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Dell PowerEdge R430: руководство по обслуживанию
Chassis dimensions
This section
describes the physical dimensions of the system.Figure 1. Chassis dimensions
of the PowerEdge R430 system
Table 1. Dimensions of
the Dell PowerEdge R430 systemThis table gives details of the dimensions of the
Dell PowerEdge R430 system. The dimensions are as follows: X = 482.4
mm, Xa = 434.0 mm, Y = 42.8 mm, Z(with bezel)= 677.3 mm, Z (without
bezel) = 662.4 mm, Za (with bezel) = 35.0 mm, Za (without bezel) =
20.1 mm, and Zb=642.3 mm.
X
Xa
Y
Z (with bezel)
Z (without bezel)
Za (with bezel)
Za (without bezel)
Zb
482.4 mm (18.99 inches)
434.0 mm (17.08 inches)
42.8 mm (1.68 inches)
677.3 mm (26.66 inches)
662.4 mm (264.07 inches)
35.0 mm (1.37 inches)
20.1 mm (0.79 inches)
642.3 mm (25.28 inches)
Chassis weight
This section
describes the weight of the system.
Table 1. Chassis weightFor PowerEdge R430 systems, the maximum chassis
weight is 19.9 kg (43.87 lb).
System
Maximum weight (with all hard drives/SSDs)
PowerEdge R430
19.9 kg (43.87 lb)
Processor specifications
The PowerEdge
R430 system supports up to two Intel Xeon E5-2600 v3 or Intel Xeon
E5-2600 v4 product family processors.
PSU specifications
The PowerEdge
R430 system supports up to two AC redundant power supply units (PSUs)
and a single AC cabled PSU.
Table 1. PSU specificationsFor 550 W AC, platinum power supply unit, the maximum
heat dissipation is 2107 BTU/hr, frequency is 50/60 Hz, and voltage
range is 100240 V AC autoranging and the current rating is between
7.4 A-3.7 A. For 450 W AC Bronze PSU, the maximum heat dissipation
is 1871 BTU/hr, frequency is 50/60 Hz, and voltage range is 100240
V AC autoranging and the current rating is between 605 A-3.5 A.
PSU
Class
Heat dissipation (maximum)
Frequency
Voltage
Current
550 W AC
Platinum
2107 BTU/hr
50/60 Hz
100–240 V AC, autoranging
7.4 A-3.7 A
450 W AC
Bronze
1871 BTU/hr
50/60 Hz
100–240 V AC, autoranging
6.5 A-3.5 A
NOTE Heat
dissipation is calculated using the PSU wattage rating.
NOTE This system is also
designed to connect to the IT power systems with a phase-to-phase
voltage not exceeding 230 V.
System battery
specifications
The PowerEdge
R430 system supports 3 V CR2032 Lithium coin cell system battery.
Expansion bus
specifications
The PowerEdge
R430 system supports PCI express (PCIe) Generation 2 and 3 expansion
cards, which need to be installed on the system board using expansion
card risers. This system supports two types of expansion card risers.
The following table provides the expansion card riser specifications:
Table 1. Expansion card
riser specificationsThis table describes the details of the PICe slots
on the expansion card risers. PCIE_G3_X16 riser supports PCIe slots
1 and 2 with low-profile, half-length, x16 link speed cards. PCIE_G3_X8
riser supports two PCIe cards on slots 1 and 2 with a full height,
low profile, x8 link speed cards on slot 1 and a low-profile, half-length,
x8 link speed card on slot 2
Expansion card riser
PCIe slots on the riser
Height
Length
Link
PCIE_G3_X16 riser
Slot 1
low-profile
half-length
x16
Slot 2
low-profile
half-length
x16
PCIE_G3_X8 riser
Slot 1
full-height
half-length
x8
Slot 2
low-profile
half-length
x8
Memory specifications
The PowerEdge
R430 system supports DDR4 registered DIMMs (RDIMMs) and load-reduced
DIMMs (LRDIMMs). Supported memory bus frequencies are 1866 MT/s, 2133MT/s,
or 2400 MT/s.
Table 1. Memory specificationsYour system supports 12 memory module sockets of
288-pins each. The system supports RDIMMs of memory capacity 4 GB
or 8 GB single rank, and RDIMMs of memory capacity 8 GB, 16 GB, or
32 GB dual rank. For system with single processor, the minimum RAM
is 4 GB and the maximum RAM is up to 256 GB. For system with dual
processor, the minimum RAM is 8 GB (minimum one memory module per
processor) and the maximum RAM is up to 384 GB.
Memory module sockets
Memory capacity
Minimum RAM
Maximum RAM
Twelve 288–pin
4 GB single rank (RDIMMs)
8 GB, 16 GB, or 32 GB dual rank (RDIMMs)
4 GB with single processor
8 GB with dual processors (minimum one memory module
per processor)
Up to 256 GB with a single processor
Up to 384 GB with a dual processor
Hard drives
The PowerEdge R430 system supports SAS, SATA, Nearline SAS hard drives and Solid State Drives (SSDs).
Table 1. Supported hard drive and SSD options for the PowerEdge R430 systemThis table lists out the supported hard drive and SSD options for the PowerEdge 430 system.
Drive System
Supports up to
Four hard drive systems
Up to four 3.5-inch cabled hard drives, or
Up to four 3.5-inch hot-swappable SAS, SATA, or Nearline SAS hard drives, or
Up to four 2.5-inch hot-swappable SAS, SATA, SATA SSD, or Nearline SAS hard drives.
NOTE Four hard-drive systems support software RAID. For more information about software RAID, see the Dell PowerEdge RAID Controller (PERC) documentation at
dell.com/storagecontrollermanuals.
Eight hard-drive systems
Up to eight 2.5-inch, hot-swappable SAS, SATA, SATA SSD, or Nearline SAS hard drives
Ten hard-drive systems
Up to ten 2.5-inch, hot-swappable SATA hard drive or SATA SSD
Optical drive
The PowerEdge
R430 system supports one optional SATA DVD-ROM drive or DVD+/-RW drive.
NOTE The optical drive is supported on the four hard-drive systems and
eight hard-drive systems.
USB ports
The PowerEdge
R430 system supports:
USB 2.0-compliant ports on the front panel
USB 3.0-complaint and USB 2.0-compliant ports on the
back panel
USB 3.0-compliant internal port
The following table provides more information about the USB specifications:
Table 1. USB specificationsThe PowerEdge R430 system supports two 4-pin, USB
2.0-compliant ports on the front panel. Your system supports one 9-pin,
USB 3.0-compliant port and one 4-pin, USB 2.0-compliant port on the
back panel and one 9-pin, USB 3.0-compliant internal port.
System
Front panel
Back panel
Internal
PowerEdge R430
Two 4-pin, USB 2.0-compliant ports
One 9-pin, USB 3.0-compliant port
One 4-pin, USB 2.0-compliant port
One 9-pin, USB 3.0-compliant port
NIC ports
The PowerEdge
R430 system supports four 10/100/1000 Mbps Network Interface Controller
(NIC) ports on the back panel.
Serial connector
The serial
connector connects a serial device to the system. The PowerEdge R430
system supports one serial connector on the back panel, which is a
9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.
VGA ports
The Video
Graphic Array (VGA) port enables you to connect the system to a VGA
display. The PowerEdge R430 system supports two 15-pin VGA ports one
each on the front and back panels.
Internal Dual
SD Module
The PowerEdge
R430 system supports two optional flash memory card slots with an
internal dual SD module.
NOTE One card slot is dedicated
for redundancy.
Video specifications
The PowerEdge
R430 system supports Matrox G200 graphics card with 16 MB capacity.
Table 1. Supported video
resolution optionsFor 640 x 480 resolution, the refresh rate is 60
to 70 Hz and the color depth is 8, 16, 32 bit. For 800 x 600 resolution,
the refresh rate is 60, 75, 85 Hz and color depth is 8, 16, 32 bit.
For 1024 x 768 resolution, the refresh rate is 60, 75, 85 Hz and color
depth is 8, 16, 32 bit. For 1152 x 864 resolution, the refresh rate
is 60, 75, 85 Hz and color depth is 8, 16, 32 bit. For 1280 x 1024
resolution, the refresh rate is 60, 75 Hz and color depth is 8, 16,
32 bit. For 1440 x 900 resolution, the refresh rate is 60 Hz and color
depth is 8, 16, 32 bit.
Resolution
Refresh rate (Hz)
Color depth (bits)
640 x 480
60, 70
8, 16, 32
800 x 600
60, 75, 85
8, 16, 32
1024 x 768
60, 75, 85
8, 16, 32
1152 x 864
60, 75, 85
8, 16, 32
1280 x 1024
60, 75
8, 16, 32
1440 x 900
60
8, 16, 32
Environmental
specifications
NOTE For additional information
about environmental measurements for specific system configurations,
see Dell.com/environmental_datasheets.
Table 1. Temperature
specificationsWhen the system is in continuous operation (for
altitude less than 950 m or 3117 ft), the temperature specification
ranges from 10°C to 35°C (50°F to 95°F) with no direct sunlight on
the equipment. NOTE: Maximum of 145 W 22 core processor is supported
in systems with eight 2.5-inches drives, two PCI slot chassis, and
75 W single wide active GPU. When the system is not in operation,
the temperature specification is –40°C to 65°C (–40°F to 149°F). The
Maximum temperature gradient for both operation and non-operational
systems is 20°C/h (36°F/h).
Temperature
Specifications
Storage
–40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950
m or 3117 ft)
10°C to 35°C (50°F to 95°F) with no direct sunlight
on the equipment.
Maximum temperature gradient (operating and storage)
20°C/h (36°F/h)
Table 2. Relative humidity
specificationsFor a non-operational system, the ambient relative
humidity ranges from 5% to 95% with 33°C (91°F) maximum dew point.
Atmosphere must be non-condensing at all times. For an operational
system, the ambient relative humidity ranges from 10% to 80% with
29°C (84.2°F) maximum dew point.
Relative humidity
Specifications
Storage
5% to 95% RH with 33°C (91°F) maximum dew point.
Atmosphere must be non-condensing at all times.
Operating
10% to 80% relative humidity with 29°C (84.2°F)
maximum dew point.
Table 3. Maximum vibration
specificationsThe maximum vibration specification of an operational
system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The
maximum vibration specification of a non-operational system is 1.88
Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum vibration
Specifications
Operating
0.26 Grms at 5 Hz to 350 Hz (all operation
orientations).
Storage
1.88 Grms at 10 Hz to 500 Hz for 15
min (all six sides tested).
Table 4. Maximum shock
specificationsThe maximum shock specification of an operational
system is six consecutively executed shock pulses in the positive
and negative x, y, and z axes of 40 G for up to 2.3 ms. The maximum
shock specification of a non-operational system is six consecutively
executed shock pulses in the positive and negative x, y, and z axes
(one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock
Specifications
Operating
Six consecutively executed shock pulses in the
positive and negative x, y, and z axes of 40 G for up to 2.3 ms.
Storage
Six consecutively executed shock pulses in the
positive and negative x, y, and z axes (one pulse on each side of
the system) of 71 G for up to 2 ms.
Table 5. Maximum altitude
specificationsThe maximum altitude specification for an operational
system is 3048 m (10,000 ft). The maximum altitude specification for
a non-operational system is 12,000 m (39,370 ft).
Maximum altitude
Specifications
Operating
30482000 m (10,0006560 ft)
Storage
12,000 m (39,370 ft)
Table 6. Operating temperature
de-rating specificationsIf the operating temerature of a system is up to
35 °C (95 °F), the maximum temperature is reduced by 1 °C/300 m (1
°F/547 ft) above 950 m (3,117 ft). If the operating temperature of
a system ranges from 35 °C to 40 °C (95 °F to 104 °F), the maximum
temperature is reduced by 1 °C/175 m (1 °F/319 ft) above 950 m (3,117
ft). If the operating temperature of a system ranges from 40 °C to
45 °C (104 °F to 113 °F), the maximum temperature is reduced by 1
°C/125 m (1 °F/228 ft) above 950 m (3,117 ft).
Operating temperature de-rating
Specifications
Up to 35°C (95°F)
Maximum temperature is reduced by 1°C/300 m (1°F/547
ft) above 950 m (3,117 ft).
35°C to 40°C (95°F to 104°F)
Maximum temperature is reduced by 1°C/175 m (1°F/319
ft) above 950 m (3,117 ft).
40°C to 45°C (104°F to 113°F)
Maximum temperature is reduced by 1°C/125 m (1°F/228
ft) above 950 m (3,117 ft).
Particulate
and gaseous contamination specifications
The following
table defines the limitations that help avoid any equipment damage
or failure from particulates and gaseous contamination. If the levels
of particulates or gaseous pollution exceed the specified limitations
and result in equipment damage or failure, you may need to rectify
the environmental conditions. Re-mediation of environmental conditions
is the responsibility of the customer.
Table 1. Particulate
contamination specificationsAir filtration specification: Data center air filtration as
defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence
limit. Note: This condition applies only to data center environments.
Air filtration requirements do not apply to IT equipment designed
to be used outside a data center, in environments such as an office
or factory floor. Note: Air entering the data center must have MERV11
or MERV13 filtration. Conductive dust specification: Air must be free
of conductive dust, zinc whiskers, or other conductive particles.
Note: This condition applies to data center and non-data center environments.
Corrosive dust specification: Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less
than 60% relative humidity. Note: This condition applies to data center
and non-data center environments.
Particulate contamination
Specifications
Air filtration
Data center air filtration as defined by ISO Class
8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE This condition applies
to data center environments only. Air filtration requirements do not
apply to IT equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE Air entering the data
center must have MERV11 or MERV13 filtration.
Conductive dust
Air must be free of conductive dust, zinc whiskers,
or other conductive particles.
NOTE This condition applies
to data center and non-data center environments.
Corrosive dust
Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE This condition
applies to data center and non-data center environments.
Table 2. Gaseous contamination
specificationsThe copper coupon corrosion rate is <300 Å/month per Class
G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate
is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination
Specifications
Copper coupon corrosion rate
<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate
<200 Å/month as defined by AHSRAE TC9.9.
NOTE Maximum
corrosive contaminant levels measured at ≤50% relative humidity.
Expanded operating
temperature
Table 1. Expanded operating
temperature specificationsWhen the system is at 10% of annual operating hours,
the expanded operating temperature ranges from 5°C to 40°C at 5% to
85% RH with 29°C dew point. NOTE: Outside the standard operating temperature
(10°C to 35°C), the system can operate continuously in temperatures
as low as 5°C and as high as 40°C. For temperatures between 35°C and
40°C, de-rate maximum allowable dry bulb temperature by 1°C per 175
m above 950 m (1°F per 319 ft). When the system is operating at <
1% of annual operating hours, the expanded operating temperature is
–5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE: Outside the
standard operating temperature (10°C to 35°C), the system can operate
down to –5°C or up to 45°C for a maximum of 1% of its annual operating
hours. For temperatures between 40°C and 45°C, de-rate maximum allowable
temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Expanded operating temperature
Specifications
Continuous operation
5°C to 40°C at 5% to 85% RH with 29°C dew point.
NOTE Outside the standard
operating temperature (10°C to 35°C), the system can operate continuously
in temperatures as low as 5°C and as high as 40°C.
For temperatures between 35°C and 40°C, de-rate maximum allowable
dry bulb temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
< 1% of annual operating
hours
–5°C to 45°C at 5% to 90% RH with 29°C dew point.
NOTE Outside the standard
operating temperature (10°C to 35°C), the system can operate down
to –5°C or up to 45°C for a maximum of 1% of its annual operating
hours.
For temperatures between 40°C and 45°C,
de-rate maximum allowable temperature by 1°C per 125 m above 950 m
(1°F per 228 ft).
NOTE When
operating in the expanded temperature range, system performance may
be impacted.
NOTE When operating in the expanded temperature range, ambient temperature
warnings maybe reported on the LCD panel and in the System Event Log.
Expanded operating
temperature restrictions
Processors of 55 W and 65 W are not supported.
Do not perform a cold startup below 5°C.
Allow processor performance degrade.
Non-redundant power supplies are not supported.
Non Dell qualified peripheral cards and/or peripheral cards
are not supported.
Maximum altitude for the operating temperature must be 3050
m (10,000 ft).
