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Dell EMC PowerEdge R7425: технические характеристики и спецификации
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Dell EMC PowerEdge R7425: технические характеристики и спецификации

System dimensions

This section describes the physical dimensions of the system.

Figure 1. System dimensions of PowerEdge R7425 system
This image shows system dimensions of PowerEdge R7425 system.
Table 1. DimensionsThis table gives details of the dimensions of the R7425 system:
SystemXaXbYZa (with bezel)Za (without bezel)Zb Zc
PowerEdge R7425482.0 mm

(18.98 inches)

434.0 mm

(17.09 inches)

86.8 mm (3.42 inches)35.84 mm

(1.41 inches)

22.0 mm

(0.87 inches)

677.3 mm (26.66 inches)715.63 mm (28.17 inches)

Chassis weight

Table 1. Chassis weight

The table below shows the maximum weight of the R7425 system:
System Maximum weight (with all drives/SSDs)
2.5 inch 28.4 kg (62.6 lb)
3.5 inch 33.4 kg (73.6 lb)

Processor specifications

The PowerEdge R7425 system supports up to two AMD EPYC™ processors.

Supported operating systems

The PowerEdge R7425 supports the following operating systems:

  • Microsoft Windows Server® with Hyper-V
  • Red Hat® Enterprise Linux
  • SUSE® Linux Enterprise Server3
Virtualization options:
  • VMware® ESXi 6.7

NOTE: : For more information about the specific versions and additions, go to https://www.dell.com/support/home/Drivers/SupportedOS/poweredge-r7425.

PSU specifications

The PowerEdge R7425 system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications

The table below are the specifications for 495 W, 750 W, 1100 W, 1600 W, 2000 W and 2400 W power supplies:

PSU Class Heat dissipation (maximum) Frequency Voltage High line 200v240 V Low line 100– 140 V DC Current
495 W AC Platinum 1908 BTU/hr 50/60 Hz 100–240 V AC, autoranging 495 W 495 W N/A 6.5 A–3 A
750 W AC Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC, autoranging 750 W 750 W N/A 10 A–5 A
750 W AC Titanium 2843 BTU/hr 50/60 Hz 200–240 V AC, autoranging 750 W N/A N/A 5 A
750 W Mixed Mode HVDC AC (for China only) Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC, autoranging 750 W 750 W N/A 10 A–5 A
750 W Mixed Mode HVDC DC(for China only) Platinum 2891 BTU/hr N/A 240 V DC, autoranging N/A N/A 750 W 4.5 A
750 W Mixed Mode AC Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC 750 W 750 W N/A 10 A-5 A
750 W Mixed Mode DC (for China only) Platinum 2891 BTU/hr N/A 240 V DC 750 W N/A 750 W 5 A
1100 W AC Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC, autoranging 1100 W 1050 W N/A 12 A–6.5 A
1100 W DC N/A 4416 BTU/hr N/A –(48–60) V DC, autoranging N/A N/A 1100 W 32 A
1100 W Mixed Mode HVDC (for China and Japan only) Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC, autoranging 1100 W 1050 W N/A 12 A–6.5 A
N/A 4100 BTU/hr N/A 200–380 V DC, autoranging N/A N/A 1100 W 6.4 A–3.2 A
1600 W AC Platinum 6000 BTU/hr 50/60 Hz 100–240 V AC, autoranging 1600 W 800 W N/A 10 A
2000 W AC Platinum 7500 BTU/hr 50/60 Hz 100–240 V AC, autoranging 2000 W 1000 W N/A 11.5 A
2400 W AC Platinum 9000 BTU/hr 50/60 Hz 100–240 V AC, autoranging 2400 W 1400 W N/A 16 A

NOTE: : Heat dissipation is calculated using the PSU wattage rating.

NOTE: : This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 240 V.

NOTE: : PSUs rated for 1100 W AC or 1100 W Mixed Mode HVDC and higher require high-line voltage (200–240 V AC) to supply their rated capacity.

System battery specifications

The PowerEdge R7425 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge R7425 system supports up to eight PCI express (PCIe) generation 3 expansion cards that can be installed on the system board using expansion card risers. The following table provides detailed information about the expansion card riser specifications:

Table 1. Expansion card riser specificationsThis table describes the expansion card riser specifications.
PCIe slot Riser Processor connection Height Length Slot width
1 1A Processor 1 Full height Full length x16
1D Processor 1 Full height Full length x16
1E Processor 1 Full height Full length x16
2 1D Processor 1 Full height Full length x8
1E Processor 1 Full height Full length x16
3 1A Processor 1 Full height Full length x16
1D Processor 1 Full height Full length x8
4 2D Processor 1 Full height Full length x16
2A Processor 2 Full height Full length x16
2E Processor 2 Full height Full length x16
5 2D Processor 2 Full height Full length x16
6 2D Processor 2 Low profile Half length x8
2A Processor 2 Low profile Half length x8
2C Processor 2 Low profile Half length x16
2E Processor 2 Low profile Half length x8
7 3A Processor 2 Full height Full length x8
3B Processor 2 Full height Full length x16
8 3A Processor 2 Full height Full length x16
3B Processor 2 Full height Full length x16

Memory specifications

The PowerEdge R7425 system supports up to thirty two 288-pins RDIMMs, and LRDIMMs with speeds of 2666 MT/s, 2400 MT/s, 2133 MT/s, and 1866 MT/s with support for memory optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications for the R7425 system:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
LRDIMMQuad rank64GB64GB1TB128GB2TB
RDIMM Single rank 8GB 8GB 128GB 16GB 256GB
RDIMM Dual rank 16GB 16GB 256GB 32GB 512GB
RDIMM Dual rank 32GB 32GB 512GB 64GB 1024GB

NOTE: : For optimal performance, it is recommended to populate one DIMM per channel with DDR4, 2666 MT/s memory modules on the first slot of each memory channel. The first slot of each channel can be identified as the DIMM slots with white latches. For example, 64 GB system memory capacity can be divided into 8 x 8 GB DIMM slots.

Storage controller specifications

The PowerEdge R7425 system supports:
  • Internal storage controller cards: PowerEdge RAID Controller (PERC) H330+, PERC H730+, PERC H740P, HBA330, S140, and Boot Optimized Server Storage (BOSS-S1).
  • External storage controller cards: PERC H840 and 12Gbps SAS HBA.

Drives

The PowerEdge R7425 system supports SAS, SATA, Nearline SAS hard drives/SSDs, or NVMe drives.

Table 1. Supported drive options for the PowerEdge R7425 system

This table lists out the supported drive and SSD options for the PowerEdge R7425 system:

ConfigurationDescription
8 drives system
  • Up to eight 3.5 inch or 2.5 inch (SAS, SATA or Nearline SAS) front accessible drives in slots 0 through 7
12 drives system
  • Up to 12 3.5 inch (SAS, SATA or Nearline SAS) front accessible drives in slots 0 to 11
18 drives system
  • Up to 12 3.5 inch (SAS, SATA or Nearline SAS) front accessible drives in slots 0 to 11
  • up to four 3.5 inch (SAS, SATA or Nearline SAS) mid drives in slots 14 to 17
  • up to two 3.5 inch (SAS, SATA or Nearline SAS) rear accessible drives in slots 12 to 13
24 drives system
  • Up to 24 2.5 inch (SAS, SATA or Nearline SAS) front accessible drives in slots 0 to 23
24 drives system
  • Up to 16 2.5 inch (SAS, SATA or Nearline SAS) front accessible drives in slots 0 to 15
  • Up to 12 2.5 inch NVMe drives in 8 universal slots 16 ro 23
24 drives system
  • Up to 24 2.5 inch NVMe drives in bay 1 (slots 0 to 11) and bay 2 (slots 0 to 11)
  • Up to 8 2.5 inch (SAS, SATA or Nearline SAS) in 8 universal slots (bay 1 slot 0 to 7) and 16 2.5 inch NVME drives in bay 1 (slots 8 to 11) and bay 2 (slot 0 to 11)
32 drives system
  • Up to 24 2.5 inch (SAS, SATA or Nearline SAS) front accessible drives in slots 0 to 23
  • up to four 3.5 inch (SAS, SATA or Nearline SAS) mid drives in slots 28 to 31
  • up to four 2.5 inch (SAS, SATA or Nearline SAS) rear accessible drives in slots 24 to 27

NOTE: : Universal slots are slots that support SAS, SATA hard drives/SSDs, or NVMe drives in the same slot.

NOTE: : Hot swap for the NVMe drives is supported for your system. For more information on correct usage and technical specifications, see the Dell PowerEdge Express Flash NVMe PCIe SSD 2.5 inch Small Form Factor User's Guide at Dell.com/support/manuals > All Products > Server, Storage, & Networking > Dell Adapters page.

Optical drive

The PowerEdge R7425 system supports one optional slim SATA DVD-ROM drive or DVD +/-RW drive.

USB ports

The PowerEdge R7425 system supports:
  • Two USB 2.0-compliant ports on the front of the system
  • One internal USB 3.0-compliant port
  • One optional USB 3.0-compliant port on the front of the system
  • One micro USB 2.0-compliant port in the front of the system for iDRAC Direct

    NOTE: : The micro USB 2.0 compliant port on the front of the system can only be used as an iDRAC Direct or a management port.

  • Two USB 3.0-compliant ports on the back of the system

NIC ports

The PowerEdge R7425 system supports up to four Network Interface Controller (NIC) ports that are integrated on the network daughter card (NDC), and are available in the following configurations:
  • Four RJ-45 ports that support 10, 100 and 1000 Mbps
  • Four RJ-45 ports that support 100 M, 1 G and 10 Gbps
  • Four RJ-45 ports, where two ports support maximum of 10 G and the other two ports maximum of 1 G
  • Two RJ-45 ports that support up to 1 Gbps and 2 SFP+ ports that support up to 10 Gbps
  • Four SFP+ ports that support up to 10 Gbps
  • Two SFP28 ports that support up to 25 Gbps

NOTE: : You can install up to eight PCIe add-on NIC cards.

NOTE: : For information about Linux network settings, see the Linux® Network Tuning Guide for AMD EPYC™ Processor Based Servers AMD tuning guide.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge R7425 system supports two 15-pin VGA ports on the front and back panels.

Serial connector

The PowerEdge R7425 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

IDSDM or vFlash module

The PowerEdge R7425 system supports optional Internal Dual SD module (IDSDM) or vFlash module. In 14th generation of PowerEdge servers, IDSDM or vFlash module are combined into a single card module, and are available in these configurations:
  • vFlash or
  • vFlash and IDSDM
The IDSDM or vFlash module sits in the back of the system, in a Dell-proprietary slot. IDSDM or vFlash module supports three micro SD cards (two cards for IDSDM and one card for vFlash). Micro SD cards capacity for IDSDM are 16, 32, 64 GB while for vFlash the microSD card capacity is 16 GB.

NOTE: : There are two dip switches on the IDSDM or vFlash module for write-protection.

NOTE: : One IDSDM card slot is dedicated for redundancy.

NOTE: : It is recommended to use Dell branded MicroSD cards associated with the IDSDM or vFlash configured systems.

Video specifications

The PowerEdge R7425 system supports integrated Matrox G200eW3 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution optionsThis table describes the supported video resolution options:
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

NOTE: : 1920 x 1080 and 1920 x 1200 resolutions are only supported in reduced blanking mode.

Environmental specifications

NOTE: : For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on support.dell.com.

Table 1. Temperature specifications

The table below shows the optimal working temperature specifications:
Temperature Specifications
Storage –40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Maximum temperature gradient (operating and storage) 20°C/h (68°F/h)
Table 2. Relative humidity specifications

The table below shows the relative humidity specification during operations and storage:
Relative humidity Specifications
Storage 5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating 10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.
Table 3. Maximum vibration specifications

The table below shows the maximum vibration specifications during operations and storage:
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all three axes).
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Table 4. Maximum shock specifications

The table below shows the maximum shock specifications during operations and storage:

Maximum shock Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Table 5. Maximum altitude specifications

The table below shows the maximum altitude specifications during operations and storage.
Maximum altitude Specifications
Operating

3048 m (10,000 ft)
Storage 12,000 m (39,370 ft)
Table 6. Operating temperature de-rating specifications

The table below shows the operating temperature de-rating specifications:
Operating temperature de-rating Specifications
Up to 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
35°C to 40°C (95°F to 104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
40°C to 45°C (104°F to 113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).

Standard operating temperature

Table 1. Standard operating temperature specifications

The standard operating temperature for altitude less than 950 m or 3117 ft ranges 10°C–35°C with no direct sunlight on the equipment.

NOTE: : The 2.5-inch hard drive chassis supports a maximum of 145 W processors.
Standard operating temperature Specifications
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.

Expanded operating temperature

Table 1. Expanded operating temperature specificationsThis table describes the expanded operating temperature specifications.
Expanded operating temperature Specifications
Continuous operation 5°C to 40°C at 5% to 85% RH with 29°C dew point.

NOTE: : Outside the standard operating temperature (10°C to 35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C.

For temperatures between 35°C to 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours –5°C to 45°C at 5% to 90% RH with 29°C dew point.

NOTE: : Outside the standard operating temperature (10°C to 35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours.

For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE: : When operating in the expanded temperature range, system performance may be impacted.

NOTE: : When operating in the expanded temperature range, ambient temperature warnings may be reported in the System Event Log.

Expanded operating temperature restrictions

  • Do not perform a cold startup below 5°C.
  • The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
  • 180 W/200 W CPUs are not supported.
  • Redundant power supply unit is required.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • PCIe SSD is not supported.
  • Mid drive tray is not supported.
  • Rear storage devices or drives are not supported.
  • GPU is not supported

Thermal restrictions

Following table lists the configuration required for efficient cooling.

Table 1. Thermal restrictions matrix tableThis tables describes thermal restrictions for the system.
Config number Storage moduleMiddle/rear configurationCPU countThermal solution (heat sink)Shroud and blank
180W/200W CPU155W/170W and 120W CPUFanShroudDIMM blankCPU blankFan blank
1 3.5" x 8 PCIe x 81 2U HSK, 2JYG2 1U STD HSK, GDYH1 STD x4, 4VKDD Standard No Yes Yes
2 2U HSK, 2JYG2 1U STD HSK, GDYH1 STD x6, 4V1WX Standard No No No
GPGPU x 32 1U HPR HSK, 4CFPC 1U STD HSK, GDYH1 HPR X6, 15G45GPGPU No No No
2a 2.5" x 24 PCIe x 82 2U HSK, 2JYG2 1U STD HSK, GDYH1 STD x6, 4V1WXStandardNoNoNo
GPGPU x 32 1U HPR HSK, 4CFPC 1U STD HSK, GDYH1 HPR X6, 15G45GPGPUNoNoNo
2b 2.5"x16 + NVMe x 8 PCIe x 72 2U HSK, 2JYG2 1U STD HSK, GDYH1 STD x6, 4V1WX StandardNoNoNo
GPGPU x 32 1U HPR HSK, 4CFPC 1U STD HSK, GDYH1 HPR X6, 15G45 GPGPUNoNoNo
2d 2.5" x 32 Middle 2.5" x 4 + Rear 2.5" x 42 1U HPR HSK, 4CFPC 1U STD HSK, GDYH1HPR X6, 15G45No Yes, x30 5M8WD*NoNo
3a 3.5" x 12 PCIe x 82 2U HSK, 2JYG21U STD HSK, GDYH1 STD x6, 4V1WXStandardNoNoNo
3b 3.5" x 18 Middle 3.5" x 4 + Rear 3.5" x 22 1U HPR HSK, 4CFPC 1U STD HSK, GDYH1 HPR X6, 15G45 No Yes, x30 5M8WD* No No
4 NVMe x 24 PCIe x 72 2U HSK, 2JYG2 1U STD HSK, GDYH1 STD x6, 4V1WXStandardNoNoNo
4 GPGPU x 32 1U HPR HSK, 4CFPC 1U STD HSK, GDYH1 HPR X6, 15G45GPGPUNoNoNo

Other thermal restrictions

The list below are other thermal restrictions:

  1. Mellanox CX4 and CX5 only support up to 35°C ambient with limited slots 1, 7, and 8

Ambient temperature limitations

The following table lists configurations that require ambient temperature less than 35°C.

NOTE: : The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess CPU throttling, which may impact system performance.

Table 1. Configuration based ambient temperature restrictionsThe following table lists configurations that require ambient temperature less than 35°C.
Storage configuration Chassis or hardware configuration CPU Thermal Design Power (TDP) CPU heat sink Fan type Ambient restriction

12 x 3.5 inch

 Mid (SAS) and rear drive 200 W/180 W 1U high performance High performance 30°C

12 x 3.5 inch

 Mid (SAS) and rear drive 120-170 W 1U standard High performance 35°C

24 x 2.5 inch

 Mid (SAS) and rear drive All

1U high performance for 180/200W

1U standard for 120-170W

 High performance 35°C

24 x 2.5 inch

 All PCIe cards 200 W/180 W 2U Standard 35°C

12 x 3.5 inch

 All PCIe cards 200 W/180 W 2U Standard 35°C

8 x 3.5 inch

 All PCIe cards 200 W/180 W 2U Standard 35°C

24 NVMe

 All PCIe cards 200 W/180 W 2U Standard 35°C

16 x 2.5 inch SAS + 8 NVMe + 24 NVMe

 All PCIe cards 120-170 W 1U standard Standard 35°C

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications

Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have the MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.

NOTE: : The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.

NOTE: : Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.

NOTE: : This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.

NOTE: : This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specifications

The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013.
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013.

NOTE: : Maximum corrosive contaminant levels measured at ≤50% relative humidity.