Dell EMC PowerEdge R6515: характеристики и спецификации

Chassis dimensions

The image shows system dimensions. — Figure 1. Chassis dimensions

Table 1. PowerEdgeR6515 chassis dimensionsThis table provides the dimensions of the PowerEdgeR6515system:
System configurations	Xa	Xb	Y	Za	Zb^*	Zc
4 x 3.5-inches or 10 x 2.5-inches	482.0 mm (18.97 inches)	434.0 mm (17.08 inches)	42.8 mm (1.68 inches)	With bezel: 35.84 mm (1.4 inches) Without bezel: 22.0 mm (0.87 inches)	657.25 mm (25.87 inches)	692.62 mm (27.26 inches)
8 x 2.5-inches	482.0 mm (18.97 inches)	434.0 mm (17.08 inches)	42.8 mm (1.68 inches)	With bezel: 35.84 mm (1.4 inches) Without bezel: 22.0 mm (0.87 inches)	606.47 mm (23.87 inches)	641.85 mm (25.26 inches)

NOTE^* Zb goes to the nominal rear wall external surface where the motherboard I/O connectors reside.

System weight

Table 1. PowerEdge R6515 system weightsystem weight of PowerEdge R6515 is 16.75 kg (36.92 lb) for 4 x 3.5-inch configuration, 15.6 kg (34.39 lb) for 8 x 2.5-inch configuration, 15.8 kg (34.83 lb) for 10 x 2.5-inch configuration.
System configuration	Maximum weight (with all drives)
4 x 3.5-inch configuration	16.75 kg (36.92 lb)
8 x 2.5-inch configuration	15.6 kg (34.39 lb)
10 x 2.5-inch configuration	15.8 kg (34.83 lb)

Processor specifications

Table 1. PowerEdge R6515 processor specificationsThis table provides processor specifications for the PowerEdge R6515 system:
Supported processor	Number of processors supported
AMD EYPC 7002 and 7003 series processor	One

PSU specifications

Table 1. PowerEdge R6515 PSU specificationsThe table lists the power supply specifications
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	Current
550 W AC	Platinum	2107 BTU/hr	50/60 Hz	100-240 V AC,autoranging	7.4 A - 3.7 A
700 W AC	Platinum	2107 BTU/hr	50/60 Hz	100-240 V AC,autoranging	7.4 A - 3.7 A

NOTE This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 230 V.

NOTE For certain premium configurations with high power consumption, system PSU might stay with 2+0 mode only, 1+1 redundant mode is not available.

NOTE When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

Supported operating systems

The PowerEdge R6515 supports the following operating systems:

Canonical Ubuntu Server LTS
Citrix Xen Hypervisor
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware vSAN/ESXi

For more information, see www.dell.com/ossupport.

Cooling fans specifications

The PowerEdge R6515 system supports both the Standard fan (STD fan) and High Performance fan (HPR fan) and requires all six fans to be installed.

NOTE Mixing of STD and HPR fans is not supported.

NOTE The STD and HPR fans installation depends on the system configuration. For more information about the fan support configuration or matrix, see Thermal restriction matrix.

System battery specifications

The PowerEdge R6515 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

WARNING Consumer-Grade GPU should not be installed or used in the Enterprise Server products.

The PowerEdge R6515 system supports up to two PCI express (PCIe) expansion cards:

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots supported on the PowerEdge R6515 system
PCIe slot	Riser	PCIe slot height	PCIe slot length	Slot width
Slot 2	Riser 1A	Low-profile	Half-length	x16 (Gen 3)
Slot 3	Riser 2	Low-profile	Half-length	x16 (Gen 4)

Memory specifications

The PowerEdge R6515 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications for the PowerEdge R6515 system :
DIMM type	DIMM rank	DIMM capacity	Minimum RAM	Maximum RAM
RDIMM	Single rank	8 GB	8 GB	128 GB
	Dual rank	16 GB	16 GB	256 GB
		32 GB	32 GB	512 GB
		64 GB	64 GB	1 TB
3DS LRDIMM	Octa rank	128 GB	128 GB	2 TB

NOTE The older 32 GB capacity RDIMM memory with x4 data width and 8Gb DRAM density cannot be mixed with the newer 32 GB capacity RDIMM memory with x8 data width and 16Gb DRAM density in the same AMD EPYC™ processor unit.

NOTE The older 128 GB capacity LRDIMM memory at 2666 MT/s speed cannot be mixed with the new 128 GB capacity LRDIMM memory at 3200 MT/s speed.

Table 2. Memory module socketsThe table below shows the memory module sockets for the PowerEdge R6515 system:
Memory module sockets	Speed
Sixteen 288-pin	3200 MT/s, 2933 MT/s, 2666 MT/s

Storage controller specifications

The PowerEdge R6515 system supports the following controller cards:

Table 1. PowerEdge R6515 system controller cardsThis table provides the controller cards supported by PowerEdge R6515 system:
Internal controllers	External controllers
PERC H740P PERC H730P PERC H330 S150 HBA330 Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs	12Gbps SAS Ext. HBA H840 HBA355e

Drives

The PowerEdge R6515 system supports

Up to 4 x 3.5-inch (SAS, SATA or SSD) front accessible drives in slot 0 to 3
Up to 8 x 2.5-inch (SAS, SATA or SSD) front accessible drives in slot 0 to 7
Up to 10 x 2.5-inch drives front accessible drives (with 8 SAS/SATA drives in slot 0 to 7 + 2 NVMe drives in slot 8 to 9)
Up to 10 x 2.5-inch front accessible NVMe drives in slot 0 to 9

NOTE The front accessible NVMe drives currently utilize PCIe Gen3.

NOTE For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at https://www.dell.com/support> Browse all Products > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

Optical drives

The PowerEdge R6515 system supports the following optical drives.

Table 1. Supported optical drive typeThis table shows the supported optical drive type
Supported drive type	Supported number of drives
Dedicated SATA DVD-ROM drive or DVD +/-RW drive	One

USB ports specifications

Table 1. PowerEdge R6515 system USB specificationsThe following table shows the USB specifications for the PowerEdge system.
Front		Rear		Internal
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 3.0-compliant ports	Two	Internal USB 3.0-compliant port	One
Micro USB 2.0-compliant port for iDRAC Direct	One	USB 3.0-compliant ports	Two	Internal USB 3.0-compliant port	One

NOTE The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

LOM riser card specifications

The PowerEdge R6515 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports that are located on the back panel. The system also supports LAN on Motherboard (LOM) on an optional riser card.

You can install one LOM riser card. The supported LOM riser options are:

2 x 1 Gb Base-T
2 x 10Gb Base-T
2 x 10Gb SFP+
2 x 25Gb SFP+

NOTE

You can install up to two PCIe add-on NIC cards.
For information about Linux network performance settings, see the Linux Network Tuning Guide for AMD EPYC Processor Based Servers white paper at AMD.com

Serial connector specifications

The PowerEdge R6515 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA ports specifications

The PowerEdge R6515 system supports two 15-pin VGA ports one each on the front and back panels.

IDSDM

The PowerEdge R6515 system supports Internal Dual SD module (IDSDM) with the below storage capacity:

16 GB
32 GB
64 GB

NOTE One IDSDM card slot is dedicated for redundancy.

NOTE Use Dell EMC branded microSD cards that are associated with the IDSDM configured systems.

Video specifications

The PowerEdge R6515 system supports integrated Matrox G200eR2 graphics controller with 16 MB of video frame buffer.

Table 1. Supported front video resolution optionsThis table describes the supported front video resolution options.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32

Table 2. Supported rear video resolution optionsThis table describes the supported rear video resolution options.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on https://www.dell.com/support.

Operational climatic range category A2

Table 1. Operational climatic range category A2This table describes the Operational climatic range category A2.
Allowable continuous operations
Temperature ranges for altitude <900 meters (<2,953 feet)	10 to 35°C (50 to 95°F) with no direct sunlight on the platform
Humidity percent ranges (Non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 meters (1.8°F/984 feet) above 900 meters (2,953 feet)

Operational climatic range category A3

Table 2. Operational climatic range category A3This table describes the Operational climatic range category A3.
Allowable continuous operations
Temperature ranges for altitude <900 meters (<2,953 ft)	5°C- 40°C (41°F-104°F) with no direct sunlight on the platform
Humidity percent ranges (Noncondensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 meters (1.8°F/574 feet) above 900 meters (2,953 feet)

Shared requirements across all categories

Table 3. Shared requirements across all categoriesThis table describes Shared requirements across all categories.
Allowable operations
Maximum temperature gradient (applies to both operation and nonoperation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
Nonoperational temperature limits	-40°C-65°C (-40°F-149°F)
Nonoperational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum nonoperational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

*: Per ASHRAE thermal guidelines, these are not instantaneous rates of temperature change.

Table 4. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 5. Maximum shock pulse specificationsThe maximum shock specification of an operational system is 24 consecutively run shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms (4 pulse on each side of the system). The maximum shock specification of a nonoperational system is six consecutively run shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	24 run shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. (4 pulse on each side of the system)
Storage	Six consecutively run shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE Air entering the data center must have MERV11 or MERV13 filtration. NOTE Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHARE Standard 127.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE This condition applies to data center and non-data center environments. NOTE Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination	Specifications
Copper Coupon Corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal restriction matrix

Table 1. Thermal restriction matrix for processor and fansThis table describes the thermal restriction for processor and fans for R6515.
Configuration	4 x 3.5-inch	8 x 2.5-inch	10 x 2.5-inch drives (NVMe)
Processor TDP
120 W	STD fan STD HSK	STD fan STD HSK	HPR fan* STD HSK
155 W	STD fan STD HSK	STD fan STD HSK	HPR fan* STD HSK
180 W	STD fan HPR HSK	STD fan HPR HSK	HPR fan* HPR HSK
200 W	STD fan HPR HSK	STD fan HPR HSK	HPR fan* HPR HSK
225 W	HPR fan HPR HSK	HPR fan HPR HSK	HPR fan* HPR HSK
240 W	HPR fan HPR HSK	HPR fan HPR HSK	HPR fan* HPR HSK
280 W	HPR fan HPR HSK with DIMM Blank	HPR fan HPR HSK with DIMM Blank	Not supported
280 W - 64C/32C	HPR fan HPR HSK with DIMM Blank	HPR fan HPR HSK with DIMM Blank	Not supported

NOTE * Supported ambient temperature is 30°C.

NOTE To ensure proper cooling in the system with 280 W processor, memory module blank should be installed in the memory sockets that are not populated.

NOTE For 280 W processor, maximum supported ambient temperature is 35°C.

NOTE For 10 x 2.5-inch drives (NVMe), maximum supported ambient temperature is 30°C.

Table 2. Thermal restriction matrix for T4 GPGPU This table describes the thermal restriction for T4 GPGPU for R6515.
Riser configurations	Configuration type and ambient temperature support
	4 x 3.5-inch drives	8 x 2.5-inch drives	10 x 2.5-inch drives (NVMe)
	2 LP	2 LP	2 LP
	Ambient = 30°C
Slot 2	HPR fan	HPR fan	NA
Slot 3	HPR fan	HPR fan	HPR fan + NVMe drives from slot 6-9 + SAS or SATA drives from slot 0-5

Table 3. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
STD	Standard
HPR	High performance
HSK	Heat sink
LP	Low profile

Thermal restriction for ASHRAE A3/Fresh air environment

Processor TDP equal or greater than 180 W are not supported.
128 GB or greater capacity LRDIMMs are not supported.
Redundant power supply configuration is required, but PSU failure is not supported
Non-Dell qualified peripheral cards greater than 25 W are not supported.
GPU card is not supported.
PCIe SSD is not supported.

Thermal restriction for ASHRAE A4/Fresh air environment

Processor TDP equal or greater than 155 W are not supported within A4.
128 GB or greater capacity LRDIMMs are not supported within A4.
Two PSUs are required in redundant mode, but PSU failure is not supported.
Non Dell qualified peripheral cards and/or peripheral cards greater than 25W are not supported.
GPU is not supported within A4.
PCIeSSD is not supported within A4.
25G OCP is not supported within A4.

Other thermal restrictions

SolarFlare, Mellanox CX4/CX5/CX6, P4800 AIC can only support up to 35°C ambient.
Mellanox CX6 on 10x2.5-inch configuration can only support on slot 3.
25G OCP card does not support with 128 GB LRDIMM on 10 x 2.5-inch configuration.
HPR fan is required with 128 GB LRDIMM.
T4 GPGPU is not supported with 128 GB LRDIMM.
T4 GPGPU supports up to 30°C ambient temperature with HPR fans and 4 x 3.5-inch or 8 x 2.5-inch configurations.
T4 GPGPU supports up to 30°C ambient temperature with HPR fan and 10 x 2.5-inch configuration (NVMe(slot 6-9) and SAS or SATA drives (slot 0-5)) on slot 3 only.

Dell EMC PowerEdge R6515: технические характеристики и спецификации