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Dell EMC PowerEdge R940xa: технические характеристики и спецификации
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Dell EMC PowerEdge R940xa: технические характеристики и спецификации

System dimensions

This section describes the physical dimensions of the system.

Figure 1. System dimensions of PowerEdge R940xa system
This image shows system dimensions of PowerEdge R940xa system.
Table 1. DimensionsThis table gives details of the dimensions of the R940xa system:
SystemXaXbY

Za

Zb Zc
UpperBottom(with bezel)(without bezel)

PowerEdge
R940xa

482.0 mm
(18.98 inches)

441.16 mm
(17.37 inches)

422.5 mm
(16.64 inches)

174.3 mm
(6.87 inches)

35.84 mm
(1.41 inches)

23.9 mm
(0.94 inches)

812 mm
(31.96 inches)

842 mm
(33.14 inches)

Chassis weight

Table 1. Chassis weight

The table below shows the maximum weight of the R940xa system:
System Maximum weight (with all drives)
PowerEdge R940xa (2.5 x 32 + X16 PCIe Riser 1/X16 PCIe Riser 2 riser with 4 DW GPU + 2 full height, half length PCIE cards) 56.0 Kg (111.75 lb)

Processor specifications

The PowerEdge R940xa system supports two or four Intel Xeon Processor Scalable Family (Skylake-EP) Gold and Platinum processors.

Supported operating systems

The supports the following operating systems:

RedHat Enterprise Linux
Novell SuSE Linux Enterprise Server
Microsoft Windows Server
Ubuntu
VMWare ESXi
Citrix Hypervisor

For more information, go to www.dell.com/ossupport.

PSU specifications

The PowerEdge R940xa system supports up to four AC or DC power supply units (PSUs).

Table 1. PSU specifications

The table below are the specifications for 750 W, 1100 W, 1600 W, 2000 W and 2400 W power supplies:

PSU Class Heat dissipation (maximum) Frequency Voltage High line 200v240 V Low line 100– 140 V DC Current
750 W Mixed Mode HVDC (for China only) Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC, autoranging 750 W 750 W N/A 10 A–5 A
N/A 2891 BTU/hr N/A 240 V DC, autoranging N/A N/A 750 W 4.5 A
750 W Mixed Mode AC Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC 750 W 750 W N/A 10 A-5 A
750 W Mixed Mode DC (for China only) N/A 2891 BTU/hr 50/60 Hz 240 V DC 750 W N/A 750 W 5 A
1100 W AC Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC, autoranging 1100 W 1050 W N/A 12 A–6.5 A
1100 W DC N/A 4416 BTU/hr N/A –(48–60) V DC, autoranging N/A N/A 1100 W 32 A
1100 W Mixed Mode HVDC (for China and Japan only) Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC, autoranging 1100 W 1050 W N/A 12 A–6.5 A
N/A 4100 BTU/hr N/A 200–380 V DC, autoranging N/A N/A 1100 W 6.4 A–3.2 A
1600 W HLAC Titanium 5840 BTU/hr 50/60 Hz 200–240 V AC 1600 W NA NA 10 A
1600 W AC Platinum 6000 BTU/hr 50/60 Hz 100–240 V AC, autoranging 1600 W 800 W N/A 10 A
2000 W AC Platinum 7500 BTU/hr 50/60 Hz 100–240 V AC, autoranging 2000 W 1000 W N/A 11.5 A
2400 W AC Platinum 9000 BTU/hr 50/60 Hz 100–240 V AC, autoranging 2400 W 1400 W N/A 16 A
2600 W HLAC Titanium 9500 BTU/hr 50/60 Hz 200–240 V AC 2600 W NA NA 15 A
NOTE Heat dissipation is calculated using the PSU wattage rating.
NOTE This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 240 V.
NOTE PSUs rated for 1100 W AC or 1100 W Mixed Mode HVDC and higher require high-line voltage (200–240 V AC) to supply their rated capacity.

System battery specifications

The PowerEdge R940xa system supports CR 2032 3.0-V lithium coin cell system battery.

PCIe riser and slots

The PowerEdge R940xa system supports up to twelve PCI express (PCIe) generation 3 expansion cards that can be installed on the system board and expansion card risers. The following table provides detailed information about the expansion card riser specifications:

Table 1. PCIe riser and slots specificationsThis table describes the expansion card riser specifications.
Number of processors NVMe GPU Riser size Slot size Slot quantity Available slots Height Length
4 NA GPU Ready/Double wide accelerators capable X16 PCIe Riser 1 X 16 2 2,4 FH FL
X 8 1 5 FH HL
X16 PCIe Riser 2 X 16 2 9,11 FH FL
X 8 1 12 FH HL
NA Non-GPU/Single wide FPGA X8 PCIe Riser 1 X 8 5 1,2,3,4,5 FH HL
X8 PCIe Riser 2 X 8 5 8,9,10,11,12 FH HL
Front NVMe GPU Ready/Double wide accelerators capable X16 PCIe Riser 1 X 16 2 2,4 FH FL
X16 PCIe Riser 2 X 16 2 9,11 FH FL
Front NVMe Non-GPU/Single wide FPGA X8 PCIe Riser 1 X 8 4 1,2,3,4 FH HL
X8 PCIe Riser 2 X 8 4 8,9,10,11 FH HL
2 NA GPU Ready/Double wide accelerators capable X16 PCIe Riser 1 X 16 1 4 FH FL
X16 PCIe Riser 2 X 16 1 11 FH FL
NA Non-GPU/Single wide FPGA X8 PCIe Riser 1 X 8 2 3,4 FH HL
X8 PCIe Riser 2 X 8 2 10,11 FH HL
NOTE Use double-wide accelerator capable for installation or removal of Xilinx card.

Memory specifications

.
Table 1. Memory specificationsThe following table shows the memory specifications for the R940xa system:
Memory module sockets DIMM type DIMM rank DIMM capacity Dual processors Quad processors
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
48 288-pins LRDIMM Octal rank 256 GB 512 GB 6144 GB 1024 GB 12.288 TB
LRDIMM Octal rank 128 GB 256 GB 3072 GB 512 GB 6144 GB
LRDIMM Quad rank 64 GB 128 GB 1536 GB 256 GB 3072 GB
RDIMM Dual rank 64 GB 128 GB 1536 GB 256 GB 3072 GB
RDIMM Dual rank 32 GB 64 GB 768 GB 128 GB 1536 GB
RDIMM Dual rank 16 GB 32 GB 384 GB 64 GB 768 GB
RDIMM Single rank 8 GB 16 GB 192 GB 32 GB 384 GB
NVDIMM-N Single rank 16 GB RDIMM: 192 GB RDIMM: 384 GB RDIMM: 384 GB RDIMM: 1152 GB
NVDIMM-N: 16 GB NVDIMM-N: 192 GB NVDIMM-N: 16 GB NVDIMM-N: 192 GB
PMem N/A 128 GB RDIMM: 192 GB LRDIMM: 1536 GB RDIMM: 384 GB LRDIMM: 3072 GB
PMem: 1536 GB PMem: 1536 GB PMem: 248 GB PMem: 3072 GB
N/A 256 GB RDIMM: 384 GB LRDIMM: 1536 GB RDIMM: 384 GB LRDIMM: 3072 GB
PMem: 2048 GB PMem: 3072 GB PMem: 4096 GB PMem: 6144 GB
N/A 512 GB RDIMM: 384 GB LRDIMM: 1536 GB RDIMM: 768 GB LRDIMM: 3072 GB
PMem: 4096 GB PMem: 6144 GB PMem: 8192 GB PMem: 12,288 GB
NOTE Do not mix 8 GB RDIMMs and 16 GB NVDIMM-Ns.
NOTE Do not mix 64 GB LRDIMMs, 128 GB LRDIMMs and 256 GB LRDIMMs.
NOTE 256GB does not support GPU configuration.
Table 2. DIMM blank population rulesThe following table shows the DIMM blank population rules for the R940xa system:
Processor configuration Processor 1 Processor 2 Processor 3 Processor 4
Dual processor Required Required Not required Not required
Quad processor Required Required Required Required

PMem and 256GB LRDIMM Thermal Restrictions

Table 3. PMem Thermal RestrictionsThe following table shows the PMem Thermal Restriction for the R940xa system:
PMem Support V2 Air-shroud V1 Air-shroud
8x 2.5-inch SAS/SATA

30C ambient temperature support, 25C ambient temperature with 256GB LRDIMMs

25C ambient temperature support, not supported with 256GB LRDIMM

24x 2.5-inch SAS/SATA

30C ambient temperature support, not supported with 256GB LRDIMM

25C ambient temperature support, not supported with 256GB LRDIMM

32x 2.5-inch SAS/SATA or mixed NVMe

30C ambient temperature support, not supported with 256GB LRDIMM

25C ambient temperature support, not supported with 256GB LRDIMM

NOTE PMem does not support GPU configuration.

Storage controller specifications

The PowerEdge R940xa system supports:
  • Internal storage controller cards: PowerEdge RAID Controller (PERC) H330, H350, PERC H730P, H830, H740P, H750, H840, HBA330, HBA350i, S140, and Boot Optimized Server Storage—BOSS-S1.
  • External storage controller cards: 12 Gbps SAS HBA, including HBA355e.

Storage

The Dell EMC PowerEdge R940xa provide scalable storage that allows you to adapt to your workload and operational demands. The Dell EMC PowerEdge R940xa offers storage expansion with the middle hard drive tray and rear hard drive cage. The hard drive bay supports up to 32 2.5-inch hard drives or SSDs.

Drive

The PowerEdge R940xa system supports SAS, SATA, Nearline SAS hard drives/SSDs, or NVMe drives.

The supported drive options for the PowerEdge R940xa system are:
  • 8 drives system - Up to eight 2.5-inch (SAS, SATA, or Nearline SAS) front accessible drives in slots 0 through 7.
  • 32 drives system - Up to 24 2.5-inch (SAS, SATA, or Nearline SAS) including 4 NVMe front accessible drives (slots 20 to 23) in slots 0 to 23 of upper drives bay, and up to eight 2.5-inch (SAS, SATA, or Nearline SAS) front accessible drives in slots 24 to 31 of lower drives bay.

Internal storage configuration matrix

Table 1. Internal storage configuration matrixThe following table lists the internal storage configuration matrix for R940xa.
HDD/SDD (not BOSS) NVMe Enabled/Universal Slot Internal Storage (Front) Internal Storage (Rear) PERC cards Storage Controller(s) Controller
8 0/0 8 x 2.5 inch SATA (passive) N/A 1 SATA S140 N/A
8 0/0 8 x 2.5 inch SAS/SATA (passive) N/A 1 PERC H330, H350 Adapter
8 0/0 8 x 2.5 inch SAS/SATA (passive) N/A 1 PERC H730P, H750 Adapter
8 0/0 8 x 2.5 inch SAS/SATA (passive) N/A 1 PERC H740P, H750 Adapter
8 0/0 8 x 2.5 inch SAS/SATA (passive) N/A 1 HBA330, HBA350 Adapter
32 0/0 24 x 2.5 inch SAS/SATA /NVMe (expander)

8 x 2.5 inch SAS/SATA (passive)

 N/A 2 PERC H740P, H750 Adapter
32 0/0 24 x 2.5 inch SAS/SATA /NVMe (expander)

8 x 2.5 inch SAS/SATA (passive)

 N/A 2 PERC H730P, H750 Adapter
32 0/0 24 x 2.5 inch SAS/SATA /NVMe (expander)

8 x 2.5 inch SAS/SATA (passive)

 N/A 2 PERC H330, H350 Adapter
32 0/0 24 x 2.5 inch SAS/SATA /NVMe (expander)

8 x 2.5 inch SAS/SATA (passive)

 N/A 2 HBA330, HBA350 Adapter
32 4/4 24 x 2.5 inch SAS/SATA /NVMe (expander)

8 x 2.5 inch SAS/SATA (passive)

 N/A 2 PERC H730P, H750

S140 (NVMe enablement)

 Adapter
32 4/4 24 x 2.5 inch SAS/SATA /NVMe (expander)

8 x 2.5 inch SAS/SATA (passive)

 N/A 2 PERC H740P, H750

S140 (NVMe enablement)

 Adapter
32 4/4 24 x 2.5 inch SAS/SATA /NVMe (expander)

8 x 2.5 inch SAS/SATA (passive)

 N/A 2 PERC H330, H350

S140 (NVMe enablement)

 Adapter
32 4/4 24 x 2.5 inch SAS/SATA /NVMe (expander)

8 x 2.5 inch SAS/SATA (passive)

 N/A 2 HBA330, HBA350

S140 (NVMe enablement)

 Adapter

Boot Optimized Storage Subsystem

The Boot Optimized Storage Subsystem (BOSS) is offered as a means of booting PowerEdge systems to a full operating system mode when:

  • Target operating system is a full operating system and not hypervisor that may be supported best by IDSDM
  • You do not want to trade off standard hot plug drive slots for operating system install

The RAID controller on the BOSS card has limited set of features. This RAID controller presents the M.2 SATA SSDs as either a non-RAID volume or as a single RAID volume.

Figure 1. Boot Optimized Storage Subsystem (BOSS)
Boot_Optimized_Storage_Subsystem
Table 1. BOSS featuresFollowing are features for BOSS RAID controller :
Function or feature Supported
Stripe size supported 64 K
Configuration (HII) Yes
Full initialization No
Fast initialization Yes
NOTE By default, fast initialization is performed when you create a virtual drive.
Background initialization No
RAID 0 No
RAID 1 Yes
Single non-RAID Yes
Dual non-RAID Yes
Degraded RAID1 and non-RAID No
Foreign import Yes
Consistency check No
Patrol read No
Load balance N/A
Rebuild Yes
NOTE You must manually start the rebuild process using HII or using the Marvell CLI.
Auto-rebuild Yes
NOTE Auto-rebuild is performed when the system is powered on only if there is a surviving native virtual drive and another hard drive is present.
Hot spare No
Change rebuild priority/rate. No
Virtual disks write back/read ahead cache. No
NOTE BOSS controller does not support controller cache.
Battery support N/A
NOTE BOSS controller does not support a battery.
Non-RAID disk cache policy Yes
NOTE Operating system controlled/Device defaults.
SMART Info Yes
NOTE Use the Marvell CLI to retrieve the SMART information from the drives.
Physical disk hot swap No
Virtual disk expansion No
Virtual disk slicing No
Virtual disk migration Yes
NOTE On new controller, virtual disk must be Imported from HII before presented to operating system.
Split mirror No
NOTE System that is required to shutdown and migrate one hard drive to another system and continue rebuild.
Non-RAID migration Yes
BIOS configuration utility (Ctrl-M) No
Add on driver for data path (operating system device driver). No
NOTE Console Windows driver or Linux library is required for management purposes only.
4K native drive support No
TRIM and UNMAP virtual disk No
TRIM and UNMAP Non-RAID hard drive Yes
Self-encrypting drives(SED) support No
Cryptographic erase (sanitize). Yes
NOTE If drive supports SANITIZE Crypto Erase. No other encryption support from controller or drive.

Optical drives

The PowerEdge R940xa system supports one optional slim SATA DVD-ROM drive or DVD +/-RW drive.
NOTE DVD devices support only data.

External storage

Table 1. External storage device typesThe PowerEdge R940xa supports the external storage device types mentioned below:
Device Type Description
External Tape Supports connection to external USB tape products
NAS/IDM appliance software Supports NAS software stack
JBOD Supports connection to 12Gb MD-series JBODs

Optical drives

The PowerEdge R940xa supports one of the following internal optical drive options:

  • DVD-ROM
  • DVD+RW

Tape drives

The PowerEdge R940xa does not support internal tape drives. However, external tape drives are supported. The supported external tape drives are as mentioned below:

  • External RD1000 USB
  • External LTO-5, LTO-6,LTO-7 and 6 Gb SAS tape drives
  • 114X rack mount chassis with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
  • TL1000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
  • TL2000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
  • TL2000 with LTO-5, LTO-6, and LTO-7 8Gb FC tape drives
  • TL4000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
  • TL4000 with LTO-5, LTO-6, and LTO-7 8Gb FC tape drives
  • ML6000 with LTO-5, LTO-6, 6 Gb SAS tape drives
  • ML6000 with LTO-5, LTO-6, LTO-7 8Gb FC tape drives

USB ports

The PowerEdge R940xa system supports:
  • Two USB 2.0-compliant ports on the front of the system
  • One internal USB 3.0-compliant port
  • One optional USB 3.0-compliant port on the front of the system
    NOTE The USB 3.0 port is supported in the 8x2.5-inch configuration only.
  • One micro USB 2.0-compliant port in the front of the system for iDRAC Direct
    NOTE The micro USB 2.0 compliant port on the front of the system can only be used as an iDRAC Direct or a management port.
  • Two USB 3.0-compliant ports on the back of the system

NIC ports

The PowerEdge R940xa system supports up to four Network Interface Controller (NIC) ports that are integrated on the network daughter card (NDC), and are available in the following configurations:
  • Four RJ-45 ports that support 10, 100 and 1000 Mbps
  • Four RJ-45 ports that support 100 M, 1 G and 10 Gbps
  • Four RJ-45 ports, where two ports support maximum of 10 G and the other two ports maximum of 1 G
  • Two RJ-45 ports that support up to 1 Gbps and 2 SFP+ ports that support up to 10 Gbps
  • Four SFP+ ports that support up to 10 Gbps
  • Two SFP28 ports that support up to 25 Gbps

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge R940xa system supports two 15-pin VGA ports on the front and back panels.

Serial connector

The PowerEdge R940xa system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

IDSDM or vFlash module

The PowerEdge R940xa system supports optional Internal Dual SD module (IDSDM) or vFlash module. In 14th generation of PowerEdge servers, IDSDM or vFlash module are combined into a single card module, and are available in these configurations:
  • vFlash or
  • vFlash and IDSDM
The IDSDM or vFlash module sits in the back of the system, in a Dell-proprietary slot. IDSDM or vFlash module supports three micro SD cards (two cards for IDSDM and one card for vFlash). Micro SD cards capacity for IDSDM are 16, 32, 64 GB while for vFlash the microSD card capacity is 16 GB.
NOTE There are two dip switches on the IDSDM or vFlash module for write-protection.
NOTE One IDSDM card slot is dedicated for redundancy.
NOTE It is recommended to use Dell branded MicroSD cards associated with the IDSDM or vFlash configured systems.

Video specifications

The PowerEdge R940xa system supports integrated Matrox G200eW3 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution optionsThis table describes the supported video resolution options:
Resolution Refresh Rate Color depth (bits) Horizontal Freq. Pixel Clock Rear Panel Front Panel DVO DisplayPort
1024 x 768 60 Hz 8, 16, 32 48.4 kHz 65.0 MHz Yes Yes Yes*
1280 x 800 60 Hz 8, 16, 32 49.7 kHz 83.5 MHz Yes Yes Yes*
1280 x 1024 60 Hz 8, 16, 32 64.0 kHz 108.0 MHz Yes TBD Yes*
1360 x 768 60 Hz 8, 16, 32 47.71 kHz 85.5 MHz Yes Yes Yes*
1440 x 900 60 Hz 8, 16, 32 55.9 kHz 106.5 MHz Yes TBD Yes*
1600 x 900 60 Hz (RB) 8, 16, 32 55.54 kHz 97.75 MHz Yes Yes Yes*
1600 x 1200 60 Hz 8, 16, 32 75.0 kHz 162.0 MHz TBD TBD Yes*
1680 x 1050 60 Hz (RB) 8, 16, 32 64.7 kHz 119.0 MHz Yes TBD Yes*
1920 x 1080 60 Hz 8, 16, 32 67.158 kHz 173.0 MHz TBD No No
1920 x 1200 60 Hz 8, 16, 32 74.556 kHz 193.25 MHz TBD No No
NOTE 1920 x 1080 and 1920 x 1200 resolutions are only supported in reduced blanking mode.

Environmental specifications

NOTE For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/poweredgemanuals.
Table 1. Temperature specifications

The table below shows the optimal working temperature specifications:
Temperature Specifications
Storage –40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Maximum temperature gradient (operating and storage) 20°C/h (68°F/h)
Table 2. Relative humidity specifications

The table below shows the relative humidity specification during operations and storage:
Relative humidity Specifications
Storage 5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating 10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.
Table 3. Maximum vibration specifications

The table below shows the maximum vibration specifications during operations and storage:
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all three axes).
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Table 4. Maximum shock specifications

The table below shows the maximum shock specifications during operations and storage:

Maximum shock Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Table 5. Maximum altitude specifications

The table below shows the maximum altitude specifications during operations and storage.
Maximum altitude Specifications
Operating

3048 m (10,000 ft)
Storage 12,000 m (39,370 ft)
Table 6. Operating temperature de-rating specifications

The table below shows the operating temperature de-rating specifications:
Operating temperature de-rating Specifications
Up to 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
35°C to 40°C (95°F to 104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
40°C to 45°C (104°F to 113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).

Standard operating temperature

Table 1. Standard operating temperature specifications

The standard operating temperature for altitude less than 950 m or 3117 ft ranges 10°C–35°C with no direct sunlight on the equipment.

NOTE The 2.5-inch hard drive chassis supports a maximum of 145 W processors.
Standard operating temperature Specifications
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.

Thermal and acoustics

The system's thermal management delivers high performance through optimized cooling of components at the lowest fan speeds across a wide range of ambient temperatures from 10°C to 35°C (50°F to 95°F) and to extended ambient temperature ranges. These optimizations result in lower fan power consumption which translate to lower system power and data center power consumption.

Thermal design

The thermal design of the system reflects the following:

  • Optimized thermal design: The system layout is architected for optimum thermal design. System component placement and layout are designed to provide maximum airflow coverage to critical components with minimal expense of fan power.
  • Comprehensive thermal management: The thermal control system regulates the system fan speeds based on feedback from system component temperature sensors, as well as for system inventory and subsystem power draw. Temperature monitoring includes components such as processors, DIMMs, chipset, system inlet air ambient, hard disk drives, NDC, and GPU.
  • Open and closed loop fan speed control: Open loop fan control uses system configuration to determine fan speed based on system inlet air temperature. Closed loop thermal control uses temperature feedback to dynamically adjust fan speeds based on system activity and cooling requirements.
  • User-configurable settings: With the understanding and realization that every customer has a unique set of circumstances or expectations from the system, in this generation of servers, we have introduced limited user-configurable settings in the iDRAC9 BIOS setup screen. For more information, see the Dell EMC PowerEdge system Installation and Service Manual on Dell.com/Support/Manuals and “Advanced Thermal Control: Optimizing across Environments and Power Goals” on Dell.com.

  • Cooling redundancy: The system allows N+1 fan redundancy, allowing continuous operation with one fan failure in the system.

  • Environmental Specifications: The optimized thermal management makes the R940xa reliable under a wide range of operating environments.

Expanded operating temperature restrictions

  • The operating temperature is for a maximum altitude of 950 m for fresh air cooling
  • No cold start-ups below 5°C due to hard drive constraints
  • Apache Pass DIMM, NVDIMM, PCIeSSD and NVME are not supported
  • GPGPU configuration are not supported
  • LRDIMM > 32 GB are not supported in x4 socket configurations
  • DCPMMs are not supported.
  • Redundant power supply units are required
  • Non Dell qualified peripheral cards and /or peripheral cards greater than 25 W are not supported
  • Intel FPGA is not supported
  • Mellanox CX5 is not supported

Fresh air restrictions

Following table lists the configuration required for efficient cooling.

Table 1. Fresh air restriction matrixThis table displays the fresh air restriction matrix
ProcessorsNumber of Processor/GPUs Number of drivesAmbient temperatureFresh air supportFan typeProcessorsShroud
Up to 304W processor (CPU 1/2)Up to 304W processor (CPU 3/4)
AllGPU/2&4 CPU32x2.5-inch, w/ NVMe30No AEPSix standard2U height HSK4U height HSKRemove the air shroud A
(L-shape)
AllNo GPU /2&4 CPU32x2.5-inch, w/ NVMe35No AEPSix standard2U height HSK4U height HSKInstall the air shroud A
(L-shape)
205W / 200W / 165W_12C / 150W_8C CPUNo GPU /4 CPU32x2.5-inch, w/o NVMe35No AEPSix standard2U height HSK4U height HSKInstall the air shroud A
(L-shape)
Processor TDP <= 165WNo GPU /4 CPU32x2.5-inch, w/o NVMeC40E45Non-support FA with GPU, AEP, NVDIMM, PCIeSSD, NVMe and INTEL FPGALRDIMM > 32GSix standard2U height HSK4U height HSKInstall the air shroud A
(L-shape)
AllNo GPU /2 CPU32x2.5-inch, w/o NVMeC40E45Non-support FA with GPU, AEP, NVDIMM, PCIeSSD, NVMe and INTEL FPGASix standard2U height HSK4U height HSKInstall the air shroud A
(L-shape)
AllGPU/2&4 CPU8x2.5-inch30No AEPSix standard2U height HSK4U height HSKRemove the air shroud A
(L-shape)
AllNo GPU /2&4 CPU8x2.5-inchC40E45Non-support FA with GPU, AEP, NVDIMM, PCIeSSD, NVMe and INTEL FPGALRDIMM > 32GSix standard2U height HSK4U height HSKInstall the air shroud A
(L-shape)
NOTE C40E45 - Fresh air support for continuous 40C and extended 45C.

Thermal restrictions

Following table lists the configuration required for efficient cooling.

Table 1. Thermal restrictions support matrixThis table describes thermal restrictions support matrix.
Number of hard drives Risers Number of processorsNumber of GPUs Heat sink Fan type Shroud DIMM blank Processor/DIMM blank Fan blank
Up to 205W processor (CPU 1/2) Up to 205W processor (CPU 3/4)
24 x 2.5 inch SAS/SATA + 12 PCIe (X8 PCIe Riser 1/X8 PCIe Riser 2) 2N/A 2U height HSK N/A Six standard Standard Yes (max 22x) N/A N/A
8 x 2.5 inch SAS/SATA
24 x 2.5 inch SAS/SATA + 12 PCIe (X8 PCIe Riser 1/X8 PCIe Riser 2) 4N/A 2U height HSK 4U height HSK Six standard Standard Yes (max 44x) N/A N/A
8 x 2.5 inch SAS/SATA (L-shape)
24 x 2.5 inch SAS/SATA + 8 PCIe (X16 PCIe Riser 1/X16 PCIe Riser 2) 22 2U height HSK N/A Six standard Remove the GPU shroud Yes (max 22x) N/A N/A
8 x 2.5 inch SAS/SATA
24 x 2.5 inch SAS/SATA + 8 PCIe (X16 PCIe Riser 1/X16 PCIe Riser 2) 42 2U height HSK 4U height HSK Six standard Remove the GPU shroud Yes (max 44x) N/A N/A
8 x 2.5 inch SAS/SATA (L-shape)
24 x 2.5 inch SAS/SATA + 8 PCIe (X16 PCIe Riser 1/X16 PCIe Riser 2)442U height HSK4U height HSKSix standardRemove the GPU shroudYes (max 44x)N/AN/A
8 x 2.5 inch SAS/SATA (L-shape)
8 x 2.5 inch SAS/SATA 12 PCIe (X8 PCIe Riser 1/X8 PCIe Riser 2) 2N/A2U height HSKN/ASix standardStandardYes (max 22x)N/AN/A
8 x 2.5 inch SAS/SATA 12 PCIe (X8 PCIe Riser 1/X8 PCIe Riser 2) 4N/A2U height HSK4U height HSKSix standardStandardYes (max 44x)N/AN/A
(L-shape)
8 x 2.5 inch SAS/SATA 8 PCIe (X16 PCIe Riser 1/X16 PCIe Riser 2) 222U height HSKN/ASix standardRemove the GPU shroudYes (max 22x)N/AN/A
8 x 2.5 inch SAS/SATA 8 PCIe (X16 PCIe Riser 1/X16 PCIe Riser 2) 422U height HSK4U height HSKSix standardRemove the GPU shroudYes (max 44x)N/AN/A
(L-shape)
8 x 2.5 inch SAS/SATA 8 PCIe (X16 PCIe Riser 1/X16 PCIe Riser 2) 442U height HSK4U height HSKSix standardRemove the GPU shroudYes (max 44x)N/AN/A
(L-shape)

Ambient temperature limitations

The following table lists configurations that require ambient temperature less than 30°C:

NOTE The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess CPU throttling, which may impact system performance.
Table 1. Configuration-based ambient temperature restrictionsThe following table lists configurations that require ambient temperature less than 30°C:
System Backplane CPU Thermal Design Power (TDP) CPU heat sink Fan type GPU Ambient restriction
PowerEdge R940xa 24 x 2.5 inch SAS/ SATA + 8 x 2.5 inch SAS/SATA Up to 205 W 2U height HSK + 4U height HSK Standard fan ≥1 double-width/ single-width 30°C
8 x 2.5 inch SAS/SATA Up to 205 W 2U height HSK + 4U height HSK Standard fan ≥1 double-width/ single-width 30°C

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications

Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have the MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specifications

The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013.
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013.
NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.