Dell PowerEdge R360: руководство по обслуживанию

Chassis dimensions

The image shows system dimensions. — Figure 1. Chassis dimensions

Table 1. PowerEdgeR360 chassis dimensionsThis table provides the dimensions of the system:
Drives	Xa	Xb	Y	Za	Zb	Zc
8 drives 2.5 - inch	482.0 mm (18.976 inches)	434.0 mm (17.086 inches)	42.8 mm (1.685 inches)	With bezel 35.6 mm (1.401 inches)Without bezel 22.0 mm (0.866inches)	483.82 mm (19.048 inches)	512.53 mm (20.178 inches)
4 drives 3.5 - inch	482.0 mm (18.976 inches)	434.0 mm (17.086 inches)	42.8 mm (1.685 inches)	With bezel 35.6 mm (1.401 inches)Without bezel 22.0 mm (0.866inches)	534.59 mm (21.046 inches)	563.3 mm (22.177 inches)
6 drives 2.5-inch SAS/SATA + 2 drives 2.5-inch NVMe.	482.0 mm (18.976 inches)	434.0 mm (17.086 inches)	42.8 mm (1.685 inches)	With bezel 35.6 mm (1.401 inches)Without bezel 22.0 mm (0.866inches)	483.82 mm (19.048 inches)	512.53 mm (20.178 inches)

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R360 system weightThe table below shows the maximum weight of the system.
System configuration	Maximum weight (with all drives/SSDs)
A server with fully populated drives	2.5 inch drives	11.64 kg (25.68 lb)
A server with fully populated drives	3.5 inch drives	13.23 kg (29.17 lb)
A server without drives and PSU installed	2.5 inch drives	8.36 kg (18.45 lb)
A server without drives and PSU installed	3.5 inch drives	9.01 kg (19.88 lb)

Processor specifications

Table 1. PowerEdge R360 processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
Intel^® Xeon^® 6300 series processor or Intel® Xeon® E-2400 series processor	One
Intel^® Pentium^® G7400/G7400T processor	One

NOTE:Intel Xeon® 6300 series CPUs do not support Windows Server 2019.

PSU specifications

The PowerEdgeR360system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	Voltage	AC		DC	Current (A)
PSU	Class	Heat dissipation (maximum) (BTU/hr)	Frequency (Hz)	Voltage	High line 200–240 V	Low line 100–120 V	DC	Current (A)
600 W	Platinum	2250	50/60	100 — 240 V AC	600 W	600 W	NA	7.1 - 3.6
600 W	NA	2250	NA	240 V DC	NA	NA	600 W	2.9
700 W	Titanium	2625	50/60	200 — 240 V AC	700 W	NA	NA	4.1
700 W	NA	2625	NA	240 V DC	NA	NA	700 W	3.4

NOTE:This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE: When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool atDell.com/calc.

This image shows the C13 power connector — Figure 1. PSU power cord

Table 2. PSU power cordsThe table lists the PSU power cords list
Form factor	Output	Power cord
Redundant 60 mm	600 W	C13 /C14 (inlet)
Redundant 60 mm	700 W	C13 /C14 (inlet)

Cooling fan specifications

The PowerEdgeR360system supports up to a maximum of four fans, three Brickfielder (BF), and one High performance (HPR) cooling fan based on the system configuration. These fans are not hot swappable.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Label color	Label image
Standard (STD) fans	STD	No label
High performance (HPR) silver fans	HPR	Silver

Supported operating systems

The PowerEdge R360 system supports the following operating systems:

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi

NOTE:Intel Xeon® 6300 series CPUs do not support Windows Server 2019.

For more information, go to OS support.

System battery specifications

The PowerEdge R360 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge R360 system supports up to two Gen5 PCI express (PCIe) slots on the riser and one PCI express (PCIe) slot for PERC on system board.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system. R360 system supports one x4 PCIe slot on the system board and two x8 PCIe slots on the Gen4 butterfly riser.
-	With Regular shroud	No Riser	Butterfly Riser
-	With Regular shroud	No Riser	Mechanical	Electrical
Internal Slot	Half Length, Low Profile	X4	X8	X4
Slot-1 (Riser)	Half Length, Low Profile	-	X8	X8
Slot-2 (Riser)	Half Length, Low Profile	-	X16	X8

Memory specifications

The PowerEdge R360 system supports DDR5 UDIMM ECC memory in the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Single processor
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity
DDR5 ECC UDIMM	Single rank	16 GB	16 GB	64 GB
	Dual rank	32 GB	32 GB	64 GB
	Dual rank	32 GB	32 GB	128 GB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
4, 288-pin	Up to 4400 MT/s

NOTE:Memory DIMM slots are not hot pluggable.

NOTE:The operating speed of the memory will be reduced due to processor limitation. For more information, refer R360 Technical Guide at PowerEdge Manuals

Storage controller specifications

The PowerEdge R360 system supports the following controller cards with a maximum of one internal controller and one external controller:

Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers PERC H355 PERC H755 PERC H355 Front PERC H755 Front
External controllers HBA355e
Software RAID S160
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSDs
SAS Hot Bus Adapters (HBA) HBA355i, HBA355i Front

Drives

The PowerEdge R360 system supports:

Front Drives

8 x 2.5-inch hot-swappable SAS,SATA drives through PERC
4 x 3.5-inch hot-swappable SAS,SATA drives through PERC
4 x 3.5-inch hot-swappable SATA drives through chipset
6 x 2.5-inch hot-swappable SAS/SATA drives through PERC + 2 x 2.5-inch direct attach NVMe

GPU specifications

The PowerEdge R360 system supports one 60 W low profile Nvidia A2 GPU on the riser.

NOTE:Systems configured with GPUs will have higher fan acoustics.

NOTE: The R360 with GPU configuration is not recommended for an acoustic sensitive environment (Office environment, or general use space etc.).

NIC port specifications

The PowerEdge R360 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM).

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
LOM	1 Gb x 2
Network Card	1 GbE x 4, 10 GbE x 2, 10 GbE x 4

Serial connector specifications

The PowerEdge R360 system supports one serial port on the system board, which is Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

USB ports specifications

Table 1. PowerEdge R360 USB specificationsThe following table shows the USB specifications for the system:
Front		Rear		Internal
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 2.0-compliant port	One	Internal USB 3.2 Gen1-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	USB 3.2 Gen1-compliant ports	One	Internal USB 3.2 Gen1-compliant port	One

NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

VGA ports specifications

The PowerEdge R360 system supports DB-15 VGA port on rear of the system

Video specifications

The PowerEdge R360 system supports integrated Matrox G200eW graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
640 x 480	60 Hz	32
640 x 480	72 Hz	32
640 x 480	75 Hz	32
640 x 480	85 Hz	32
800 x 600	60 Hz	32
800 x 600	72 Hz	32
800 x 600	75 Hz	32
800 x 600	85 Hz	32
1024 x 768	60 Hz	32
1024 x 768	72 Hz	32
1024 x 768	75 Hz	32
1024 x 768	85 Hz	32
1280 x 800	60 Hz	32
1280 x 800	75 Hz	32
1280 x 1024	60 Hz	32
1280 x 1024	75 Hz	32
1360 x 768	60 Hz	32
1440 x 900	60 Hz	32
1440 x 900	60 Hz (RB)	32
1600 x 900	60 Hz (RB)	32
1600 x 900	60 Hz (RB)	32
1600 x 1200	60 Hz	32
1600 x 1200	60 Hz (RB)	32
1680 x 1050	60 Hz (RB)	32
1680 x 1050	60 Hz	32
1920 x 1080	60 Hz	32
1920 x 1080	60 Hz (RB)	32
1920 x 1200	60 Hz	32
1920 x 1200	60 Hz (RB)	32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support.

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
-	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 ft) above 900 m (2953 ft).

Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
-	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 ft) above 900 m (2953 ft).

Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
-	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 ft) above 900 m (2953 ft).

Table 4. Common Environmental Specifications for ASHRAE A2, A3, and A4 This table describes the shared requirements across all categories.
-	Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-104 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6G for up to 11 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Thermal air restrictions

ASHRAE A3/A4 environment

The operating temperature is for a maximum altitude of 950 m for ASHRAE A3/A4 Cooling.
If over 950 m, we need to do the ambient temperature de-rating.
CPU TDP greater than 80 W is not supported.
BOSS-N1 (M.2) module is not supported.
A2 GPU card is not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
Two PSUs are required in redundant mode.

Thermal restriction matrix

Table 1. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink	Configuration No
1U HSK	All configurations

Table 2. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard
LP	Low profile
FH	Full height

Table 3. Thermal restriction matrix (Without GPU) Thermal restriction matrix for air cooled configuration (non - GPU):
Configuration		Configuration 1 2.5 inch and 3.5 inch Drives With Riser		Configuration 2 2.5 inch and 3.5 inch Drives With N1- BOSS	Configuration 3 2.5 inch and 3.5 inch Drives Without Riser and N1 - BOSS	Ambient temperature
CPU TDP/cTDP	≤ 80 W	4 x STD Fans 1U STD HSK		1 x Silver Fan, 3 x STD Fans 1U STD HSK	3 x STD Fan 1U STD HSK	35°C (95°F)
CPU TDP/cTDP	95 W	4 x STD Fans 1U Performance HSK		1 x Silver Fan, 3 x STD 1U Performance HSK	3 x STD Fan 1U Performance HSK	35°C (95°F)

NOTE:Refer to the ASHRAE A3/A4 environment specifications under Appendix A for detailed configuration limitation.

Table 4. Thermal restriction matrix (With GPU)The table describes the GPU thermal restriction matrix for air cooled configuration.
Configuration		Configuration 1 2.5 inch and 3.5 inch Drives With Riser		Configuration 2 2.5 inch and 3.5 inch Drives With N1- BOSS	Configuration 3 2.5 inch and 3.5 inch Drives Without Riser and N1 - BOSS	Ambient temperature
CPU TDP/cTDP	≤ 80 W	4 x STD Fans 1U STD HSK		1 x Silver Fan, 3 x STD Fans 1U STD HSK	N/A	35°C (95°F)
CPU TDP/cTDP	95 W	4 x STD Fans 1U Performance HSK		1 x Silver Fan, 3x STD 1U Performance HSK	N/A	35°C (95°F)

NOTE:When A2 GPU card is populated, PCIe slot 2 has to be populated or should have a blank installed.

Table 5. Fan LocationThe table describes the fan location for the R360.
Chassis	Configuration	Fan Quantity	Fan Location
2.5 inch and 3.5 inch Drives	With Riser Card	4	Fan 1 (STD), Fan 2, Fan 3, Fan 4
2.5 inch and 3.5 inch Drives	With N1-BOSS Module	4	Fan 1 (Silver), Fan 2, Fan 3, Fan 4
2.5 inch and 3.5 inch Drives	Without Riser and N1- BOSS Module	3	Fan 2, Fan 3, Fan 4