive configuration.
  • Maximum 30°C (86°F) for CPU > 270 W in10 x 2.5 inch storage configuration..
  • Maximum 30°C (86°F) for CPU > 250 W with rear drive in 10 x 2.5 inch storage configuration.
  • Maximum 30°C (86°F) for CPU > 250 W with 256G RDIMM in 10 x 2.5 inch storage configuration.
  • Maximum 30°C (86°F) for CPU > 225 W with 256G RDIMM in 10 x 2.5 rear drive configuration.
  • CPU > 350W are not supported in no BP chassis storage configuration.
  • Maximum 30°C (86°F) for CPU > 300W in no BP chassis storage configuration.
  • CPU > 350W are not supported in 8 x 2.5 inch storage configuration.
  • Maximum 30°C (86°F) for CPU > 300 W in 8 x 2.5 inch storage configuration.

ASHRAE A3 environment

  • CPU > 185W are not supported in 10 x 2.5 inch storage configuration.
  • CPU > 205W are not supported in 8 x 2.5 inch and no BP chassis storage configuration.
  • 128 GB or greater capacity RDIMMs are not supported.
  • 2.5 inch NVMe storage are not supported in a 8 x 2.5 inch and 10 x 2.5 inch storage configuration.
  • Rear drives are not supported.
  • Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • GPU is not supported.
  • 85°C (185°F) active optics cable is required.
  • Two power supplies are required. System performance may be reduced in the event of a PSU failure.

ASHRAE A4 environment

  • CPU > 125W are not supported in 10 x 2.5 inch storage configuration.
  • 128 GB or greater capacity RDIMMs are not supported.
  • Rear drives are not supported.
  • 2.5 inch NVMe storage are not supported.
  • BOSS N1 is not supported.
  • GPU is not supported.
  • Two power supplies are required. System performance may be reduced in the event of a PSU failure.
  • Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • OCP 3.0 card is not supported.
  • 85°C (185°F) active optics cable is required.

ASHRAE A3 environment for liquid cooling configuration

  • 128 GB or greater capacity RDIMMs are not supported.
  • Rear drives are not supported.
  • GPU is not supported.
  • Two power supplies are required. System performance may be reduced in the event of a PSU failure.
  • Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • 85°C (185°F) active optics cable is required.

ASHRAE A4 environment for liquid cooling configuration

  • 128 GB or greater capacity RDIMMs are not supported.
  • Rear drives are not supported.
  • 2.5 inch NVMe storage are not supported.
  • BOSS N1 is not supported.
  • GPU is not supported.
  • Two power supplies are required. System performance may be reduced in the event of a PSU failure.
  • Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • OCP 3.0 card is not supported.
  • 85°C (185°F) active optics cable is required.

ASHRAE A2 environment for EDSFF

  • CPU > 300W are not supported .
  • CPU > 270W with rear drive are not supported.
  • Maximum 30°C (86°F) for CPU > 270 W storage configuration..
  • Maximum 30°C (86°F) for CPU > 250 W with rear drive storage configuration.
  • Maximum 30°C (86°F) for CPU > 185 W with 256G RDIMM .
  • Maximum 30°C (86°F) for CPU > 150 W with 256G RDIMM in 2.5 rear drive configuration.
  • CPU > 250 W are not supported in storage configuration.
  • CPU > 225 W with rear drive are not supported .

ASHRAE A3 environment for EDSFF

  • CPU > 205W are not supported.
  • 128 GB or greater capacity RDIMMs are not supported.
  • Rear drives are not supported.
  • Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • GPU is not supported.
  • 85°C (185°F) active optics cable is required.
  • Two power supplies are required. System performance may be reduced in the event of a PSU failure.
  • CPU > 150 W are not supported in storage configuration.
  • 128 GB or greater capacity RDIMMs are not supported.

ASHRAE A4 environment for EDSFF

  • CPU > 150 W are not supported in storage configuration.
  • CPU > 125W are not supported in storage configuration.
  • 128 GB or greater capacity RDIMMs are not supported.
  • Rear drives are not supported.
  • BOSS N1 is not supported.
  • GPU is not supported.
  • Two power supplies are required. System performance may be reduced in the event of a PSU failure.
  • Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • OCP 3.0 card is not supported.
  • 85°C (185°F) active optics cable is required.