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Dell EMC PowerEdge R740xd2: технические характеристики и спецификации
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Dell EMC PowerEdge R740xd2: технические характеристики и спецификации

Chassis dimensions

Figure 1. Chassis dimensions
This image shows dimensions of the PowerEdge R740xd2 system
Table 1. Dell EMCPowerEdgeR740xd2 chassis dimensionsThis table provides the dimensions of the Dell EMCPowerEdgeR740xd2 chassis :
XaXbYZaZb*Zc
482.0 mm

(18.9 inches)

448.0 mm

(17.63 inches)

86.8 mm

(3.41 inches)

With bezel: 35.93 mm (1.41 inches)

Without bezel: 22.0 mm (0.866 inches)

810.264 mm

(31.9 inches)

844.826mm

(33.260 inches)

NOTE* - Zb refers to the nominal rear wall external surface, where the system board I/O connectors are located.

System weight

Table 1. Dell EMC PowerEdge R740xd2 system weightSystem weight of Dell EMC PowerEdge R740xd2 system is 40 kg (88.2 lb)
System configuration Maximum weight (with all drives/SSDs)
24+2 x 3.5-inch drives 40 kg (88.2 lb)

Processor specifications

Table 1. Dell EMC PowerEdge R740xd2 processor specificationsThis table provides processor specifications for the Dell EMC PowerEdge R740xd2 system:
Supported processor Number of supported processors
2nd generation Intel Xeon Scalable Processor Two

Supported operating systems

The Dell EMC PowerEdge R740xd2 supports the following operating systems:

  • Canonical Ubuntu LTS
  • Citrix XenServer
  • Microsoft Windows Server
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi

PSU specifications

The Dell EMC PowerEdge R740xd2 system supports up to two AC or DC power supply units (PSUs).
Table 1. PSU specificationsThe table lists the specifications for 750 W, 1100 W, 1600 W power supplies.
PSU Class Heat dissipation (maximum) Frequency Voltage AC DC Current
High line 100–240 V Low line 100–120 V
1100 W AC Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC, autoranging 1100 W 1050 W NA 12 A–6.5 A
1100 W Mixed Mode HVDC (for China and Japan only) Platinum 4416 BTU/hr 50/60 Hz 100–240 V AC, autoranging 1100 W NA NA 12 A–6.5 A
Platinum 4416 BTU/hr NA 200–380 V DC, autoranging NA NA 1100 W 6.4 A–3.2 A
750 W AC Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC, autoranging 750 W NA NA 10 A–5 A
750 W Mixed Mode Platinum 2902 BTU/hr/ 50/60 Hz 100–240 V AC, autoranging 750 W NA NA 10 A–5 A
Platinum (For China only) 2902 BTU/hr/ NA 240 V DC, autoranging NA NA 750 W 5 A
750 W Mixed Mode HVDC (for China only) Platinum 2902 BTU/hr/ 50/60 Hz 100–240 V AC, autoranging 750 W NA NA 10 A–5 A
Platinum 2902 BTU/hr NA 240 V DC, autoranging NA NA 750 W 4.5 A
NOTE Heat dissipation is calculated using the PSU wattage rating.
NOTE This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.

Cooling fans specifications

The Dell EMC PowerEdge R740xd2 system supports up to six high performance cooling fans.
NOTE When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.
Table 1. Dell EMC PowerEdge R740xd2 fan support matrixThis table describes the fan support matrix for R740xd2.
Storage PSU typeProcessor count Fan 1 Fan 2 Fan 3 Fan 4 Fan 5 Fan 6
24+2 x 3.5-inch or 24 x 3.5-inch.Redundant PSUs only1RequiredRequiredRequiredRequiredRequiredRequired
2RequiredRequiredRequiredRequiredRequiredRequired
NOTE Each fan is listed in the systems management software, referenced by the respective fan number. If there is a problem with a particular fan, you can easily identify and replace the proper fan by noting the fan numbers on the cooling fan assembly.

System battery specifications

The Dell EMC PowerEdge R740xd2 system supports CR 2032 3.0-V lithium coin cell system battery.

PCIe Expansion card riser specifications

The Dell EMC PowerEdge R740xd2 system supports up to three PCI express (PCIe) generation expansion cards that can be installed on the system board and expansion card risers.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots supported on the PowerEdge R740xd2 system board.
Processor 1 Processor 2 PCH
PCie slots on the riser Card support Riser 2 (LOM riser) Right riser Butterfly riser On Planar Internal riser Left riser On Planar On Planar
PCIe slot-1 Unique to Dell x8
PCIe slot-2 Low profile-half length x16
PCIe slot-2 Full height-half length x16 x8 or x16
PCIe slot-3 Low profile-half length x8 x16
PCIe slot-4 Low profile-half length x16
PCIe slot-5
NOTE PCIe slot 5 has open backend and bigger PCIe card connections can be inserted in this slot.
Low profile-half length x4
PCIe slot-6 Low profile-half length x4
NOTE The expansion-card slots are not hot-swappable.

Memory specifications

The Dell EMC PowerEdge R740xd2 system supports 16 DDR4 registered DIMM (RDIMMs) slots. Supported memory bus frequencies are 1866 MT/s, 2133 MT/s, 2400 MT/s, and 2666 MT/s.
Table 1. Memory specificationsThe table below shows the memory specifications.
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
RDIMM Single rank 8 GB 8 GB 80 GB 16 GB 128 GB
Dual rank 16 GB 16 GB 160 GB 32 GB 256 GB
Dual rank 32 GB 32 GB 320 GB 64 GB 512 GB

Storage controller specifications

The PowerEdge R740xd2 system supports the following controller cards.
Table 1. Dell EMC PowerEdge R740xd2 system controller cardsThis table provides the controller cards supported by Dell EMC PowerEdge R740xd2 system.
Internal controllers External controllers
  • PERC H740P
  • PERC H730P
  • PERC H330
  • HBA330
  • S140
  • HBA350i,MMLP-B
  • 12 Gbps SAS HBA
  • PERC H840
  • PERC HBA355e

Drives

The Dell EMC PowerEdge R740xd2 system supports:
Table 1. Drive specificationThe below table describes about the drive specifications of R740xd2.
Chassis options Configurations
Twenty-four drive chassis Up to twenty-four 3.5-inch (SATA or Nearline SAS drives) front accessible drives in slots 0 through 23 and

Up to eight 2.5-inch (SAS, SATA SSDs) front accessible drives can be installed from slots 16 through 23.

Twenty-four front + two rear drive chassis Up to twenty-four 3.5 inch (SATA or Nearline SAS drives) front accessible drives in slots 0 through 23 and up to two 3.5-inch SAS/SATA rear accessible drives.
NOTE For single PERC configuration, it is slot 24 to slot 25. For dual PERC configuration including S140 software RAID, it is slot 0 to slot 1.
NOTE 2.5-inch drives in 3.5-inch carriers are supported for SAS, and SATA SSD drives.

Hard drives configurations

Table 2. Hard drives configurationsThe below table describes about the drive configurations for R740xd2.
Chassis options Configurations
Twenty-four 3.5-inch (12+12 with single PERC)
  • Drive Bay 1 physical slot number 0 through 11
    • Logically numbered 0 through 11
  • Drive Bay 2 physical slot number 12 through 23
    • Logically numbered 12 through 23
Twenty-four 3.5-inch front + two 3.5-inch rear ( 12 + 12 + 2 with single PERC)
  • Drive Bay 1 physical slot number 0 through 11
    • Logically numbered 0 through 11
  • Drive Bay 2 physical slot number 12 through 23
    • Logically numbered 12 through 23
  • Drive Bay 0 slot numbers 24 and 25
    • Two drives in the rear chassis with logically numbered 24 and 25.
Twenty-four 3.5-inch front + two 3.5-inch rear ( 12 + 12 + 2 rear chipset SATA)
  • Drive Bay 1 physical slot number 0 through 11
    • Logically numbered 0 through 11
  • Drive Bay 2 physical slot number 12 through 23
    • Logically numbered 12 through 23
  • Drive Bay 0 slot numbers 24 and 25
    • With this configuration, two drives in the rear chassis will be logically numbered 0 and 1.
Twenty-four 3.5-inch front + two 3.5-inch rear (Dual PERC: Bay 1 and 2 on first PERC, Bay 0 on second PERC)
  • Drive Bay 1 physical slot number 0 through 11
    • Logically numbered 0 through 11
  • Drive Bay 2 physical slot number 12 through 23
    • Logically numbered 12 through 23
  • Drive Bay 0 slot numbers 24 and 25
    • With this configuration, two drives in the rear chassis will be logically numbered 0 and 1

USB ports specifications

Table 1. Dell EMC PowerEdge R740xd2 system USB specificationsThe following table shows the USB specifications for the PowerEdge system.
Front RearInternal
USB port typeNo. of portsUSB port typeNo. of portsUSB port typeNo. of ports
USB 2.0-compliant portOne USB 3.0-compliant portsTwoInternal USB 3.0-compliant portOne
Micro USB 2.0-compliant port for iDRAC Direct
NOTE The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
One

NIC ports specifications

The Dell EMC PowerEdge R740xd2 system supports up to two Network Interface Controller (NIC) ports on the back panel, which have two 1 Gbps configuration.
NOTE You can install up to six PCIe add-on NIC cards

Serial connector specifications

The Dell EMC PowerEdge R740xd2 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA ports specifications

The Dell EMC PowerEdge R740xd2 system supports one 15-pin VGA ports, on the rear of the system.

IDSDM module

The Dell EMC PowerEdge R740xd2 system supports optional Internal Dual SD module (IDSDM) module.
The module supports three microSD cards; two cards for IDSDM and one card for vFlash. In 14th generation of PowerEdge servers, the IDSDM or vFlash module is combined into a single card module, and is available in the following configurations:
  • vFlash or
  • vFlash and IDSDM
Table 1. Supported microSD card storage capacityThis table lists the storage capacity of the supported microSD cards
IDSDM cardvFlash card
  • 16 GB
  • 32 GB
  • 64 GB
  • 16 GB
NOTE There are two dip switches on the IDSDM or vFlash module for write-protection.
NOTE One IDSDM card slot is dedicated for redundancy.
NOTE Use Dell EMC branded microSD cards that are associated with the IDSDM or vFlash configured systems.

Video specifications

The Dell EMC PowerEdge R740xd2 system supports integrated Matrox G200eW3 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution optionsThis table describes the supported video resolution options.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32
NOTE 1920 x 1080 and 1920 x 1200 resolutions are only supported in reduced blanking mode.

Environmental specifications

NOTE https://www.dell.com/idracmanuals
Table 1. Temperature specifications When the system is in continuous operation (for altitude less than 950 m or 3117 feet), the temperature specification ranges 10°C to 30°C (50–86°F) with no direct sunlight on the equipment. When the system is not in operation, the temperature specification is -40°C to 65°C (-40°F to149°F). For more information about fresh air, see the Expanded operating temperature section. The maximum temperature gradient for both operation and nonoperational systems is 20°C/h (36°F/h). Information about fresh air specification is described in the Expanded operating temperature section.
Temperature Specifications
Storage -40–65°C (-40–149°F)
Continuous operation (for altitude less than 950 m or 3117 ft) 10–30°C (50–86°F) with no direct sunlight on the equipment
Fresh air For information about fresh air, see the Expanded operating temperature section.
Maximum temperature gradient (operating and storage) 20°C/h (36°F/h)
Table 2. Relative humidity specificationsFor a nonoperational system, the ambient relative humidity ranges from 5% to 95% with 33°C (91°F) maximum dew point. Atmosphere must be noncondensing at all times. For an operational system, the ambient relative humidity ranges from 10% to 80% with 29°C (84.2°F) maximum dew point.
Relative humidity Specifications
Storage 5% to 95% RH with 33°C (91°F) maximum dew point.

Atmosphere must be noncondensing at all times.

Operating 10% to 80% RH with 29°C (84.2°F) maximum dew point.
Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Table 5. Maximum altitude specificationsThe maximum altitude specification for an operational system is 3048 m (10,000 ft). The maximum altitude specification for a nonoperational system is 12,000 m (39,370 ft).
Maximum altitude Specifications
Operating 3048 m (10,000 ft)
Storage 12,000 m (39,370 ft)
Table 6. Operating temperature derating specificationsIf the operating temperature of a system is up to 30°C (86°F), the maximum temperature is reduced by 1°C/300 m (1°F/547 feet) above 950 m (3,117 feet). If the operating temperature of a system is 30°C to 40°C (86°F to 104°F), the maximum temperature is reduced by 1°C/175 m (1°F/319 feet) above 950 m (3,117 feet). If the operating temperature of a system is 40°C to 45°C (104°F to 113°F), the maximum temperature is reduced by 1°C/125 m (1°F/228 feet) above 950 m (3,117 feet).
Operating temperature derating Specifications
Up to 30°C (86°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft), above 950 m (3,117 ft).
30–40°C (86–104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft), above 950 m (3,117 ft).
40–45°C (104–113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft), above 950 m (3,117 ft).

Standard operating temperature

Table 1. Standard operating temperature specificationsThe standard operating temperature for altitude less than 950 meters or 3117 feet ranges from 10°C to 30°C (50°F to 86°F) with no direct sunlight on the equipment.
Standard operating temperature Specifications
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C to 30°C (50°F to 86°F) with no direct sunlight on the equipment.

Thermal restrictions

  • System must operate at temperature below 30°C.
  • All fans installed in the system must be from the same manufacturer.
  • Fresh air condition is not supported.
  • 140W processors are not supported in rear drive configuration.
  • Non Dell qualified or certified processors are not supported.
  • LRDIMM is not supported.
  • 10 GbE / 25 GbE OCPs require PCIe shroud with rear drive configuration if there is no PCIe card installed.
  • Butterfly without riser configuration cannot support 10GbE / 25GbE OCP because PCIe shroud cannot be installed.
  • Drive bays should not be in service position for more than 5 minutes because of thermal concerns. When the drive bay is open for more than five minutes, the cooling fans spin at a higher speed to provide extra cooling to the system. Thus system health status changes from the normal to critical state, and system event The BP1 drive bay is kept open for an extended period of time is logged.
  • GPGPU card is not supported.
  • Non Dell certified peripheral cards are not supported.
  • Expansion card and riser installation must follow specific Expansion card installation guidelines.
  • Mellanox CX-5 dual port 100G - QSPF PCIe adapter cable is restricted to Dell NW QSPF28 Direct attach cables and Finisar 100G 85C optic cables. Non Dell certified cables are not supported.
Table 1. Thermal limitation standard This table shows thermal limitation standard.
Configuration Maximum no.of processors supported DIMM blanks Heat Sink Type of Air shroud Fan
Quantity Model
Butterfly Configuration No riser 1 or 2 processors <=140 W Required Processor 1 : Standard heat sink

Processor 2: 1.5 U HPR heatsink

2U Air shroud 6 x High Performance fans
With Butterfly Riser
Rear Module Configuration Right Riser for 1x FH adapter card 1 or 2 processors <=125 W Processor 1 : Standard heat sink

Processor 2: 1 U HPR heatsink

2U Air shroud for Rear 3.5" X 2 HDD
Right Riser + Left Riser for 2x LP adapter cards
Table 2. Expansion cards thermal limitationThis table shows expansion cards thermal limitation.
Thermal Cooling Tier level Bus width Full height Cards Application Restriction (Configuration Type / PCIe slot) Half height Cards Application Restriction (Configuration Type / PCIe slot)
5 x8 - Rear HDD Module Configuration / Slot# 2 QLOGIC 10G Dual port BT, QLOGIC 25G Dual port SFP
  1. Butterfly Riser Configuration / Slot# 3, 4, 5
  2. Rear HDD Module Configuration / Slot# 2, 3
  3. No Riser, No Rear HDD Module / Slot# 5
6 Mellanox 40G Dual Port CXP, QSFP, Solarflare 10G Dual Port SF852P, Solarflare 10G Dual Port SF852X Mellanox 40G Dual Port CXP QSF, Solarflare 10G Dual Port SF852X, Solarflare 10G Dual Port SF852P
  1. Butterfly Riser Configuration / Slot# 3, 4, 5
  2. Rear HDD Module Configuration / Slot# 2, 3
Mellanox 40G Dual Port CXP, QSFP
  1. Butterfly Riser Configuration Slot# 3, 4
  2. Rear HDD Module Configuration / Slot# 2,3
10 QLOGIC 10G Quad port QLGX QLOGIC 10G Quad port QLGX
  1. Butterfly Riser Configuration / Slot# 3, 4
  2. Rear HDD Module Configuration / Slot# 2, 3
8 x4 - - Intel NVME P4800X Butterfly Riser Configuration / Slot# 3

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate <200 Å/month as defined by AHSRAE TC9.9.
NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.