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Dell PowerEdge R550: технические характеристики и спецификации
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Сервер Dell PowerEdge R550 210-AZEG
Сервер Dell PowerEdge R550 210-AZEG
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Dell PowerEdge R550: технические характеристики и спецификации

Chassis dimensions

Figure 1. Chassis dimensions

The image shows system dimensions.

Table 1. PowerEdgeR550 chassis dimensionsThis table provides the dimensions of the PowerEdgeR550
Drives Xa Xb Y Za Zb Zc
16 drives482.0 mm (18.97 inches)434.0 mm (17.08 inches)86.8 mm (3.41 inches)22.0 mm (0.86 inches)Without bezel35.84 mm (1.41 inches)With bezel675.04 mm (26.57 inches)Ear to L bracket housing650.24 mm (25.6 inches)Ear to PSU surface685.78 mm (26.99 inches)Ear to PSU handle without velcro strap
8 drives
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

Chassis weight

Table 1. PowerEdge R550 chassis weightThe table below shows the maximum weight of the Dell EMC PowerEdge R550.
System configuration Maximum weight (with all drives/SSDs/bezel)
16 x 2.5-inch 21.94 kg (48.36 lb)
8 x 2.5-inch 20.44 kg (45.06 lb)
8 x 3.5-inch 24.80 kg (54.67 lb)

Processor specifications

Table 1. PowerEdge R550 processor specificationsThis table provides processor specifications for the PowerEdge R550.
Supported processor Number of processors supported
3rd Generation Intel Xeon Scalable processors with up to 24 cores Up to two

PSU specifications

The PowerEdge R550 system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specificationsThe table lists the specifications for 1100 W, 800 W, 700 W and 600 W power supplies.
PSU Class Heat dissipation (maximum) Frequency Voltage AC DC Current
High line 200–240 V Low line 100–120 V
1100 W DC NA 4265 BTU/hr NA -48–(-60) V NA NA 1100 W 27 A
1100 W Mixed Mode Titanium 4,125 BTU/hr 50/60 Hz 100-240 V AC 1100 W 1050 W NA 12 A- 6.3A
NA 4,125 BTU/hr NA 240 V DC NA NA 1100 W 5.2A
800 W Mixed Mode Platinum 3000 BTU/hr 50/60 Hz 100 - 240 V AC, autoranging 800 W 800 W NA 9.2 - 4.7 A
NA 3000 BTU/hr NA 240 V DC, autoranging NA NA 800 W 3.8 A
700 W Mixed Mode Titanium 2,625 BTU/hr 50/60 Hz 200-240 V AC 700 W NA NA 4.1 A
NA 2,625 BTU/hr NA 240 V DC NA NA 700 W 3.4 A
600 W Mixed Mode Platinum 2250 BTU/hr 50/60 Hz 100 - 240 V AC, autoranging 600 W 600 W NA 7.1 - 3.6 A
NA 2250 BTU/hr NA 240 V DC, autoranging NA NA 600 W 2.9 A
NOTE:This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

Supported operating systems

The PowerEdge R550 system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • VMware ESXi
  • Microsoft Windows Server with Hyper-V
  • SUSE Linux Enterprise Server
  • Red Hat Enterprise Linux
  • VMware ESXi

For more information, go to Operating System Manuals.

Cooling fan specifications

The PowerEdgeR550 system supports up to five standard (STD) cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
Standard fan STD STD No label This shows the Standard fan image.
High-performance fan (Silver grade)HPR SLVR HPR Silver
NOTE:New cooling fans come with the High-Performance Silver Grade label. While the older cooling fans have the High-Performance label.
Figure 1. High performance fan
this image shows HPSLVR fan

System battery specifications

The PowerEdge R550 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge R550 supports up to four PCI express (PCIe) slots (3 Gen4 and 1 Gen3 slots) on the system board.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot Expansion card riser Processor connection Height Length Slot width
Slot 1 N/A Processor 1 Low Profile Half Length x16
Slot 2 N/A PCH Low Profile Half Length x8 (x4-Link)
Slot 5 N/A Processor 2 Low Profile Half Length x16
Slot 6 N/A Processor 2 Low Profile Half Length x16

Memory specifications

The PowerEdge R550 system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum DIMM capacity Maximum DIMM capacity Minimum DIMM capacity Maximum DIMM capacity
RDIMM Single rank 8 GB 8 GB 64 GB 16 GB 128 GB
Dual rank 16 GB 16 GB 128 GB 32 GB 256 GB
32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
16, 288-pin 2933 MT/s

Storage controller specifications

The PowerEdge R550 system supports the following controller cards:
Table 1. Storage controller cards for the systemThis table provides the controller cards supported on the system:
Internal controllers External controllers
  • S150
  • PERC H345
  • PERC H355
  • PERC H745
  • PERC H755
  • HBA355i
  • Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2 x M.2 SSDs 240 GB or 480 GB
  • PERC H840
  • HBA355e

Drives

The PowerEdge R550 system supports:
  • 16 x 2.5-inch SAS/SATA HDD/SSD.
  • 8 x 2.5-inch SAS/SATA HDD/SSD.
  • 8 x 3.5-inch SAS/SATA HDD/SSD.

USB ports specifications

Table 1. PowerEdge R550 USB specifications The following table shows the USB specifications :
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 2.0-compliant port One Internal USB 3.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0-compliant port) One USB 3.0-compliant ports USB 3.0-compliant port One
NOTE:The micro-AB USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NIC port specifications

The PowerEdge R550 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM card 1 GbE x 2
OCP card (OCP 3.0) 1 GbE x 4, 10 GbE x 2, 25 GbE x 2

Serial connector specifications

The PowerEdge R550 system supports one optional card type serial connector on rear of the system, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The process to install the optional serial connector card is similar to an expansion card filler bracket.

VGA ports specifications

The PowerEdge R550 system supports two DB-15 VGA ports, one each on the front and rear panels of the system.

Video specifications

The PowerEdge R550 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options for the systemThis table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation > Regulatory Information on Dell Support.
Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Operational climatic range category A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Operational climatic range category A4 This table describes the operational climatic range for category A4.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-104 to 149°F)
Non-operational humidity limits (Non-Condensing at all times) 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 5. Maximum vibration specifications The table lists the maximum vibration specifications.
Maximum vibration Specifications
Operating 0.21Grms at 5Hz to 500Hz for 10min (all x, y, and z axes)
Storage 1.88Grms at 10Hz to 500Hz for 15min (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6G for up to 11ms.Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6G for up to 11ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE:Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HSK Heat sink
LP Low profile
FH Full height
Table 2. Thermal restriction matrixThe table describes thermal restriction matrix for the PowerEdge R550 system.
Configuration 8 x 2.5-inch SAS/ SATA 16 x 2.5-inch SAS/ SATA 8 x 3.5-inch SAS/ SATA Ambient temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives
CPU TDP/cTDP 105 W 2U STD HSK with STD fan 35°C
120 W 35°C
135 W 35°C
150 W 35°C
165 W 2U HPR HSK with STD fan 35°C
185 W 35°C
NOTE:Fan blank is required for five standard fan configurations.
NOTE:GPU is not supported in any of the configurations.
NOTE:OCP shroud is required if riser module is not installed.
NOTE:Processor blank is required for one processor configuration.

PCIe adapter cards and other slot restrictions

  • Can support Mellanox CX6-DX with Finisar 100G QSFP28 optical transceiver for all the slots.
  • Mellanox Starlord CX6 Dx DP 100GbE with QSFP56 (MFS1S00-V003E) restricted to slot1, slot3 and slot6 in all the configurations.
Table 3. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Processor TDP
2U STD HSK < 165 W
2U HPR HSK >= 165 W

ASHRAE A3 and A4 environment thermal restriction

  • Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
  • Processor TDP greater than or equal to 185 W are not supported.
  • Front storage is not supported in 12x3.5-inch SAS/SATA configuration.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • OCP transceiver specification greater than or equal to 70°C is not supported.
  • OCP card with transmission rate greater than 25 GB is not supported.
  • PCIe SSD is not supported.
  • BOSS (M.2) card is not supported.