Dell EMC PowerEdge R6415: характеристики и спецификации

System dimensions

Figure 1. Dimensions of the PowerEdgeR6415 system This image shows dimensions of the PowerEdgeR6415 system

Table 1. Dimensions of the PowerEdge R6415 system . This table gives details of the dimensions of the Dell EMC PowerEdge R6415 system
Xa	Xb	Y	Za (with bezel)	Za (without bezel)	Zb	Zc
482.0 mm (18.97 inches)	434.0 mm (17.08 inches)	42.8 mm (3.41 inches)	35.84 mm (1.41 inches)	22 mm (0.87 inches)	x4 and x10 = 657.25 mm (25.87 inches) x8 = 606.47 (23.87 inches)	x4 and x10 = 692.62 (27.26 inches) x8 = 641.85 mm (25.26 inches)

Chassis weight

Table 1. Chassis weight. The table below shows the maximum weight of the R6415.
System	Maximum weight (with all drives/SSDs)
4 x 3.5 inch drive system	16.91 kg (37.28 lb)
8 x 2.5 inch drive system	14.5 kg (34.17 lb)
10 x 2.5 inch drive system	16.01 kg (35.29 lb)

Processor specifications

The PowerEdge R6415 system supports one AMD EPYC™ processor.

Supported operating systems

The R6415 supports the following operating systems:

Microsoft Windows Server® with Hyper-V
Red Hat® Enterprise Linux
Canonical® Ubuntu® LTS
SUSE® Linux Enterprise Server

Virtualization options:

VMware® ESXi 6.7
Citrix® XenServer® 7.1

NOTE: For more information about the specific versions and additions, go to https://www.dell.com/support/home/Drivers/SupportedOS/poweredge-r6415.

PSU specifications

The PowerEdge R6415 system supports the following AC power supply units (PSUs).

Table 1. PSU specifications. The table below are the specifications for power supplies.
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage
550 W AC	Platinum	2107 BTU/hr	50/60 Hz	100–240 V AC, autoranging
450 W AC (cabled)	Bronze	1871 BTU/hr	50/60 Hz	100–240 V AC, autoranging

NOTE: Heat dissipation is calculated using the PSU wattage rating.

NOTE: This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 230 V.

System battery specifications

The PowerEdge R6415 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion bus specifications

The PowerEdge R6415 system supports up to two Gen3 PCI express (PCIe) expansion cards, which need to be installed on the system board using expansion card risers. The R6415 system supports three configurations:

Riser configuration: Supported configuration
No riser: N/A
Single PCIe slot riser: 1 x 16x Gen3 slot
Dual PCIe slot riser: 2 x 16x Gen3 slots

Memory specifications

The PowerEdge R6415 system supports 16 DDR4 registered DIMM (RDIMMs) slots. Supported memory bus frequencies are 2666 MT/s, 2400 MT/s, 2133 MT/s, and 1866 MT/s.

Table 1. Memory specifications. The table below shows the memory specifications.
Memory module sockets	Memory capacity	Minimum RAM	Maximum RAM
Sixteen 288-pin	8 GB, 16 GB, or 32 GB single rank or dual rank (RDIMMs) 64GB quad rank (LRDIMMs)	8 GB with single processor	1 TB with a single processor

NOTE: For optimal performance, populate one DIMM per channel with DDR4-2666 memory modules on the first slot of each memory channel. The first slot of each channel can be identified as the DIMM slots with white latches. For example, 64 GB system memory capacity can be divided into 8 x 8 GB DIMM slots.

Drives

The PowerEdge R6415 system is available in these configurations:

Up to 4 x 3.5 inch SAS or SATA drives
Up to 8 x 2.5 inch SAS or SATA drives
Up to 10 x 2.5 inch NVMe drives (with 8 SAS/SATA/NVMe drives from slot 0 to slot 7 + 2 NVMe drives from slot 8, 9)

NOTE: Hot swap for the NVMe drives is supported for your system. For more information on correct usage and technical specifications, see the Dell PowerEdge Express Flash NVMe PCIe SSD 2.5 inch Small Form Factor User's Guide at Dell.com/support/manuals > All Products > Server, Storage, & Networking > Dell Adapters page.

USB ports

The PowerEdge R6415 system supports:

The following table provides more information about the USB specifications:

Table 1. USB specifications. The table below shows the USB specifications for the PowerEdge R6415 system.
Front panel	Back panel	Internal USB
Two USB 2.0 ports (One AB– Micro USB 2.0 port (dedicated iDRAC Direct) + one standard USB 2.0 port) NOTE: The micro USB 2.0 compliant port on the front of the system can only be used as an iDRAC Direct or a management port	Two USB 3.0 ports	One internal USB 3.0 port

NIC ports

The PowerEdge R6415 system supports two onboard network ports accessible from the back panel, each port supports up to 1 Gbps. The system also supports LAN on Motherboard (LOM) on an optional riser card.

You can install one LOM riser card. The supported options are listed here:

2 x 1 Gb Base-T
2 x 10Gb Base-T
2 x 10Gb SPF+
2 x 25Gb SPF+

NOTE:
- You can install up to two PCIe add-on NIC cards.
- For information about Linux network performance settings, see the Linux® Network Tuning Guide for AMD EPYC™ Processor Based Servers AMD tuning guide.

Serial connector

The serial connector connects a serial device to the system. The PowerEdge R6415 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge R6415 system supports two 15-pin VGA ports one each on the front and back panels.

Internal Dual SD Module and vFlash module

The PowerEdge R6415 system supports two options for the Internal Dual SD Module (IDSDM) and vFlash module:

vFlash memory card slot along with dual MicroSD cards supported on the same module
vFlash memory card slot module

NOTE:
- In the IDSDM one of the MicroSD card slots is dedicated for redundancy.
- The IDSDM card provides software RAID1 support for the MicroSD cards.
- Dual MicroSD cards are not required as the module can operate with only one card but will provide no redundancy or RAID capability.

Video specifications

The PowerEdge R6415 system supports Matrox G200eR2 graphics card with 16 MB capacity.

Table 1. Supported video resolution options . This table describes the supported video resolution options
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE: For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on support.dell.com.

Table 1. Temperature specifications . The table below shows the optimal working temperature specifications.
Temperature	Specifications
Storage	–40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft)	10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Fresh air	For information about fresh air, see the Expanded Operating Temperature section.
Maximum temperature gradient (operating and storage)	20°C/h (68°F/h)

Table 2. Relative humidity specifications . The table below shows the relative humidity specification during operations and storage.
Relative humidity	Specifications
Storage	5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating	10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.

Table 3. Maximum vibration specifications . The table below shows the maximum vibration specifications during operations and storage.
Maximum vibration	Specifications
Operating	0.26 G _rms at 5 Hz to 350 Hz (all operation orientations).
Storage	1.88 G _rms at 10 Hz to 500 Hz for 15 min (all six sides tested).

Table 4. Maximum shock specifications . The table below shows the maximum shock specifications during operations and storage.
Maximum shock	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.

Table 5. Maximum altitude specifications . The table below shows the maximum altitude specifications during operations and storage.
Maximum altitude	Specifications
Operating	3048 m ( 10,000 ft)
Storage	12,000 m (39,370 ft)

Table 6. Operating temperature derating specifications . The table below shows the operating temperature derating specifications.
Operating temperature derating	Specifications
Up to 35°C (95°F)	Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
35°C to 40°C (95°F to 104°F)	Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
40°C to 45°C (104°F to 113°F)	Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications . Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications . The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate	<200 Å/month as defined by AHSRAE TC9.9.

NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Standard operating temperature

Table 1. Standard operating temperature specifications . The standard operating temperature for altitude less than 950 metres or 3117 feet ranges from 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Standard operating temperature	Specifications
Continuous operation (for altitude less than 950 m or 3117 ft)	10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.

Expanded operating temperature

Table 1. Expanded operating temperature specifications . When the system is in continuous operation, the expanded operating temperature ranges from 10°C to 35°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 40°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft). When the system is operating at < 1% of annual operating hours, the expanded operating temperature is –5°C to 45°C at 5% to 90% RH with 29°C dew point.
NOTE: Outside the standard operating temperature (10°C to 40°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Expanded operating temperature	Specifications
Continuous operation	5°C to 35°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 40°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours	–5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 40°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE: When operating in the expanded temperature range, system performance may be impacted.

NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the bezel's LCD panel and in the System Event Log.

Expanded operating temperature restrictions

Do not perform a cold startup below 5°C.
The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
Redundant power supply configuration is required.
Cabled power supply unit is not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
Processors that consume more than 180 W are not supported.

Thermal restriction matrix

Table 1. Thermal restriction matrix for R6415 . This table describes the thermal restriction for R6415.
Features, processor type and specifications			Configuration type and ambient temperature support
Storage configuration			4 x 3.5 inch drives	8 x 2.5 inch drives	10 x 2.5 inch drives (NVMe)
Fan type			Standard fan	Standard fan	Performance fan
CPU heat sink type			1U heat sink	1U heat sink	1U heat sink
Processor number	TDP (W)	Core count	Ambient = 35°C	Ambient = 35°C	Ambient = 30°C
AMD 7601	180 W	32	Yes	Yes	Yes
AMD 7551P	180 W	32	Yes	Yes	Yes
AMD 7451	180 W	24	Yes	Yes	Yes
AMD 7401P	155 W/170 W	24	Yes	Yes	Yes
AMD 7351P	155 W/170 W	16	Yes	Yes	Yes
AMD 7251	120 W	8	Yes	Yes	Yes
AMD 7281	155 W/170 W	16	Yes	Yes	Yes
AMD 7261	155 W/170 W	8	Yes	Yes	Yes

Other thermal restrictions

Mellanox CX4 and CX5 only support up to 35°C ambient

Dell EMC PowerEdge R6415: технические характеристики и спецификации