Dell EMC PowerEdge R650xs: характеристики и спецификации

Chassis dimensions

The image shows system dimensions. — Figure 1. Chassis dimensions

Table 1. PowerEdgeR650xs Chassis dimensionsThis table provides the dimensions of the PowerEdgeR650xssystem:
Drives	Xa	Xb	Y	Za	Zb	Zc
10 or 8 NVMe drives, 4 SATA/SAS/ NVMe drives	482 mm (18.97 inches)	434 mm (17.08 inches)	42.8 mm (1.68 inches)	22 mm (0.86 inches)Without bezel 35.84 mm (1.41 inches)With bezel	677.8 mm (26.68 inches)Ear to PSU surface wall 691.07 mm (27.20 inches)Ear to butterfly L bracket housing	712.95 mm (28.06 inches) Ear to PSU handle without velcro strap
8 SATA/SAS drives, Zero drives	482 mm (18.97 inches)	434 mm (17.08 inches)	42.8 mm (1.68 inches)	22 mm (0.86 inches)Without bezel 35.84 mm (1.41 inches)With bezel	627.03 mm (24.68 inches)Ear to PSU surface wall 640.3 mm (25.20 inches)Ear to butterfly L bracket housing	662.19 mm (26.07 inches)Ear to PSU handle without velcro strap

NOTE Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R650xs system weightThe table below shows the maximum weight of the.
System configuration	Maximum weight (with all drives/SSDs/bezel)
10 x 2.5-inch NVMe	17.12 Kg (37.74 pound)
4 x 3.5-inch	18.62 Kg (41.05 pound)
8 x 2.5-inch SATA/SAS	16.58 Kg (36.55 pound)
8 x 2.5-inch NVMe	17.12 Kg (37.74 pound)

Processor specifications

Table 1. PowerEdge R650xs processor specificationsThis table provides processor specifications for the system.
Supported processor	Number of processors supported
3^rd Generation Intel Xeon Scalable processors with up to 32 cores	Up to two

PSU specifications

The PowerEdge R650xs system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specificationsThe table lists the specifications for 800 W, 1400 W power supplies.
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	AC		DC	Current
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	High line 200–240 V	Low line 100–120 V	DC	Current
1400 W Mixed Mode	Platinum	5406 BTU/hr	50/60 Hz	100–240 V AC, autoranging	1400 W	1050 W	NA	12 A–8 A
1400 W Mixed Mode	NA	5406 BTU/hr	NA	240 V DC, autoranging	NA	NA	1400 W	6.6 A
1100 W Mixed Mode	Titanium	4299 BTU/hr	50/60 Hz	100–240 V AC, autoranging	1100 W	1050 W	NA	12 A–6.3 A
1100 W Mixed Mode	NA	4299 BTU/hr	NA	240 V DC, autoranging	NA	NA	1100 W	5.2 A
1100 W DC	NA	4265 BTU/hr	NA	-48–(-60) V	NA	NA	1100 W	27 A
800 W Mixed Mode	Platinum	3000 BTU/hr	50/60 Hz	100–240 V AC, autoranging	800 W	800 W	NA	9.2 A-4.7 A
800 W Mixed Mode	NA	3000 BTU/hr	NA	240 V DC, autoranging	NA	NA	800 W	3.8 A
600 W Mixed Mode	Platinum	2250 BTU/hr	50/60 Hz	100–240 V AC, autoranging	600 W	600 W	NA	7.1 A-3.6 A
600 W Mixed Mode	NA	2250 BTU/hr	NA	240 V DC, autoranging	NA	NA	600 W	2.9 A

NOTE This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.

NOTE Heat dissipation is calculated using the PSU wattage rating.

NOTE When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

Supported operating systems

The PowerEdge R650xs system supports the following operating systems:

Canonical Ubuntu Server LTS
Citrix Xen Server
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi

For more information, go to www.dell.com/ossupport.

Cooling fans specifications

The PowerEdgeR650xssystem supports up to seven Standard (STD) fans, High performance SLVR fans, or High performance (HPR) gold fans.

NOTE For more information about the fan support configuration or matrix, see Thermal restriction matrix.

Table 1. Cooling fan specificationsCooling fan specifications:
Fan type	Abbreviation	Also known as	Label color	Label image
High performance (Gold grade) fan	HPR (Gold)	VHP - Very High Performance	Gold	Figure 1. High performance (Gold grade) fan
Standard fan	STD	STD	No label	Figure 2. Standard fan
High performance (Silver grade) fan	HPR (SLVR)	HPR	Silver	Figure 3. High performance (Silver grade) fan

System battery specifications

The PowerEdge R650xs system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge R650xs system supports up to three PCI express (PCIe) Gen 4 expansion cards.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot	Riser	PCIe slot height	PCIe slot length	PCIe slot width
Slot 1	Riser 1	Low Profile	Half length	x16
Slot 2 and 3	Riser 2a	Low Profile	Half length	x8 + x8
Slot 3	Riser 2b (SNAPI)	Low Profile	Half length	x16
Slot 3	Riser 2c	Low Profile	Half length	x16

NOTE For information on the expansion card installation guidelines, see the system specific Installation and Service Manual available at https://www.dell.com/poweredgemanuals.

Memory specifications

The PowerEdge R650xs system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processors
DIMM type	DIMM rank	DIMM capacity	Minimum DIMM capacity	Maximum DIMM capacity	Minimum DIMM capacity	Maximum DIMM capacity
RDIMM	Single rank	8 GB	8 GB	64 GB	16 GB	128 GB
	Dual rank	16 GB	16 GB	128 GB	32 GB	256 GB
		32 GB	32 GB	256 GB	64 GB	512 GB
		64 GB	64 GB	512 GB	128 GB	1 TB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
16, 288-pin	3200 MT/s, 2933 MT/s, 2666 MT/s

Storage controller specifications

The PowerEdge R650xs system supports the following controller cards:

Table 1. Storage controller cardsThis table provides the controller cards supported on the system:
Internal controllers	External controllers
PERC H345 PERC H355 PERC H745 PERC H755 PERC H755N HBA355i S150 Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs	HBA355e PERC H840

NOTE The software RAID S150 is supported on either SATA drives with chipset SATA only backplane or NVMe drives in universal slots with processor direct PCIe cable connected backplane.

Drives

The PowerEdge R650xs system supports:

Up to 10 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives
Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) drives
Up to 8 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives

NOTE For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at https://www.dell.com/support > Browse all Products > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

Table 1. PowerEdge R650xs system USB ports specifications The following table shows the USB ports specifications :
Front		Rear		Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 2.0-compliant port	One	Internal USB 3.0-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0)	One	USB 3.0-compliant ports	One	Internal USB 3.0-compliant port	One

NOTE The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NOTE The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.

NOTE The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

NIC port specifications

The PowerEdge R650xs system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
LOM	1 GB x 2
OCP card (OCP 3.0)	1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4

Serial connector specifications

The PowerEdge R650xs system supports one optional card type serial connector on rear of the system, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The process to install the optional serial connector card is similar to an expansion card filler bracket.

VGA ports specifications

The PowerEdge R650xs system supports two DB-15 VGA ports, one each on the front and rear panels of the system.

IDSDM

The PowerEdge R650xs system supports Internal Dual SD module (IDSDM).

The IDSDM supports two SD cards and is available in the following configurations:

Table 1. Supported SD card storage capacityThis table lists the storage capacity of the supported SD cards
IDSDM card
16 GB 32 GB 64 GB

NOTE One IDSDM card slot is dedicated for redundancy.

NOTE Use Dell EMC branded SD cards that are associated with the IDSDM configured systems.

Video specifications

The PowerEdge R650xs system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options for the systemThis table describes the supported front video resolution options for the system.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation > Regulatory Information on www.dell.com/support/home.

Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Operational climatic range category A3 This table describes the operational climatic range for category A3.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Operational climatic range category A4 This table describes the operational climatic range for category A4.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape NOTE * - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-40 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

Table 5. Maximum vibration specifications
Maximum vibration	Specifications
Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations)
Storage	1.88 G _rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that prevent the damage to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination	Specifications
Copper Coupon Corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal restrictions

Other Thermal restrictions

Table 1. Thermal restriction matrix for processor and fansThis table describes the thermal restriction for processor and fans.
Configuration / Processor TDP	4 x 3.5-inch configuration with Maximum Ambient Temperature		8 x 2.5-inch SAS/SATA configuration	8 x 2.5-inch NVMe configuration	10 x 2.5-inch SAS/SATA configuration		10 x 2.5-inch NVMe configuration
Rear Storage	Rear 3 LP	1 LP + 2 Rear drives	Rear 3 LP	Rear 3 LP	Rear 3 LP	1 LP + 2 Rear drives	Rear 3 LP
105 W	STD fan STD HSK 40 °C	HPR (Silver) fan STD HSK 35 °C	STD fan STD HSK 40 °C	HPR (Gold) fan STD HSK 45 °C	HPR (Silver) fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 45 °C
120 W	STD fan STD HSK 40 °C	HPR (Silver) fan STD HSK 35 °C	STD fan STD HSK 40 °C	HPR (Gold) fan STD HSK 45 °C	HPR (Silver) fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 45 °C
135 W	STD fan STD HSK 40 °C	HPR (Silver) fan STD HSK 35 °C	STD fan STD HSK 40 °C	HPR (Gold) fan STD HSK 45 °C	HPR (Silver) fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 45 °C
150 W	STD fan STD HSK 40 °C	HPR (Silver) fan STD HSK 35 °C	STD fan STD HSK 40 °C	HPR (Gold) fan STD HSK 40 °C	HPR (Silver) fan STD HSK 40 °C	HPR (Gold) fan STD HSK 35 °C	HPR (Gold) fan STD HSK 40 °C
165 W	STD fan ** STD HSK * 35 °C	HPR (Silver) fan STD HSK * 35 °C	STD fan ** STD HSK * 35 °C	HPR (Gold) fan STD HSK * 40 °C	HPR (Silver) fan*** STD HSK * 40 °C	HPR (Gold) fan STD HSK * 35 °C	HPR f(Gold) an STD HSK * 40 °C
185 W / 190 W	HPR (Silver) fan HPR HSK 35 °C	HPR (Silver) fan HPR HSK 35 °C	HPR (Silver) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C
205 W	HPR (Silver) fan HPR HSK 35 °C	HPR (Silver) fan HPR HSK 35 °C	HPR (Silver) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C
220 W	HPR (Silver) fan HPR HSK 35 °C	HPR (Silver) fan HPR HSK 35 °C	HPR (Silver) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C	HPR (Gold) fan HPR HSK 35 °C

NOTE

* For Intel 165 W 8 core 3.6 GHz QXRQ processor, HPR HSK is required. For all the other 165 W processor, use STD HSK.

** For Intel 165 W 8 core 3.6 GHz QXRQ processor, use HPR Silver fan (HPR) for the SKU with ** marked.

*** For Intel 165W 8 core 3.6 GHz QXRQ processor, use HPR Gold fan (VHP) for the SKU with *** marked.

**** HDD Blank is required for empty HDD slot.

Table 2. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
LP	Low Profile
HPR (Gold)	High performance (gold grade)
HPR (Silver)	High Performance (silver grade)
HSK	Heat sink

10 x 2.5-inch NVMe configuration requires HPR (Gold) fan. 7 fans are required for dual processor configuration.
DIMM blank is not required.
Processor blank is required for single processor configuration.
Two fan blanks are required to be installed on fan slot 1 and fan slot 2 for 5 fans configuration.

Table 3. Thermal restriction matrix for processor and configurationsThis table describes the thermal restriction for processor and configurations.
Parameters		Configurations
Front storage		2 x 3.5-inch SAS/SATA configuration	4 x 2.5-inch NVMe configuration	6 x 3.5-inch SAS/SATA configuration
Fan type and quantity		HPR (Silver) fan x 7	HPR (Gold) fan x 7	HPR (Gold) fan x 7
Rear configuration		OCP, PCIe slot 1 only	OCP, BOSS, PCIe slot1 and slot 3	OCP, BOSS, PCIe slot1, slot 2 and slot 3
Processor TDP	250 W	HPR HSK	HPR HSK	HPR HSK
Processor TDP	270 W	HPR HSK	HPR HSK	HPR HSK
Maximum Ambient Temperature		35°C	35°C	35°C

NOTE DIMM blank is not required.

Thermal Restriction for ASHRAE A2/A3/A4

Table 4. 4 x3 .5-inch SAS/SATA and 8 x 2.5-inch SAS/SATA and No BP Configuration
Dell EMC PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted.	Dell EMC PowerEdge Server Extended Inletient 40° C Operating Support (ASHRAE A3 compliant)	Dell EMC PowerEdge Server Extended Inletient 45° C Operating Support (ASHRAE A4 compliant)
HPR Gold Fan is required for Processor TDP >165 W HPR Gold Fan is required for with RM configuration 10 x 2.5-inch SAS/SATA config Processor TDP >220 W SM only support 6 x 2.5-inch SAS/SATA at HDD#0~ HDD#5 and SM Blank x 2 are required at HDD#6 ~HDD#9 With RM Config do not support Processor TDP >220 W The Following OCP3.0 NIC only support optic cable with thermal Spec 85C and power <=1.2 W Broadcom Thor QP 25G SFP28 Solarflare Medford2 DP 25GbE SFP28 Channel devices Intel E810-XXVDA4 100G 4P DPN: 6C2NG The Following OCP3.0 NIC only support optic cable with thermal Spec 85C and power <=2.5W ( DPN:4WGYD) Channel devices Intel E810-CQDA2 100G QSF28 DPN: N8PW5 The Following PCIe NIC only support optic cable with thermal Spec 85C and power <=1.2W ( DPN: M14MK) Broadcom 100G 2P QSF DPN: 61PR9 Mellonax 25G DP OCP3 CX6 LX SPF28 DPN: 9XCTH Mellonax 25G 2P OCP3 CX6 LX SPF28 DPN: DN78C The Following PCIe NIC only support optic cable with thermal Spec 85C and power <=2.5 W Channel Devices Intel Columbiaville DP 100GbE Intel Columbiaville 100G 2P Q28 DPN: DWNRF The following NVMe /SAS/SATA could not be support in Rear Module Samsung PM1735 Capacities > 6.4 TB Samsung PM1733 Capacities > 7.68 TB Kioxia CM6 all capacities Kioxia PM6 SAS all capacities Hynix PE8010 >3.84T capacities	Not support processor TDP > 150 W Not support BOSS M.2 Module Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards Not support NIC consuming power >= 25 W. Not Support Config with RM Not support OCP transfer rate >25 G or cooling tier > 10 Optic Cable with spec 85°C is required. Two PSUs are required. System performance may be reduced in the event of a PSU failure	A4 environment not support

Table 5. 10 x 2.5-inch NVMe and 8 x 2.5-inch NVMe configuration
Dell EMC PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted.	Dell EMC PowerEdge Server Extended Inletient 40°C Operating Support (ASHRAE A3 compliant)	Dell EMC PowerEdge Server Extended Inletient 45°C Operating Support (ASHRAE A4 compliant)
HPR Gold Fan is required 10 x 2.5-inch NVMe config Processor TDP >220 W SM only support 4x2.5 NVMe at HDD#0~ HDD#3 and SM Blank x 3 are required at HDD#4 ~HDD#9 10 x 2.5-inch NVMe config Processor TDP >220 W, RIO do not support PCIe2 8 x 2.5-inch NVMe config do not support Processor TDP >220 W The Following OCP3.0 NIC only support optic cable with thermal Spec 85C and power <=1.2W Broadcom Thor QP 25G SFP28 Solarflare Medford2 DP 25GbE SFP28 in both configuration Channel devices Intel E810-XXVDA4 100G 4P DPN: 6C2NG in 10x2.5 NVMe config. only (8x2.5 NVMe do not support channel devices) The Following OCP3.0 NIC only support optic cable with thermal Spec 85C and power <=2.5W ( DPN:4WGYD) Channel devices Intel E810-CQDA2 100G QSF28 DPN: N8PW5 in 10x2.5 NVMe config. only (8x2.5 NVMe do not support channel devices) The Following PCIe NIC only support optic cable with thermal Spec 85C and power <=1.2W ( DPN: M14MK) Broadcom 100G 2P QSF DPN: 61PR9 Mellonax 25G DP OCP3 CX6 LX SPF28 DPN: 9XCTH Mellonax 25G 2P OCP3 CX6 LX SPF28 DPN: DN78C The Following PCIe NIC only support optic cable with thermal Spec 85C and power <=2.5 W Channel Devices Intel Columbiaville DP 100GbE Intel Columbiaville 100G 2P Q28 DPN: DWNRF in both configs.	Not support CPU TDP > 165W Not support BOSS M.2 Module Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards Not support NIC consuming power >= 25W. Not Support Config with RM Not support OCP transfer rate >25 G or cooling tier > 10 Optic Cable with spec 85°C is required. Two PSUs are required. System performance may be reduced in the event of a PSU failure	A4 environment not Support

Table 6. 10 x 2.5-inch NVMe storage configuration
Dell EMC PowerEdge Server Standard Operating Support (ASHRAE A2 compliant) All options supported unless otherwise noted.	Dell EMC PowerEdge Server Extended Inletient 40°C Operating Support (ASHRAE A3 compliant)	Dell EMC PowerEdge Server Extended Inletient 45°C Operating Support (ASHRAE A4 compliant)
HPR Gold fan is required 10 x 2.5-inch NVMe config processor TDP > 220 W SM only support 4x2.5 NVMe at HDD#0~ HDD#3 and SM Blank x 3 are required at HDD#4 ~HDD#9. 10 x 2.5-inch NVMe config processor TD P >220W, RIO do not support PCIe2 8 x 2.5-inch NVMe config do not support processor TDP >220W The Following OCP 3.0 NIC only support optic cable with thermal Spec 85°C and power <=1.2 W Broadcom Thor QP 25G SFP28 Solarflare Medford2 DP 25GbE SFP28 in both configs. The Following PCIe NIC only support optic cable with thermal Spec 85C and power <=2.5 W Channel Devices Intel Columbiaville DP 100GbE	Not support processor TDP > 165W Not support BOSS M.2 Module Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards Not support NIC consuming power >= 25W. Not Support Config with RM Not support OCP transfer rate >25 G or cooling tier > 10 Optic Cable with spec 85°C is required. Two PSUs are required. System performance may be reduced in the event of a PSU failure	Not support processor TDP > 135 W Not support BOSS M.2 Module Not support Non-Dell qualified peripheral cards and Channel devices (FW) cards Not support NIC consuming power >= 25 W. Not Support Config with RM Not support OCP transfer rate >25 G or cooling tier > 10 Optic Cable with spec 85°C is required. Two PSUs are required. System performance may be reduced in the event of a PSU failure

Table 7. Thermal Solution Configuration
Configurations	Rear drive configurations	Processor (TDP)	Fan type	Heat sink type	Air Shroud	Memory Blank	Processor Blank	Fan Counts	Fan Blank
4 x 3.5-inch drives	without rear drives	TDP <= 165 W	**STD fan	*STD HSK	Yes	No	Only required on processor 2 for 1 processor Configuration	7 x fans for 2 processors Configuration 5 x fans for 1 processors Configuration	Only required on fan Slot 1 and slot 2 for 1 processor configuration
	without rear drives	165 W < TDP <= 220 W	HPR Silver Fan (HPR)	HPR HSK
	with rear dries	TDP <= 165 W	HPR Silver Fan (HPR)	*STD HSK
	with rear dries	165 W < TDP <= 220 W	HPR Silver Fan (HPR)	HPR HSK
8 x 2.5-inch SAS/SATA drives	without rear drives	TDP <= 165 W	**STD fan	*STD HSK
8 x 2.5-inch SAS/SATA drives	without rear drives	165 W < TDP <= 220 W	HPR Silver Fan (HPR)	HPR HSK
10 x 2.5-inch SAS/SATA drives	without rear drives	TDP <= 165 W	***HPR Silver Fan (HPR)	*STD HSK
	without rear drives	165 W < TDP <= 220 W	HPR Gold Fan (VHP)	HPR HSK
	with rear dries	TDP <= 165 W	HPR Gold Fan (VHP)	*STD HSK
	with rear dries	165 W < TDP <= 220 W	HPR Gold Fan (VHP)	HPR HSK
8 and 10 x 2.5-inch NVMe drives	without rear drives	TDP <= 165 W	HPR Gold Fan (VHP)	*STD HSK
8 and 10 x 2.5-inch NVMe drives	without rear drives	165 W < TDP <= 220 W	HPR Gold Fan (VHP)	HPR HSK
No Backplane	without rear drives	TDP <= 165 W	**STD fan	*STD HSK
No Backplane	without rear drives	165 W < TDP <= 220 W	HPR Silver Fan (HPR)	HPR HSK