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Dell EMC PowerEdge R640: технические характеристики и спецификации
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Сервер Dell PowerEdge R640 210-AKWU-99WCS23
Сервер Dell PowerEdge R640 210-AKWU-99WCS23
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Dell EMC PowerEdge R640: технические характеристики и спецификации

System dimensions

Figure 1. System dimensions
The image shows System dimensions
Table 1. Dimensions

This table gives details of the dimensions of the Dell Technologies PowerEdge system:

SystemXaXbYZa (with bezel)Za (without bezel)Zb*Zc

4 x 3.5-inches

or

10 x 2.5-inches

482.0 mm

(18.97-inches)

434.0 mm

(17.08-inches)

42.8 mm

(1.68-inches)

35.84 mm

(1.41-inches)

22.0 mm

(0.87-inches)

733.82 mm

(29.61-inches)

772.67 mm

(30.42-inches)

8 x 2.5-inches482.0 mm

(18.97-inches)

434.0 mm

(17.08-inches)

42.8 mm

(1.68-inches)

35.84 mm

(1.41-inches)

22.0 mm

(0.87-inches)

683.05 mm

(26.89-inches)

721.91

(28.42-inches)

Chassis weight

Table 1. Chassis weight

The table below shows the maximum weight of the R640

System Maximum weight (with all hard drives/SSDs)
PowerEdge R640 21.9 kg

(48.28 lbs)

Processor specifications

The PowerEdge R640 system supports two 2nd generation Intel Xeon Scalable processors, up to 28 cores per processor.
NOTE: The sockets for the processors are not hot-pluggable.

Cooling fan specifications

The cooling fans are integrated into the system to dissipate the heat generated by the functioning of the system. These fans provide cooling for the processors, expansion cards, and memory modules.

Your system supports up to eight standard or high performance cooling fans.

NOTE:
  • High performance fans can be identified by a blue label on top of the cooling fan.
  • Mixing of standard and high performance cooling fans is not supported.
  • Each fan is listed in the systems management software, referenced by the respective fan number. If there is a problem with a particular fan, you can easily identify and replace the proper fan by noting the fan number on the system.

PSU specifications

The PowerEdge R640 system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications

The table below are the specifications for 495 W, 750 W, 1100 W, and 1600 W power supplies:

PSU Class Heat dissipation (maximum) Frequency Voltage
495 W AC Platinum 1908 BTU/hr 50/60 Hz 100–240 V AC, autoranging
750 W AC Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC, autoranging
750 W Mixed Mode AC Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC, 10 A - 5 A
750 W AC Titanium 2843 BTU/hr 50/60 Hz 200–240 V AC
750 W Mixed Mode HVDC (for China only) Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC
750 W Mixed Mode DC (for China only) N/A 2891 BTU/hr 50/60 Hz 240 V DC, 4.5 A
1100 W DC N/A 4416 BTU/hr 50/60 Hz –(48–60) V DC
1100 W Mixed Mode HVDC (for China and Japan only) Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC and 200–380 V DC
1100 W AC Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC
1600 W AC Platinum 6000 BTU/hr 50/60 Hz 100–240 V AC
1600 W AC Titanum 5970 BTU/hr 50/60 Hz 200–240 V AC
NOTE: If system with 1100 W AC or HVDC PSU operates from 100 to 120V, the power rating per PSU is derated to 1050 W.
NOTE: If system with 1600 W PSUs operates from 100 to 120 V, then the power rating per PSU is derated to 800 W.
NOTE: Heat dissipation is calculated using the PSU wattage rating.
NOTE: This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 230 V.
NOTE: PSUs rated for 1600 W and higher require high-line voltage (200-240 V) to supply their rated capacity.

System battery specifications

The PowerEdge R640 system supports CR 2032 lithium coin cell system battery.

Expansion bus specifications

The PowerEdge R640 system supports PCI express (PCIe) generation 3 expansion cards, which are installed on the system, using expansion card risers. This system supports 1A, 2A, 1B, and 2B expansion card risers.

NOTE:
  • The expansion card riser slots are not hot-pluggable.
  • Internal cable connectors are not hot-pluggable.

Memory specifications

Table 1. Memory specificationsThe table below shows the memory specifications for the R640 system:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
LRDIMM Octa rank 512 GB 512 GB 6 TB 1024 GB 12 TB
256 GB 256 GB 3 TB 512 GB 6 TB
128 GB 128 GB 1.5 TB 256 GB 3 TB
Quad rank 64 GB 64 GB 768 GB 128 GB 1.5 TB
RDIMM Single rank 8 GB 8 GB 96 GB 16 GB 192 GB
Dual rank 16 GB 16 GB 192 GB 32 GB 384 GB
32 GB 32 GB 384 GB 64 GB 768 GB
64 GB 64 GB 768 GB 128 GB 1536 GB
NVDIMM-N Single rank 16 GB Not supported with single processor Not supported with single processor RDIMM: 192 GB RDIMM: 384 GB
NVDIMM-N: 16 GB NVDIMM-N: 192 GB
PMem NA 128 GB RDIMM: 64 GB RDIMM: 384 GB RDIMM: 128 GB LRDIMM: 1536 GB
PMem: 128 GB PMem: 768 GB PMem: 128 GB PMem: 1536 GB
NA 256 GB NA NA RDIMM: 192 GB LRDIMM: 1536 GB
NA NA PMem: 2048 GB PMem: 3072 GB
NA 512 GB NA NA RDIMM: 384 GB RDIMM: 1536 GB
NA NA PMem: 4096 GB PMem: 6144 GB
NOTE: 8 GB RDIMMs and NVDIMM-N must not be mixed.
NOTE: Minimum of two CPUs are required for any configurations that support NVDIMM-N.
NOTE: PMem can be mixed with RDIMMs and LRDIMMs.
NOTE: Mixing of DDR4 DIMM Types (RDIMM, LRDIMM), within channel, integrated memory controller, socket, or across sockets is not supported.
NOTE: x4 and x8 DDR4 DIMMs can be mixed within channel.
NOTE: Mix of Intel PMem operating modes (App Direct, Memory Mode) is not supported within socket or across sockets.
NOTE: DIMM slots are not hot-pluggable.

Storage controller specifications

The PowerEdge R640 system supports:

  • Internal storage controller cards: PowerEdge RAID Controller (PERC) H330, H350, HBA350i, H730P, H740P, H750 (adapter only), Software RAID (SWRAID) S140.
  • Boot Optimized Storage Subsystem: HWRAID 2 x M.2 SSDs 240 GB, 480 GB.
    • The card supports up to two 6 Gbps M.2 SATA drives. The BOSS adapter card has a x8 connector using PCIe gen 2.0 x2 lanes, available only in the low-profile and half-height form factor.
  • External PERC (RAID): H840
  • 12Gbps SAS HBAs (non-RAID):
    • External- 12 Gbps SAS HBA (non-RAID), HBA355e (adapter only, non-RAID)
    • Internal- HBA330 (non-RAID), HBA350i (non-RAID)
NOTE: The mini-PERC socket is not hot-pluggable.
NOTE: The PERC H750, H350 and HBA350i cards are not supported on 4x3.5 + 2x2.5 dual PERC, 10x2.5 + 2x2.5 dual PERC, or x10 NVMe configurations.

Hard drive specifications

The PowerEdge R640 supports :

  • Up to ten 2.5 inch, hot swappable SAS, SATA, SAS/SATA SSD, NVMe (up to 8x) or Nearline SAS hard drives with up to 2 x 2.5 inch hot swappable SAS, SATA, SAS/SATA SSD, NVMe or Nearline SAS hard drives supported at the back of the system
  • Up to eight 2.5 inch, hot swappable SAS, SATA, SAS/SATA SSD, or Nearline SAS hard drives
  • Up to four 3.5 inch, hot swappable hard drives with up to 2 x 2.5 inch hot swappable SAS, SATA, SAS/SATA SSD, or Nearline SAS hard drives supported at the back of the system

Optical drive

Certain configurations of the system support one optional SATA DVD-ROM drive or DVD+/-RW drive.

NOTE: The optical drive is supported in both 4 x 3.5 and 8 x 2.5 inch hard drive systems.

USB ports

Table 1. USB port specifications

The supported USB specifications for the PowerEdge R640 system are:

System Front panel Back panel Internal
Four hard drive systems One 4-pin, USB 2.0-compliant ports Two 9-pin, USB 3.0-compliant ports One 9-pin, USB 3.0-compliant ports
One 5-pin micro USB 2.0 management port
NOTE: The micro USB 2.0-compliant port on the front panel can only be used as an iDRAC Direct or a management port.
N/A N/A
Eight hard drive systems One 4-pin, USB 2.0-compliant ports Two 9-pin, USB 3.0-compliant ports
NOTE: One optional USB 3.0-compliant port on the front panel for 4 x 3.5 and 8 x 2.5 inch hard drive systems.
One 9-pin, USB 3.0-compliant ports
One 5-pin micro USB 2.0 management port N/A N/A
Ten hard drive systems One 4-pins, USB 2.0-compliant port Two 9-pin, USB 3.0-compliant ports One 9-pin, USB 3.0-compliant ports
One 5-pin micro USB 2.0 management port N/A N/A

NIC ports

The PowerEdge R640 system supports four Network Interface Controller (NIC) ports on the back panel, which are available in the following configurations:
  • Four RJ-45 ports that support 10, 100 and 1000 Mbps
  • Four RJ-45 ports that support 100 M, 1 G and 10 Gbps
  • Four RJ-45 ports, where two ports support maximum of 10 G and the other two ports maximum of 1 Gbps
  • Two RJ-45 ports that support up to 1 Gbps and 2 SFP+ ports that support up to 10 Gbps
  • Four SFP+ ports that support up to 10 Gbps
  • Two SFP28 ports that support up to 25 Gbps
NOTE: You can install up to three PCIe add-on NIC cards.
NOTE: The NDC slot is not hot-pluggable.

Serial port

The PowerEdge R640 system supports one serial port on the back panel. This port is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

NOTE: The Serial port is not hot-pluggable.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge R640 system supports one 15-pin VGA port on the front and back of system.

NOTE: The VGA ports are not hot-pluggable.

Video specifications

The PowerEdge R640 system supports integrated Matrox G200eW3 graphics controller with 16 MB of video frame buffer .

Table 1. Supported video resolution optionsThis table describes the supported video resolution options:
Resolution Refresh rate (Hz) Color depth (bits)
640 x 480 60, 70 8, 16, 32
800 x 600 60, 75, 85 8, 16, 32
1024 x 768 60, 75, 85 8, 16, 32
1152 x 864 60, 75, 85 8, 16, 32
1280 x 1024 60, 75 8, 16, 32
1440 x 900 60 8, 16, 32
1920 x 1200 60 8, 16, 32

IDSDM or vFlash card

The PowerEdge R640 system supports Internal Dual SD module (IDSDM) and vFlash card. In the 14th generation of PowerEdge servers, IDSDM and vFlash card are combined into a single module, and are available in the following options:

  • vFlash or
  • vFlash and IDSDM

The IDSDM/vFlash card can be connected in a Dell-proprietary PCIe x1 slot using a USB 3.0 interface to host. IDSDM/vFlash module supports two MicroSD cards for IDSDM and one card for vFlash. The MicroSD card capacity for IDSDM are 16, 32, or 64 GB, while for vFlash the MicroSD card capacity is 16 GB. The IDSDM or vFlash module combines the IDSDM or vFlash features into a single module.

NOTE: There are two dip switches on the IDSDM/vFlash card for write-protection.
NOTE: One IDSDM card slot is dedicated for redundancy.
NOTE: It is recommended to use Dell branded MicroSD cards associated with the IDSDM/vFlash configured systems.
NOTE: The IDSDM and vFlash slot is not hot-pluggable.

Environmental specifications

NOTE: For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/poweredgemanuals
Table 1. Temperature specifications

The table below shows the optimal working temperature specifications:
Temperature Specifications
Storage –40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
NOTE: Maximum of 205 W, 28 core processor is supported in systems with eight 2.5 inch processor direct attached PCIe SSD drives, and three PCIe slot chassis.
NOTE: Certain configurations may have ambient temperature restrictions. For more information see the Ambient temperature limitations section.
Fresh air For information about fresh air, see Expanded Operating Temperature section.
Maximum temperature gradient (operating and storage) 20°C/h (68°F/h)
Table 2. Relative humidity specifications

The table below shows the relative humidity specification during operations and storage:
Relative humidity Specifications
Storage 5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating 10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.
Table 3. Maximum vibration specifications

The table below shows the maximum vibration specifications during operations and storage:
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Table 4. Maximum shock specifications

The table below shows the maximum shock specifications during operations and storage:

Maximum shock Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Table 5. Maximum altitude specifications

The table below shows the maximum altitude specifications during operations and storage.
Maximum altitude Specifications
Operating

3048 m (10,000 ft)
Storage 12,000 m (39,370 ft)
Table 6. Operating temperature de-rating specifications

The table below shows the operating temperature de-rating specifications:
Operating temperature de-rating Specifications
Up to 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
35°C to 40°C (95°F to 104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
40°C to 45°C (104°F to 113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).

Standard operating temperature

Table 1. Standard operating temperature specifications

The standard operating temperature for altitude less than 950 m or 3117 ft ranges 5°C–40°C (41°F–104°F) with no direct sunlight on the equipment.

NOTE: The chassis supports a maximum of 135 W processors.
Standard operating temperature Specifications
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.

Expanded operating temperature

Table 1. Expanded operating temperature specifications

When the system is in continuous operation, the expanded operating temperature ranges from 5°C–40°C at 5% to 85% RH with 29°C dew point.

NOTE: Outside the standard operating temperature (10°C–35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures 35°C – 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft). When the system is operating at < 1% of annual operating hours, the expanded operating temperature is –5°C–45°C at 5% to 90% RH with 29°C dew point.
NOTE: Outside the standard operating temperature (10°C–35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Expanded operating temperature Specifications
≤ 10% of annual operating hours 5°C–40°C at 5% to 85% RH with 29°C dew point.
NOTE: Outside the standard operating temperature (10°C–35°C), the system can operate down to 5°C or up to 40°C for a maximum of 10% of its annual operating hours.

For temperatures between 35°C–40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).

≤ 1% of annual operating hours –5°C–45°C at 5% to 90% RH with 29°C dew point.
NOTE: Outside the standard operating temperature (10°C–35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours.

For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE: When operating in the expanded temperature range, system performance may be impacted.
NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD panel and in the System Event Log.

Expanded operating temperature restrictions

  • Do not perform a cold startup below 5°C.
  • The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
  • 150 W/8 C, 165 W/12 C and higher wattage processor(TDP>165 W) are not supported.
  • Redundant power supply unit is required.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • NVDIMM-Ns are not supported.
  • PMems are not supported.
  • GPU is not supported.
  • PCIe SSD is not supported.
  • Rear installed drives are not supported
  • Tape backup unit is not supported.

Thermal restrictions

The following table lists the configurations required for efficient cooling.

Table 1. Thermal restrictions configurationThe following table describes the configuration required for efficient cooling.
Configuration Number of processors Heatsink Processor/DIMM blank DIMM blanks Maximum number of DIMM blanks Fan

PowerEdge R640 (2.5 inch hard drives x 10)

1 One 1U standard heat sink for CPU ≤ 165 W Not required Required for processor 1 11 blanks Five standard fans
One 1U 2-pipe heat sink for CPU=200/205 W and 150 W/165 W FO* Required Eight high performance fans
2 Two 1U standard heat sink for CPU ≤ 165 W Not required Eight standard fans
Two 1U 2-pipe heat sink for CPU=200/205 W and 150 W/165 W FO* Required 22 blanks Eight high performance fans

PowerEdge R640 (2.5 inch hard drives x 10 with NVMe drives)

2 Two 1U standard heat sink for CPU ≤ 165 W Not required Required 22 blanks Eight high performance fans
Two 1U 2-pipe heat sink for CPU=200/205 W and 150 W/165 W FO*
PowerEdge R640

(2.5 inch hard drives x 8)

(3.5 inch hard drives x 4)

1 One 1U standard heat sink for CPU ≤ 165 W Not required Required for processor 1 11 blanks Five standard fans
One 1U 2-pipe heat sink for CPU=150 W/165 W FO* Required
One 1U 2-pipe heat sink for CPU=200/205 W Eight high performance fans
2 Two 1U standard heat sink for CPU ≤ 165 W Required Eight standard fans
Two 1U 2-pipe heat sink for CPU=150 W/165 W FO* Not required Eight high performance fans
Two 1U 2-pipe heat sink for CPU=200/205 W Not required Required 22 blanks

PowerEdge R640 (3.5 inch hard drives x 4 with NVMe drives x 2 in the rear)

2 Two 1U standard heat sink for CPU <= 165 W Not required Required 22 blanks Eight standard fans
Two 1U 2-pipe heat sink for CPU=155 W/165 W FO*
Two 1U 2-pipe heat sink for CPU=200/205W
NOTE: *165 W and 150 W FO includes Intel Xeon Gold 6146, 6144, 6244 and 6246 processors.
Table 2. PMem thermal restrictions configurationThe following table describes the PMem thermal restrictions.
Configuration TDP Maximum ambient temperature Fan requirement Heatsink Requirement
PowerEdge R640

2.5 inch x10 hard drives (PCIe x3)

3.5 inch x4 hard drives (PCIe x2/x3)

2.5 inch x8 hard drives (PCIe x3/x2)

200/205 W

155/165 W FO*

165 W Gold 6146

150 W 6144 and 6244

150 W Gold 6240Y

30oC

High performance fans

High performance heat sink

35oC
35oC
35oC
35oC
PowerEdge R640

2.5 inch x10 hard drives (PCIe x3)

3.5 inch x4 hard drives (PCIe x2/x3)

2.5 inch x8 hard drives (PCIe x3/x2)

70 to 165 W

35oC

High performance fans

High performance heat sink

NOTE: When installing PMems for systems that support 200W or higher wattage processors, the ambient temperature of 30oC must be adhered to ensure proper cooling and to avoid excess processor throttling, which may impact system performance.
Table 3. GPU thermal restrictions configurationThe following table describes the GPU thermal restrictions.

TDP(Watts)

PowerEdge R640 2.5 inch hard drives x 10 x2GPU in slot 1,3

PowerEdge R640 (2.5 inch hard drives x 8 x3GPU)

Thermal restriction at 30oC

Thermal restriction at 35oC

Thermal restriction at 30oC

Thermal restriction at 35oC

200/205 W

155/165 W FO*

165 W Gold 6146

150 W 6144 and 6244

150 W Gold 6240Y

High performance fans and High performance heat sink required

Not supported

High performance fans and High performance heat sink required

Not supported

70 to 165 W

Standard fans and standard heat sink required

Not supported

Standard fans and standard heat sink required

Not supported

NOTE: PowerEdge R640 does not support x3 GPU T4 (PPGXG) in 2.5 inch x10 hard drive chassis.

Ambient temperature limitations

The following table lists configurations that require ambient temperature less than 35°C.

NOTE: The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess processor throttling, which may impact system performance.
Table 1. Configuration based ambient temperature restrictionsThe following table describes the configurations required with ambient temperature restriction.
System Front Backplane Processor Thermal Design Power Processor Heat Sink Fan Type Ambient Restriction
PowerEdge R640

10 x 2.5 inch SAS/SATA hard drives

8 x 2.5 inch SAS/SATA hard drives

4 x 3.5 inch SAS/SATA hard drives

200 W, 205 W 2 pipe 1U high performance High performance fan 30°C
10 x 2.5 inch SAS/SATA and NVMe drives(4, 8, or 10) 165 W 2 pipe 1U standard High performance fan 30°C
200 W, 205 W 2 pipe 1U high performance

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications

Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have the MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE: This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE: Air entering the data center must have the MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specifications

The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate <200 Å/month as defined by AHSRAE TC9.9.
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.