Dell EMC PowerEdge R7515: характеристики и спецификации

System dimensions

Table 1. PowerEdge R7515 system dimensionsThis table provides the dimensions of the PowerEdge R7515 system:
Xa	Xb	Y	Za (with bezel)	Za (without bezel)	Zb*	Zc
482 mm (18.97 inches)	434 mm (17.08 inches)	86.8 mm (3.41 inches)	35.84 mm (1.41 inches)	22 mm (0.87 inches)	647.07 mm (25.47 inches)	681.755 mm (26.84 inches)

Chassis weight

Table 1. Chassis weightThe table below shows the maximum weight of the PowerEdge R7515.
System	Maximum weight (with all drives)
8 x 3.5-inch	23.78 kg (52.42 lb)
12 x 3.5-inch	25.68 kg (56.61 lb)
12 x 3.5-inch + 2 x 3.5-inch (rear)	27.3 kg (60.18 lb)
24 x 2.5-inch	23.72 kg (52.29 lb)

Processor specifications

Table 1. PowerEdge R7515 processor specificationsThis table provides processor specifications for the PowerEdge R7515 system:
Supported processor	Number of processors supported
AMD EPYC 7002 series processor	One
AMD EPYC 7003 series processor	One

PSU specifications

The PowerEdge R7515 system supports the following AC or DC power supply units (PSU):

Table 1. PSU specificationsThe following table lists the specifications for power supplies:
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage
1600 W AC	Platinum	6000 BTU/hr	50/60 Hz	100—240 V AC, autoranging
1100 W DC	NA	4416 BTU/hr	NA	-48 — -60 V DC
1100 W AC	Platinum	4100 BTU/hr	50/60 Hz	100—240 V AC, autoranging
1100 W HVDC	Platinum	4100 BTU/hr	50/60 Hz	100—240 V AC, autoranging
1100 W HVDC	NA	4100 BTU/hr	NA	200—380 V DC, autoranging
750 W AC	Platinum	2891 BTU/hr	50/60 Hz	100—240 V AC, autoranging
750 W HVDC	Platinum	2891 BTU/hr	50/60 Hz	100—240 V AC, autoranging
750 W HVDC	Platinum	2891 BTU/hr	NA	240 V DC
750 W AC	Titanium	2843 BTU/hr	50/60 Hz	200—240 V AC, autoranging
495 W AC	Platinum	1908 BTU/hr	50/60 Hz	100—240 V AC, autoranging

NOTE When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

NOTE Heat dissipation is calculated using the PSU wattage rating.

NOTE This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 230 V.

NOTE If a system with 1600 W AC PSU operates at low line 100-120 V AC, then the power rating per PSU is derated to 800 W.

NOTE If a system with 1100 W AC PSU or 1100 W mixed mode PSU operates at low line 100-120 V AC, and then the power rating per PSU is derated to 1050 W.

Supported operating systems

The PowerEdge R7515 supports the following operating systems:

Canonical Ubuntu Server LTS
Citrix Xen Hypervisor
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware vSAN/ESXi

For more information, see www.dell.com/ossupport.

Cooling fans specifications

The PowerEdge R7515 system supports both the Standard fan (STD fan) and High Performance fan (HPR fan) and requires all six fans to be installed.

NOTE Mixing of STD and HPR fans is not supported.

NOTE The STD and HPR fans installation depends on the system configuration. For more information about the fan support configuration or matrix, see Thermal restriction matrix.

System battery specifications

The PowerEdge R7515 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

WARNING Consumer-Grade GPU should not be installed or used in the Enterprise Server products.

The PowerEdge R7515 system supports PCI Express (PCIe) Gen3/Gen4 expansion cards. This system supports low profile, full height, and 1U/2U expansion card risers.

Table 1. Expansion card riser configurationsThis table provides information about the expansion card riser configuration for PowerEdge R7515 system.
Expansion card riser	PCIe slots on the riser	Processor connection	Height	Length	Slot width
Riser-1B (2U riser)	Slot 2	Processor 1	Full Height	Full Length	x16 (Gen 3)
Riser-1B (2U riser)	Slot 3	Processor 1	Full Height	Full Length	x16 (Gen 4)
Riser-1A (1U right riser with rear drives configuration)	Slot 2	Processor 1	Low Profile	Half Length	x16 (Gen 3)
Riser- 2 (1U left riser with rear drives configuration)	Slot 3	Processor 1	Low Profile	Half Length	x16 (Gen 4)

NOTE The expansion-card slots are not hot-swappable.

Memory specifications

The PowerEdge R7515 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications for the PowerEdge R7515 system :
DIMM type	DIMM rank	DIMM capacity	Minimum RAM	Maximum RAM
RDIMM	Single rank	8 GB	8 GB	128 GB
	Dual rank	16 GB	16 GB	256 GB
		32 GB	32 GB	512 GB
		64 GB	64 GB	1 TB
3DS LRDIMM	Octa rank	128 GB	128 GB	2 TB

NOTE The older 32 GB capacity RDIMM memory with x4 data width and 8Gb DRAM density cannot be mixed with the newer 32 GB capacity RDIMM memory with x8 data width and 16Gb DRAM density in the same AMD EPYC™ processor unit.

NOTE The older 128 GB capacity LRDIMM memory at 2666 MT/s speed cannot be mixed with the new 128 GB capacity LRDIMM memory at 3200 MT/s speed.

Table 2. Memory module socketsThe table below shows the memory module sockets for the PowerEdge R7515 system:
Memory module sockets	Speed
Sixteen 288-pin	3200 MT/s, 2933 MT/s, 2666 MT/s

Storage controller specifications

The PowerEdge R7515 system supports the following controller cards:

Table 1. PowerEdge R7515 system controller cardsThis table provides the controller cards that are supported by PowerEdge R7515 system:
Internal controllers	External controllers
PERC H740P PERC H730P PERC H330 HBA330 S150 Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs	12 Gbps SAS Ext. HBA H840 HBA355e

Drives

The PowerEdge R7515 system supports:

Up to 8 x 3.5 inch (SAS, SATA or SSD) front accessible drives in slots 0 to 7
Up to 12 x 3.5 inch (SAS, SATA or SSD) front accessible drives in slots 0 to 11
Up to 12 x 3.5 inch (SAS, SATA or SSD) front accessible drives in slots 0 to 11 + up to 2 x 3.5 inch (SAS, SATA or SSD) rear accessible drives in slots 12 to 13
Up to 24 x 2.5 inch (SAS, SATA or SSD) front accessible drives in slots 0 to 23
Up to 12 x 2.5 inch (SAS, SATA or SSD) front accessible drives in slots 0 to 11 and up to 12 x 2.5 inch NVMe drives in 12 universal slots 12 to 23
Up to 24 x 2.5 inch front accessible NVMe drives in bay 0 (slot 0 to 11) and bay 1 (slots 0 to 11)
Up to 8 x 2.5 inch (SAS, SATA or SSD) front accessible drives in Universal slots 0 to 7 (Bay 0) and up to 16 x 2.5 inch NVMe drives in bay 0 (slots 8 to 11) and bay 1 (slots 0 to 11)

NOTE The front-accessible NVMe drives currently utilize PCIe Gen3.

NOTE For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell.com/support > Browse all Products > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

Backplane:

8 x 3.5-inch SAS, SATA drives
24 x 2.5-inch SAS, SATA drives
24 x 2.5-inch NVMe drives
12 x 3.5-inch SAS, SATA drives and 2 x 3.5-inch SAS, SATA drives
12 x 2.5-inch SAS, SATA drives and 12 x 2.5-inch NVMe drives
8 x 2.5-inch SAS, SATA drives and 16 x 2.5-inch NVMe drives

Optical drives

The PowerEdge R7515 system supports the following optical drives:

Table 1. Supported optical drive typeThis table shows the supported optical drive type.
Supported drive type	Supported number of drives
Dedicated SATA DVD-ROM drive or DVD +/-RW drive	One

USB ports specifications

Table 1. PowerEdge R7515 system USB specificationsThe following table shows the USB specifications for the PowerEdge system.
Front		Rear		Internal
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	Two	USB 3.0-compliant ports	Two	Internal USB 3.0-compliant port	One
Micro USB 2.0-compliant port for iDRAC Direct	One	USB 3.0-compliant ports	Two	Internal USB 3.0-compliant port	One

NOTE The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

LOM Riser card specifications

The PowerEdge R7515 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports that are located on the back panel. The system also supports LAN on Motherboard (LOM) on an optional riser card.

You can install one LOM riser card. The supported LOM riser options are:

2 x 1 Gb Base-T
2 x 10 Gb Base-T
2 x 10 Gb SFP+
2 x 25 Gb SFP+

NOTE

You can install up to four PCIe add-on NIC cards.
For information about Linux network performance settings, see the Linux Network Tuning Guide for AMD EPYC Processor Based Servers white paper at AMD.com

Serial connector specifications

The serial connector connects a serial device to the system. The PowerEdge R7515 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA ports specifications

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge R7515 system supports two 15-pin VGA ports one each on the front and back panels.

IDSDM module

The PowerEdge R7515 system supports optional Internal Dual SD module (IDSDM) module.

The module supports two microSD cards. The supported microSD card storage capacities are mentioned below:

16 GB
32 GB
64 GB

NOTE There are two dip switches on the IDSDM for write-protection.

NOTE One IDSDM card slot is dedicated for redundancy.

NOTE Use Dell EMC branded microSD cards that are associated with the IDSDM configured systems.

Video specifications

The PowerEdge R7515 system system supports Matrox G200eR2 graphics card with 16 MB capacity.

NOTE 1920 x 1080 and 1920 x 1200 resolutions are only supported in reduced blanking mode.

Table 1. Supported front video resolution optionsThis table describes the supported front video resolution options.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32

Table 2. Supported rear video resolution optionsThis table describes the supported rear video resolution options.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

The following sections contain information about the environmental specifications of the system.

NOTE For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/poweredgemanuals

Operational climatic range category A2

Table 1. Operational climatic range category A2This table describes the Operational climatic range category A2.
Allowable continuous operations
Temperature ranges for altitude <900 meters (<2,953 feet)	10 to 35°C (50 to 95°F) with no direct sunlight on the platform
Humidity percent ranges (Non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 meters (1.8°F/984 feet) above 900 meters (2,953 feet)

Operational climatic range category A3

Table 2. Operational climatic range category A3This table describes the Operational climatic range category A3.
Allowable continuous operations
Temperature ranges for altitude <900 meters (<2,953 feet)	5 to 40°C (41 to 104°F) with no direct sunlight on the platform
Humidity percent ranges (Non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 meters (1.8°F/574 feet) above 900 meters (2,953 feet)

Thermal restriction for ASHRAE A3/Fresh air environment (UI)

Two PSUs are required in redundant mode. Single PSU failure is not supported
LRDIMM is not supported
Processor TDP equal or greater than 180 W are not supported
128 GB or greater capacity DIMMs are not supported
Non-Dell qualified peripheral cards greater than 25 W are not supported
Both SW and DW GPGPU are not supported
PCIe SSD is not supported
Rear drive configuration is not supported

Thermal restriction for ASHRAE A4/Fresh air environment (UI)

Two PSUs are required in redundant mode. Single PSU failure is not supported
LRDIMM is not supported.
Processor TDP equal or greater than 155 W are not supported.
128 GB or greater capacity DIMMs are not supported.
Both SW and DW GPGPU are not supported.
PCIe card without EOT (max 65°C inlet temperature) and cooling tier 5 and above are not supported (UI).
PCIe SSD is not supported.
BOSS and OCP are not supported (UI).
PCIe card TDP greater than 25 W is not supported.
Rear drive configuration is not supported.

Shared requirements across all categories

Table 3. Shared requirements across all categoriesThis table describes Shared requirements across all categories.
Allowable operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
Non-operational temperature limits	-40 to 65°C (-40 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

*: Per ASHRAE thermal guidelines, these are not instantaneous rates of temperature change.

Table 4. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.26 Grms at 5 Hz to 350 Hz (all operation orientations)
Storage	1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 5. Maximum shock pulse specificationsThe maximum shock specification of an operational system is 24 consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms (4 pulse on each side of the system). The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	24 executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. (4 pulse on each side of the system)
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal restriction matrix

Table 1. Label referencesThis table describes the references that are used in the following tables.
Label references
STD	Standard
HPR	High Performance
HSK	Heat sink
LP	Low Profile (Riser)
FH	Full Height (Riser)
DW	Double Wide (Xilinx FPGA accelerator)

Table 2. Thermal restriction matrix This table describes the thermal restriction for R7515.
Drive Configuration type		8 x 3.5-inch drives	12 x 3.5-inch drives	12 x 3.5-inch drives	24 x 2.5-inch drives		12 x 2.5-inch drives SAS + 12 x 2.5-inch drives NVMe		24 x 2.5-inch drives NVMe
Rear Configuration		2LP+2FH	2LP+2FH	Rear 2x3.5-inch drives SAS	2LP+2FH	2LP+1DW	2LP+2FH	2LP+1DW	2LP+2FH	2LP+1DW
Ambient temperature		Up to 35°C	Up to 35°C	Up to 35°C	Up to 35°C	Up to 30°C	Up to 35°C	Up to 30°C	Up to 35°C	Up to 30°C
TDP (W)	120	STD Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 2U HPR HSK	STD Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	155	STD Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 2U HPR HSK	STD Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	170	STD Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 2U HPR HSK	STD Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	180	STD Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 2U HPR HSK	STD Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	200	STD Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 2U HPR HSK	STD Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	225	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 2U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	240	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 2U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	280*	HPR Fan 1U HPR HSK	NA	* HPR Fan 2U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	*HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	*HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	280 W - 64C/32C	HPR Fan 1U HPR HSK	NA	*HPR Fan 2U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	*HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	*HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
Double Wide FPGA		No	No	Not supported	No	Yes	No	Yes	No	Yes

NOTE To ensure proper cooling in the system with 280 W processor, memory module blank should be installed in the memory sockets that are not populated.

NOTE *For 12 x 3.5-inch drive (Rear 2 x 3.5-inch drives SAS)/24 x 2.5-inch drive/12 x 2.5-inch drives SAS + 12 x 2.5-inch drives NVMe configuration support 280 W CPU up to 30°C ambient temperature.

Table 3. Thermal restriction matrix for T4 and A2 GPU CardThis table describes the thermal restriction for T4 GPU Card.
Drive Configuration type		8 x 3.5-inch drives	12 x 3.5-inch drives	12 x 3.5-inch drives	24 x 2.5-inch drives	12 x 2.5-inch drives SAS + 12 x 2.5-inch drives NVMe	24 x 2.5-inch drives NVMe
Rear Configuration		2LP+2FH	2LP+2FH	Rear 2x3.5-inch drives SAS	2LP+2FH	2LP+2FH	2LP+2FH
Ambient temperature		Up to 30°C	Up to 30°C	Up to 30°C	Up to 30°C	Up to 30°C	Up to 30 °C
	Slot 2	HPR Fan 1U HPR HSK	N/A	N/A	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	Slot 3	HPR Fan 1U HPR HSK	N/A	N/A	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	Slot 4	HPR Fan 1U HPR HSK	N/A	N/A	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	Slot 5	HPR Fan 1U HPR HSK	N/A	N/A	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	Slot 2/Slot 3	HPR Fan 1U HPR HSK	N/A	N/A	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	Slot 4/Slot 5	HPR Fan 1U HPR HSK	N/A	N/A	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK
	Slot 2/Slot 3 Slot 4/Slot 5	HPR Fan 1U HPR HSK	N/A	N/A	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK	HPR Fan 1U HPR HSK

NOTE The table shows ambient restriction according to T4 and A2in specific PCIe slots of R7515 PCIex4 rear end configuration. R7515 rear drive x2 + PCIe x2 does not support T4 and A2 is not considered in this table.

Table 4. Thermal restriction matrix for MI210, A16 and V100S GPU CardsThis table describes the thermal restriction for MI210, A16 and V100S GPU Cards.
Drive Configuration type		8 x 3.5-inch drives	12 x 3.5-inch drives	12 x 3.5-inch drives	24 x 2.5-inch drives	12 x 2.5-inch drives SAS + 12 x 2.5-inch drives NVMe	24 x 2.5-inch drives NVMe
Rear Configuration		2LP+2FH	2LP+2FH	Rear 2x3.5-inch drives SAS	2LP+2FH	2LP+2FH	2LP+2FH
Ambient temperature		Up to 30°C	Up to 30°C	Up to 30°C	Up to 30°C	Up to 30°C	Up to 30 °C
	Slot 2	N/A	N/A	N/A	N/A	N/A	N/A
	Slot 3	N/A	N/A	N/A	HPR Fan 1U HPR HSK	N/A	N/A
	Slot 4	N/A	N/A	N/A	N/A	N/A	N/A
	Slot 5	N/A	N/A	N/A	N/A	N/A	N/A

NOTE 8 x 3.5-inch drives chassis do not support AUX power cable, and therefore do not support A16 and V100S GPU cards.

Table 5. Processor support matrixThis table describes the processor support matrix.
TDP (W)	Fan type	Fan type (8 x 3.5-inch/24 x 2.5-inch)	HSK Type(8 x 3.5-inch/24 x 2.5/12x2.5-inchSAS+ 12 x 2.5-inchNVMe/24x2.5-inchNVMe)	HSK Type(12 x 3.5-inch)	HSK Type(12 x 3.5-inch+Rear 2 x 3.5-inch)	ASHRAE A3 support	ASHRAE A4 support
280	HPR Fan	HPR Fan	1U HPR	NA	2U HPR	No	No
240	HPR Fan	HPR Fan	1U HPR	1U HPR	2U HPR	No	No
225	HPR Fan	HPR Fan	1U HPR	1U HPR	2U HPR	No	No
200	HPR Fan	STD Fan	1U HPR	1U HPR	2U HPR	No	No
180	HPR Fan	STD Fan	1U HPR	1U HPR	2U HPR	No	No
155	HPR Fan	STD Fan	1U HPR	1U HPR	2U HPR	Yes	No
120	HPR Fan	STD Fan	1U HPR	1U HPR	2U HPR	Yes	Yes

NOTE HPR fan is required for T4 GPU, A16 GPU, V100S GPU, NVMe, and Double wide FPGA supporting.

NOTE NVMe configuration with drive install/Nvidia T4/ Double Width FPGA

NOTE Except for 8 x 3.5-inch/24 x 2.5-inch(without NVMe), all other configurations have only high-performance fan type.

NOTE 12 x 3.5-inch does not support 280 W processor.

NOTE Need DIMM blank support for Evans HDD (RJT6H, 7KT9W, PY7WD, CNXPV, WGXDC, V308G, 3JTD3, 39XRY) in 12 x 3.5-inch drive configuration.

Other thermal restrictions

Mellanox CX5 with QSFP28 is restricted to slot 4 and slot 5 in no rear drive configuration. Non-Dell qualified cables are not supported.
Mellanox CX6 with QSFP56 (Mellanox MFS1S00) is restricted to slot 4 and slot 5 in no rear drive configuration. Non-Dell qualified cables are not supported.
Solarflare XtremeScale X2522-25G adapter is restricted to slot 4 and slot 5 in no rear drive configuration.
750 GB PCIe SSD Adapter (P4800) by Intel is restricted to slot 4 and slot 5 in no rear drive configuration.
25 G LOM riser is not supported with 128 G LRDIMM or higher on 12 x 3.5-inch drives configuration.
DIMM blank is required at 12 x 3.5-inch and 12 x 3.5-inch + 2 x 3.5-inch (rear) storage configuration.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE Air entering the data center must have MERV11 or MERV13 filtration. NOTE Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHRAE Standard 127
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE This condition applies to data center and non-data center environments. NOTE Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination	Specifications
Copper Coupon Corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Dell EMC PowerEdge R7515: технические характеристики и спецификации