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Dell PowerEdge R330: руководство по обслуживанию

Chassis dimensions

This section describes the physical dimensions of the system.
Figure 1. Chassis dimensions of the PowerEdge R330 system
Chassis dimensions for the PowerEdge R330 system
Table 1. Dimensions of the Dell PowerEdge R330 systemThis table gives details of the dimensions of the Dell PowerEdge R330 system. The dimensions are as follows: X = 482.4 mm, Xa = 434.0 mm, Y = 42.4 mm, Z(with bezel)= 681.2 mm, Z (without bezel) = 666.2 mm, Za (with bezel) = 35.1 mm, Za (without bezel) = 20.1 mm, and Zb = 607.0 mm.
XXaYZ (with bezel)Z (without bezel)Za (with bezel) Za (without bezel)Zb
482.4 mm (18.99 inches)434.0 mm (17.08 inches)42.4 mm (1.66 inches)681.2 mm (26.81 inches)666.2 mm (26.22 inches)35.1 mm (1.38 inches)20.1 mm (0.79 inches)607.0 mm (23.89 inches)

Chassis weight

This section describes the weight of the system.
Table 1. Chassis weightFor PowerEdge R330 systems, the maximum chassis weight is 26.02 kg (57.32 lb).
System Maximum weight (with all hard drives/SSDs)
PowerEdge R330 26.02 Kg (30.42 lb)

Processor specifications

Processor
Specification
Type
The PowerEdge R330 supports any one of the processors listed here:
  • Intel E3-1200 v5 or v6 series
  • Intel Core i3 6100 series
  • Intel Celeron G3900 series
  • Intel Celeron G3930
  • Intel Pentium G4500 series
  • Intel Pentium G4600 series

Expansion bus specifications

PCI Express (PCIe) Generation 3 expansion slots (with optional expansion card risers)
Specification
LP SLOT 1
One half-height, half-length x4 link
FH SLOT 2
One full-height, half-length x8 link
PCI Express Generation 3 expansion slots (without expansion card risers)
Specification
PCIE_G3_X4
One half-height, half-length x4 link for PERC card
PCIE_G3_X8
One x8 link for riser

Memory specifications

Memory
Specification
Architecture
1600 MT/s, 1866 MT/s, 2133 MT/s, or 2400 MT/s DDR4 Unbuffered DIMMs
Support for advanced ECC or memory optimized operation
Memory module sockets
Four 288-pin sockets
Memory module capacities (UDIMM)
4 GB (single-rank), 8 GB (single- and dual-rank), 16 GB (single- and dual-rank)
Minimum RAM
4 GB
Maximum RAM
64 GB

Power specifications

Power supply unit
Specification
Power rating per power supply unit
350 W (Platinum) (100–240 V AC, 50/60 Hz, 4.8 A–2.4 A)
Heat dissipation
1357.1 BTU/hr

NOTE: Heat dissipation is calculated by using the power supply wattage rating.

Voltage
100-240 V AC, autoranging, 50/60 Hz

NOTE: This system is also designed to be connected to IT power systems with a phase-to-phase voltage not exceeding 230 V.

Storage controller specifications

Storage controller
Specification
Storage controller type
PERC H730, PERC H330, PERC H830, PERC S130.

NOTE: Your system supports software RAID S130 and a PERC card.

For more information on software RAID, see the Dell PowerEdge RAID Controller (PERC) documentation at Dell.com/storagecontrollermanuals.

NOTE: The upgrade from embedded controller or Software RAID controller to Hardware RAID controller is not supported.

Hard drives

The PowerEdge R330 system supports SAS, SATA, Nearline SAS hard drives and Solid State Drives (SSDs).

Drives
Specification
Eight hard drive systems
Up to eight 2.5-inch, hot swappable SAS, SATA, SATA SSD, or Nearline SAS hard drives.
Four hard drive systems
Up to four 3.5-inch cabled hard drives, or
Up to four 3.5-inch hot swappable SATA, or Nearline SAS hard drives, or
Up to four 2.5-inch hot swappable SATA, or Nearline SAS hard drives in 3.5-inch adapters

Optical drive

The PowerEdge R330 system supports one optional slim SATA DVD-ROM drive or DVD+/-RW drive.

USB ports

The PowerEdge R330 system supports:
  • USB 2.0-compliant ports on the front panel
  • USB 3.0-compliant ports on the back panel
  • USB 3.0-compliant internal port
The following table provides more information about the USB specifications:
Table 1. USB specificationsThe PowerEdge R330 system supports two 4-pin, USB 2.0-compliant ports on the front panel. Your system supports two 9-pin, USB 3.0-compliant ports on the back panel and one 9-pin, USB 3.0-compliant internal port.
System Front panel Back panel Internal
PowerEdge R330 Two 4-pin, USB 2.0-compliant ports

Two 9-pin, USB 3.0-compliant port

One 9-pin, USB 3.0-compliant port

NIC ports

The PowerEdge R330 system supports two 10/100/1000 Mbps Network Interface Controller (NIC) ports on the back panel.

iDRAC8

The PowerEdge R330 system supports one optional dedicated 1 GbE Ethernet on the iDRAC Enterprise port card.

Serial connector

The serial connector connects a serial device to the system. The PowerEdge R330 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge R330 system supports two 15-pin VGA ports one each on the front and back panels.

SD vFlash

The PowerEdge R330 system supports one optional SD vFlash memory card on the iDRAC Enterprise port card.

NOTE: The card slot is available for use only if the iDRAC8 Enterprise license is installed on your system.

Internal Dual SD Module

The PowerEdge R330 system supports two optional flash memory card slots with an internal dual SD module.

NOTE: One card slot is dedicated for redundancy.

Video specifications

The PowerEdge R330 system supports Integrated Matrox G200 with iDRAC8 and 16 MB application memory.

Table 1. Supported video resolution optionsFor 640 x 480 resolution, the refresh rate is 60 to 70 Hz and the color depth is 8, 16, 24 bit. For 800 x 600 resolution, the refresh rate is 60, 75, 85 Hz and color depth is 8, 16, 24 bit. For 1024 x 768 resolution, the refresh rate is 60, 75, 85 Hz and color depth is 8, 16, 24 bit. For 1152 x 864 resolution, the refresh rate is 60, 75, 85 Hz and color depth is 8, 16, 24 bit. For 1280 x 1024 resolution, the refresh rate is 60, 75 Hz and color depth is 8, 16, 24 bit.
Resolution Refresh Rate (Hz) Color Depth (bit)

640 x 480

60, 70

8, 16, 24

800 x 600

60, 75, 85

8, 16, 24

1024 x 768

60, 75, 85

8, 16, 24

1152 x 864

60, 75, 85

8, 16, 24

1280 x 1024

60, 75

8, 16, 24

Expanded operating temperature

NOTE: When operating in the expanded temperature range, system performance may be impacted.

NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD and in the System Event Log.

Expanded operating temperature
Specifications
Continuous operation
5°C to 40°C (40°F to 104°F) at 5% to 85% RH with 29°C (84.2°F)dew point.

NOTE: Outside the standard operating temperature (10°C to 35°C(50°F to 95°F)), the system can operate continuously down to 5°C (40°F) or as high as 40°C (104°F).

For temperatures between 35°C( 95°F) and 40°C(104°F), de-rate maximum allowable temperature by 1°C per 175 m (33.8°F per 574.14 ft) above 950 m (3116.8 ft).

≤ 1% of annual operating hours
–5°C to 45°C (23°F to 113°F) at 5% to 90% RH with 29°C (84.2°F) dew point.

NOTE: Outside the standard operating temperature (10°C to 35°C(50°F to 95°F)),, the system can operate down to –5°C (23°F)or up to 45°C (113°F) for a maximum of 1% of its annual operating hours.

For temperatures between 40°C (104°F) and 45°C (113°F), de-rate maximum allowable temperature by 1°C per 125 m (33.8°F per 410.105ft) above 950 m (3116.8 ft).

Expanded Operating Temperature Restrictions
  • The operating temperature specified is for a maximum altitude of 3048 m (10,000 ft).
  • Non-redundant power supply units are not supported.
  • Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • Do not perform a cold startup below 5°C (40°F).
  • Enable processor performance degrade.

Environmental specifications

NOTE: For additional information about environmental measurements for specific system configurations, see Dell.com/environmental_datasheets.

Temperature
Specifications
Storage
–40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft)
10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Fresh air
For information on fresh air, see Expanded Operating Temperature section.
Maximum temperature gradient (operating and storage)
20°C/h (68°F/h)
Relative humidity
Specifications
Storage
5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating
10% to 80% Relative Humidity with 29°C (84.2°F) maximum dew point.
Maximum vibration
Specifications
Operating
0.26 Grms at 5 Hz to 350 Hz (operation orientation).
Storage
1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum shock
Specifications
Operating
Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 40 G for up to 2.3 ms.
Storage
Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum altitude
Specifications
Operating

30482000 m (10,0006560 ft).

Storage
12,000 m (39,370 ft).
Operating temperature de-rating
Specifications
Up to 35 °C (95 °F)
Maximum temperature is reduced by 1°C/300 m (33.8°F/984.25 ft) above 950 m (3,117 ft)

The following section defines the limits to help avoid IT equipment damage and/or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution are beyond the specified limits and cause equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Particulate contamination
Specifications
Air filtration
Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.

NOTE: Applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.

NOTE: Air entering the data center must have MERV11 or MERV13 filtration.

Conductive dust
Air must be free of conductive dust, zinc whiskers, or other conductive particles.

NOTE: Applies to data center and non-data center environments.

Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.

NOTE: Applies to data center and non-data center environments.

Gaseous contamination
Specifications
Copper coupon corrosion rate
<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate
<200 Å/month as defined by AHSRAE TC9.9.

NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.