Dell EMC PowerEdge R350: технические характеристики и спецификации

Table 1. PowerEdge R350 system weightThe table below shows the maximum weight of the system.

System configuration	Maximum weight (with all drives/SSDs)
4 x 3.5-inch	13.14 kg (28.96 pound)
8 x 2.5-inch	11.74 kg (25.88 pound)

The PowerEdge R350 system supports up to two AC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.

PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	AC		DC Input	AC Current	DC Current
					High line 200–240 V	Low line 100–120 V
600 W AC	Platinum	2250 BTU/hr	50/60 Hz	100 - 240 V, autoranging	600 W	600 W	240 VDC	7.1 - 3.6 A	2.9 A

The PowerEdge R350 system supports up to four non hot plug system fans connected to the system board.

The PowerEdge R350 system supports the following operating systems:

• Canonical Ubuntu Server LTS
• VMware ESXi
• Microsoft Windows Server with Hyper-V
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server

For more information, go to www.dell.com/ossupport.

The PowerEdge R350 system supports CR 2032 3.0-V lithium coin cell system battery.

The PowerEdge R350 system supports up to three PCI express (PCIe) Gen 4 expansion cards.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.

PCIe slot	Form factor	Processor	PCIe slot bandwidth	PCIe slot connector
Slot 1	Half Height	Processor 1	Gen4 x8 lanes	x8
Slot 2	Half Height	Processor 1	Gen4 x8 lanes	x16
Internal	Half Length	Processor 1	Gen4 x4 lanes	x8

Table 2. Riser Configuration 0This table provides information for riser configuration 0 supported on the system.

PCIe slot	Risers	Riser width	PCIe slot height	PCIe slot length	PCIe slot width
Slot 1	Butterfly Riser	Single Wide	Half Height	Half Length	x8
Slot 2	Butterfly Riser	Single Wide	Half Height	Half Length	x8
Internal	NA	Single Wide	Half Height	Half Length	x4

The PowerEdge R350 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:

DIMM type	DIMM rank	DIMM capacity	Single processor
			Minimum system capacity	Maximum system capacity
UDIMM	Single rank	8 GB	8 GB	32 GB
		16 GB	16 GB	64 GB
	Dual rank	32 GB	32 GB	128 GB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:

Memory module sockets	Speed
4, 288-pin	3200 MT/s, 2933 MT/s, 2666 MT/s

The PowerEdge R350 system supports the following controller cards:

Table 1. Storage controller cards This table provides the controller cards supported on the system:

Internal controllers	External controllers
PERC H355 PERC H355f PERC H345 PERC H755 HBA355i PERC H345f PERC H755f HBA355f	HBA355e

The PowerEdge R350 system supports:

• 4 x 3.5-inch hot-swappable SAS, SATA drives.
• 8 x 2.5-inch hot-swappable SAS, SATA drives.
• Max 80TB for 4 HDD configurations

The PowerEdge R350 system supports one Slim SATA DVD-ROM drive or DVD +/- RW drive.

The PowerEdge R350 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on Motherboard.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.

Feature	Specifications
LOM	1 GB x 2

The PowerEdge R350 system supports serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

Table 1. PowerEdge R350 USB specificationsThe following table shows the USB specifications for the system:

Front		Rear		Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 3.0-compliant port	One	Internal USB 3.0-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	USB 2.0-compliant port	One

The PowerEdge R350 system supports One DB-15 VGA port on back panel.

The PowerEdge R350 system supports Internal Dual SD module (IDSDM).

The IDSDM supports two SD cards and is available in the following configurations:

Table 1. Supported SD card storage capacityThis table lists the storage capacity of the supported SD cards

IDSDM card
16 GB 32 GB 64 GB

The PowerEdge R350 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution options This table describes the supported rear video resolution options for the system.

Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60, 72, 75, 85	8, 16, 32
1280 x 800	60, 75	8, 16, 32
1280 x 1024	60, 75, 85	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60, 75, 85	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60, 65, 70, 75, 85	8, 16, 32
1680 x 1050	60, 75, 85	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60, 75, 85	8, 16, 32

Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.

	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.

	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)

Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.

	Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times)	8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)

Table 4. Common Environmental Specifications for ASHRAE A2, A3, A4 This table describes the shared requirements across all categories.

	Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE * - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-104 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).

Maximum vibration	Specifications
Operating	0.26 Grms at 5 Hz to 350 Hz (all operation orientations)
Storage	1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.

Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE Air entering the data center must have MERV11 or MERV13 filtration. NOTE Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHRAE Standard 127
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE This condition applies to data center and non-data center environments. NOTE Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.

Gaseous contamination	Specifications
Copper Coupon Corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

ASHRAE A3/A4 environment

• BOSS (M.2) is not supported.
• 8 x 2.5-inch supported with capacity < 1 TB.
• Redundant power supplies are required.
• Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.