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Dell EMC PowerEdge R840: технические характеристики и спецификации
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Dell EMC PowerEdge R840: технические характеристики и спецификации

Chassis dimensions

Figure 1. Dimensions of PowerEdge R840 system
This image shows dimensions of the PowerEdge R840 system
Table 1. Dimensions of PowerEdge R840 systemThis table gives details of the dimensions of the PowerEdge R840 system:
XaXb (without brackets)Xb (w brackets)YZa (with bezel)Za (without bezel)Zb* Zc (with PSU handle)Zc (with chassis rear wall handle)
482 mm (18.97 inches)434 mm (17.08 inches)444.0 (17.48 inches) 86.8 mm (3.41 inches)37.84 mm (1.41 inches)23.9 mm (0.94 inches)812 mm (31.96 inches) 842 mm (33.14 inches) 902 mm (35.51 inches)

* - Zb refers to the nominal rear wall external surface, where the system board I/O connectors are located.

Chassis weight

Table 1. Chassis weight

The following table shows the maximum weight of the R840 system:
System Maximum weight (with all drives/SSDs)
2.5 inch 36.6 kg (80.68 lb)

Processor specifications

The PowerEdge R840 system supports four processors - Intel Xeon Scalable Processor family.

Supported operating systems

The PowerEdge R840 supports the following operating systems:

  • Canonical Ubuntu LTS
  • Citrix Hypervisor
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
For more information, go to www.dell.com/ossupport.

PSU specifications

The PowerEdge R840 system supports up to two AC or DC power supply units (PSUs).
Table 1. PSU specificationsThe table below are the specifications for 750 W, 1100 W, 1600 W, 2000 W, 2400 W and 2600 W power supplies.
PSU Class Heat dissipation (maximum) Frequency Voltage High line 200V–240 V Low line 100 V– 140 V DC Current
750 W AC Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC, autoranging 750 W 750 W NA 10 A-5 A
750 W AC Titanium 2843 BTU/hr 50/60 Hz 200–240 V AC 750 W NA NA 5 A
750 W Mixed Mode HVDC (for China only) Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC, autoranging 750 W 750 W NA 10 A-5 A
N/A 2891 BTU/hr N/A 240 V DC, autoranging NA NA 750 W 4.5 A
750 W Mixed Mode AC Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC 750 W 750 W N/A 10 A-5 A
750 W Mixed Mode DC (for China only) N/A 2891 BTU/hr 50/60 Hz 240 V DC 750 W N/A 750 W 5 A
1100 W AC Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC, autoranging 1100 W 1050 W NA 12 A-6.5 A
1100 W DC N/A 4416 BTU/hr N/A –(48–60) V DC, autoranging NA NA 1100 W 32 A
1100 W 10 A-5 A Mixed Mode HVDC (for China and Japan only) Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC, autoranging 1100 W 1050 W NA 12 A-6.5 A
N/A 4100 BTU/hr N/A 200–380 V DC, autoranging NA NA 1100 W 6.4 A-3.2 A
1600 W AC Platinum 6000 BTU/hr 50/60 Hz 100–240 V AC, autoranging 1600 W 800 W NA 10 A
1600 W HLAC Titanium 5840 BTU/hr 50/60 Hz 200–240 V AC 1600 W NA NA 10 A
2000 W AC Platinum 7500 BTU/hr 50/60 Hz 100–240 V AC, autoranging 2000 W 1000 W NA 11.5 A
2400 W AC Platinum 9000 BTU/hr 50/60 Hz 100–240 V AC, autoranging 2400 W 1400 W NA 16 A
2600 W HLAC Titanium 9500 BTU/hr 50/60 Hz 200–240 V AC 2600 W NA NA 15 A
NOTE: Heat dissipation is calculated using the PSU wattage rating.
NOTE: This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.
NOTE: PSUs rated for 1100 W AC or 1100 W Mixed Mode HVDC and higher require high-line voltage (200–240 V AC) to supply their rated capacity.

System battery specifications

The PowerEdge R840 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge R840 system supports up to six PCI express (PCIe) generation 3 expansion cards that can be installed on the system board and expansion card risers.

Figure 1. 24 x 2.5-inch drive system. This image shows the PCIe slot numbers.
This image shows the PCIe slot numbers on the 24 x 2.5-inch drive system.
Figure 2. 24 x 2.5-inch + 2 x 2.5-inch (rear) drive system. This image shows the PCIe slot numbers.
This image shows the PCIe slot numbers on the 24 x 2.5-inch + 2 x 2.5-inch (rear) drive system.

The following table provides detailed information about the expansion card riser specifications:

Table 1. Expansion card riser specificationsThis table describes the expansion card riser specifications.
PCIe slotRiserProcessor connectionHeightLengthSlot width
1X8 PCIe Riser 1Processor 1Full heightHalf lengthx8
2X16 PCIe Riser 1Processor 1Full heightFull lengthx16
X8 PCIe Riser 1Processor 1Full heightHalf lengthx8
3On the system boardProcessor 1Low profileHalf lengthx16
4On the system boardProcessor 2Low profileHalf lengthx16
5X8 PCIe Riser 2Processor 2Full heightHalf lengthx8
6 X16 PCIe Riser 2Processor 2Full heightFull lengthx16
X8 PCIe Riser 2Processor 2Full heightHalf lengthx8

Memory specifications

.
Table 1. Memory specificationsThe following table shows the memory specifications for the R840 system:
Memory module sockets DIMM type DIMM rank DIMM capacity Dual processors Quad processors
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
48 288-pins LRDIMM Octal rank 256 GB 512 GB 6144 GB 1024 GB 12.288 TB
LRDIMM Octal rank 128 GB 256 GB 3072 GB 512 GB 6144 GB
LRDIMM Quad rank 64 GB 128 GB 1536 GB 256 GB 3072 GB
RDIMM Dual rank 64 GB 128 GB 1536 GB 256 GB 3072 GB
RDIMM Dual rank 32 GB 64 GB 768 GB 128 GB 1536 GB
RDIMM Dual rank 16 GB 32 GB 384 GB 64 GB 768 GB
RDIMM Single rank 8 GB 16 GB 192 GB 32 GB 384 GB
NVDIMM-N Single rank 16 GB RDIMM: 192 GB RDIMM: 384 GB RDIMM: 384 GB RDIMM: 1152 GB
NVDIMM-N: 16 GB NVDIMM-N: 192 GB NVDIMM-N: 16 GB NVDIMM-N: 192 GB
PMem N/A 128 GB RDIMM: 192 GB LRDIMM: 1536 GB RDIMM: 384 GB LRDIMM: 3072 GB
PMem: 1536 GB PMem: 1536 GB PMem: 248 GB PMem: 3072 GB
N/A 256 GB RDIMM: 384 GB LRDIMM: 1536 GB RDIMM: 384 GB LRDIMM: 3072 GB
PMem: 2048 GB PMem: 3072 GB PMem: 4096 GB PMem: 6144 GB
N/A 512 GB RDIMM: 384 GB LRDIMM: 1536 GB RDIMM: 768 GB LRDIMM: 3072 GB
PMem: 4096 GB PMem: 6144 GB PMem: 8192 GB PMem: 12,288 GB
NOTE: Do not mix 8 GB RDIMMs and 16 GB NVDIMM-Ns.
NOTE: Do not mix 64 GB LRDIMMs, 128 GB LRDIMMs and 256 GB LRDIMMs.
NOTE: 256GB does not support GPU configuration.
NOTE: 256GB LRDIMMs only support 8x 2.5" Chassis at 30oC ambient temperature.
Table 2. DIMM blank population rulesThe following table shows the DIMM blank population rules for the R840 system:
Processor configuration Processor 1 Processor 2 Processor 3 Processor 4
Dual processor Required Required Not required Not required
Quad processor Required Required Required Required

PMem and 256GB LRDIMM Thermal Restrictions

Table 3. PMem Thermal RestrictionsThe following table shows the PMem Thermal Restriction for the R840 system:
PMem Support V2 Air-shroud V1 Air-shroud
8x 2.5-inch SAS/SATA

35C ambient temperature support, 30C ambient temperature with 256GB LRDIMMs

30C ambient temperature support, not supported with 256GB LRDIMMs

8x 2.5-inch NVMe

35C ambient temperature support, 30C ambient temperature with 256GB LRDIMMs

Not supported

24x 2.5-inch SAS/SATA or NVMe

30C ambient temperature support, not supported with 256GB LRDIMMs

Not supported

NOTE: PMem does not support GPU configuration.

RAID controller specifications

The PowerEdge R840 system supports:
  • Internal storage controller cards: PowerEdge RAID Controller (PERC) H330, H350, PERC H730P, H740P, H750, HBA330, HBA350i, HBA350 and Boot Optimized Server Storage (BOSS-S1)
  • External storage controller cards: S140, 12 Gbps SAS HBA, including HBA355e

Drives

The PowerEdge R840 system supports SAS, SATA, Nearline SAS hard drives/SSDs, or NVMe drives.

Table 1. Supported drive options for PowerEdge R840 system

This table lists out the supported drive and SSD options for the PowerEdge R840 system:
Chassis options Configurations
Eight hard drive chassis

Up to eight 2.5-inch SAS/SATA front accessible drives in slots 0–7

Up to eight 2.5-inch SATA front accessible drives in slots 0–7
Twenty-four drive chassis

Up to twenty-four 2.5-inch SAS/SATA front accessible drives in slots 0–23

Up to twelve 2.5-inch SAS/SATA front accessible drives in slots 0–11 + twelve SAS/SATA/NVMe front accessible drives in slots 12–23

Up to twenty-four 2.5-inch NVMe front accessible drives in slots 0–23

Twenty four front + two rear drive chassis

Up to twenty-four 2.5 inch SAS/SATA front accessible drives in slots 0–23 + up to two 2.5-inch SAS/SATA rear accessible drives

Optical drives

The PowerEdge R840 system supports one optional slim SATA DVD-ROM drive or DVD +/-RW drive.
NOTE: DVD devices support only data.

Tape drives

The PowerEdge R840 system supports external tape backup devices.
NOTE: The PowerEdge R840 system does not support internal tape drives.
Supported external tape drives:
  • External RD1000 USB
  • External LTO-5, LTO-6,LTO-7, and 6 Gb SAS tape drives
  • 114X rack mount chassis with LTO-5, LTO-6, and LTO-7, 6 Gb SAS tape drives
  • TL1000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
  • TL2000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
  • TL2000 with LTO-5, LTO-6, and LTO-7 8 Gb FC tape drives
  • TL4000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
  • TL4000 with LTO-5, LTO-6, and LTO-7 8 Gb FC tape drives
  • ML6000 with LTO-5, LTO-6, 6 Gb SAS tape drives
  • ML6000 with LTO-5, LTO-6, LTO-7 8 Gb FC tape drives

USB ports

The PowerEdge R840 system supports both USB 2.0-compliant ports and USB 3.0-compliant ports:

The following table provides more information about the USB specifications:

Table 1. USB specificationsThe following table shows the USB specifications for the PowerEdge R840 system.
Front panel Back panelInternal USB
  • Two USB 2.0-compliant ports
  • One micro USB 2.0-compliant port for iDRAC Direct
    NOTE: The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
  • One optional USB 3.0-compliant port
  • Two USB 3.0-compliant ports
  • One internal USB 3.0-compliant port

NIC ports

The PowerEdge R840 system supports up to four Network Interface Controller (NIC) ports that are integrated on the network daughter card (NDC), and are available in the following configurations:
  • Four RJ-45 ports that support 10 Mbps, 100 Mbps, and 1000 Mbps
  • Four RJ-45 ports that support 100 M, 1 G, and 10 Gbps
  • Four RJ-45 ports, where two ports support maximum of 10 G and the other two ports maximum of 1 G
  • Two RJ-45 ports that support up to 1 Gbps and 2 SFP+ ports that support up to 10 Gbps
  • Four SFP+ ports that support up to 10 Gbps
  • Two SFP28 ports that support up to 25 Gbps

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display.

The PowerEdge R840 system supports two 15-pin VGA ports, one each, on the front and back of the system.

Serial connector

The serial connector on the rear of system for serial device connection and console redirection.

The PowerEdge R840 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

IDSDM or vFlash module

The PowerEdge R840 system supports optional Internal Dual SD module (IDSDM) or vFlash module. In 14th generation of PowerEdge servers, IDSDM or vFlash module is combined into a single card module, and are available in these configurations:
  • vFlash or
  • vFlash and IDSDM
The IDSDM or vFlash module is located in a slot on the back of the system. The module supports three microSD cards; two cards for IDSDM and one card for vFlash. The following capacities are supported:
  • IDSDM: 16 GB, 32 GB, 64 GB
  • vFlash: 16 GB
NOTE: There are two dip switches on the IDSDM or vFlash module for write-protection.
NOTE: One IDSDM card slot is dedicated for redundancy.
NOTE: Use Dell branded microSD cards associated with the IDSDM or vFlash configured systems.

Video specifications

R840 servers support the integrated Matrox G200eW3 graphics controller with 16 MB of video frame buffer.

The following table describes the supported video resolution options.

Table 1. Supported video resolution optionsVideo resolution options
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32
NOTE: 1920 x 1080 and 1920 x 1200 resolutions are supported only in reduced blanking mode.

Standard operating temperature

Table 1. Standard operating temperature specifications

The standard operating temperature for altitude less than 950 m or 3117 ft ranges 10 °C–35°C with no direct sunlight on the equipment.

NOTE: The 2.5-inch hard drive chassis supports a maximum of 145 W processors.
Standard operating temperature Specifications
Continuous operation (for altitude less than 950 m or 3117 ft) 10 °C–35°C (50 °F–95°F) with no direct sunlight on the equipment.

Expanded operating temperature

Table 1. Expanded operating temperature specificationsWhen the system is in continuous operation, the expanded operating temperature ranges 5 °C–40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10 °C–35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures 35 °C – 40°C, derate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft). When the system is operating at < 1% of annual operating hours, the expanded operating temperature is –5 °C–45°C at 5% to 90% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10 °C–35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures 40 °C–45°C, derate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Expanded operating temperature Specifications
Continuous operation 5 °C–40°C at 5% to 85% RH with 29°C dew point.
NOTE: Outside the standard operating temperature (10 °C–35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C.

For temperatures 35 °C – 40°C, derate maximum allowable temperature by 1°C per 175 m (1°F per 319 ft.) above 950 m (3,1171 ft.).
≤ 1% of annual operating hours –5 °C–45°C at 5% to 90% RH with 29°C dew point.
NOTE: Outside the standard operating temperature (10 °C–35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours.

For temperatures 40 °C – 45°C, derate maximum allowable temperature by 1°C per 125 m (1°F per 228 ft.) above 950 m (3.117 ft.).
NOTE: When operating in the expanded temperature range, the performance of the system may be impacted.
NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD panel and in the System Event Log.

Expanded operating temperature restrictions

  • The operating temperature is specified for a maximum altitude of 950 m for Fresh Air Cooling.
  • Do not perform cold start below 5°C due to hard drive constraints.
  • Apache Pass DIMM, NVDIMM, PCIe SSD, and NVMe are not supported.
  • Tape Backup Unit (TBU) is not supported in Fresh Air.
  • LRDIMM >32 GB is not supported in x4 sockets configuration.
  • DCPMMs are not supported.
  • Rear installed drives and GPU configuration are not supported.
  • Redundant power supplies are required.
  • Non Dell qualified peripheral cards and /or peripheral cards greater than 25 W are not supported.
  • Intel FPGA is not supported.
  • 205 W SKUs, 200W/18C, 165W/12C, and 150W_8C processor are not supported on all x4 socket processor configurations.
  • 165 W SKUs, 130W/8C, 115W/6C, and 105W_4C are not supported on the x4 socket processor configurations except front x8 inch SAS/SATA drives configurations.

Ambient temperature limitations

NOTE: The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess processor throttling, which may impact system performance.
Table 1. Configuration-based ambient temperature restrictions with GPGPUThis table describes the configuration-based ambient temperature restrictions with GPGPU.
TDP(W) R840
  • 8 x 2.5 inch SAS/SATA
  • 2 x CPU
  • 2 x GPGPU
R840
  • 8 x 2.5 inch SAS/SATA
  • 4 x CPU
  • 2 x GPGPU
R840
  • 24 x 2.5 inch SAS/SATA
  • 2 x CPU
  • 2 x GPGPU
R840
  • 24 x 2.5 inch SAS/SATA
  • 4 x CPU
  • 2 x GPGPU
R840
  • 24 x 2.5 inch NVme
  • 4 x CPU
  • 2 x GPGPU
C40E45 35 30 C40E45 35 30 C40E45 35 30 C40E45 35 30 C40E45 35 30
205 N N N N N N N N N N N N N N N
200 N N N N N N N N N N N N N N N
165 (Gold 6146) N N N N N N N N N N N N N N N
150 (Gold 6144 and 6244) N N N N N N N N N N N N N N N
150 (Gold 6240Y) N N N N N N N N N N N Y N N Y
165 N Y Y N Y Y N Y Y N N Y N N Y
150 N Y Y N Y Y N Y Y N N Y N N Y
140 N Y Y N Y Y N Y Y N N Y N N Y
130 ( Gold 6134) N Y Y N Y Y N Y Y N N Y N N Y
125 N Y Y N Y Y N Y Y N N Y N N Y
115 ( Gold 6128) N Y Y N Y Y N Y Y N N Y N N Y
115 N Y Y N Y Y N Y Y N N Y N N Y
105(Gold 5122 and 8156) N Y Y N Y Y N Y Y N N Y N N Y
105(Gold 5222 and 8256) N Y Y N Y Y N Y Y N N Y N N Y
105 N Y Y N Y Y N Y Y N N Y N N Y
100 N Y Y N Y Y N Y Y N N Y N N Y
85 N Y Y N Y Y N Y Y N N Y N N Y
70 N Y Y N Y Y N Y Y N N N N N N

N= Not Supported

Y= Supported

Table 2. Configuration-based ambient temperature restrictions with PCIeThis table describes the configuration-based ambient temperature restrictions with PCIe.
TDP(W) R840
  • 8 x 2.5 inch SAS/SATA
  • 2 x CPU
  • 6 x PCIe
R840
  • 8 x 2.5 inch SAS/SATA
  • 4 x CPU
  • 6 x PCIe
R840
  • 24 x 2.5 inch SAS/SATA
  • 2 x CPU
  • 6 x PCIe
R840
  • 24 x 2.5 inch SAS/SATA
  • 4 x CPU
  • 6 x PCIe
R840
  • 24 x 2.5 inch NVMe
  • 4 x CPU
  • 6 x PCIe
C40E45 35 30 C40E45 35 30 C40E45 35 30 C40E45 35 30 C40E45 35 30
205 Y Y Y N Y Y Y Y Y N N Y N N Y
200 Y Y Y N Y Y Y Y Y N N Y N N Y
165 (Gold 6146) Y Y Y N Y Y Y Y Y N N Y N N Y
150 (Gold 6144 and 6244) Y Y Y N Y Y Y Y Y N N Y N N Y
150 (Gold 6240Y) Y Y Y N Y Y Y Y Y N Y Y N N Y
165 Y Y Y Y Y Y Y Y Y N Y Y N N Y
150 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y
140 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y
130 ( Gold 6134) Y Y Y Y Y Y Y Y Y N Y Y N N Y
125 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y
115 ( Gold 6128) Y Y Y Y Y Y Y Y Y N Y Y N N Y
115 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y
105(Gold 5122 and 8156) Y Y Y Y Y Y Y Y Y N Y Y N N Y
105(Gold 5222 and 8256) Y Y Y Y Y Y Y Y Y N Y Y N N Y
105 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y
100 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y
85 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y
70 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y

N=Not Supported

Y=Supported

NOTE: C40E45 = Continuous operating temperature at 40°C, and Excursion temperature at 45°C.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and nondata center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air Filtration

Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.

NOTE: This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13 filtration.

Conductive dust

Air must be free of conductive dust, zinc whiskers, or other conductive particles.

NOTE: This condition applies to data center and non-data center environments.

Corrosive dust

  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination Specifications
Copper Coupon Corrosion <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver Coupon Corrosion <200 Å/month as defined by AHSRAE TC9.9.
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.