Dell EMC PowerEdge R6525: характеристики и спецификации

Chassis dimensions

This image shows chassis dimension for the PowerEge R6525 system. — Figure 1. Chassis dimensions

Table 1. PowerEdgeR6525 chassis dimensionsThis table provides the dimensions of the PowerEdgeR6525 system:
Drives	Xa	Xb	Y	Za	Zb^*	Zc
Eight drives	482.0 mm (18.97 inches)	434.0 mm (17.08 inches)	42.8 mm (1.68 inches)	With bezel: 35.84 mm (1.4 inches) Without bezel: 22.0 mm (0.87 inches)	700.53 mm (27.58 inches) (Ear to rear wall)	736.27 mm (28.98 inches) (Ear to PSU handle)
Four or ten drives	482.0 mm (18.97 inches)	434.0 mm (17.08 inches)	42.8 mm (1.68 inches)	With bezel: 35.84 mm (1.4 inches) Without bezel: 22.0 mm (0.87 inches)	751.48 mm (29.58 inches) (Ear to I/O label)	787.05 mm (30.98 inches) (Ear to PSU handle)

NOTE Zb* is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R6525 system weightThe table below shows the maximum weight of the PowerEdge R6525.
System configuration	Maximum weight (with all drives/SSDs)
4 x 3.5-inch	21.8 kg (48.06 lb)
8 x 2.5-inch	19.2 kg (42.33 lb)
10 x 2.5-inch	21.8 kg (48.06 lb)

Processor specifications

Table 1. PowerEdge R6525 processor specificationsThis table provides processor specifications for the PowerEdge R6525 system:
Supported processor	Number of processors supported
AMD EPYC 7002 or 7003 series processors	Two

PSU specifications

The PowerEdge R6525 system supports up to two AC or DC power supply units (PSUs).

WARNING Instructions for the qualified electricians only:

System using -(48-60) V DC or 240 V DC power supplies are intended for restricted access locations in accordance with Articles 110-5, 110-6, 110-11, 110-14, and 110-17 of the National Electrical Code, American National Standards Institute (ANSI)/National Fire Protection Association (NFPA) 70.

240 V DC power supplies shall be connected to the 240 V DC outlet from certified power distribution units if applicable in country of use.

Power supply cords/jumper cords and the associated plugs/inlets/connectors shall have appropriate electrical ratings referencing the rating label on the system when used for connection.

Table 1. PowerEdge R6525 PSU specificationsThis table describes PSU specifications.
PSU	Class (AC only)	Heat dissipation (maximum)	Frequency	Voltage	Current
800 W Mixed Mode	Platinum	3000 BTU/hr	50/60 Hz	100 -240 V AC	9.2 - 4.7 A
800 W Mixed Mode	N/A	3000 BTU/hr	DC	240 V DC	3.8 A
1100 W Mixed Mode	Titanium	4100 BTU/hr	50/60 Hz	100–240 V AC	12 A-6.3 A (X2)
1100 W Mixed Mode	N/A	4100 BTU/hr	DC	240 V DC	5.2 A DC
1100 W (-48Vdc)	N/A	4265 BTU/hr	DC	(-48)-(-60) V DC	27 A
1400 W Mixed Mode	Platinum	5250 BTU/hr	50/60 Hz	100 - 240 V AC	12 - 8 A AC
1400 W Mixed Mode	N/A	5250 BTU/hr	DC	240 V DC	6.6 A DC

NOTE When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

Supported operating systems

The PowerEdge R6525 supports the following operating systems:

Canonical Ubuntu Server LTS
Citrix XenServer
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware vSAN/ESXi

For more information, see www.dell.com/ossupport.

Cooling fan specifications

The PowerEdgeR6525 system supports up to four standard (STD), high performance silver grade (HPR (Silver)), or high performance gold grade (HPR (Gold)) dual cooling fan modules.

Table 1. Cooling fan specificationsCooling fan specifications:
Fan type	Abbreviation	Also known as	Label color	Label image
Standard fan	STD	STD	No label	Figure 1. Standard fan
High performance (Silver grade) fan	HPR (Silver)	HPR	Silver	NOTE New cooling fans comes with the High Performance Silver Grade label. While the older cooling fans has the High Performance label. Figure 2. High performance fan Figure 3. High performance (Silver grade) fan
High performance (Gold grade) fan	HPR (Gold)	VHP - Very High Performance	Gold	NOTE New cooling fans comes with the High Performance Gold Grade label. While the older cooling fans has the High Performance label. Figure 4. High performance fan Figure 5. High performance (Gold grade) fan

NOTE You can distinguish between the High-performance (Silver) fan and High-performance (Gold) fan by the color of the label.

NOTE Mixing of STD, HPR (Silver), or HPR (Gold) fan is not supported.

NOTE The STD, HPR (Silver), or HPR (Gold) fan installation depends on the system configuration. For more information about the supported fan configuration or matrix, see Thermal restriction matrix.

System battery specifications

The PowerEdge R6525 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

WARNING Consumer-Grade GPU should not be installed or used in the Enterprise Server products.

The PowerEdge R6525 system supports up to four PCI express (PCIe) Gen 4 expansion cards.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the PowerEdge R6525 system.
PCIe slot	Risers	Riser width	PCIe slot height	PCIe slot length	Slot width
Slot 1	R2a (Riser 2)	x32 PCIe	Low profile	Half length	x16
Slot 1	R1a (Riser 1)	x16 PCIe	Full height	3/4th length	x16
Slot 2	R2a (Riser 2)	x32 PCIe	Low profile	Half length	x16
Slot 2	R4c + R4d (Riser 4)	x16 PCIe	Full height	3/4th length	x16
Slot 3	R3a (Riser 3)	x16 PCIe	Low profile	Half length	x16

Memory specifications

The PowerEdge R6525 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications for the PowerEdge PowerEdge system:
DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processor
DIMM type	DIMM rank	DIMM capacity	Minimum RAM	Maximum RAM	Minimum RAM	Maximum RAM
RDIMM	Single rank	8 GB	8 GB	128 GB	16 GB	256 GB
	Dual rank	16 GB	16 GB	256 GB	32 GB	512 GB
		32 GB	32 GB	512 GB	64 GB	1 TB
		64 GB	64 GB	1 TB	128 GB	2 TB
LRDIMM	Quad rank	128 GB	128 GB	2 TB	256 GB	4 TB
LRDIMM	Octa rank	128 GB	128 GB	2 TB	256 GB	4 TB

NOTE The older 32 GB capacity RDIMM memory with x4 data width and 8Gb DRAM density cannot be mixed with the newer 32 GB capacity RDIMM memory with x8 data width and 16Gb DRAM density in the same AMD EPYC™ processor unit.

NOTE The older 128 GB capacity LRDIMM memory at 2666 MT/s speed cannot be mixed with the new 128 GB capacity LRDIMM memory at 3200 MT/s speed.

Table 2. Memory module socketsThe table below shows the memory module sockets for the PowerEdge R6525 system:
Memory module sockets	Speed
32, 288-pin	3200 MT/s, 2933 MT/s, 2666 MT/s

Storage controller specifications

The PowerEdge R6525 system supports the following controller cards:

Table 1. PowerEdge R6525 system controller cardsThe table provides the controller cards that are supported by PowerEdge R6525 system:
Internal controllers	External controllers
PERC H755N PERC H745 HBA345 HBA355 S150 H345 Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2 x M.2 SSDs	12 Gbps SAS Ext. HBA PERC H840 HBA355E

NOTE The front PERC module for the PowerEdge R6525 system connects to the drive backplane. The front PERC module is connected in two different ways:

Front mounting front PERC module
Rear mounting front PERC module

Drives

The PowerEdge R6525 system supports:

4 x 3.5-inch hot-swappable SAS, SATA drives
8 x 2.5-inch hot-swappable SAS, SATA drives
10 x 2.5-inch hot-swappable SAS, SATA , or NVMe drives
10 + 2 x 2.5-inch hot-swappable SAS, SATA , or NVMe drives

Backplane:

Up to 2 x 2.5-inch SAS, SATA, or NVMe drives
Up to 4 x 3.5-inch SAS, SATA drives
Up to 8 x 2.5-inch SAS, SATA drives
Up to 10 x 2.5-inch SAS, SATA, or NVMe drives

NOTE For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at https://www.dell.com/support Browse all Products > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

Table 1. PowerEdge R6525 system USB specificationsThe following table shows the USB specifications for the PowerEdge R6525 system:
Front		Rear		Internal
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 3.0-compliant ports	One	Internal USB 3.0-compliant port	One
Micro-USB 2.0 compliant port	One	USB 2.0-compliant ports	One	Internal USB 3.0-compliant port	One

NOTE The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NOTE The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.

NOTE The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

NIC port specifications

The PowerEdge R6525 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional OCP cards.

Table 1. NIC port specification This table describes the NIC port specification.
Feature	Specifications
LOM card	1 GB x 2
OCP card (OCP 3.0)	1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4, 50 GbE x 2, 100 GbE x 2

Serial connector specifications

The PowerEdge R6525 system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

The optional serial connector card is installed similar to an expansion card filler bracket.

VGA ports specifications

The PowerEdge R6525 system supports one DB-15 VGA port that is located on the front and rear panel of the system.

IDSDM

The PowerEdge R6525 system supports optional Internal Dual SD module (IDSDM).

The IDSDM supports two SD cards and is available in the following configurations:

Table 1. Supported SD card storage capacityThis table lists the storage capacity of the supported SD cards
IDSDM card
16 GB 32 GB 64 GB

NOTE One IDSDM card slot is dedicated for redundancy.

NOTE Use Dell EMC branded SD cards that are associated with the IDSDM configured systems.

Video specifications

The PowerEdge R6525 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported front video resolution optionsThis table describes the supported front video resolution options.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Table 2. Supported rear video resolution optionsThis table describes the supported rear video resolution options.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/support/home.

Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Operational climatic range category A3 This table describes the operational climatic range for category A3.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Operational climatic range category A4 This table describes the operational climatic range for category A4.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware NOTE * - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-40 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.21 G_rms at 5 Hz to 500 Hz (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal air restrictions

ASHRAE A3 environment

CPU TDP equal or greater than 180 W are not supported.
Rear drives are not supported.
128 GB or greater capacity LRDIMMs are not supported.
Two PSUs are required in redundant mode, however PSU failure is not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
GPU is not supported.
BOSS 1.5 is not supported.
NVMe is not supported.

ASHRAE A4 environment

CPU TDP equal or greater than 155 W are not supported.
Rear drives are not supported.
128 GB or greater capacity LRDIMMs are not supported.
Two PSUs are required in redundant mode, however PSU failure is not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than Tier 5 cards are not supported.
GPU is not supported.
BOSS 1.5 is not supported.
OCP 3.0 card cooling tier greater than Tier4 is not supported.
NVMe is not supported.

Liquid cooling: ASHRAE A3 environment

128 GB ir greater capacity LRDIMMs are not supported.
Two PSUs are required in redundant mode, but PSU failure is not supported.
Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
GPU is not supported.
BOSS 1.5 is not supported.
NVMe is not supported.

Liquid cooling: ASHRAE A4 environment

Rear drives are not supported.
128 GB ir greater capacity LRDIMMs are not supported.
Two PSUs are required in redundant mode, but PSU failure is not supported.
Non Dell qualified peripheral cards and/or peripheral cards greater than Tier 5 are not supported.
OCP 3.0 card cooling tier greater than Tier 4 is not supported.
GPU is not supported.
BOSS 1.5 is not supported.
NVMe is not supported.

Thermal restriction matrix

Table 1. Thermal restriction matrixThe table describes thermal restriction matrix for the PowerEdge R6525 system.
Configuration		4 x 3.5-inch			8 x 2.5-inch		10 x 2.5-inch SAS			10 x 2.5-inch NVMe
Rear configuration		3 LP/ 2 FH	Rear 2 x 2.5-inch SAS	Rear 2 x 2.5-inch NVMe	3 LP/ 2 FH	Rear 2 x 2.5-inch NVMe(single processor)	3 LP/ 2 FH	Rear 2 x 2.5-inch SAS	Rear 2 x 2.5-inch NVMe	3 LP/ 2 FH	Rear 2 x 2.5-inch NVMe
CPU TDP	CPU cTDP Max
120 W	150 W	STD fan STD HSK	HPR Fan STD HSK	HPR Fan STD HSK	STD fan STD HSK	HPR Fan STD HSK	VHP fan STD HSK	VHP fan STD HSK	VHP fan STD HSK	VHP fan STD HSK	VHP fan STD HSK
155 W	180 W	STD fan STD HSK	HPR Fan STD HSK	HPR Fan STD HSK	STD fan STD HSK	HPR Fan STD HSK	VHP fan STD HSK	VHP fan STD HSK	VHP fan STD HSK	VHP fan STD HSK	VHP fan STD HSK
180 W	200 W	HPR fan L-type HSK	HPR Fan L-type HSK	HPR Fan L-type HSK	HPR fan L-type HSK	HPR Fan L-type HSK	VHP fan L-type HSK	VHP fan L-type HSK	VHP fan L-type HSK	VHP fan L-type HSK	VHP fan L-type HSK
200 W	200 W	HPR fan L-type HSK	HPR Fan L-type HSK	HPR Fan L-type HSK	HPR fan L-type HSK	HPR Fan L-type HSK	VHP fan L-type HSK	VHP fan L-type HSK	VHP fan L-type HSK	VHP fan L-type HSK	VHP fan L-type HSK
225 W	240 W	HPR fan L-type HSK	HPR Fan L-type HSK	HPR Fan L-type HSK	HPR fan L-type HSK	HPR Fan L-type HSK	VHP fan L-type HSK	VHP fan L-type HSK	VHP fan L-type HSK	VHP fan L-type HSK	VHP fan L-type HSK
280 W - 64C (7H12,7763)		HPR fan* L-type HSK	HPR Fan* L-type HSK	HPR Fan* L-type HSK	HPR fan L-type HSK	HPR Fan* L-type HSK	VHP fan* L-type HSK	VHP fan* L-type HSK	VHP fan* L-type HSK	VHP fan L-type HSK	VHP fan* L-type HSK
280 W - 32C (75F3)		-	-	-	VHP fan* L-type HSK	-	VHP fan* L-type HSK	-	-	VHP fan* L-type HSK	-
280 W - 64C/32C/24C 280 W (7773X,7573X,7473X)		-	-	-	-	-	VHP fan L-type HSK	VHP fan* L-type HSK	VHP fan* L-type HSK	-	-
280 W - 16C 280 W (7373X)		-	-	-	-	-	VHP fan** L-type HSK	-	-	-	-
T4 or A2 GPU		HPR fan*	HPR Fan*	HPR Fan*	HPR fan*	-	VHP fan*	VHP fan*	VHP fan*	VHP fan*	VHP fan*

NOTE * Supported ambient temperature is 30°C.

NOTE ** Supported ambient temperature is 25°C.

Table 2. Liquid cooling thermal restriction matrixThis table describes the liquid cooling thermal restriction matrix.
Configuration		4 x 3.5-inch			8 x 2.5-inch	10 x 2.5-inch SAS			10 x 2.5-inch NVMe
Rear storage		3 LP/ 2 FH	Rear 2 x 2.5-inch SAS	Rear 2 x 2.5-inch NVMe	3 LP/ 2 FH	3 LP/ 2 FH	Rear 2 x 2.5-inch SAS	Rear 2 x 2.5-inch NVMe	3 LP/ 2 FH	Rear 2 x 2.5-inch NVMe
CPU TDP	CPU cTDP Max
120 W	150 W	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan
155 W	180 W	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan
180 W	200 W	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan
200 W	200 W	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan
225 W	240 W	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan
280 W	280 W	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan
T4 GPU		HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan	HPR fan

NOTE Three dual fan modules are required for single processor, and four dual fan modules are required for dual processor system.

NOTE For T4 GPU and 280 W CPU, maximum supported ambient temperature is 30°C. For other configurations maximum supported ambient temperature is 35°C.

Table 3. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink	Processor TDP
STD HSK	< 180 W
L-type HSK	Processor 1 >= 180 W
L-type HSK	Processor 2 >= 180 W

Table 4. Processor support matrixThis table describes the processor support matrix.
Processor	TDP (W)	cTDP Max (W)	Cores	Heat sink (HSK) type	Fan type (x4/x8)	Fan type (x10)	Support A3	Support A4
7773X	280	280	64	L-type HSK	NA	HPR (gold) fan	No	No
7573X	280	280	32	L-type HSK	NA	HPR (gold) fan	No	No
7H12	280	280	64	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7F72	240	240	24	L-type HSK	HPR(silver) fan	HPR (gold) fan	No	No
7F52	225	240	16	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7662	225	240	64	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7643	240	240	56	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7742	225	240	64	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7713P	225	240	64	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7642	225	240	48	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7552	200	200	48	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7702	200	200	64	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7663	240	240	56	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7543P	225	240	32	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7542	225	240	32	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7532	200	200	32	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7F32	180	180	8	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7513	200	200	32	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7502	180	200	32	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
74F3	240	240	24/48	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7402	180	200	24	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7452	155	180	32	STD HSK	STD fan	HPR (gold) fan	Yes	No
7443P	200	200	24	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7443	200	200	24	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7352	155	180	24	STD HSK	STD fan	HPR (gold) fan	Yes	No
7343	200	200	32	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7313P	155	180	16	STD HSK	STD fan	HPR (gold) fan	Yes	No
7302	155	180	16	STD HSK	STD fan	HPR (gold) fan	Yes	No
72F3	180	200	8	L-type HSK	HPR (silver) fan	HPR (gold) fan	No	No
7282	120	150	16	STD HSK	STD fan	HPR (gold) fan	Yes	Yes
7272	120	150	12	STD HSK	STD fan	HPR (gold) fan	Yes	Yes
7252	120	150	8	STD HSK	STD fan	HPR (gold) fan	Yes	Yes
7262	155	180	8	STD HSK	STD fan	HPR (gold) fan	Yes	No

NOTE DIMM blanks are required on empty slots if 280 W CPU is installed.

NOTE Processors 7573X and 7773X support only x10 SAS/SATA drives.

Table 5. T4 GPU support restrictionThis table describes the T4 GPU support restriction.
	2.5-inch x 10		2.5-inch x 8		3.5-inch x 4
Rear Config	3 x LP	2 x FH	3 x LP	2 x FH	3 x LP	2 x FH
Slot 1	Supported	Supported	Supported	Supported	Supported	Supported
Slot 2	Supported	Supported	Supported	Supported	Supported	Supported
Slot 3	Supported	NA	Not supported	NA	Not supported	NA

NOTE 128 GB LRDIMM 3200 MT/s or higher memory is not supported with 280 W T4/A2 configuration.

Table 6. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard
HPR	High performance (silver grade)
VHP	Very high performance (gold grade)
HSK	Heat sink
LP	Low profile
FH	Full height

Dell EMC PowerEdge R6525: технические характеристики и спецификации