Dell PowerEdge R570: руководство по обслуживанию

Chassis dimensions

This image shows chassis dimension for the PowerEge R7725 system. — Figure 1. Chassis dimensions

Table 1. PowerEdgeR570 chassis dimensionsThis table provides the dimensions of the system:
Drives	Xa	Xb	Y	Za	Zb	Zc
8 x EDSFF E3.S drives 16 x EDSFF E3.S drives Cold aisle configurations	482 mm (19.0 inches)	434 mm (17.1 inches)	86.8 mm (3.42 inches)	42.9 mm(1.69 inches) without bezel NOTE:Front bezel is not supported in a front I/O configuration.	700.7 mm (27.59 inches) Ear to rear wall	771.6 mm (30.4 inches)
12 x 3.5-inch drives 8 x 2.5-inch drives 16 x 2.5-inch drives 24 x 2.5-inch drives 32 x EDSFF E3.S drives	482 mm (19.0 inches)	434 mm (17.1 inches)	86.8 mm (3.42 inches)	30.78 mm (1.21 inches) with bezel 29.89 mm (1.18 inches) without bezel	700.7 mm (27.59 inches) Ear to rear wall	771.6 mm (30.4 inches)

NOTE:Zb is the nominal rear wall external surface where the HPM board I/O connectors reside.

System weight

Table 1. PowerEdge R570 system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives/SSDs)
8 x 2.5-inch SATA (HDD/SSD)	25.2 kg (55.5 lb)
16 x 2.5-inch SATA (HDD/SSD)	27.1 kg (59.7 lb)
24 x 2.5-inch SATA (HDD/SSD)	28.6 kg (63.05 lb)
12 x 3.5-inch SATA (HDD/SDD)	31 kg (68.3 lb)
8 x EDSFF E3.S Gen5 NVMe cold aisle configuration.	27.8 kg (61.28 lb)
8 x EDSFF E3.S Gen5 NVMe cold aisle configuration	22.3 kg (49.16 lb)
16 x EDSFF E3.S Gen5 NVMe cold aisle configuration	22.9 kg (50.48 lb)
32 x EDSFF E3.S Gen5 NVMe hot aisle configuration	24.2 kg (53.35 lb)

Table 2. PowerEdge R570 weight handling recommendationsThis table shows the recommendations in handling the system weight.
Chassis weight	Description
40–70 lbs	Recommend two people to lift.
70–120 lbs	Recommend three people to lift.
≥ 121 lbs	Recommend to use a server-lift.

Processor specifications

Table 1. PowerEdge R570 processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
Intel^® Xeon^® 6 E-core processor	One
Intel^® Xeon^® 6 P-core processor	One

Table 2. Minimum Firmware requirement for Intel^® Xeon^® 6 E-core processor and Intel^® Xeon^® 6 P-core processorThis table lists the Minimum Firmware requirement for Intel^® Xeon^® 6 E-core processor and Intel^® Xeon^® 6 P-core processor.
Processors	IDRAC	BIOS	FPGA
Intel^® Xeon^® 6 E-core processor	1.10.17.00	1.1.3	106.102.000
Intel^® Xeon^® 6 P-core processor	1.20.25.00	1.2.6	107.102.000

PSU specifications

The PowerEdgeR570system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	AC Voltage			DC Voltage			Current (A)
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	200—240 V	100—120 V	277 V	240 V	- (48—60) V	336 V	Current (A)
800 W mixed mode	Platinum	3000	50/60	800 W	800 W	N/A	N/A	N/A	N/A	9.2—4.5 A
	Titanium	3000	50/60	800 W	800 W	N/A	N/A	N/A	N/A	9.2—4.5 A
	N/A	3000	N/A	N/A	N/A	N/A	800 W	N/A	N/A	3.7 A
1100 W	Titanium	4100	50/60	1100 W	1050 W	N/A	N/A	N/A	N/A	12—6.1 A
	Platinum	4100	50/60	1100 W	1050 W	N/A	N/A	N/A	N/A	12—6.1 A
	N/A	4100	N/A	N/A	N/A	N/A	1100 W	N/A	N/A	5.1 A
1400 W -48 VDC	Titanium	5310	N/A	N/A	N/A	N/A	N/A	1400 W	N/A	33 A
1500 W 227 VAC	Titanium	5625	50/60	N/A	N/A	N/A	1500 W	N/A	N/A	6.1 A
1500 W 227 VAC	N/A	5625	N/A	N/A	N/A	N/A	N/A	N/A	1500 W	4.91 A
1500 W mixed mode	Titanium	5625	50/60	1500 W	1050 W	N/A	N/A	N/A	N/A	12—8.2 A
1500 W mixed mode	N/A	5625	N/A	N/A	N/A	N/A	1500 W	N/A	N/A	6.8 A
1800 W mixed mode	Titanium	6750	50/60	1800 W	1050 W	N/A	N/A	N/A	N/A	9.8—8.2 A
1800 W mixed mode	N/A	6750	N/A	N/A	N/A	N/A	1800 W	N/A	N/A	8.2 A

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.

NOTE:If a system with AC 1500 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is degraded to 1050 W.

this image shows C13 power cords — Figure 1. PSU power cables

this image shows list of PSU power cord APP 2006G1 — Figure 2. APP 2006G1 power cable

this image shows list of PSU power cord LOTES APOWA048 — Figure 3. LOTES APOWA048 power cable

Table 2. PSU power cablesThe table lists the PSU power cables list .
Form factor	Output	Power cable
Redundant 60 mm	800 W mixed mode	C13
	1100w mixed mode	C13
	1400w -48v DC	LOTES APOWA048
	1500 W mixed mode	C13
	1500w 277v	APP2006G1/2006G3
	1800 W mixed mode	C13

Cooling fan specifications

The PowerEdgeR570system supports up to six cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Also known as	Label color	Label image
High Performance Silver (HPR Silver) fans	HPR SLVR	Silver	Silver
High Performance Gold (HPR Gold) fans	HPR GOLD	Gold	Gold

NOTE:Cooling fans rotate at a slower speed, even while the system is in standby mode, and the fan speed varies in response to changes in the ambient temperature.

Supported operating systems

The PowerEdge R570 system supports the following operating systems:

Canonical Ubuntu Server LTS
RedHat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi
Windows Server
Windows Server Datacenter

For specifications and interoperability details, see OS support.

System battery specifications

The PowerEdge R570 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R570 system supports up to four PCI express (PCIe) slots (Gen5 slots), dual OCP NIC, and BOSS on the HPM board.

Table 1. Expansion card slots supported on the HPM boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Expansion card riser	Processor connection	Height	Length	Slot width
Slot 2	R1x	Processor 0	Full Height	Half Length	x16
Slot 3	R2t	Processor 0	Full Height	Half Length	x16
Slot 4	R3e (Flop OCP) R3f (Flop OCP)	Processor 0	N/A	N/A	x16
Slot 6	BOSS (optional)	Processor 0	N/A	N/A	x4
Slot 7	R5b	Processor 0	Full Height	Half Length	x16
Slot 9	R4b	Processor 0	Full Height	Half Length	x16
Slot 10	Onboard OCP (optional)	Processor 0	N/A	N/A	x16
Slot 31	RF1a	Processor 0	Full Height	Half Length	x16
Slot 34	RF2a (Flop OCP) BOSS (optional)	Processor 0	N/A	N/A	x16/x4
Slot 36	RF3c	Processor 0	Full Height	Half Length	x16
Slot 38	RF4b (Flop OCP)	Processor 0	N/A	N/A	x16

Memory specifications

The PowerEdge R570 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	Rank	Capacity	Single Processor
			Intel^® Xeon 6 E- core processor		Intel^® Xeon 6 P- core processor
			Minimum system capacity	Maximum system capacity	Minimum system capacity	Maximum system capacity
RDIMM	1 R	16 GB	N/A	N/A	16 GB	128 GB
	2 R	32 GB	32 GB	256 GB	32 GB	512 GB
		64 GB	512 GB	1 TB	256 GB	1 TB
		96 GB	N/A	N/A	768 GB	1.5 TB
		128 GB	N/A	N/A	1 TB	2 TB
	8 R	256 GB	N/A	N/A	4 TB	4 TB

NOTE: The RDIMM configuration depends on the DIMM capacity and the processor combination. Refer the System memory guidelines for more information.

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
16 DDR5 DIMM slots	6400 MT/s (1DPC) 5200 MT/s (2DPC)

NOTE:Memory DIMM slots are not hot pluggable.

NOTE:The processor may reduce the performance of the rated DIMM speed.

Storage controller specifications

The PowerEdge R570 system supports the following controller cards:

Table 1. Storage controller cardsThis table provides the controller cards that are supported on the system:
Supported storage controller cards
Internal controllers PERC H365i DC-MHS Front PERC H965i DC-MHS Front PERC H365i adapter PERC H965i adapter
External controllers PERC H965e HBA 465e
Internal boot Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS) M.2 interposer with up to 2 x M.2 NVMe SSDs USB
Software RAID N/A

Drives

The PowerEdge R570 system supports:

Up to12 x 3.5-inch SATA (HDD) RAID hot-swappable drives + 4 x EDSFF E3.S Gen5 NVMe hot-swappable drives
8 x 2.5-inch NVMe (SSD) RAID hot-swappable drives
8 x 2.5-inch NVMe (SSD) hot-swappable drives
8 x 2.5-inch SATA (HDD/SSD) hot-swappable drives
8 x 2.5-inch SATA/Universal (HDD/SSD) hot-swappable drives
16 x 2.5-inch SATA (HDD/SSD) RAID hot-swappable drives
24 x 2.5-inch SATA (HDD/SSD) hot-swappable drives
8 x EDSFF E3.S (hot-aisle) Gen5 NVMe hot-swappable drives
8 x EDSFF E3.S (cold-aisle) Gen5 NVMe hot-swappable drives
16 x EDSFF E3.S (cold-aisle) Gen5 NVMe hot-swappable drives
16 x EDSFF E3.S (hot-aisle) Gen5 NVMe hot-swappable drives
32 x EDSFF E3.S (hot-aisle) Gen5 NVMe hot-swappable drives

NOTE: For more information about how to hot swap NVMe PCIe SSD device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

GPU Specifications

The PowerEdge R570 system supports

Up to four NVIDIA L4 24 GB 72 W single-width GPUs
Up to three NVIDIA L40S 48 GB 350 W double-width GPUs
Up to three NVIDIA H100 NVL 94 GB 400 W double-width GPUs

DPU Specifications

The PowerEdge R470 platform accommodates Data Processing Units (DPUs). These units are system-on-chip solutions that combine ARM cores, high-performance NICs, and programmable acceleration engines to offload and accelerate data center infrastructure services.

Table 1. Supported Data Processing Units(DPU) CardsThis table describes the feature and the specifications for the supported DPU cards in R570
Feature	Specifications
Model	NVIDIA BlueField-3 B3220
Type	Data Processing Units (DPU)
Networking	2 x 200 GbE
Form Factor	FHHL
Interface	PCIe Gen5 x16
Power Consumption	150 W
Compatible Risers	RC 1(Slot 7), RC 3(Slot 31), RC 4(Slot 31), RC 5(Slot 7), RC 6(Slot 7), RC 8(Slot 7), RC 9(Slot 7), RC 10( Slot 7), RC 11(Slot 7)

NIC port specifications

The PowerEdge R570 system supports one 10/100/1000 Mbps BMC Ethernet and two optional Open Compute Project (OCP) cards.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
Datacenter-Secure Control Module (DC-SCM)	1 GbE x 1
OCP NIC 3.0 card	100 GbE x 2, 25 GbE x 2, 25 GbE x 4, 10 GbE x 2, 10 GbE x 4, 1 GbE x 4

USB ports specifications

Table 1. PowerEdge R570 USB specificationsThe following table shows the USB specifications for the system:
Front		Rear		Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port (optional)	One	USB 3.1-compliant port	Two	Internal USB 3.1-compliant port	One
USB type C dual-mode host/BMC Direct port	One	USB 3.1-compliant port	Two	Internal USB 3.1-compliant port	One

Serial connector specifications

The PowerEdge R570 system supports one optional card type connector, which is a 9 - pin connector, Data Terminal Equipment (DTE), 16550-compliant.

The optional serial connector card is available only in front I/O configuration.

Top USB port on DC-SCM supports external DB9 Dongle.

Video ports specifications

The PowerEdge R570 system supports one DB-15 VGA port (optional) on the rear I/O board and one Mini Display (mDP) port (optional) on the Left Control Panel (LCP) .

NOTE:Both ports cannot be used together. The mDP port overrides the VGA port.

Video specifications

Table 1. Supported video resolution optionsThis table describes the supported video resolution options for the system.
Resolution	Refresh Rate	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on Dell Support.

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Parameters	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 ft) above 900 m (2953 ft)

Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Parameters	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Parameters	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Continuous Operation Specifications for Rugged Environment This table describes the operational climatic range for category A4.
Parameters	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–55°C (41–131°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 5. Common Environmental Specifications for ASHRAE A2, A3, A4, and Rugged This table describes the shared requirements across all categories.
Parameters	Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40°C to 65°C (-40°F to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 ft)
Maximum operational altitude	3,048 meters (10,000 ft)

Table 6. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz for 10 min (all x, y, and z axes)
Storage	1.38 G_rms at 7 Hz to 250 Hz for 15 minutes (all six sides tested)

Table 7. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a non-operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard
HPR	High performance
HPR Silver	High performance (HPR) Silver fan
HPR Gold	High Performance (HPR) Gold fan
HSK	Heat sink
LP	Low profile
FH	Full height
EXT	Extended

Table 2. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink	Processor TDP
2U STD HSK	Require a regular shroud CPU TDP ≤150 W in Non 12x3.5” configuration
HPR HSK	Require a regular shroud CPU TDP > 150 W or all CPUs in 12x3.5” configuration

NOTE:The configuration's ambient temperature is dictated by its critical component. For example, if the processor's ambient temperature is 35°C, the DIMM is 35°C, and the GPU is 30°C, the configuration's ambient temperature can only be 30°C.

Table 3. Thermal restriction matrix for air cooling (non - GPU)The table describes the thermal restriction matrix for air cooling:
Configuration		Cold Aisle 8 x E3.S 16 x E3.S	8 x 2.5-inch NVMe	12 x 3.5-inch SAS/SATA	12 x 3.5-inch SAS/SATA	16 x 2.5-inch drives 24 x 2.5-inch drives	Hot Aisle 8 x E3.S 16 x E3.S	Hot Aisle 32 x E3.S	Ambient temperature
Rear storage		No rear drives	No rear drives	Rear 4 x E3.S	No rear drives	No rear drives	No rear drives	No rear drives
Shroud		Regular Shroud
Processor	TDP/cTDP	Fan/HSK
6710E	205 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
6756E	225 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
6740E/6766E/6731E/6746E	250 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
6780E	330 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
6507P/6505P/6511P	150 W	HPR Silver fan STD HSK	HPR Silver fan STD HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan STD HSK	HPR Silver fan STD HSK	HPR Gold fan STD HSK	35°C
6517P	190 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
6724P	210 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
6521P	225 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
6731P	245 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
6527P	255 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
6737P	270 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
6730P	250 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
6741P	300 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
6747P	330 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
6787P/6767P/6781P/6761P	350 W	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	HPR Gold fan HPR HSK	HPR Silver fan HPR HSK	HPR Silver fan HPR HSK	HPR Gold fan HPR HSK	35°C
Memory		Ambient Temperature
16 GB RDIMM		35°C	35°C	35°C	35°C	35°C	35°C	35°C	35°C
32 GB RDIMM		35°C	35°C	35°C	35°C	35°C	35°C	35°C	35°C
64 GB RDIMM		35°C	35°C	35°C	35°C	35°C	35°C	35°C	35°C
96 GB RDIMM		35°C	35°C	35°C	35°C	35°C	35°C	35°C	35°C
128 GB RDIMM		35°C	35°C	35°C	35°C	35°C	35°C	35°C	35°C

Table 4. Thermal restriction matrix for air cooling (GPU)The table describes the thermal restriction matrix for air cooling:
Configuration		Cold Aisle 8 x E3.S 16 x E3.S	Ambient temperature
Rear storage		No rear drives
Shroud		GPU Shroud
Processor	TDP/cTDP	Fan/HSK
6710E	205 W	HPR Gold fan 1U EXT HSK	35°C
6756E	225 W	HPR Gold fan 1U EXT HSK	35°C
6740E/6766E/6731E/6746E	250 W	HPR Gold fan 1U EXT HSK	35°C
6780E	330 W	HPR Gold fan 1U EXT HSK	35°C
6507P/6505P/6511P	150 W	HPR Gold fan 1U EXT HSK	35°C
6517P	190 W	HPR Gold fan 1U EXT HSK	35°C
6724P	210 W	HPR Gold fan 1U EXT HSK	35°C
6521P	225 W	HPR Gold fan 1U EXT HSK	35°C
6731P	245 W	HPR Gold fan 1U EXT HSK	35°C
6527P	255 W	HPR Gold fan 1U EXT HSK	35°C
6737P	270 W	HPR Gold fan 1U EXT HSK	35°C
6730P	250 W	HPR Gold fan 1U EXT HSK	35°C
6741P	300 W	HPR Gold fan 1U EXT HSK	35°C
6747P	330 W	HPR Gold fan 1U EXT HSK	35°C
6787P/6767P/6781P/6761P	350 W	HPR Gold fan 1U EXT HSK	30°C
Memory		Ambient Temperature
16 GB RDIMM		35°C	35°C
32 GB RDIMM		35°C	35°C
64 GB RDIMM		35°C	35°C
96 GB RDIMM		35°C	35°C
128 GB RDIMM		35°C	35°C

Thermal air restrictions

ASHRAE A3/A4

Two PSUs are required in redundant mode, however a single PSU failure is not supported.
NVMe drive including U.2 and E3.S is not supported.
128 GB or greater capacity DIMMs are not supported.
GPU and FPGA are not supported.
CPU TDP ≥ 190 W is not supported.
Rear drives are not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
12 x 3.5-inch SAS/SATA drive configuration is not supported.
M.2 module is not supported.
OCP card with a transmission rate higher than 25G is not supported.
NIC/OCP transceiver specification ≤ 75°C is not supported.
PERC adapter card with battery is not supported.

NVIDIA L4 GPU

In 24 x 2.5-inch drive and 32 x E3.S drive configurations, L4 with ≥ 270W CPU , it is limited at max ambient 30°C support and with ≤ 250W CPU can support max ambient 35°C.
L4 cannot be supported in a 12 x 3.5-inch drive configurations.
L4 can be supported at max ambient 35°C. However, with ≥ 300 W CPU SKUs, it is limited at max ambient 30°C support.

NVIDIA H100 NVL GPU

H100 NVL is dedicated to cold aisle 8 x E3.S drive configuration.
H100 NVL cannot be supported in a 12 x 3.5-inch, 24 x 2.5- Inch and 32 x E3.S drive configurations.
H100 NVL can be supported at max ambient 35°C. However, with ≥ 300 W CPU SKUs, it is limited at max ambient 30°C support.

PCIe card Restrictions

12x3.5-inch, 24 x 2.5-inch and 32 x E3.S drive configuration requires the optical transceiver with higher temperature spec ≥ 85C support.
DPU, 100 Gb network adapter, or 100 Gb OCP is not supported in 12x3.5” drive configuration.
NVIDIA B3220 200G DPU requires a passive copper cable transceiver – MCP1650-H0XXXXX .
200G Broadcom network adaptor or OCP (250P7 / T635T) requires the optical transceiver with higher temperature spec (≥ 85C) support .

Table 1. Air cooling configuration thermal restriction for AHSRAE A3 and A4This table provides information about ASHRAE A3 and A4 restrictions for air cooling configuration.
ASHRAE	A3/40°C (104°F)	A4/45°C (113°F)
PSU	Two PSUs are required in redundant mode. Single PSU failure is not supported.
PCIe card	Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA	Not supported
DIMM	128 GB, or greater capacity DIMMs are not supported.
Front storage	12 x 3.5-inch SAS/SATA configuration is not supported.
E3.S drive	E3.S drive configuration is not supported.
U.2 NVMe drive	U.2 NVMe drive configuration is not supported.
M.2 Module	M.2 module is not supported.
Rear storage	Not supported
Processor	CPU TDP ≥ 190 W is not supported.
PERC	PERC adapter card with battery is not supported.
NIC/OCP	transceiver spec ≤ 75 W is not supported.