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Dell EMC PowerEdge R450: технические характеристики и спецификации
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Сервер Dell PowerEdge R450 210-AZDS_8B
Сервер Dell PowerEdge R450 210-AZDS_8B
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Dell EMC PowerEdge R450: технические характеристики и спецификации

Chassis dimensions

Figure 1. PowerEdgeR450 Chassis dimensions

The image shows system dimensions.

Table 1. Chassis dimensionsThis table provides the dimensions of the PowerEdgeR450system:
Drives Xa Xb Y Za Zb Zc
4 x 3.5-inch 482 mm (18.976 inches) 434 mm (17.08 inches) 42.8 mm(1.685 inches)

22 mm (0.866 inches) without bezel

35.84 mm (1.41 inches) with bezel		 677.8 mm (26.685 inches)

(Ear to PSU surface)

691.07mm (27.207 inches)

(Ear to butterfly L bracket housing)

712.95 mm (28.069 inches)

(Ear to PSU handle without velcro strap)

8 x 2.5-inch 482 mm (18.976 inches) 434 mm (17.08 inches) 42.8 mm(1.685 inches)

22 mm (0.866 inches) without bezel

35.84 mm (1.41 inches) with bezel		627.03 mm (24.686 inches)

(Ear to PSU surface)

640.3 mm (25.209 inches)

(Ear to butterfly L bracket housing)

662.19 mm (26.070 inches)

(Ear to PSU handle without velcro strap)

NOTE Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge R450 system weight The table below shows the maximum weight of the PowerEdge R450 system.
System configuration Maximum weight (with all drives/SSDs/bezel)
4 x 3.5-inch system 18.62 kg (41.05 pound)
8 x 2.5-inch system 16.58 kg (36.55 pound)

Processor specifications

Table 1. PowerEdge R450 processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
3rd Generation Intel Xeon Scalable processors with up to 24 cores Up to two

PSU specifications

The PowerEdge R450 system supports up to two AC or DC power supply units (PSUs).

Table 1. PowerEdge R450 PSU specificationsThe table lists the specifications for 600 W, 800 W, and 1100 W power supplies.
PSU Class Heat dissipation (maximum) Frequency Voltage AC DC Current
High line 200–240 V Low line 100–120 V
1100 W DC NA 4265 BTU/hr NA -48–(-60) V NA NA 1100 W 27 A
800 W Mixed Mode Platinum 3000 BTU/hr 50/60 Hz 100–240 V AC, autoranging 800 W 800 W NA 9.2 A-4.7 A
NA 3000 BTU/hr NA 240 V DC, autoranging NA NA 800 W 3.8 A
600 W Mixed Mode Platinum 2250 BTU/hr 50/60 Hz 100–240 V AC, autoranging 600 W 600 W NA 7.1 A-3.6 A
NA 2250 BTU/hr NA 240 V DC, autoranging NA NA 600 W 2.9 A
NOTE This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.
NOTE Heat dissipation is calculated using the PSU wattage rating.
NOTE When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

Supported operating systems

The PowerEdge R450 system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Citrix Hypervisor
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi

For more information, go to www.dell.com/ossupport.

Cooling fans specifications

The PowerEdgeR450system supports Standard (STD) fans, and High performance SLVR fans .

NOTE For more information about the fan support configuration or matrix, see Thermal restriction matrix.
Table 1. PowerEdgeR450 cooling fan specificationsCooling fan specifications of PowerEdgeR450 system:
Fan type Abbreviation Also known as Label color Label image
Standard fan STD STD No label
Figure 1. Standard fan
This image shows the standard fan.
High performance (Silver grade) fanHPR (SLVR) HPR Silver
NOTE New cooling fans comes with the High Performance Silver Grade label. While the older cooling fans has the High Performance label.
Figure 2. High performance (Silver grade) fan
This image shows the High performance (Silver grade) fan.

System battery specifications

The PowerEdge R450 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge R450 system supports up to two PCI express (PCIe) Gen 4 expansion cards.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
PCIe slot Riser PCIe slot height PCIe slot length PCIe slot width
Slot 1 Riser 1 Low Profile Half length x16
Slot 3 Riser 2c Low Profile Half length x16
NOTE For information on the expansion card installation guidelines, see the system specific Installation and Service Manual available at https://www.dell.com/poweredgemanuals.

Memory specifications

The PowerEdge R450 system supports the following memory specifications for optimized operation.
Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum DIMM capacity Maximum DIMM capacity Minimum DIMM capacity Maximum DIMM capacity
RDIMM Single rank 8 GB 8 GB 64 GB 16 GB 128 GB
Dual rank 16 GB 16 GB 128 GB 32 GB 256 GB
32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
16, 288-pin 2933 MT/s, 2666 MT/s

Storage controller specifications

The PowerEdge R450 system supports the following controller cards:
Table 1. PowerEdge R450 storage controller cardsThis table provides the controller cards supported on the system:
Internal controllers External controllers
  • PERC H345
  • PERC H355
  • PERC H745
  • PERC H755
  • HBA355i
  • S150
  • Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs
  • HBA355e
  • PERC H840

Drives

The PowerEdge R450 system supports:
  • 4 x 3.5-inch Chip SATA (HDD/SSD) drives.
  • 4 x 3.5-inch hot-swappable SAS, SATA (HDD/SSD) drives.
  • 8 x 2.5-inch SAS, SATA (HDD/SSD) drives.

USB ports specifications

Table 1. PowerEdge R450 USB ports specifications The following table shows the PowerEdge R450 USB ports specifications :
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 2.0-compliant port One Internal USB 3.0-compliant port One
Micro-USB 2.0-compliant port for iDRAC Direct One USB 3.0-compliant port One
NOTE The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NIC port specifications

The PowerEdge R450 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM card 1 GbE x 2
OCP card (OCP 3.0) 1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4

Serial connector specifications

The PowerEdge R450 system supports one optional card type serial connector on rear of the system, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The process to install the optional serial connector card is similar to an expansion card filler bracket.

VGA ports specifications

The PowerEdge R450 system supports two DB-15 VGA ports, one each on the front and rear panels of the system.

IDSDM

The PowerEdge R450 system supports Internal Dual SD module (IDSDM).

The IDSDM supports two SD cards and is available in the following configurations:

Table 1. Supported SD card storage capacityThis table lists the storage capacity of the supported SD cards
IDSDM card
  • 16 GB
  • 32 GB
  • 64 GB
NOTE One IDSDM card slot is dedicated for redundancy.
NOTE Use Dell EMC branded SD cards that are associated with the IDSDM configured systems.

Video specifications

The PowerEdge R450 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options for the systemThis table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation > Regulatory Information on www.dell.com/support/home.
Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE * - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-40 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 3. Maximum vibration specifications
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations)
Storage 1.88 G rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that prevent the damage to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE This condition applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE This condition applies to data center and non-data center environments.
Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal restrictions

Table 1. Thermal restriction matrix for processor and fansThis table describes the thermal restriction for processor and fans.
Configuration / Processor TDP 4 x 3.5-inch configuration 8 x 2.5-inch SAS/SATA configuration Maximum Ambient Temperature
Rear Storage Rear 3 LP Rear 3 LP N/A
105 W STD fan

STD HSK

STD fan

STD HSK

40°C
120 W STD fan

STD HSK

STD fan

STD HSK

40°C
135 W STD fan

STD HSK

STD fan

STD HSK

40°C
150 W STD fan

STD HSK

STD fan

STD HSK

40°C
165 W STD fan

STD HSK

STD fan

STD HSK

35°C
165 W 8 cores, 3.6 GHz HPR (SLVR) fan

HPR HSK

HPR (SLVR) fan

HPR HSK

35°C
185 W / 190 W HPR (SLVR) fan

HPR HSK

HPR (SLVR) fan

HPR HSK

35°C
  • Processor blank is required for single processor configuration.
  • Two fan blanks are required to be installed on fan slot 1 and fan slot 2 for 5 fans configuration.
Table 2. Label referenceThis table describes the label references used in the restriction tables.
Label Description
LP Low Profile
HPR (SLVR) High performance (silver grade)
HPR High Performance
HSK Heat sink
NOTE DIMM blank is not required.
Table 3. Thermal restriction matrix for ASHRAE A2, A3 and A4This table describes the thermal restriction for ASHRAE A2, A3, and A4.
Dell EMC PowerEdge Server Standard Operating Support (ASHRAE A2 compliant)
NOTE All options supported unless otherwise noted.
Dell EMC PowerEdge Server Extended Inletient 40 ° C Operating Support (ASHRAE A3 compliant) Dell EMC PowerEdge Server Extended Inletient 45 ° C Operating Support (ASHRAE A4 compliant)
  • HPR Silver Fan is required for CPU >165 W
  • The following OCP3.0 NIC only support optic cable with thermal Spec 85 °C and power <=1.2 W
    • Intel Columbiaville DP 25 GbE SFP28 in 8x2.5-inch SAS/SATA configuration only
    • Broadcom Thor QP 25 G SFP28 in both configurations.
    • Mellanox CX5 DP 25 GbE SFP28 in both configurations.
    • Solarflare Medford2 DP 25 GbE SFP28 in both configurations.
  • The following PCIe NIC only support optic cable with thermal spec 85°C and power <= 1.2 W:
    • Solarflare Medford2 DP 25 GbE SFP28 in 8x2.5-inch SAS/SATA configuration.
    • Broadcom 100 G 2P QSF in both configurations.
    • Mellanox CX6 DP 25 G SFP28 in both configurations.
  • The following PCIe NIC only support optic cable with thermal spec 85°C and power <= 2.5 W
    • Mellanox CX6 DP 100 GbE in both configurations
    • Intel Columbiaville 100 G 2P Q28 in both configurations
  • PCIe SSD: Intel P4800X 750 G and 375 G are only supported in PCIe slot2 and PCIe slot3 in 4x3.5-inch configuration. No restriction in 8x2.5-inch SAS/SATA configuration.
  • Processor TDP greater than 150 W are not supported.
  • BOSS M.2 is not supported.
  • Non-Dell qualified peripheral cards are not supported.
  • NIC consuming power >= 25 W. Example: CX6 card is not supported.
  • Configuration with RM is not supported.
  • OCP transfer rate >25 G or cooling tier > 10 is not supported.
  • Optic cable with spec 85 °C power < 1.2 W is required.
  • Two PSUs are required. System performance may be reduced in the event of a PSU failure.
  • Does not support A4 environment.