Определяем
Сегодня покупают
ГлавнаяСправочникиDellRack Servers
Dell PowerEdge R470: руководство по обслуживанию
← Вернуться назад
Нужна помощь с конфигурацией?
Пришлите SKU, спецификацию или список требований. Специалист Apltech проверит совместимость компонентов и найдёт актуальные артикулы
Получить консультацию →

Dell PowerEdge R470: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEge R7525 system.
Table 1. PowerEdgeR470 chassis dimensionsThis table provides the dimensions of the system:
Drives Xa Xb Y Za Zb Zc
8 x E3.S EDSFF drives Front I/O configuration482.0 mm (19 inches)434.0 mm (17.1 inches)42.8 mm (1.69 inches)43.3 mm (1.7 inches)750.57 mm (29.55 inches)Ear to rear wall786.141 mm (30.95 inches)Ear to PSU handle

8 x 2.5-inch drives

10 x 2.5-inch drives

4 x 3.5-inch drives

16 x E3.S EDSFF drives

482.0 mm (19 inches)434.0 mm (17.1 inches)42.8 mm (1.69 inches)With bezel 30.78 mm (1.21 inches)Without bezel 29.0 mm (1.14inches)750.57 mm (29.55 inches)Ear to rear wall786.141 mm (30.95 inches)Ear to PSU handle
NOTE:Zb is the nominal rear wall external surface where the HPM board I/O connectors reside.
NOTE:Front bezel is not supported on systems with front I/O configuration.

System weight

Table 1. PowerEdge R470 system weightThe table below shows the maximum weight of the system.
System configuration Maximum weight (with all drives/SSDs)
8 x E3.S EDSFF 19.11 kg (42.13 lb)
16 x E3.S EDSFF 17.66 kg (38.93 lb)
8 x 2.5-inch SATA 17.03 kg (37.54 lb)
10 x 2.5 - inch SATA 17.53 kg (38.64 lb)
4 x 3.5 - inch SATA 18.78 kg (41.40 lb)
Table 2. PowerEdge R470 weight handling recommendationsThe table below shows the weight handling recommendations.
Chassis weight Description
40–70 lbs Recommend two people to lift.
70–120 lbs Recommend three people to lift.
≥ 121 lbs Recommend to use a server-lift.

Processor specifications

Table 1. PowerEdge R470 processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
Intel® Xeon 6 processor One
NOTE: R470 supports both Intel® E- Core and Intel® P-Core processors
Table 2. Minimum Firmware requirement for Intel® Xeon® 6 E-core processor and Intel® Xeon® 6 P-core processorThis table lists the Minimum Firmware requirement for Intel® Xeon® 6 E-core processor and Intel® Xeon® 6 P-core processor.
Processors IDRAC BIOS FPGA
Intel® Xeon® 6 E-core processor 1.10.17.00 1.1.3 106.102.000
Intel® Xeon® 6 P-core processor 1.20.25.00 1.2.6 107.102.000

PSU specifications

The PowerEdgeR470system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) AC Voltage DC Voltage Current (A)
200—240 V 100—120 V 277 V 240 V - (48—60) V 336 V
800 W mixed mode Platinum 3000 50/60 800 W 800 W N/A N/A N/A N/A 9.2—4.5 A
Titanium 3000 50/60 800 W 800 W N/A N/A N/A N/A 9.2—4.5 A
N/A 3000 N/A N/A N/A N/A 800 W N/A N/A 3.7 A
1100 WTitanium4100 50/60 1100 W1050 WN/A N/A N/A N/A 12—6.1 A
Platinum 4100 50/60 1100 W1050 WN/A N/A N/A N/A 12—6.1 A
N/A 4100 N/A N/A N/A N/A 1100 WN/A N/A 5.1 A
1400 W -48 VDCTitanium5310N/A N/A N/A N/A N/A 1400 WN/A 33 A
1500 W 227 VACTitanium 5625 50/60 N/A N/A N/A1500 WN/A N/A 6.1 A
N/A 5625 N/A N/A N/A N/A N/A N/A 1500 W4.91 A
1500 W mixed mode Titanium 5625 50/60 1500 W 1050 W N/A N/A N/A N/A 12—8.2 A
N/A 5625 N/A N/A N/A N/A 1500 W N/A N/A 6.8 A
NOTE:If a system with AC 1500 W PSUs operates at low line 100-120 Vac, then the power rating per PSU is degraded to1050 W.
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc .
Figure 1. PSU power cables

this image shows list of PSU power cords

Figure 2. APP 2006G1 power cable

this image shows list of PSU power cord APP 2006G1

Figure 3. LOTES APOWA048 power cable

this image shows list of PSU power cord LOTES APOWA048

Table 2. PSU power cablesThe table lists the PSU power cables list .
Form factor Output Power cable
Redundant 60 mm 800 W mixed mode C13
1100 W mixed modeC13
1400 W -48v DCLOTES APOWA048
1500 W mixed mode C13
1500w 277vAPP2006G1/2006G3

Cooling fan specifications

The PowerEdgeR470system supports up to four sets of 2 fan module standard (STD) cooling fans or high performance (HPR) silver cooling fans .

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
Standard (STD) fans STD STD No labelThis shows the Standard fan image.
High performance (HPR) silver fansHPR SLVR HPR Silverthis image shows HPR SLVR fan
NOTE:Cooling fans rotate at a slower speed, even while the system is in standby mode, and the fan speed varies in response to changes in the ambient temperature.

Supported operating systems

The PowerEdge R470 system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • RedHat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
  • Windows Server
  • Windows Server Datacenter
For specifications and interoperability details, see OS support. .

System battery specifications

The PowerEdge R470 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R470 system supports PCI express (PCIe) slots on risers. On the front I/O configuration, the R470 supports up to two Full Height (FH) PCIe slots. On the rear I/O configuration, the R470 supports up to two FH or two Low Profile (LP) PCIe slots on the riser.
Table 1. Expansion card slots are supported on the HPM boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot Expansion card riser Processor connection Height Length Slot width
Slot 3 (Optional rear BOSS-N1 ) N/A Processor 0 N/A N/A x4
Slot 5 (Optional OCP) N/A Processor 0 N/A N/A x16
Slot 31 RF1d (front OCP) Processor 0 N/A N/A x16
Slot 32 RF1d (front OCP) Processor 0 N/A N/A x16
Slot 34 (Optional front BOSS-N1) N/A Processor 0 N/A N/A x4
Slot 1 R2q Processor 0 Full Height Half Length x16
Slot 4 R4b Processor 0 Full Height Half Length x16
Slot 34 (Optional front BOSS-N1 ) N/A Processor 0 N/A N/A x4
Slot 1 R2k Processor 0 Low profile Half Length x16
Slot 2 (Flop OCP) R2k Processor 0 N/A N/A x16
Slot 4 R4a Processor 0 Low Profile Half Length x16
Slot 1 R2v Processor 0 Low Profile Half Length x16
Slot 2 (Flop OCP) R2v Processor 0 N/A N/A x16

Memory specifications

The PowerEdge R470 system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type Rank Capacity Single Processor
Intel® Xeon 6 E- core processor Intel® Xeon 6 P- core processor
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
RDIMM 1 R 16 GB N/A N/A 16 GB 128 GB
2 R 32 GB 32 GB 256 GB 32 GB 512 GB
64 GB 512 GB 1 TB 256 GB 1 TB
96 GB N/A N/A 768 GB 1.5 TB
128 GB N/A N/A 1 TB 2 TB
8 R 256 GB N/A N/A 4 TB 4 TB
NOTE: For Intel® Xeon 6 E- core processor 32GB could be 1DIMM per CPU or 1 DIMM per channel.
NOTE: For Intel® Xeon 6 P- core processor - series processor, 16 GB and 32GB could be 1DIMM per CPU with limited features.
NOTE:16 GB and 96 GB memory are supported only in on Intel® Xeon 6 P- core processors .
NOTE:DIMM mixing configurations are not allowed. All DIMM slots must be populated with the exact same DIMMs (one Dell PN).
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
16, 288-pin 6400 MT/s (1DPC)

5200 MT/s (2 DPC)
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:The processor may reduce the performance of the rated DIMM speed.

Storage controller specifications

The PowerEdge R470 system supports the following controller cards:
Table 1. Storage controller cardsThis table provides the controller cards that are supported on the system:
Supported storage controller cards
Internal controllers
  • PERC H365i DC-MHS Front
  • PERC H965i DC-MHS Front
  • PERC H365i adapter
  • PERC H965i adapter
External controllers
  • PERC H965e
  • HBA 465e
Internal boot
  • Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS)
  • M.2 interposer with up to 2 x M.2 NVMe SSDs
  • USB
Software RAID
  • N/A

Drives

The PowerEdge R470 system supports:
  • 8 x EDSFF E3.S hot-swappable NVMe drives.
  • Up to 16 x EDSFF E3.S hot-swappable NVMe drives.
  • 8 x 2.5-inch hot-swappable SATA drives.
  • 10 x 2.5-inch hot-swappable SATA drives with four universal ports.
  • 4 x 3.5-inch hot-swappable SATA drives with 2 x EDSFF E3.S hot-swappable rear drives.
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

GPU Specifications

The Dell PowerEdge R470 system supports
  • Up to four NVIDIA L4 24 GB 72 W Low Profile or Full Height card.

DPU Specifications

The PowerEdge R470 platform accommodates Data Processing Units (DPUs). These units are system-on-chip solutions that combine ARM cores, high-performance NICs, and programmable acceleration engines to offload and accelerate data center infrastructure services.

Table 1. Supported Data Processing Units(DPU) CardsThis table describes the feature and the specifications for the supported DPU cards in R470
Feature Specifications
Model NVIDIA BlueField-3 B3220
Type Data Processing Units (DPU)
Networking 2 x 200 GbE
Form Factor FHHL
Interface PCIe Gen5 x16
Power Consumption 150 W
Compatible Risers RC2 (Slot 31), RC4 (Slot 1), RC5 (Slot 1), RC6 (Slot 1)

NIC port specifications

The PowerEdge R470 system supports Network Interface Controller (NIC) ports embedded on the optional Open Compute Project (OCP) cards.
NOTE:The OCP NIC card is installed at the front or rear of the system, depending on the system I/O configuration.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
Datacenter-Secure Control Module (DC-SCM) 1GB x 1
OCP 3.0 card 25 GbE x 2 , 25 GbE x 4 ,100 GbE x 2

USB ports specifications

Table 1. PowerEdge R470 USB specificationsThe following table shows the USB specifications for the system:
Front Rear Internal
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One (Optional) USB 3.1- compliant ports Two Internal USB 3.1- compliant port One
Type-C USB 2.0-compliant port dual-mode host/iDRAC Direct port One

Serial connector specifications

The PowerEdge R470 system supports one optional card type connector, which is a 9 - pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is available only in front I/O configuration.

Top USB port on DC-SCM supports external DB9 Dongle.

Video ports specifications

The PowerEdge R470 system supports one DB-15 VGA port (optional) on the rear I/O board and one Mini Display (mDP) port (optional) on the Left Control Panel (LCP) .

NOTE:Both ports cannot be used together. The mDP port overrides the VGA port.

Video specifications

The PowerEdge R470 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support.
Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 4. Common Environmental Specifications for ASHRAE A2, A3, and A4 This table describes the shared requirements across all categories.
Temperature Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-40 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz for 10min (all x, y, and z axes)
Storage 1.38 Grms at 7 Hz to 250 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions.
NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment) Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles.
NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HPR (Silver) High performance Silver (HPR SLVR) fan
HPR (Gold) High performance Gold (HPR GOLD) fan
HSK Heat sink
LP Low profile
FH Full height
DLC Direct Liquid Cooling
Table 2. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Processor TDP
Extend HSK <=250 W
Remote HSK >250 W
NOTE:The configuration's ambient temperature is dictated by its critical component. For example, if the processor's ambient temperature is 35°C, the DIMM is 35°C, and the GPU is 30°C, the configuration's ambient temperature can only be 30°C.
Table 3. Thermal restriction matrix (non-GPU) The table describes the thermal restriction matrix:
Configuration 8 x EDSFF E3.S NVMe 16 x EDSFF E3.S NVMe 8 x 2.5 inch SAS/SATA/NVMe 10 x 2.5 inch SAS/SATA 4 x 3.5 inch SAS/SATA with rear 2 x EDSFF E3.S NVMe Ambient temperature
Storage configuration number C01-1/2/3 , C06-01 C05-01 C02-1/2/3/5/6 C04-1/2 C03-01
Riser configuration RC-2/3/4/56/7 RC-7 RC-0/6/8 RC-6/7 RC-1
Air shroud type EXT/Remote EXT/Remote EXT/Remote EXT/Remote EXT/Remote
Processor TDP Cores Fan
6780E 330 W 144 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6766E 250 W 144 STD STD STD HPR SLVR STD 35°C
6756E 225 W 128 STD STD STD STD STD 35°C
6746E 250 W 112 STD STD STD HPR SLVR STD 35°C
6740E 250 W 96 STD STD STD HPR SLVR STD 35°C
6731E 250 W 96 STD STD STD HPR SLVR STD 35°C
6710E 205 W 64 STD STD STD STD STD 35°C
6787P 350 W 86 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6767P 350 W 64 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6747P 330 W 48 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6737P 270 W 32 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6730P 250 W 32 STD STD STD HPR SLVR STD 35°C
6527P 255 W 24 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6724P 210 W 16 STD STD STD STD STD 35°C
6517P 190 W 16 STD STD STD STD STD 35°C
6505P 150 W 12 STD STD STD STD STD 35°C
6507P 150 W 8 STD STD STD STD STD 35°C
6781P 350 W 80 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6761P 350 W 64 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6741P 300 W 48 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6731P 245 W 32 STD STD STD STD STD 35°C
6521P 225 W 24 STD STD STD STD STD 35°C
6511P 150 W 16 STD STD STD STD STD 35°C
NOTE:Extended heatsink and shroud can support CPU TDP up to 250 W.
Table 4. Thermal restriction matrix (GPU) The table describes the thermal restriction matrix:
Configuration 8 x EDSFF E3.S NVMe 16 x EDSFF E3.S NVMe 8 x 2.5 inch SAS/SATA/NVMe 10 x 2.5 inch SAS/SATA 4 x 3.5 inch SAS/SATA with rear 2 x EDSFF E3.S NVMe Ambient temperature
Storage configuration number C01-1/2/3 , C06-01 C05-01 C02-1/2/3/5/6 C04-1/2 C03-01
Riser configuration RC-2/3/4/56/7 RC-7 RC-0/6/8 RC-6/7 RC-1
Air shroud type EXT/Remote EXT/Remote EXT/Remote EXT/Remote EXT/Remote
Processor TDP Cores Fan
6780E 330 W 144 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6766E 250 W 144 STD STD STD HPR SLVR STD 35°C
6756E 225 W 128 STD STD STD STD STD 35°C
6746E 250 W 112 STD STD STD HPR SLVR STD 35°C
6740E 250 W 96 STD STD STD HPR SLVR STD 35°C
6731E 250 W 96 STD STD STD HPR SLVR STD 35°C
6710E 205 W 64 STD STD STD STD STD 35°C
6787P 350 W 86 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6767P 350 W 64 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6747P 330 W 48 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6737P 270 W 32 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6730P 250 W 32 STD STD STD HPR SLVR STD 35°C
6527P 255 W 24 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6724P 210 W 16 STD STD STD STD STD 35°C
6517P 190 W 16 STD STD STD STD STD 35°C
6505P 150 W 12 STD STD STD STD STD 35°C
6507P 150 W 8 STD STD STD STD STD 35°C
6781P 350 W 80 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6761P 350 W 64 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6741P 300 W 48 HPR SLVR HPR SLVR HPR SLVR HPR SLVR HPR SLVR 35°C
6731P 245 W 32 STD STD STD STD STD 35°C
6521P 225 W 24 STD STD STD STD STD 35°C
6511P 150 W 16 STD STD STD STD STD 35°C
NOTE:Extended heatsink and shroud can support CPU TDP up to 250 W.
NOTE:Remote heatsink and HPR SLVR fan is required for 350 W CPU TDP supporting at 35°C ambient temperature.
NOTE:System can support CPU TDP up to 250 W with extended heatsink and STD fan in 8x EDSFF E3.S cold aisle config and 8 x 2.5- inch SAS/SATA(NVMeRAID/direct) config at 35°C ambient temperature.
NOTE:System can support CPU TDP up to 225 W with extended heatsink and STD fan in 10 x 2.5-inch SAS/SATA config at 35°C ambient temperature.

Thermal air restrictions

ASHRAE A3 environment

8 x EDSFF E3.S Configuration (Cold Aisle Capable Front I/O)

  • CPU > 225 W is not supported.
  • 128G or greater capacity RDIMMs are not supported.
  • GPU cards are not supported.
  • DPU is not supported.
  • Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • 85 C active optics or DAC is required.

16 x EDSFF E3.S Configuration

  • CPU > 225 W is not supported.
  • 128G or greater capacity RDIMMs are not supported.
  • GPU cards are not supported.
  • DPU is not supported.
  • Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • 85 C active optics or DAC is required.

8 x 2.5-inch Configuration SAS/SATA; NVMe RAID/direct

  • CPU > 225 W is not supported.
  • 128G or greater capacity RDIMMs are not supported.
  • GPU cards are not supported.
  • DPU is not supported.
  • Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • 85 C active optics or DAC is required.

10 x 2.5-inch Configuration SAS/SATA

  • CPU > 185 W is not supported.
  • 128G or greater capacity RDIMMs are not supported.
  • GPU cards are not supported.
  • DPU is not supported.
  • Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • 85 C active optics or DAC is required.

4 x 3.5-inch Configuration with rear 2 x EDSFF E3.S drives

  • CPU > 185 W is not supported.
  • 128G or greater capacity RDIMMs are not supported.
  • GPU cards are not supported.
  • DPU is not supported.
  • Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • 85 C active optics or DAC is required.

ASHRAE A4 environment

8 x EDSFF E3.S Configuration (Cold Aisle Capable Front I/O)

  • CPU > 185 W is not supported.
  • 128G or greater capacity RDIMMs are not supported.
  • BOSS-N1 DC-MHS is not supported at the rear of the system..
  • GPU cards are not supported.
  • DPU is not supported.
  • Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • 85 C active optics or DAC is required.

16 x EDSFF E3.S Configuration

  • CPU > 185 W is not supported.
  • 128G or greater capacity RDIMMs are not supported.
  • BOSS-N1 DC-MHS is not supported..
  • GPU cards are not supported.
  • DPU is not supported.
  • Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • 85 C active optics or DAC is required.

8 x 2.5-inch Configuration SAS/SATA; NVMe RAID/direct

  • CPU > 185 W is not supported.
  • 128G or greater capacity RDIMMs are not supported.
  • BOSS-N1 DC-MHS is not supported..
  • GPU cards are not supported.
  • DPU is not supported.
  • Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • 85 C active optics or DAC is required.

10 x 2.5-inch Configuration SAS/SATA; NVMe RAID/direct

  • CPU > 165 W is not supported.
  • 128G or greater capacity RDIMMs are not supported.
  • BOSS-N1 DC-MHS is not supported..
  • GPU cards are not supported.
  • DPU is not supported.
  • Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • 85 C active optics or DAC is required.

4 x 3.5-inch Configuratio with rear 2 x EDSFF E3.S drives

  • CPU > 165 W is not supported.
  • 128G or greater capacity RDIMMs are not supported.
  • BOSS-N1 DC-MHS is not supported..
  • GPU cards are not supported.
  • DPU is not supported.
  • Two PSUs are required in redundant mode. System performance may be reduced in the event of a PSU failure.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • 85 C active optics or DAC is required.
NOTE:There are no specific restrictions for ASHRAE A2 environment.

Additional Restriction

For rear I/O configurations with 25 Gb and above,25Gb PCIe/OCP cards require DAC or 85 C active optics.

85 C active optics are SFP28 and QSFP+