Dell EMC PowerEdge R7525: характеристики и спецификации

Chassis dimensions

This image shows chassis dimension for the PowerEge R7525 system. — Figure 1. Chassis dimensions

Table 1. PowerEdgeR7525This table provides the dimensions of the PowerEdgeR7525 system:
Drives	Xa	Xb	Y	Za	Zb	Zc
12 drives	482.0 mm (18.97 inches)	434.0 mm (17.08 inches)	86.8 mm (3.41 inches)	With bezel: 35.84 mm (1.4 inches) Without bezel: 22.0 mm (0.87 inches)	700.7 mm (27.58 inches) (Ear to rear wall)	736.29 mm (28.98 inches) (Ear to PSU handle)
24 drives	482.0 mm (18.97 inches)	434.0 mm (17.08 inches)	86.8 mm (3.41 inches)	With bezel: 35.84 mm (1.4 inches) Without bezel: 22.0 mm (0.87 inches)	700.7 mm (27.58 inches) (Ear to rear wall)	736.29 mm (28.98 inches) (Ear to PSU handle)

NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

Chassis weight

Table 1. PowerEdge R7525The table below shows the maximum weight of the PowerEdge R7525.
System configuration	Maximum weight (with all drives/SSDs)
12 x 3.5-inch	36.3 kg (80.02 lb)
8 x 3.5-inch	33.2 kg (73.19 lb)
24 x 2.5-inch	28.6 kg (63.05 lb)
16 x 2.5-inch	26.6 kg (58.64 lb)
8 x 2.5-inch	24.6 kg (54.23 lb)

Processor specifications

Table 1. PowerEdge R7525 processor specifications This table provides processor specifications for the PowerEdge R7525
Supported processor	Number of processors supported
AMD EPYC 7002 or 7003 series processor	Two

PSU specifications

The PowerEdge R7525 system supports up to two AC or DC power supply units (PSUs).

WARNING:Instructions for the qualified electricians only:

System using -(48-60) V DC or 240 V DC power supplies are intended for restricted access locations in accordance with Articles 110-5, 110-6, 110-11, 110-14, and 110-17 of the National Electrical Code, American National Standards Institute (ANSI)/National Fire Protection Association (NFPA) 70.

240 V DC power supplies shall be connected to the 240 V DC outlet from certified power distribution units if applicable in country of use.

Power supply cords/jumper cords and the associated plugs/inlets/connectors shall have appropriate electrical ratings referencing the rating label on the system when used for connection.

Table 1. PowerEdge R7525 PSU specificationsThis table describes PSU specifications.
PSU	Class (AC only)	Heat dissipation (maximum)	Frequency	Voltage	Current
800 W Mixed Mode	Platinum	3000 BTU/hr	50/60 Hz	100 -240 V AC	9.2 - 4.7 A
800 W Mixed Mode	N/A	3000 BTU/hr	DC	240 V DC	3.8 A
1100 W Mixed Mode	Titanium	4100 BTU/hr	50/60 Hz	100–240 V AC	12 A-6.3 A (X2)
1100 W Mixed Mode	N/A	4100 BTU/hr	DC	240 V DC	5.2 A DC
1100 W (-48Vdc)	N/A	4265 BTU/hr	DC	(-48)-(-60) V DC	27 A
1400 W Mixed Mode	Platinum	5250 BTU/hr	50/60 Hz	100 - 240 V AC	12 - 8 A AC
1400 W Mixed Mode	N/A	5250 BTU/hr	DC	240 V DC	6.6 A DC
2400W Mixed Mode	Platinum	9000 BTU/hr	50/60 Hz	100 - 240 V AC	13.5 - 11 A AC
2400W Mixed Mode	N/A	9000 BTU/hr	DC	240 V DC	11.2 A DC

NOTE:If a system with AC 1400 W PSU operate at low line 100-120 V AC, then the power rating per PSU is derated to 1050 W.

NOTE: : If a system with AC 2400 W PSU operate at low line 100-120 V AC, then the power rating per PSU is derated to 1400 W.

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

Supported operating systems

The PowerEdge R7525 supports the following operating systems:

Canonical Ubuntu Server LTS
Citrix XenServer
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware vSAN/ESXi

For more information, see www.dell.com/ossupport.

Cooling fan specifications

The PowerEdgeR7525 system supports up to six (STD), high performance silver grade (HPR (Silver)), or high performance gold grade (HPR (Gold)) cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Also known as	Label color	Label image
Standard fan	STD	STD	No label
High-performance fan (Silver grade) fan	HPR (Silver)	HPR	Silver	NOTE:New cooling fans comes with the High Performance Silver Grade label. While the older cooling fans has the High Performance label. Figure 1. High performance fan Figure 2. High performance (Silver grade) fan
High-performance fan (Gold grade) fan	HPR (Gold)	VHP - Very High Performance	Gold	NOTE:New cooling fans comes with the High Performance Gold Grade label. While the older cooling fans has the High Performance label. Figure 3. Very high performance fan Figure 4. High performance (Gold grade) fan

NOTE:Mixing of STD, HPR (Silver), or HPR (Gold) fan is not supported.

NOTE:The STD, HPR (Silver), or HPR (Gold) fan installation depends on the system configuration. For more information about the supported fan configuration or matrix, see Thermal restriction matrix.

System battery specifications

The PowerEdge R7525 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

WARNING: Consumer-Grade GPU should not be installed or used in the Enterprise Server products.

The PowerEdge R7525 system supports up to eight PCI express (PCIe) Gen 4 expansion cards.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the PowerEdge R7525 system.
PCIe slot	With Regular shroud	PCIe slot length	R1a	R1b	R1c	R2a	R3a	R3b	R4a	R4b	R4c
Slot 1	Low profile and Full Height- Half Length	Low profile and Full Height- Half Length		x8	x16
Slot 2	Low profile and Full Height- Half Length	Full Height-3/4 and Full Length	x16(GPU)	x8	x16
Slot 3	Low profile-Half Length					x16
Slot 4	Low profile and Full Height- Half Length							x8
Slot 5	Low profile and Full Height- Half Length	Full Height-3/4 and Full Length					x16(GPU)	x8
Slot 6	Low profile-Half Length					x16
Slot 7	Low profile and Full Height- Half Length	Full Height-3/4 and Full Length							x16(GPU)	x8	x16
Slot 8	Low profile and Full Height- Half Length	Low profile and Full Height- Half Length								x8	x16

Memory specifications

The PowerEdge R7525 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications for the PowerEdge PowerEdge R7525 system:
DIMM type	Rank	Capacity	DIMM rated voltage and speed	Operating Speed on AMD EPYC™ processor
DIMM type	Rank	Capacity	DIMM rated voltage and speed	1 DIMM per channel (1DPC)	2 DIMMs per channel (2DPC)
RDIMM	1R	8 GB	DDR4 (1.2V), 3200 MT/s	3200 MT/s	2933 MT/s
RDIMM	2R	16 GB, 32 GB, 64 GB	DDR4 (1.2V), 3200 MT/s	3200 MT/s	2933 MT/s
LRDIMM	4 R	128 GB	DDR4 (1.2 V), 3200 MT/s	3200 MT/s	2933 MT/s
	8R	128 GB	DDR4 (1.2V), 2666 MT/s	2666 MT/s	2666 MT/s
	8R	128 GB	DDR4 (1.2V), 3200 MT/s	3200 MT/s	2933 MT/s

NOTE:The older 32 GB capacity RDIMM memory with x4 data width and 8Gb DRAM density cannot be mixed with the newer 32GB capacity RDIMM memory with x8 data width and 16Gb DRAM density in the same AMD EPYC™ processor unit.

NOTE:The older 128 GB capacity LRDIMM memory at 2666 MT/s speed cannot be mixed with the new 128 GB capacity LRDIMM memory at 3200 MT/s speed.

Table 2. Memory module socketsThe table below shows the memory module sockets for the PowerEdge R7525 system:
Memory module sockets	Speed
32, 288-pin	3200 MT/s, 2933 MT/s, 2666 MT/s

Storage controller specifications

The PowerEdge R7525 system supports the following controller cards:

Table 1. PowerEdge R7525 system controller cardsThis table provides the controller cards supported on PowerEdge R7525 system:
Internal controllers	External controllers
PERC H755 PERC H755N PERC H745 PERC H345 HBA345 HBA355 S150 Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2 x M.2 SSDs	12Gbps SAS Ext. HBA PERC H840 HBA355E

Table 2. PowerEdge R7525 Front PERC and Adapter PERC support on back planes This table provides information on Front PERC and Adapter PERC on different back planes supported on PowerEdge R7525 system:
Front PERC	Adapter PERC
8 x 3.5 inches SAS/SATA	12 x 3.5 inches SAS/SATA
16 x 2.5 inches SAS/SATA	12 x 3.5 inches + Rear 2 x 2.5 inches
24 x 2.5 inches (16 SAS/SATA X 2.5 inches + 8 X 2.5 inches NVME)	12 x 3.5 inches + Rear 2 x 2.5 inches NVME
8 x 2.5 inches NVMe	16 x 2.5 inches SAS/SATA

Drives

The PowerEdge R7525 system supports:

8 x 3.5-inch hot-swappable SAS, SATA drives.
8 x 2.5 inch NVMe drives.
12 x 3.5-inch hot-swappable SAS, SATA drives.
16 x 2.5-inch hot-swappable SAS, SATA drives.
24 x 2.5-inch hot-swappable SAS, SATA , or NVMe drives.

Backplane

Up to 8 x 3.5-inch SAS, SATA drives.
Up to 8 x 2.5 inch NVMe drives.
Up to 12 x 3.5-inch SAS, SATA drives.
Up to 16 x 2.5-inch SAS, SATA drives.
Up to 24 x 2.5-inch NVMe drives.
Up to 2 x 2.5-inch rear SAS, SATA, or NVMe drives

NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at https://www.dell.com/support Browse all Products > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

Table 1. PowerEdge R7525 system USB specificationsThe following table shows the USB specifications for the PowerEdge R7525 system.
Front		Rear		Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 3.0-compliant ports	One	Internal USB 3.0-compliant port	One
Micro-USB 2.0 compliant port	One	USB 2.0-compliant ports	One	Internal USB 3.0-compliant port	One

NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NOTE:The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.

NOTE:The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

NIC port specifications

The PowerEdge R7525 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional OCP cards.

Table 1. NIC port specification This table describes the NIC port specification.
Feature	Specifications
LOM card	1 GB x 2
OCP card (OCP 3.0)	1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4, 50 GbE x 2, 100 GbE x 2

Serial connector specifications

The PowerEdge R7525 system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

The optional serial connector card is installed similar to an expansion card filler bracket.

VGA ports specifications

The PowerEdge R7525 system supports two DB-15 VGA port one each on the front and back panels.

IDSDM

The PowerEdge R7525 system supports Internal Dual SD module (IDSDM).

The IDSDM supports two SD cards and is available in the following configurations:

Table 1. Supported SD card storage capacityThis table lists the storage capacity of the supported SD cards
IDSDM card
16 GB 32 GB 64 GB

NOTE:One IDSDM card slot is dedicated for redundancy.

NOTE:Use Dell EMC branded SD cards that are associated with the IDSDM configured systems.

Video specifications

The PowerEdge R7525 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported front video resolution optionsThis table describes the supported front video resolution options.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32

Table 2. Supported rear video resolution optionsThis table describes the supported rear video resolution options.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/support/home.

Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Operational climatic range category A3 This table describes the operational climatic range for category A3.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Operational climatic range category A4 This table describes the operational climatic range for category A4.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-104 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal air restrictions

Fresh air environment

Two PSUs are required in redundant mode, however single PSU failure is not supported.
NVMe drive is not supported.
128 GB or greater capacity DIMMs are not supported.
Both SW and DW GPGPU/FPGA are not supported.
CPU TDP equal or greater than 180 W are not supported.
Rear drives are not supported.
PCIe card TDP more than 25 W is not supported

ASHRAE A3 environment

Two PSUs are required in redundant mode, however single PSU failure is not supported.
NVMe drive is not supported.
128 GB or greater capacity DIMMs are not supported.
Both SW and DW GPGPU/FPGA are not supported.
CPU TDP equal or greater than 180 W are not supported.
Rear drives are not supported.
PCIe card TDP more than 25 W is not supported.

ASHRAE A4 environment

Two PSUs are required in redundant mode, however single PSU failure is not supported.
NVMe drive is not supported.
128 GB or greater capacity DIMMs are not supported.
CPU TDP equal or greater than 155 W are not supported (Only 120 W processor supports A4).
Rear drives are not supported.
12 x 3.5-inch chassis is not supported.
BOSS and OCP are not supported.
PCIe card TDP more than 25 W is not supported.

Liquid cooling: Fresh air environment

Two PSUs are required in redundant mode. Single PSU failure is not supported.
NVMe drive is not supported.
256 GB and higher capacity DIMM is not supported.
Both SW and DW GPGPU/FPGA are not supported.
Rear drive configuration is not supported.
PCIe card TDP more than 25 W is not supported.

Liquid cooling: ASHRAE A3 environment

Two PSUs are required in redundant mode, however single PSU failure is not supported.
NVMe drive is not supported.
256 GB and higher capacity DIMM is not supported.
Both SW and DW GPGPU/FPGA are not supported.
Rear drive configuration is not supported.
PCIe card TDP more than 25 W is not supported.

Liquid cooling: ASHRAE A4 environment

Two PSUs are required in redundant mode, however single PSU failure is not supported.
NVMe drive is not supported.
256 GB and higher capacity DIMM is not supported.
Both SW and DW GPGPU/FPGA are not supported.
Rear drive configuration is not supported.
PCIe card TDP more than 25 W is not supported.

Thermal restriction matrix

Table 1. Thermal restriction matrixThe table describes thermal restriction matrix for the PowerEdge R7525 system.
Configuration		8 x 2.5-inch NVMe	16 x 2.5-inch SAS	16 x 2.5-inch NVMe	24 x 2.5-inch SAS			16 x 2.5-inch SAS + 8 x 2.5-inch NVMe	24 x 2.5-inch NVMe	8 x 3.5-inch	12 x 3.5-inch			Ambient temperature
Rear storage		No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	2 x Rear 2.5-inch No Rear Fan	4 x Rear 2.5-inch with Rear Fan	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	2 x Rear 2.5-inch No Rear Fan	4 x Rear 2.5-inch with Rear Fan	Ambient temperature
CPU TDP/cTDP	120 W	STD fan 1U STD HSK	STD fan 1U STD HSK	STD fan 1U STD HSK	STD fan 1U STD HSK	HPR fan 1U STD HSK	HPR fan 1U STD HSK	STD fan 1U STD HSK	HPR fan 1U STD HSK	STD fan 1U STD HSK	HPR fan 1U STD HSK	HPR fan 1U STD HSK	HPR fan 1U STD HSK	35°C
	155 W	STD fan 1U STD HSK	STD fan 1U STD HSK	STD fan 1U STD HSK	STD fan 1U STD HSK	HPR fan 1U STD HSK	HPR fan 1U STD HSK	STD fan 1U STD HSK	HPR fan 1U STD HSK	STD fan 1U STD HSK	HPR fan 1U STD HSK	HPR fan 1U STD HSK	HPR fan 1U STD HSK	35°C
	170 W	STD fan 1U STD HSK	STD fan 1U STD HSK	STD fan 1U STD HSK	STD fan 1U STD HSK	HPR fan 1U STD HSK	HPR fan 1U STD HSK	STD fan 1U STD HSK	HPR fan 1U STD HSK	STD fan 1U STD HSK	HPR fan 1U STD HSK	HPR fan 1U STD HSK	HPR fan 1U STD HSK	35°C
	180 W	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan 2U Full HSK	HPR fan 2U Full HSK	HPR fan 2U Full HSK	STD fan 2U Full HSK	HPR fan 2U Full HSK	STD fan 2U Full HSK	HPR fan 2U Full HSK	HPR fan 2U Full HSK	HPR fan 2U Full HSK	35°C
	200 W	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan 2U Full HSK	HPR fan 2U Full HSK	HPR fan 2U Full HSK	STD fan 2U Full HSK	HPR fan 2U Full HSK	STD fan 2U Full HSK	HPR fan 2U Full HSK	HPR fan 2U Full HSK	HPR fan 2U Full HSK	35°C
	225 W	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan 2U Full HSK	HPR fan 2U Full HSK	HPR fan 2U Full HSK	STD fan 2U Full HSK	HPR fan 2U Full HSK	STD fan 2U Full HSK	HPR fan 2U Full HSK	HPR fan 2U Full HSK	HPR fan 2U Full HSK	35°C
	240 W	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan 2U Full HSK	HPR fan 2U Full HSK	HPR fan 2U Full HSK	STD fan 2U Full HSK	HPR fan 2U Full HSK	STD fan 2U Full HSK	HPR fan 2U Full HSK	HPR fan 2U Full HSK	HPR fan 2U Full HSK	35°C
	280 W - 64C	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan* 2U Full HSK	HPR fan 2U Full HSK	VHP fan 2U Full HSK	STD fan* 2U Full HSK	HPR fan* 2U Full HSK	STD fan 2U Full HSK	HPR fan* 2U Full HSK	HPR fan* 2U Full HSK	HPR fan* 2U Full HSK	35°C
	280 W - 32C	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan* 2U Full HSK	HPR fan 2U Full HSK	VHP fan 2U Full HSK	STD fan* 2U Full HSK	HPR fan* 2U Full HSK	STD fan 2U Full HSK	-	-	-	35°C
	280 W - 64C/32C	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan 2U Full HSK	STD fan* 2U Full HSK	HPR fan 2U Full HSK	VHP fan 2U Full HSK	STD fan* 2U Full HSK	HPR fan* 2U Full HSK	STD fan 2U Full HSK	-	-	-	35°C
	280 W - 24C/16C	VHP fan 2U Full HSK	VHP fan 2U Full HSK	VHP fan 2U Full HSK
128 GB LRDIMM	-	STD fan	STD fan	STD fan	STD fan	HPR (Silver) fan	HPR (Silver) fan	STD fan	HPR (Silver) fan	STD fan	HPR (Silver) fan*, if TDP ≥ 200 W	HPR (Silver) fan*, if TDP ≥ 170 W	HPR (Silver) fan*	35°C

NOTE:* Supported ambient temperature is 30°C.

NOTE:Three fan modules are required for single processor, and six fan modules are required for dual processor system.

Table 2. Air cooling and liquid cooling: GPU/FPGA thermal restriction matrix The table describes GPU/FPGA thermal restriction matrix for the PowerEdge R7525 system.
Configuration (Front storage)	Fan type	Max CPU TDP/cTDP	GPU/FPGA ( Ambient temperature )
Configuration (Front storage)	Fan type	Max CPU TDP/cTDP	T4	V100 (16 GB)	V100S	M10	Snow white	RTX 6000	RTX8000	A100	MI100	A40	A10	A30	A16	MI210	A2
No Backpane	HPR (Silver)	280 W	30°C	35°C	30°C	35°C	35°C	35°C	35°C	35°C	30°C	30°C	30°C	35°C	35°C	35°C	30°C
8 x 2.5-inch NVMe	HPR (Silver)	280 W	30°C	35°C	30°C	35°C	35°C	35°C	35°C	35°C	30°C	30°C	30°C	35°C	35°C	35°C	30°C
16 x 2.5-inch SAS	HPR (Silver)	280 W	30°C	35°C	30°C	35°C	35°C	35°C	35°C	35°C	30°C	30°C	30°C	35°C	35°C	35°C	30°C
16 x 2.5-inch NVMe	HPR (Gold)	280 W	30°C	35°C	30°C	35°C	35°C	35°C	35°C	35°C	30°C	30°C	30°C	35°C	35°C	35°C	30°C
16 x 2.5-inch SAS + 8 x 2.5-inch NVMe	HPR (Gold)	280 W	30°C	35°C	30°C	35°C	35°C	35°C	35°C	35°C	30°C	30°C	30°C	35°C	35°C	35°C	30°C
8 x 3.5-inch SAS	HPR (Silver)	280 W	30°C	35°C	30°C	35°C	35°C	35°C	35°C	35°C	30°C	30°C	30°C	35°C	35°C	35°C	30°C

NOTE:GPU is not supported in 12 x 3.5-inch hard drive and 24 x 2.5-inch NVMe configuration systems.

NOTE:Low Profile and Full Height T4 cards are installed in order to support maximun 6 pcs T4 in x 16 slots.

NOTE:In Liquid Cooling system, maximum two DW GPUs are supported.

Table 3. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink	Processor TDP
STD HSK	< 180 W
2U HPR (Silver) HSK	>= 180 W
L-type HSK	Supports all TDP (system should be installed with GPU/FGPA/long PCIe cards)

NOTE:All GPU/FGPA cards require 1U L-type HSK and GPU shroud.

Table 4. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard
HPR (Silver)	High performance (silver grade)
HPR (Gold)	High performance (gold grade)
HSK	Heat sink
LP	Low profile
FH	Full height

Table 5. Liquid cooling: CPU thermal restrictions (non-GPU/FPGA)This table describes the CPU liquid cooling thermal restrictions for non-GPU/FPGA.
Configuration		8 x 2.5-inch NVMe	16 x 2.5-inch SAS	16 x 2.5-inch NVMe	16 x 2.5-inch SAS + 8 x 2.5-inch NVMe	24 x 2.5-inch NVMe	8 x 3.5-inch	12 x 3.5-inch
Rear storage		No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	2 x rear 2.5-inch, No rear fan
CPU TDP/cTDP	120 W	STD fan	STD fan (A4 support)	STD fan	STD fan	STD fan	STD fan (A4 support)	STD fan (A4 support)	STD fan (A3 support)
	155 W	STD fan	STD fan (A4 support)	STD fan	STD fan	STD fan	STD fan (A4 support)	STD fan (A4 support)	STD fan (A3 support)
	170 W	STD fan	STD fan (A4 support)	STD fan	STD fan	STD fan	STD fan (A4 support)	STD fan (A4 support)	STD fan (A3 support)
	180 W	STD fan	STD fan (A4 support)	STD fan	STD fan	STD fan	STD fan (A4 support)	STD fan (A4 support)	STD fan (A3 support)
	200 W	STD fan	STD fan (A4 support)	STD fan	STD fan	STD fan	STD fan (A4 support)	STD fan (A4 support)	STD fan (A3 support)
	225 W	STD fan	STD fan (A4 support)	STD fan	STD fan	STD fan	STD fan (A4 support)	STD fan (A4 support)	STD fan (A3 support)
	240 W	STD fan	STD fan (A4 support)	STD fan	STD fan	STD fan	STD fan (A4 support)	STD fan (A4 support)	STD fan (A3 support)
	280 W	STD fan	STD fan (A4 support)	STD fan	STD fan	STD fan	STD fan (A4 support)	STD fan (A4 support)	STD fan (A3 support)

Table 6. Liquid cooling: Memory thermal restrictions (non-GPU/FPGA)This table describes the memory liquid cooling thermal restrictions for non-GPU/FPGA.
Configuration		1 DPC	2 DPC	8 x 2.5-inch NVMe	16 x 2.5-inch SAS	16 x 2.5-inch NVMe	16 x 2.5-inch SAS + 8 x 2.5-inch NVMe	24 x 2.5-inch NVMe	8 x 3.5-inch	12 x 3.5-inch
Rear storage		1 DPC	2 DPC	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	2 x rear 2.5-inch, No rear fan
Memory	8 GB RDIMM 3200	2.8	2.0	STD fan	STD fan (A4 support)	STD fan	STD fan	STD fan	STD fan (A4 support)	STD fan (A4 support)	STD fan (A3 support)
	16 GB RDIMM 3200	4.3	3.0	STD fan	STD fan (A4 support)	STD fan	STD fan	STD fan	STD fan (A4 support)	STD fan (A4 support)	STD fan (A3 support)
	32 GB RDIMM 3200	6.9	4.8	STD fan	STD fan (A4 support)	STD fan	STD fan	STD fan	STD fan (A4 support)	STD fan (A4 support)	STD fan (A3 support)
	64 GB RDIMM 3200	8.3	5.8	STD fan	STD fan (A4 support)	STD fan	STD fan	STD fan	STD fan (A4 support)	STD fan (A4 support)	STD fan (A3 support)
	128 GB LRDIMM 2666	12.4	9.9	STD fan	STD fan (A3 support)	STD fan	STD fan	STD fan	STD fan (A3 support)	STD fan (A3 support)	STD fan (A3 support)

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration: Conventional Data Center only	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit NOTE: Filtering room air with a MERV8 filter, as specified in ANSI/ASHRAE Standard 127, is a recommended method for achieving the necessary environmental conditions. NOTE:Air entering the data center must have MERV11 or MERV13 filtration. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed loop environment)	Filtration is not required for cabinets that are anticipated to be opened six times or less per year. Class 8 per ISO 1466-1 filtration as defined above is required otherwise. NOTE: In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may be required.
Conductive dust: data center and non-data center environments	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: Conductive dust, which can interfere with equipment operation, can originate from various sources, including manufacturing processes and zinc whiskers that may develop on the plating of raised floor tiles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust: data center and non-data center environments	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications	Notes
Copper coupon corrosion rate	ISA-71 Class G1: <300 Å/month	Per ANSI/ISA71.04
Silver coupon corrosion rate	ISA-71 Class G1: <200 Å/month	Per ANSI/ISA71.04

Dell EMC PowerEdge R7525: технические характеристики и спецификации