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Dell EMC PowerEdge R750xa: технические характеристики и спецификации
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Dell EMC PowerEdge R750xa: технические характеристики и спецификации

Chassis dimensions

Figure 1. Chassis dimensions
This image shows chassis dimension for the PowerEge R7525 system.
Table 1. Chassis dimension for the systemThis table provides the dimensions of the system:
Drives Xa Xb Y Za Zb Zc
6 or 8 drives 482.0 mm (18.97 inches)434.0 mm (17.0 inches)86.8 mm (3.41 inches)35.84 mm (1.41 inches)with bezel22.0 mm (0.86 inches)without bezel837.2 mm (32.96 inches)Ear to rear wall872.8 mm (34.36 inches)Ear to PSU handle
NOTE Zb is the nominal rear wall external surface where the system board I/O connectors reside.

Chassis weight

Table 1. Chassis weightThe table below shows the maximum weight of the.
System configuration Maximum weight (with all drives/SSDs)
6 x 2.5-inch + 4 x DW-FL cards (front) + 2 x LP PCIe cards (rear) 29 kg (63.94 lb)
8 x 2.5-inch + 4 x DW-FL cards (front) + 4 x PCIe cards (rear) 34.9 kg (76.94 lb)

Processor specifications

Table 1. Dell EMC PowerEdge R750xa processor specifications This table provides processor specifications for the PowerEdge R750xa system.
Supported processor Number of processors supported
3rd Generation Intel Xeon Scalable processors with up to 40 cores two

PSU specifications

The system supports up to two AC or DC power supply units (PSUs).

WARNING Instructions for the qualified electricians only:

System using -(48-60) V DC or 240 V DC power supplies are intended for restricted access locations in accordance with Articles 110-5, 110-6, 110-11, 110-14, and 110-17 of the National Electrical Code, American National Standards Institute (ANSI)/National Fire Protection Association (NFPA) 70.

240 V DC power supplies shall be connected to the 240 V DC outlet from certified power distribution units if applicable in country or region of use.

Power supply cords/jumper cords and the associated plugs/inlets/connectors shall have appropriate electrical ratings referencing the rating label on the system when used for connection.

Table 1. PSU specifications for the systemThis table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) Frequency Voltage Peak power N/A N/A Peak power N/A Current
High line/-72 VDC High line/-72 VDC High line 240 VDC Low line/-40 VDC Low line/-40 VDC
1400 W AC Platinum 5459 BTU/hr 50/60 Hz 100 - 240 V 2380 W 1400 W 1400 W 1785 W 1050 W 12 - 8 A
1400 W Mixed Mode HVDC (for China only) N/A 5459 BTU/hr N/A 240 V 2380 W 1400 W 1400 W 1785 W 1050 W 6.6 A
2400 W AC Platinum 9213 BTU/hr 50/60 Hz 100 - 240 V 4080 W 2400 W 2400 W 2380 W 1400 W 16 - 13.5 A
2400 W Mixed Mode HVDC (for China only) N/A 9213 BTU/hr N/A 240 V 2380 W 1400 W 1400 W 1785 W 1050 W 11.2 A
NOTE When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

Supported operating systems

The PowerEdge R750xa system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Citrix Hypervisor
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi

For more information, go to www.dell.com/ossupport.

Cooling fan specifications

Cooling options

The Dell EMCPowerEdgeR750xa requires various cooling components based on processor TDP, storage modules, graphical processing unit (GPU), persistent memory to maintain optimum thermal performance.

The Dell EMCPowerEdgeR750xa offers two types of cooling options:

  • Air cooling
  • Processor liquid cooling (optional)

Cooling fan specifications

The Dell EMCPowerEdgeR750xa system supports up to six cooling fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
System fan Fan 60 x 76 mm system fan NA
Figure 1. 60 x 76 mm system fan

System battery specifications

The PowerEdge R750xa system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The Dell EMC PowerEdge R750xa system supports up to four full height, or eight low profile riser slots with PCI express (PCIe) Gen 4 expansion cards.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the PowerEdge R750xa system.
PCIe slot With GPGPU shroud GPU riser module right with R1 paddle card R2a (Riser 2) R3b (Riser 3) GPU riser module left with R4 paddle card
Slot 3 Low profile- Half length - x16 - -
Slot 4 Full height- Half length - - x8 -
Slot 5 Full height- Half length - - x8 -
Slot 6 Low profile- Half length - x16 - -
Slot 31 Single width/Dual width- Full height-Full length(with Dell custom bracket) - - - x16
Slot 32 Single width/Dual width- Full height-Full length(with Dell custom bracket) - - - x16
Slot 33 Single width/Dual width- Full height-Full length(with Dell custom bracket) x16 - - -
Slot 34 Single width/Dual width- Full height-Full length(with Dell custom bracket) x16 - - -

Memory specifications

The system Dell EMC PowerEdge R750xa supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processor
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
RDIMM Single rank 8 GB 8 GB 128 GB 16 GB 256 GB
Dual rank 16 GB 16 GB 256 GB 32 GB 512 GB
32 GB 32 GB 512 GB 64 GB 1 TB
64 GB 64 GB 1 TB 128 GB 2 TB
LRDIMM Quad rank 128 GB 128 GB 2 TB 256 GB 4 TB
Intel Persistent Memory 200 series (BPS) Dual rank 128 GB 128 GB 1 TB 256 GB 2 TB
256 GB 256 GB 2 TB 512 GB 4 TB
512 GB 512 GB 4 TB 1 TB 8 TB
NOTE 8 GB RDIMM is not supported with Intel Persistent Memory 200 series (BPS) .
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
32, 288-pin 3200 MT/s

Storage controller specifications

The Dell EMC PowerEdge R750xa system supports the following controller cards:
Table 1. Storage controller cards for the systemThis table provides the controller cards that are supported on the PowerEdge R750xa system:
Internal controllers External controllers
  • S150
  • PERC H745
  • PERC H755
  • PERC H755N
  • PERC H345
  • PERC H355
  • HBA355I
  • Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2 x M.2 SSDs 240 GB or 480 GB
  • Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs 240 GB or 480 GB
  • PERC H840
  • HBA355E
NOTE The software RAID S150 is supported on either SATA drives with chipset SATA only backplane or NVMe drives in universal slots with processor direct PCIe cable connected backplane.

Drives

The Dell EMC PowerEdge R750xa system supports :
  • 8 x 2.5-inch hot-swappable SAS, SATA drives, or NVMe drives.
  • 6 x 2.5-inch hot-swappable NVMe drives.
NOTE For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at https://www.dell.com/support Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

Table 1. USB specificationsPowerEdge R750xa system USB specifications
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 2.0-compliant port One Internal USB 3.0-compliant port One
Micro-USB 2.0, iDRAC Direct One USB 3.0-compliant ports One
NOTE The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
NOTE The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.
NOTE The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

NIC port specifications

The Dell EMC PowerEdge R750xa system supports up to two Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional OCP cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the Dell EMC PowerEdge R750xa system.
Feature Specifications
LOM card 1 GbE x 2
OCP card (OCP 3.0) 1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4

Serial connector specifications

The Dell EMC PowerEdge R750xa system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

VGA ports specifications

The Dell EMC PowerEdge R750xa system supports One DB-15 VGA port one each on the front and back (optional for liquid cooling) panels.

IDSDM (optional)

The Dell EMC PowerEdge R750xa system supports Internal Dual SD module (IDSDM).

The IDSDM supports two SD cards and is available in the following configurations:

Table 1. Supported SD card storage capacityThis table lists the storage capacity of the supported SD cards
IDSDM card
  • 16 GB
  • 32 GB
  • 64 GB
NOTE One IDSDM card slot is dedicated for redundancy.
NOTE Use Dell EMC branded SD cards that are associated with the IDSDM configured systems.

Video specifications

The Dell EMC PowerEdge R750xa system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported resolution options for the systemThis table describes the supported video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/support/home.
Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <900 m (<2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Operational climatic range category A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes < 900 m (< 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Operational climatic range category A4 This table describes the operational climatic range for category A4.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes < 900 m (< 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE * - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-104 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.21 Grms at 5 Hz to 500 Hz for 10 minutes (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HPR High performance
HSK Heat sink
LP Low profile
FH Full height
DW Double Wide (Xilinx FPGA accelerator)
BPS Intel Persistent Memory 200 series (BPS)
Table 2. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Processor TDP
2U HPR HSK For all processor TDP
Table 3. Thermal restriction matrix
Configuration Minimum Typical Maximum Ambient temperature
Front GPU TDP 70 W SW x 4 250 W DW x 4 300 W DW x 4
Front drives x1 SAS/SATA x8 SAS/SATA x8 NVMe
CPU TDP/cTDP 105 W System Fan (60 x 76 mm) with 2U HPR HSK 35°C
120 W
135 W
150 W
165 W
185 W
205 W
220 W
230 W
240 W
250 W
265 W
270 W
NOTE Six System fans (60 x 76 mm) are required for all the configurations.
NOTE T4 GPU card is supported on riser 2 (R2a slot 3/6) with maximum power loading.
NOTE Xeon(R) 8368Q supports only processor liquid cooling.
NOTE Only ASHRAE A2 category ambient temperature is supported.
NOTE For all memory configuration only System fan (60 x 76 mm) with 2U HPR HSK is used.
NOTE BPS DIMMs supported only at 30°C ambient temperature.
NOTE 128 GB LRDIMM, 64 GB RDIMM, 32 GB RDIMM, 16 GB RDIMM and 8 GB RDIMM supports at 35°C ambient temperature.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specificationsParticulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsGaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013.
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013.