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Dell PowerEdge R650: технические характеристики и спецификации
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Сервер Dell PowerEdge R650 210-AYJZ - 273846659
Сервер Dell PowerEdge R650 210-AYJZ - 273846659
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Dell PowerEdge R650: технические характеристики и спецификации

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEge R7525 system.
Table 1. Chassis dimension for the systemThis table provides the dimensions of the system:
Drives Xa Xb Y Za Zb Zc
4 drives, 10 drives482 mm (18.97 inches)434 mm (17.08 inches)42.8 mm (1.68 inches)35.84 mm (1.4 inches)With bezel22 mm (0.86 inches)Without bezel751.48 mm (29.58 inches)Ear to rear wall787.05 mm (31 inches)Ear to PSU handle
8 drives482 mm (18.97 inches)434 mm (17.08 inches)42.8 mm (1.68 inches)35.84 mm (1.4 inches)With bezel22 mm (0.86 inches)Without bezel700.7 mm (27.5 inches)Ear to rear wall736.27 mm (28.9 inches)Ear to PSU handle
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

Chassis weight

Table 1. Dell PowerEdge R650 chassis weightThe table below shows the maximum weight of the R650.
System configuration Maximum weight (with all drives/SSDs)
4 x 3.5-inch 21.2 kg (46.7 lbs)
8 x 2.5-inch 19.2 kg (42.3 lb)
10 x 2.5-inch 21.0 kg (46.2 lb)
0 17.2 kg (37.9 lb)

Processor specifications

Table 1. Processor specifications for the systemThis table provides processor specifications for the system.
Supported processor Number of processors supported
3rd Generation Intel Xeon Scalable processors with up to 40 cores Two

PSU specifications

The system supports up to two AC or DC power supply units (PSUs).

WARNING:Instructions for the qualified electricians only:

System using -(48-60) V DC or 240 V DC power supplies are intended for restricted access locations in accordance with Articles 110-5, 110-6, 110-11, 110-14, and 110-17 of the National Electrical Code, American National Standards Institute (ANSI)/National Fire Protection Association (NFPA) 70.

240 V DC power supplies shall be connected to the 240 V DC outlet from certified power distribution units if applicable in the country or region of use.

Power supply cords/jumper cords and the associated plugs/inlets/connectors shall have appropriate electrical ratings referencing the rating label on the system when used for connection.

Table 1. PSU specifications for the PowerEdge R650This table describes PSU specifications for the PowerEdgeR650.
PSU Class Heat dissipation (maximum) Frequency Voltage AC DC Current
High line 200–240 V Low line 100–120 V
800 W Mixed Mode Platinum 3000 BTU/hr 50/60 Hz 100 - 240 V, autoranging 800 W 800 W N/A 9.2 A - 4.7 A
N/A 3000 BTU/hr N/A 240 V DC N/A N/A 800 W 3.8 A
1100 W DC N/A 4265 BTU/hr N/A -48 VDC - -60 VDC N/A N/A 1100 W 27 A
1100 W Mixed Mode Titanium 4100 BTU/hr 50/60 Hz 100 - 240 V 1100 W 1050 W N/A 12 A - 6.3 A
N/A 4100 BTU/hr N/A 240 V DC N/A N/A 1100 W 5.2 A
1400 W Mixed Mode Platinum 5250 BTU/hr 50/60 Hz 100 - 240 V 1400 W 1050 W N/A 12 A - 8 A
N/A 5250 BTU/hr N/A 240 V DC N/A N/A 1400 W 6.6 A
1800 W Mixed Mode Titanium 6610 BTU/hr 50/60 200—240 V AC 1800 W N/A N/A 10 A
N/A N/A 240 V DC N/A N/A 1800 W 8.2 A
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at Dell.com/calc.

Supported operating systems

The supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Citrix Hypervisor
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi

Cooling specifications

Cooling options

The PowerEdgeR650 requires various cooling components based on CPU TDP, storage modules and rear drives, GPU, persistent memory to maintain optimum thermal performance.

The PowerEdge R650 offers two types of cooling options:

  • Air cooling
  • Liquid cooling (optional)

Cooling fan specifications

The PowerEdgeR650system supports upto four standard (STD), high performance silver grade (HPR SLVR), or high performance gold grade (HPR (Gold)) dual cooling fan modules based on certain CPU TDP, drive configurations, GPU and BPS memory.

High performance SLVR and GOLD fans provide higher air flow rate through the system. For certain single CPU configurations only 3 set of fan modules are required and in such configurations a fan blank is required to block fan bay 1.

The R650 is adapting to dual fans module form factor. One set of fan module includes two fan body with one fan connector.

Table 1. Cooling fan specificationsCooling fan specifications:
Fan type Abbreviation Also known as Label color Label image
Standard fanSTD STD No label
Figure 1. Standard fan
This image shows Standard fan module.
High performance (Silver grade) fan HPR (SLVR) HPR Silver
NOTE:New cooling fans comes with the High Performance Silver Grade label. While the older cooling fans has the High Performance label.
Figure 2. High performance fan
This image shows the High performance fan
Figure 3. High performance (Silver grade) fan
This image shows the High performance (Silver grade) fan
High performance (Gold grade) fan HPR (Gold) VHP - Very High Performance Gold
NOTE:New cooling fans comes with the High Performance Gold Grade label. While the older cooling fans has the High Performance label.
Figure 4. High performance fan
This image shows the high performance fan
Figure 5. High performance (Gold grade) fan
This image shows the High performance (Gold grade) fan
NOTE:The STD and HPR fans installation depends on the system configuration. For more information about the fan support configuration or matrix, see Thermal restriction matrix.

System battery specifications

The system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge R650 system supports up to three slots and all PCI express (PCIe) Gen 4 expansion cards.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the PowerEdge R650 system.
PCIe slot With Regular shroud R1a R2a R2b R3a R4c+R4d
Slot 1 Low profile- Half length x16 (FH-3/4L) x16 x16 (optional SNAPI support) NA NA
Slot 2 Low profile- Half length NA x16 x8 NA x16 (FH-3/4L)
Slot 3 Low profile- Half length NA NA NA x16 NA

Memory specifications

The system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processor
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
RDIMM Single rank 8 GB 8 GB 128 GB 16 GB 256 GB
Dual rank 16 GB 16 GB 256 GB 32 GB 512 GB
32 GB 32 GB 512 GB 64 GB 1 TB
64 GB 64 GB 1 TB 128 GB 2 TB
LRDIMM Quad rank 128 GB 128 GB 2 TB 256 GB 4 TB
Octa rank 256 GB 256 GB 4 TB 512 GB 8 TB
Intel Persistent Memory 200 series (BPS) Single rank 512 GB 512 GB 4 TB 1 TB 8 TB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
32, 288-pin 3200 MT/s, 2933 MT/s, 2666 MT/s

Storage controller specifications

The system supports the following controller cards:
Table 1. Storage controller cards for the systemThis table provides the controller cards supported on the system:
Internal controllers External controllers
  • PERC H355
  • PERC H745
  • PERC H755
  • PERC H755N
  • PERC H345
  • S150
  • HBA355I
  • Boot Optimized Storage Subsystem (BOSS-S2): HW RAID 2 x M.2 SSDs 240 GB or 480 GB
  • Boot Optimized Storage Subsystem (BOSS-S1 Adapter): HW RAID 2 x M.2 SSDs 240GB or 480GB
  • PERC H840
  • HBA355E
NOTE: The software RAID S150 is supported on either SATA drives with chipset SATA only backplane or NVMe drives in universal slots with processor direct PCIe cable connected backplane.
NOTE:The system supports either BOSS-S1 or BOSS-S2.
NOTE:M.2 hotplug is not supported on BOSS-S1.

Drives

The PowerEdgeR650 system supports:
  • 4 x 3.5-inch hot-swappable SAS, SATA drives.
  • 8 x 2.5-inch hot-swappable SAS, SATA , or NVMe drives.
  • 10 x 2.5-inch hot-swappable SAS, SATA , or NVMe drives.
  • 2 x 2.5-inch rear SAS, SATA , or NVMe drives.
  • 0 drive.
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

Table 1. USB specificationsThe following table shows the USB specifications :
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 2.0-compliant port One Internal USB 3.0-compliant port One
Micro-USB, iDRAC Direct One USB 3.0-compliant port One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
NOTE:The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.
NOTE:The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

NIC port specifications

The system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional OCP cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM card 1 GB x 2
OCP card (OCP 3.0) 1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4, 50 GbE x 2, 100 GbE x 2

Serial connector specifications

The PowerEdgeR650 system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

IDSDM

The PowerEdgeR650 system supports Internal Dual SD module (IDSDM).

The IDSDM supports two SD cards and is available in the following configurations:

Table 1. Supported SD card storage capacityThis table lists the storage capacity of the supported SD cards
IDSDM card
  • 16 GB
  • 32 GB
  • 64 GB
NOTE:One IDSDM card slot is dedicated for redundancy.
NOTE:Use Dell EMC branded SD cards that are associated with the IDSDM configured systems.

Video specifications

The PowerEdge R650 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.
Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Operational climatic range category A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Operational climatic range category A4 This table describes the operational climatic range for category A4.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-104 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal restriction for liquid cooling

Table 1. Label referencesThis table describes the references that are used in the following tables.
Label references
STD Standard
HPR High Performance
HSK Heat sink
LP Low Profile (Riser)
FH Full Height (Riser)
DW Double Wide (Xilinx FPGA accelerator)
Table 2. Cooling fan matrix for liquid coolingThe table describes thermal restriction matrix for liquid cooling.
Configuration 4 x 3.5-inch 8 x 2.5-inch and No Backplane 10 x 2.5-inch SAS 10 x 2.5-inch NVMe
Rear storage 3 LP/ 2 FH Rear 2 x 2.5–inch Rear 2 x 2.5–inch NVMe 3 LP/ 2 FH 3 LP/ 2 FH Rear 2 x 2.5–inch SAS 3 LP/ 2 FH Rear 2 x 2.5–inch NVMe
CPU TDP 105 W–270 W HPR SLVR fan HPR SLVR fan HPR SLVR fan HPR SLVR fan
Memory 64 GB RDIMM
128 GB LRDIMM
256 GB LRDIMM
Optane Persistent Memory 200 series (Barlow Pass)
70 W T4 GPU Without Barlow Pass HPR SLVR fan HPR SLVR fan HPR SLVR fan HPR SLVR fan
Barlow Pass + 64 GB RDIMM HPR Gold fan HPR Gold fan HPR Gold fan
Barlow Pass + 128 GB LRDIMM or higher capacity LRDIMM
256 GB LRDIMM
NOTE:
  • Intel(R) Xeon(R) Platinum 8368Q_ICX XCC with 270W and 38 cores CPU (QWMQ) can only be supported in liquid cooling system
  • HPR GOLD fan is required for NVDIMM support.
  • Two FAN types HPR SLVR and GOLD are supported in R650 Liquid cooling configuration.
  • Liquid cooling configurations do not support rear drive slots.
  • PCIe/OCP cards ≥ 25 Gb require 85°C active optic cable.
  • Hard drive blanks are required.
  • For 3.5-inch configuration with T4 GPU, Intel Persistent Memory 200 series (BPS) and 128 GB or higher capacity LRDIMM together support ambient temperature up to 30°C.
  • For 3.5-inch configuration with T4 GPU, 256 GB LRDIMM support ambient temperature up to 30°C
  • DIMM blank is not required in liquid cooling.
  • 8 x 2.5-inch thermal restriction can cover No backplane configuration, this configuration increase 10 percent airflow without thermal impact.

ASHRAE A3 environment for liquid cooling

  • Two PSUs are required in redundant mode, however PSU failure is not supported.
  • 128 GB or greater capacity DIMMs are not supported.
  • Intel Persistent Memory 200 series (BPS) and NVDIMM are not supported.
  • NVMe drives are not supported.
  • GPU and FPGA are not supported.
  • Rear drives are not supported.
  • BOSS 1.5 is not supported.
  • Support OCP cooling tier ≤ 5 and ≥ 25 Gb OCP cards require 85°C active optic cable.
  • Non-Dell qualified peripheral cards or peripheral cards greater than 25 W are not supported.
  • PCIe cards ≥ 25 Gb require 85°C active optic cable.

ASHRAE A4 environment for liquid cooling

  • Two PSUs are required in redundant mode, however PSU failure is not supported.
  • 128 GB or greater capacity DIMMs are not supported.
  • NVMe drives are not supported.
  • GPU and FPGA are not supported.
  • Rear drives are not supported.
  • BOSS 1.5 is not supported.
  • Support OCP cooling tier ≤ 4 and 85°C active optic cable is required.
  • Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
  • Intel Persistent Memory 200 series (BPS) and NVDIMM are not supported.
  • Require 85°C active optic cable.

Thermal restrictions matrix for air cooling

Table 1. Label referencesThis table describes the references that are used in the following tables.
Label references
STD Standard
HPR High Performance
HSK Heat sink
LP Low Profile (Riser)
FH Full Height (Riser)
DW Double Wide (Xilinx FPGA accelerator)
BPS Intel Persistent Memory 200 series (BPS)
Table 2. Cooling fan matrix for air coolingThe table describes Fan matrix for air cooling of the PowerEdge R650 system.
Configuration 4 x 3.5-inch 8 x 2.5-inch and No Backplane 10 x 2.5-inch SAS 10 x 2.5-inch NVMe
Rear storage 3 LP/ 2 FH Rear 2 x 2.5–inch Rear 2 x 2.5–inch NVMe 3 LP/ 2 FH 3 LP/ 2 FH Rear 2 x 2.5–inch SAS 3 LP/ 2 FH Rear 2 x 2.5–inch NVMe
CPU TDP

105 W / 120 W

135 W / 140 W

 STD fan HPR SLVR fan STD fan HPR SLVR fan HPR Gold fan
150 W
165 W
185 W / 195 W HPR SLVR fan HPR SLVR fan
205 W
225 W / 230 W / 235 W HPR Gold fan HPR Gold fan
240 W / 250 W Not supported HPR Gold fan HPR Gold fan
265 W / 270 W Not supported
Table 3. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Processor TDP
STD HSK ≤ 165 W
T-type HSK Processor 1 > 165 W
T-type HSK Processor 2 > 165 W
Table 4. T4 GPU support restrictionThis table describes the T4 GPU support restriction.
Slots 2.5-inch x 10 2.5-inch x 8 3.5-inch x 4
Rear Config 3 x LP 2 x FH 3 x LP 2 x FH 3 x LP 2 x FH
Slot 1 Supported Supported Supported Supported Supported Supported
Slot 2 Supported Supported Supported Supported Supported Supported
Slot 3 Supported NA Supported NA Supported NA
Thermal restrictions for Non GPU/BPS configurations at 35°C environment:
  • For 3.5–inch configuration:
    • No support for CPU > 225 W in 35°C environment.
  • For 2.5–inch configuration:
    • No support for CPU > 250 W in rear NVMe configuration in 35°C environment.
    • No support for LRDIMM ≥ 128 GB if CPU ≥ 240 W for 10 x 2.5–inch HDD/NVMe in 35°C environment.
Thermal restrictions for T4 GPU at 35°C environment:
  • For 3.5–inch configuration:
    • No support for LRDIMM ≥ 128 GB with T4 GPU.
    • T4 GPU not supported when CPU TDP > 205 W.
    • HPR SLVR fan is required.
  • For 2.5–inch configuration:
    • No support for LRDIMM ≥ 128 GB with T4 GPU if CPU > 205 W.
    • HPR GOLD fan is required
Thermal restrictions for Optane Persistent Memory 200 series (BPS and 256 GB LRDIMM) at 35°C environment:
  • For 3.5–inch configuration,
    • HPR SLVR fan is required.
    • BPS / 256 GB LRDIMM is not supported when:
      • CPU TDP > 165 W.
      • GPU is installed.
      • Rear drive is present.
  • For 2.5–inch configuration:
    • HPR GOLD fan is required.
    • All NVMe 10 x 2.5–inch configuration is not supported if CPU TDP > 255 W.
    • 10 x 2.5–inch SAS/SATA with rear drive configuration is not supported if CPU TDP > 225 W.
    • No support for LRDIMM ≥ 128 GB along with BPS if CPU > 165 W
    • No support for 256 GB LRDIMM if CPU > 165 W
30°C configuration support for 2.5-inch storage module configuration
  • For non GPU/BPS configuration
    • Up to 30°C ambient temperature support for CPU TDP 250 W - 270 W with 128 GB LRDIMM in rear drive configuration.
    • Up to 30°C ambient temperature support for CPU TDP 260 W - 270 W with 64 GB RDIMM in rear NVMe configuration.
  • With GPU configuration
    • Up to 30°C ambient temperature support for CPU TDP 210 W - 270 W with GPU and 128 GB LRDIMM.
    • Up to 30°C ambient temperature support for CPU TDP 260 W - 270 W with GPU and 64 GB RDIMM in rear NVMe configuration.
  • With BPS / 256 GB LRDIMM configuration
    • Up to 30°C ambient temperature support for CPU TDP 185 W - 270 W with BPS and 128 GB / 256 GB LRDIMM or 256 GB LRDIMM
    • Up to 30°C ambient temperature support for CPU TDP 230 W - 270 W with BPS and 64 GB RDIMM in rear drive configuration.
    • Up to 30°C ambient temperature support for CPU TDP 185 W - 270 W with GPU T4, BPS and 128 GB / 256 GB LRDIMM or GPU T4 and 256 GB LRDIMM
    • Up to 30°C ambient temperature support for CPU TDP 230 W - 270 W with GPU T4, BPS and 64 GB RDIMM in rear drive configuration.
    • Up to 30°C ambient temperature support for CPU TDP 260 W - 270 W with BPS and 64 GB RDIMM in NVMe configuration.
    • Up to 30°C ambient temperature support for CPU TDP 260 W - 270 W with GPU T4, BPS and 64 GB RDIMM in NVMe configuration.
NVMe Thermal Restrictions in Rear Slot for Air Cooling
  • Check which config can support NVMe in the rear slot in terms of CPU/DIMM/GPU/Barlow PASS Memory/256GB LRDIMM restrictions.
  • Based on the 1st step to check the exception of different NVMe drive support, drive-to-drive will have different support capacity along with different DIMM capacity.
  • Intel P5500/5600:
    • Capacity ≤ 7.68TB: DIMM capacity support is up to 256GB LRDIMM.
    • Capacity ≤ 7.68TB: Barlow Pass Memory capacity support is up to 512 GB in 2.5” config.
  • Intel P4800X: not supported.
  • Samsung PM1735_V2:
    • Capacity ≤ 12.8TB: DIMM capacity support is up to 64GB RDIMM.
    • Capacity ≤ 6.4TB: DIMM capacity support is up to 256GB LRDIMM.
    • Barlow Pass Memory is not supported when NVMe capacity is more than 6.4TB.
  • Samsung PM1733_V2, Capacity ≤ 15.36TB:
    • Capacity ≤ 15.36TB: DIMM capacity support is up to 64GB RDIMM.
    • Capacity ≤ 7.68TB: DIMM capacity support is up to 256GB LRDIMM.
    • Barlow Pass Memory is not supported when NVMe capacity is more than 7.68TB.
  • Kioxia CM6, Capacity between 1.92TB to 15.36TB: not supported.
  • Intel P5800X:
    • Capacity ≤ 1.6TB: DIMM capacity support is up to 256GB LRDIMM.
    • Capacity ≤ 1.6TB: Barlow Pass Memory capacity support is up to 512 GB in 2.5” config.
  • Hynix PE8010:
    • Capacity between 3.84TB to 7.68TB: not supported.
    • Capacity ≤ 1.92TB: DIMM capacity support is up to 64GB RDIMM.
    • Not supported with Barlow pass memory.
Other restrictions for Air cooling
  • HPR GOLD fan is required for NVDIMM support.
  • PCIe/OCP cards ≥ 25 Gb require 85°C active optic cable.
  • CPU/DIMM/HDD Blanks:
    • HDD blank is required if the slot doesn’t install HDD.
    • DIMM blank is required, but partial configs with EXT HS (CPU > 165W) support to remove DIMM blanks.
    • Single CPU config: Fan modules #1 is not required, but CPU & DIMM blank are required.
  • For 1 processor configuration, fan module 1 is not required but fan blank is required.
  • Intel® Xeon® Platinum 8368Q_ICX XCC_ with 270 W and 38C processor is not supported in air cooling system.
  • Exception of heatsink application rule: Intel® Xeon® Gold 6334_ICX HCC with 165 W and 8C CPU require T-type EXT HTSNK, not STD HTSNK.
  • 8 x 2.5-inch thermal restriction can cover No backplane configuration, this configuration increase 10 percent airflow without thermal impact.

ASHRAE A3 and A4 thermal restrictions for air cooling

ASHRAE A3 environment

  • Two PSUs are required in redundant mode, however PSU failure is not supported.
  • PCIe SSD is not supported.
  • NVMe drive are not supported.
  • 128 GB or greater capacity DIMMs are not supported.
  • Intel Persistent Memory 200 series (BPS) and NVDIMM are not supported.
  • GPU and FPGA are not supported.
  • CPU TDP >185 W are not supported.
  • Rear drives are not supported.
  • Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • BOSS 1.5 is not supported.
  • Supports OCP, cooling tier ≤ 5 and 85°C active optic cable is required.

ASHRAE A4 environment

  • Two PSUs are required in redundant mode, however PSU failure is not supported.
  • PCIe SSD is not supported.
  • NVMe drives are not supported.
  • 128 GB or greater capacity DIMMs are not supported.
  • GPU and FPGA are not supported.
  • CPU TDP > 105 W are not supported.
  • Rear drives are not supported.
  • BOSS 1.5 is not supported.
  • Supports OCP, cooling tier ≤ 4 and 85°C active optic cable is required.
  • Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • Intel Persistent Memory 200 series (BPS) and NVDIMM are not supported.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHRAE Standard 127
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE:This condition applies to data center and non-data center environments.
NOTE: Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE:Maximum corrosive contaminant levels measured at ≤50% relative humidity.