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Dell EMC PowerEdge R540: технические характеристики и спецификации
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Сервер Dell PowerEdge R540 210-ALZH-324-200
Сервер Dell PowerEdge R540 210-ALZH-324-200
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Dell EMC PowerEdge R540: технические характеристики и спецификации

System dimensions

Figure 1. Dimensions of the Dell EMCPowerEdgeR540 system
This image shows dimensions of the PowerEdge R540 system
Table 1. Dimensions of the Dell EMCR540 systemThis table gives details of the dimensions of the Dell EMCR540 system
XaXbYZa (with bezel)Za (without bezel)Zb Zc
482.0 mm (18.97 inches)434.0 mm (17.08 inches)86.8 mm (3.41 inches)35.84 mm (1.41 inches)22 mm (0.87 inches)647.07 mm (25.47 inches) 681.755 mm (26.84 inches)

Chassis weight

Table 1. Chassis weightThe table below shows the maximum weight of the R540.
SystemMaximum weight (with all drives/SSDs)
8 x 3.5 inch25.4 kg (55.99 lb)
12 x 3.5 inch29.68 kg (65.43 lb)

Processor specifications

The Dell EMC PowerEdge R540 System supports up to two Intel Xeon Scalable processors, up to 20 cores per processor.

Supported operating systems

The Dell EMC PowerEdgeR540 supports the following operating systems:
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • Canonical Ubuntu LTS
  • Microsoft Windows Server with Hyper-V
  • VMware ESXi
  • Citrix XenServer
NOTE For more information, go to www.dell.com/ossupport

Cooling fans specifications

Your system supports up to six standard or high performance cabled cooling fans.

Table 1. Fan support matrix for Dell EMC PowerEdge R540 SystemThis table describes the fan support matrix for Dell EMC PowerEdge R540 System.
Front Storage PSU type CPU count Fan1 Fan2 Fan3 Fan4 Fan5 Fan6
8 x 3.5-inch Cable PSU or Redundant PSU 1 Not required Required Required Required Required Not required
Redundant PSU 2 Not required Required Required Required Required Required
12 x 3.5-inch Redundant PSU only 1 Required Required Required Required Required Not required
2 Required Required Required Required Required Required
NOTE The high performance fans are required for 12 x 3.5-inch drive + 2 x 3.5-inch rear drive system. For more information, see the Thermal restriction matrix topic in the Technical specifications section.

PSU specifications

The Dell EMC PowerEdge R540 system supports the following AC or DC power supply units (PSU).
Table 1. PSU specificationsThe table below are the specifications for power supplies.
PSU Class Heat dissipation (maximum) Frequency Voltage
1100 W AC Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC, autoranging
1100 W Mixed Mode HVDC Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC, autoranging
1100 W Mixed Mode HVDC(For China and japan only) Platinum 4100 BTU/hr 200–380 V DC, autoranging
750 W AC Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC, autoranging
750 W Mixed Mode Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC, autoranging
750 W Mixed Mode (For China only) Platinum 2891 BTU/hr 240 V DC
750 W Mixed Mode HVDC (For China only) Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC, autoranging
240 V DC
495 W AC Platinum 1908 BTU/hr 50/60 Hz 100–240 V AC, autoranging
450 W AC (no longer offering) Bronze 1871 BTU/hr 50/60 Hz 100–240 V AC, autoranging
NOTE Heat dissipation is calculated using the PSU wattage rating.
NOTE This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 230 V.

System battery

The Dell EMC PowerEdge R540 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion bus specifications

The Dell EMC PowerEdge R540 system supports PCI express (PCIe) generation three expansion cards, which must be installed on the system board using expansion card risers.
Table 1. Expansion bus specifications
Expansion card riser PCIe slots on the riser Height Length Link
LOM riser Slot 1 Mezz type Mezz type x8
Right riser Slot 2 Low profile Half length x16
Right riser Slot 2 Half height Half length x16
Internal riser Slot intergrated Low profile Half length x8
Butterfly riser Slot 2 Full height Half length x8
Butterfly riser Slot 3 Low profile Half length x8
Left riser Slot 3 Low profile Half length x16

Memory specifications

Table 1. Memory specificationsThe table below shows the memory specifications.
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
RDIMM Single rank 8 GB 8 GB 80 GB 16 GB 128 GB
RDIMM Dual rank 16 GB 16 GB 160 GB 32 GB 256 GB
RDIMM Dual rank 32 GB 32 GB 320 GB 64 GB 512 GB
LRDIMMQuad rank 64 GB 64 GB640 GB128 GB1024 GB

Storage controller specifications

The Dell EMC PowerEdge R540 system supports:
  • Software RAID: S140
  • Internal controllers: H750, H350, H740p, H730p, H330
  • Boot Optimized Storage Subsystem (BOSS): HWRAID 2 x M.2 SSDs 120 GB, 240 GB with 6 Gb/s
    • x8 connector using PCIe Gen 2.0 x2 lanes, available only in the low-profile and half-height form factor.
  • External controller: HBA355e, H840, 12 Gbps Ext SAS HBA
  • SAS Hot Bus Adapters: HBA350i, HBA330
NOTE The new generation PERC 11 H750, H350, and HBA350i adapters cannot be mixed with the PERC H740P, H730P, H330, HBA330 adapters of the previous generations in one system.

Drives

The PowerEdge R540 system supports:
  • Up to 12 x 3.5 inch drives or 2.5 inch drives with drive adapter, internal, hot swappable SAS, SATA, or Nearline SAS drives

    or

  • Up to 8 x 3.5 inch drives or 2.5 inch drives with drive adapter, internal, hot swappable SAS, SATA or Nearline SAS drives

Optical drives

The Dell EMC PowerEdge R540 system supports one optional slim SATA DVD-ROM drive or DVD +/-RW drive.

Tape Drives

The Dell EMC PowerEdge R540 system supports external tape backup devices.
NOTE The Dell EMC PowerEdge R540 system does not support internal tape drives.
Supported external tape drives:
  • External RD1000 USB
  • External LTO-5, LTO-6,LTO-7 and 6 Gb SAS tape drives
  • 114X rack mount chassis with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
  • TL1000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
  • TL2000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
  • TL2000 with LTO-5, LTO-6, and LTO-7 8Gb FC tape drives
  • TL4000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives
  • TL4000 with LTO-5, LTO-6, and LTO-7 8Gb FC tape drives
  • ML6000 with LTO-5, LTO-6, 6 Gb SAS tape drives
  • ML6000 with LTO-5, LTO-6, LTO-7 8Gb FC tape drives

USB ports

The Dell EMC PowerEdge R540 system supports:

Table 1. USB specificationsThe table below shows the USB specifications for the Dell EMC PowerEdge R540 system.
Front panel Back panelInternal USB
  • Two USB 2.0-compliant port
  • One iDRAC Direct (Micro-AB USB) port
  • Two USB 3.0-compliant port
  • One internal USB 3.0 port

NIC ports

The Dell EMC PowerEdge R540 system supports two Network Interface Controller (NIC) ports on the back panel, which have two 1 Gbps configuration.
NOTE You can install up to six PCIe NIC cards (five PCIe AIC cards, one OCP card).

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The Dell EMC PowerEdge R540 system supports two 15-pin VGA ports.

Serial connector

The serial connector connects a serial device to the system. The Dell EMC PowerEdge R540 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

Internal Dual SD Module

The Dell EMC PowerEdge R540 system supports two optional flash memory card slots with an internal dual MicroSD module.
NOTE One card slot is dedicated for redundancy.

Video specifications

The PowerEdge Dell EMC PowerEdge R540 system supports Matrox G200eW3 graphics card with 16 MB capacity.
Table 1. Supported video resolution optionsThis table describes the supported video resolution options
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/poweredgemanuals
Table 1. Temperature specificationsThe table below shows the optimal working temperature specifications.
Temperature Specifications
Storage –40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Fresh air For information about fresh air, see the Expanded Operating Temperature section.
Maximum temperature gradient (operating and storage) 20°C/h (68°F/h)
Table 2. Relative humidity specificationsThe table below shows the relative humidity specification during operations and storage.
Relative humidity Specifications
Storage 5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating 10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.
Table 3. Maximum vibration specificationsThe table below shows the maximum vibration specifications during operations and storage.
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Table 4. Maximum shock specificationsThe table below shows the maximum shock specifications during operations and storage.
Maximum shock Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Table 5. Maximum altitude specificationsThe table below shows the maximum altitude specifications during operations and storage.
Maximum altitude Specifications
Operating

30482000 m (10,0006560 ft)
Storage 12,000 m (39,370 ft)
Table 6. Operating temperature derating specificationsThe table below shows the operating temperature derating specifications.
Operating temperature derating Specifications
Up to 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
35°C to 40°C (95°F to 104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
40°C to 45°C (104°F to 113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).

Standard operating temperature

Table 1. Standard operating temperature specificationsThe standard operating temperature for altitude less than 950 metres or 3117 feet ranges from 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Standard operating temperature Specifications
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.

Expanded operating temperature

Table 1. Expanded operating temperature specificationsWhen the system is in continuous operation, the expanded operating temperature ranges from 10°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 40°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft). When the system is operating at < 1% of annual operating hours, the expanded operating temperature is –5°C to 45°C at 5% to 90% RH with 29°C dew point.

NOTE: Outside the standard operating temperature (10°C to 40°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Expanded operating temperature Specifications
Continuous operation 5°C to 40°C at 5% to 85% RH with 29°C dew point.
NOTE Outside the standard operating temperature (10°C to 40°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C.

For temperatures between 35°C and 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours –5°C to 45°C at 5% to 90% RH with 29°C dew point.
NOTE Outside the standard operating temperature (10°C to 40°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours.

For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
NOTE When operating in the expanded temperature range, system performance may be impacted.
NOTE When operating in the expanded temperature range, ambient temperature warnings may be reported on the bezel's LCD panel and in the System Event Log.

Expanded operating temperature restrictions

  • Do not perform a cold startup below 5°C.
  • The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
  • Redundant power supply configuration is required.
  • AEP DIMM is not supported.
  • GPGPU card is not supported.
  • Rear drive configuration is not supported.
  • 12 x 3.5 inch SM configuration with CPU 125 W/115 W/105 W_4C is not supported.
  • LRDIMM is not supported.
  • Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • Tape backup unit (TBU) is not supported.

Thermal restriction matrix

Table 1. Thermal restriction matrix for R540This table describes the thermal restriction for R540.
Storage configuration Front 8 drive 12 drive 12 drive
Rear NA NA 2 drive
Fan type Standard fan Standard fan High-performance fan
CPU heat sink type 1.5U heat sink 1.5U heat sink 1U heat sink
Processor number TDP (W) Core count Ambient = 35°C Ambient = 35°C Ambient = 30°C Ambient = 30°C
Intel Xenon Gold 6230 125 20

Yes

Yes

Yes

Yes

Intel Xenon Gold 6226 125 12

Yes

Yes

Yes

Yes

Intel Xenon Gold 6222V 115 20

Yes

No

Yes

Yes

Intel Xenon Gold 6209U 125 20

Yes

Yes

Yes

Yes

Intel Xenon Gold 6138 125 20

Yes

Yes

Yes

Yes

Intel Xenon Gold 6130 125 16

Yes

Yes

Yes

Yes

Intel Xenon Gold 6126 125 12

Yes

Yes

Yes

Yes

Intel Xenon Gold 5222 105 4

Yes

No

Yes

Yes

Intel Xenon Gold 5220 125 18

Yes

Yes

Yes

Yes

Intel Xenon Gold 5218R 125 20

Yes

Yes

Yes

Yes

Intel Xenon Gold 5218 125 16

Yes

Yes

Yes

Yes

Intel Xenon Gold 5217 115 8

Yes

No

Yes

Yes

Intel Xenon Gold 5215 85 10

Yes

Yes

Yes

Yes

Intel Xenon Gold 5122 105 4

Yes

No

Yes

Yes

Intel Xenon Gold 5120 105 14

Yes

Yes

Yes

Yes

Intel Xenon Gold 5118 105 12

Yes

Yes

Yes

Yes

Intel Xenon Gold 5117 105 14

Yes

Yes

Yes

Yes

Intel Xenon Silver 4216 100 16

Yes

Yes

Yes

Yes

Intel Xenon Silver 4215 85 8

Yes

Yes

Yes

Yes

Intel Xenon Silver 4214R 100 12

Yes

Yes

Yes

Yes

Intel Xenon Silver 4214 85 12

Yes

Yes

Yes

Yes

Intel Xenon Silver 4210R 100 10

Yes

Yes

Yes

Yes

Intel Xenon Silver 4210 85 10

Yes

Yes

Yes

Yes

Intel Xenon Silver 4208 85 8

Yes

Yes

Yes

Yes

Intel Xenon Silver 4116 85 12

Yes

Yes

Yes

Yes

Intel Xenon Silver 4114 85 10

Yes

Yes

Yes

Yes

Intel Xenon Silver 4112 85 4

Yes

Yes

Yes

Yes

Intel Xenon Silver 4110 85 8

Yes

Yes

Yes

Yes

Intel Xenon Silver 4108 85 8

Yes

Yes

Yes

Yes

Intel Xenon Bronze 3206R 85 6

Yes

Yes

Yes

Yes

Intel Xenon Bronze 3204 85 6

Yes

Yes

Yes

Yes

Intel Xenon Bronze 3104 85 6

Yes

Yes

Yes

Yes

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate <200 Å/month as defined by AHSRAE TC9.9.
NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.