Dell EMC PowerEdge R750xs: характеристики и спецификации

Chassis dimensions

The image shows system dimensions. — Figure 1. Chassis dimensions

Table 1. Chassis dimensionsThis table provides the dimensions of the PowerEdgeR750xs
Drives	Xa	Xb	Y	Za	Zb	Zc
24 drives	482.0 mm (18.97 inches)	434.0 mm (17.08 inches)	86.8 mm (3.41 inches)	22.0 mm (0.86 inches)Without bezel35.84 mm (1.41 inches)With bezel	675.04 mm (26.57 inches)Ear to L bracket housing650.24 mm (25.6 inches)Ear to PSU surface	685.78 mm (26.99 inches)Ear to PSU handle without velcro strap
12 drives
16 drives
8 drives
No backplane configuration

NOTE Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R750xs system weightThe table below shows the maximum weight of the R750xs chassis
System configuration	Maximum weight (with all drives/SSDs/bezel)
24 x 2.5-inch (16 SAS/SATA + 8 NVMe)	23.84 kg (52.55 lb)
16 x 2.5-inch	21.94 kg (48.36 lb)
12 x 3.5-inch	28.76 kg (63.40 lb)
8 x 3.5-inch	24.80 kg (54.67 lb)
8 x 2.5-inch	20.44 kg (45.06 lb)
No backplane configuration	18.54 kg (40.87 lb)

Processor specifications

Table 1. PowerEdge R750xs Processor specificationsThis table provides processor specifications for the system.
Supported processor	Number of processors supported
3^rd Generation Intel Xeon Scalable processors with up to 32 cores	Up to two

PSU specifications

The PowerEdge R750xs system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specificationsThe table lists the specifications for 800 W, 1400 W power supplies.
PSU	Class	Heat dissipation (maximum) BTU/hr	Frequency Hz	Voltage	AC		DC	Current
PSU	Class	Heat dissipation (maximum) BTU/hr	Frequency Hz	Voltage	High line 200–240 V	Low line 100–120 V	DC	Current
1400 W Mixed Mode	Platinum	5406	50/60	100–240 V AC, autoranging	1400 W	1050 W	NA	12 A–8 A
1400 W Mixed Mode	NA	5406	NA	240 V DC, autoranging	NA	NA	1400 W	6.6 A
1100 W Mixed Mode	Titanium	4299	50/60	100–240 V AC, autoranging	1100 W	1050 W	NA	12 A–6.3 A
1100 W Mixed Mode	NA	4299	NA	240 V DC, autoranging	NA	NA	1100 W	5.2 A
1100 W DC	NA	4265	NA	-48–(-60) V	NA	NA	1100 W	26.1 A
800 W Mixed Mode	Platinum	3000	50/60	100–240 V AC, autoranging	800 W	800 W	NA	9.2 A-4.7 A
800 W Mixed Mode	NA	3000	NA	240 V DC, autoranging	NA	NA	800 W	3.8 A
600 W Mixed Mode	Platinum	2250	50/60	100–240 V AC, autoranging	600 W	600 W	NA	7.1 A-3.6 A
600 W Mixed Mode	NA	2250	NA	240 V DC, autoranging	NA	NA	600 W	2.9 A

NOTE This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.

NOTE Heat dissipation is calculated using the PSU wattage rating.

NOTE When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

Supported operating systems

The PowerEdge R750xs system supports the following operating systems:

Canonical Ubuntu Server LTS
Citrix Hypervisor
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi

For more information, go to www.dell.com/ossupport.

Cooling fan specifications

The PowerEdgeR750xs system supports up to sixStandard fans, High performance Silver Grade fans, or High performance Gold Grade fans .

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Also known as	Label color	Label image
Standard fan	STD	STD	No label
High-performance fan (Silver grade) fan	HPR SLVR	HPR	Silver	NOTE New cooling fans come with the High-Performance Silver Grade label. While the older cooling fans have the High-Performance label. Figure 1. High performance fan Figure 2. High performance (Silver grade) fan
High-performance fan (Gold grade) fan	HPR GOLD	VHPR - Very High Performance	Gold	NOTE New cooling fans come with the High-Performance Gold Grade label. While the older cooling fans have the High-Performance label. Figure 3. Very high performance fan Figure 4. High performance (Gold grade) fan

NOTE Mixing of STD, HPR SLVR, or HPR GOLD fan is not supported.

NOTE The STD, HPR SLVR, or HPR GOLD fan installation depends on the system configuration. For more information about the supported fan configuration or matrix, see Thermal restriction matrix.

System battery specifications

The PowerEdge R750xs system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge R750xs system supports up to six PCI express (PCIe) Gen 4 expansion cards.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Expansion card riser	Processor connection	Height	Length	Slot width
Slot 1	N/A	Processor 1	Low Profile	Half Length	x16
Slot 2	N/A	PCH	Low Profile	Half Length	x8 (x4-Link)
Slot 3	Riser 1A	Processor 1	Low Profile	Half Length	x16
Slot 4	Riser 1A	Processor 2	Low Profile	Half Length	x16
Slot 3	Riser 1B (SNAPI)	Processor 1 and 2	Low Profile	Half Length	x16
Slot 4	Riser 1B (SNAPI)	Processor 2	Low Profile	Half Length	x16 (x8-Link)
Slot 5	N/A	Processor 2	Low Profile	Half Length	x16
Slot 6	N/A	Processor 2	Low Profile	Half Length	x16

NOTE Only one cable riser can be installed at a time for any given configuration.

Memory specifications

The PowerEdge R750xs system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processors
DIMM type	DIMM rank	DIMM capacity	Minimum DIMM capacity	Maximum DIMM capacity	Minimum DIMM capacity	Maximum DIMM capacity
RDIMM	Single rank	8 GB	8 GB	64 GB	16 GB	128 GB
	Dual rank	16 GB	16 GB	128 GB	32 GB	256 GB
		32 GB	32 GB	256 GB	64 GB	512 GB
		64 GB	64 GB	512 GB	128 GB	1 TB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
16, 288-pin	3200 MT/s, 2933 MT/s, 2666 MT/s

Storage controller specifications

The PowerEdge R750xs system supports the following controller cards:

Table 1. Storage controller cards for the systemThis table provides the controller cards that are supported on the system:
Internal controllers	External controllers
PERC H755 PERC H755N PERC H745 PERC H355 PERC H345 HBA355i S150 Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2 x M.2 SSDs	HBA355e PERC H840

NOTE The software RAID controller S150 is supported on either SATA drives with chipset SATA only backplane, or NVMe drives in universal slots with processor direct PCIe cable connected backplane.

Drives

The PowerEdge R750xs system supports:

24 x 2.5-inch (16 SAS/SATA + 8 NVMe) drives
16 x 2.5-inch SAS or SATA drives
12 x 3.5-inch SAS or SATA drives
8 x 2.5-inch SAS or SATA drives
8 x 2.5-inch NVMe drives
8 x 3.5-inch SAS or SATA drives

NOTE For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at https://www.dell.com/support Browse all Products > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

Table 1. PowerEdge R750xs USB specifications The following table shows the USB specifications :
Front		Rear		Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 2.0-compliant port	One	Internal USB 3.0-compliant port	One
Micro-USB 2.0 iDRAC Direct	One	USB 3.0-compliant port	One	Internal USB 3.0-compliant port	One

NOTE The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NOTE The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.

NOTE The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

Serial connector specifications

The PowerEdge R750xs system supports one optional card type serial connector on rear of the system, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The process to install the optional serial connector card is similar to an expansion card filler bracket.

NIC port specifications

The PowerEdge R750xs system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
LOM	1 GB x 2
OCP card (OCP 3.0)	1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4, 50 GbE x 2, 100 GbE x 2

VGA ports specifications

The PowerEdge R750xs system supports two DB-15 VGA ports, one each on the front and rear panels of the system.

Video specifications

The Dell EMC PowerEdge R750xs system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options for the systemThis table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation > Regulatory Information on www.dell.com/support/home.

Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Operational climatic range category A3 This table describes the operational climatic range for category A3.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Operational climatic range category A4 This table describes the operational climatic range for category A4.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape NOTE * - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-104 to 149°F)
Non-operational humidity limits (Non-Condensing at all times)	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

Table 5. Maximum vibration specifications
Maximum vibration	Specifications
Operating	0.21Grms at 5Hz to 500Hz for 10min (all x, y, and z axes)
Storage	1.88Grms at 10Hz to 500Hz for 15min (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6G for up to 11ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination	Specifications
Copper Coupon Corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal restriction matrix

Table 1. Thermal restriction matrixThe table describes thermal restriction matrix for the PowerEdge R750xs system.
Configuration		8 x 2.5-inch NVMe	16 x 2.5-inch SAS/ SATA + 8 x 2.5-inch NVMe	12 x 3.5-inch SAS/ SATA	Ambient temperature
Rear storage		No Rear Drives	No Rear Drives	No Rear Drives	Ambient temperature
CPU TDP/cTDP	105 W	5 x HPR fan 2U STD HSK	5 x HPR silver fan 2U STD HSK	5 x HPR silver fan 2U HPR HSK	35°C
	120 W	5 x HPR fan 2U STD HSK	5 x HPR silver fan 2U STD HSK	5 x HPR silver fan 2U HPR HSK	35°C
	135 W	5 x HPR fan 2U STD HSK	5 x HPR silver fan 2U STD HSK	5 x HPR silver fan 2U HPR HSK	35°C
	150 W	5 x HPR fan 2U STD HSK	5 x HPR silver fan 2U STD HSK	5 x HPR silver fan 2U HPR HSK	35°C
	165 W	5 x HPR fan 2U HPR HSK	5 x HPR silver fan 2U HPR HSK	5 x HPR silver fan 2U HPR HSK	35°C
	185 W	5 x HPR fan 2U HPR HSK	5 x HPR silver fan 2U HPR HSK	5 x HPR silver fan 2U HPR HSK	35°C
	205 W	5 x HPR fan 2U HPR HSK	5 x HPR silver fan 2U HPR HSK	5 x HPR silver fan 2U HPR HSK	35°C
	220 W	5 x HPR fan 2U HPR HSK	5 x HPR silver fan 2U HPR HSK	5 x HPR silver fan 2U HPR HSK	35°C

NOTE Fan blank is required to be installed in Fan 1 slot for five standard fan, and five high performance fan configurations. One high-performance fan (Gold Grade) is required to be installed in Fan 1 slot when rear drives are installed.

NOTE GPU is not supported in any of the configurations.

NOTE OCP shroud is required if riser module is not installed.

NOTE Processor blank is required for one processor configuration. DIMM blank is required in the CPU2 location irrespective of the air shroud.

Table 2. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink	Processor TDP
2U STD HSK	< 165 W
2U HPR HSK	>= 165 W

Table 3. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard
HPR (Silver)	High performance (silver grade)
HPR (Gold)	High performance (gold grade)
HSK	Heat sink
LP	Low profile
FH	Full height

Dell EMC PowerEdge R750xs: технические характеристики и спецификации

Chassis dimensions

System weight

Processor specifications

PSU specifications

Supported operating systems

Cooling fan specifications

Cooling fan specifications

System battery specifications

Expansion card riser specifications

Memory specifications

Storage controller specifications

Drives

USB ports specifications

Serial connector specifications

NIC port specifications

VGA ports specifications

Video specifications

Environmental specifications

Particulate and gaseous contamination specifications

Thermal restriction matrix