Dell EMC PowerEdge R340 Technical: характеристики и спецификации

Chassis dimensions

The image shows system dimensions. — Figure 1. Chassis dimensions

Table 1. Dell EMCPowerEdge R340 chassis dimensionsThis table provides the dimensions of the Dell EMCPowerEdge R340 system:
Xa	Xb	Y	Za	Zb		Zc
482.0 mm (18.98 inches)	434.0 mm (17.08 inches)	42.8 mm (1.68 inches)	With bezel: 35.64 mm (1.4 inches) Without bezel: 22.0 mm (0.87 inches)	8 x 2.5 inch configuration	483.72 mm (19.04 inches)	8 x 2.5 inch configuration	522.85 mm (20.58 inches)
482.0 mm (18.98 inches)	434.0 mm (17.08 inches)	42.8 mm (1.68 inches)		4 x 3.5 inch configuration	534.5 mm (21.04 inches)	4 x 3.5 inch configuration	573.6 mm (22.58 inches)

System weight

Table 1. Dell EMC PowerEdge R340 system weightSystem weight of Dell EMC PowerEdge R340 system is 12 kg (26.5 lb)
System configuration	Maximum weight (with all drives/SSDs)
8 x 2.5-inch configuration	12 kg (26.5 lb)
4 x 3.5-inch configuration	13.6 kg (29.98 lb)

Processor specifications

Table 1. Dell EMC PowerEdge R340 processor specificationsThis table provides processor specifications for the Dell EMC PowerEdge R340 system:
Supported processor	Number of processors supported
Intel Xeon processor E-2200 product family Intel Core i3 9100 processor Intel Pentium G5420 processor Intel Celeron G4930 processor Intel Xeon processor E-2100 product family Intel Core i3 8100 processor Intel Pentium G5500 processor Intel Celeron G4900 processor	One

PSU specifications

The Dell EMC PowerEdge R340 system supports up to two AC power supply units (PSUs).

Table 1. Dell EMC PowerEdge R340 PSU specificationsThe table lists the power supply specifications.
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	AC		Current
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	High line 100–240 V	Low line 100–120 V	Current
350 W AC	Platinum	Redundant - 1356 BTU/hr	50/60 Hz	100–240 V AC, autoranging	350 W	NA	4.8 A–2.4 A
550 W AC	Platinum	2107 BTU/hr	50/60 Hz	100–240 V AC, autoranging	550 W	NA	7.4 A–3.7 A

NOTE This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 230 V.

Cooling fans specifications

The Dell EMC PowerEdge R340 system supports the following cooling fans.

NOTE When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

Table 1. Dell EMC PowerEdge R340 fan support matrixThis table describes the fan support matrix for R340.
Front storage	PSU type	Fan 1	Fan 2	Fan 3	Fan 4
8 x 2.5-inch	Redundant 350 W	Required, if the PERC card and/or expansion riser is installed	Required	Required	Required
4 x 3.5-inch	Redundant 350 W		Required	Required	Required
8 x 2.5-inch	Redundant 550 W	Required, if the PERC card and/or expansion riser is installed	Required	Required	Required
4 x 3.5-inch	Redundant 550 W		Required	Required	Required

Optional - .

System battery specifications

The Dell EMC PowerEdge R340 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The Dell EMC PowerEdge R340 system supports up to two PCI express (PCIe) generation 3.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots supported on the PowerEdge R340 system.
PCIe slot	Riser	PCIe slot height	PCIe slot length	Link width	Slot width
Slot 1	x8 PCIe	Low-profile	Half-length	x4	x8
Slot 2	x16 PCIe	Low-profile/Full-height	Half-length	x8	x16
Internal PERC	x8 PCIe	Low-profile	Half-length	x8	x8

Memory specifications

The PowerEdge R340 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications for the PowerEdge R340 system:
DIMM type	DIMM rank	DIMM capacity	Minimum RAM	Maximum RAM
UDIMM	Single rank	8 GB	8 GB	32 GB
	Single rank	16 GB	16 GB	64 GB
	Dual rank	8 GB	8 GB	32 GB
	Dual rank	16 GB	16 GB	64 GB

Table 2. Memory module socketsThe table below shows the memory module sockets for the PowerEdge R340 system:
Memory module sockets	Speed
Four 288-pin	2666 MT/s

NOTE 3200 MT/s UDIMM is compatible from BIOS version 2.5.1 but downshift to 2666 MT/s operational speed.

Storage controller specifications

The Dell EMC PowerEdge R340 system supports the following controller cards:

Table 1. Dell EMC PowerEdge R340 system controller cardsThis table provides the controller cards supported by Dell EMC PowerEdge R340 system:
Internal controllers	External controllers
PERC H730P PERC H330 S140 HBA330	12 Gb/s Ext SAS HBA HBA355e

Drives

NOTE The 8 x 2.5-inch configuration is shorter than the 4 x 3.5-inch configuration.

The Dell EMC PowerEdge R340 system supports:

8 x 2.5-inch hot-swappable SAS, SATA, or SSD
4 x 3.5-inch hot-swappable SAS, SATA, or SSD
4 x 2.5-inch hot-swappable SAS, SATA, or SSD in 3.5-inch adapters

Backplane:

Up to 8 x 2.5-inch SAS, SATA, or SSD drives
Up to 4 x 3.5-inch SAS, SATA, or SSD drives

Optical drives

The Dell EMC PowerEdge R340 system supports the following optical drives.

Table 1. Supported optical drive typeThis table shows the supported optical drive type
Supported drive type	Supported number of drives
Dedicated SATA DVD-ROM drive or DVD +/-RW drive	One

USB ports specifications

Table 1. Dell EMC PowerEdge R340 system USB specificationsThe following table shows the USB specifications for the PowerEdge system.
Front		Rear		Internal
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 3.0-compliant ports	Two	Internal USB 3.0-compliant port	One
Micro USB 2.0-compliant port for iDRAC Direct	One	USB 3.0-compliant ports	Two	Internal USB 3.0-compliant port	One

NOTE The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

NIC ports specifications

The Dell EMC PowerEdge R340 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports that are located on the back panel.

Serial connector specifications

The Dell EMC PowerEdge R340 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA ports specifications

The PowerEdge R340 system supports one DB-15 VGA port located on the back panel of the system.

IDSDM module

The Dell EMC PowerEdge R340 system supports optional Internal Dual SD module (IDSDM) module.

The module supports three microSD cards; two cards for IDSDM and one card for vFlash. In 14^th generation of PowerEdge servers, the IDSDM or vFlash module is combined into a single card module, and is available in the following configurations:

vFlash or
vFlash and IDSDM

Table 1. Supported microSD card storage capacityThis table lists the storage capacity of the supported microSD cards
IDSDM card	vFlash card
16 GB 32 GB 64 GB	16 GB

NOTE There are two dip switches on the IDSDM or vFlash module for write-protection.

NOTE One IDSDM card slot is dedicated for redundancy.

NOTE Use Dell EMC branded microSD cards that are associated with the IDSDM or vFlash configured systems.

Video specifications

The Dell EMC PowerEdge R340 system supports integrated Matrox G200eW3 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution optionsThis table describes the supported video resolution options.
Resolution	Refresh rate (Hz)	Color depth (bits)
640 x 480	60, 72	8, 16, 24
800 x 600	60, 75, 85	8, 16, 24
1024 x 768	60, 75, 85	8, 16, 24
1152 x 864	60, 75, 85	8, 16, 24
1280 x 1024	60, 75	8, 16, 24

Environmental specifications

NOTE For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/support/home.

Table 1. Temperature specifications When the system is in continuous operation (for altitude less than 950 m or 3117 feet), the temperature specification ranges 10°C to 35°C (50–95°F) with no direct sunlight on the equipment. When the system is not in operation, the temperature specification is -40°C to 65°C (-40°F to149°F). For more information about fresh air, see the Expanded operating temperature section. The maximum temperature gradient for both operation and nonoperational systems is 20°C/h (36°F/h). Information about fresh air specification is described in the Expanded operating temperature section.
Temperature	Specifications
Storage	-40–65°C (-40–149°F)
Continuous operation (for altitude less than 950 m or 3117 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Fresh air	For information about fresh air, see the Expanded operating temperature section.
Maximum temperature gradient (operating and storage)	20°C/h (68°F/h)

Table 2. Relative humidity specificationsFor a nonoperational system, the ambient relative humidity ranges from 5% to 95% with 33°C (91°F) maximum dew point. Atmosphere must be noncondensing at all times. For an operational system, the ambient relative humidity ranges from 10% to 80% with 29°C (84.2°F) maximum dew point.
Relative humidity	Specifications
Storage	5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be noncondensing at all times.
Operating	10% to 80% RH with 29°C (84.2°F) maximum dew point.

Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration	Specifications
Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Table 5. Maximum altitude specificationsThe maximum altitude specification for an operational system is 3048 m (10,000 ft). The maximum altitude specification for a nonoperational system is 12,000 m (39,370 ft).
Maximum altitude	Specifications
Operating	3048 m (10,000 ft)
Storage	12,000 m (39,370 ft)

Table 6. Operating temperature derating specificationsIf the operating temperature of a system is up to 35°C (95°F), the maximum temperature is reduced by 1°C/300 m (1°F/547 feet) above 950 m (3,117 feet). If the operating temperature of a system is 35°C to 40°C (95°F to 104°F), the maximum temperature is reduced by 1°C/175 m (1°F/319 feet) above 950 m (3,117 feet). If the operating temperature of a system is 40°C to 45°C (104°F to 113°F), the maximum temperature is reduced by 1°C/125 m (1°F/228 feet) above 950 m (3,117 feet).
Operating temperature derating	Specifications
Up to 35°C (95°F)	Maximum temperature is reduced by 1°C/300 m (1°F/547 ft), above 950 m (3,117 ft).
35–40°C (95–104°F)	Maximum temperature is reduced by 1°C/175 m (1°F/319 ft), above 950 m (3,117 ft).
40–45°C (104–113°F)	Maximum temperature is reduced by 1°C/125 m (1°F/228 ft), above 950 m (3,117 ft).

Standard operating temperature

Table 1. Standard operating temperature specifications
The standard operating temperature for altitude less than 950 m or 3117 feet ranges 10°C to 35°C with no direct sunlight on the equipment.
Standard operating temperature	Specifications
Continuous operation (for altitude less than 950 m or 3117 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment.

Expanded operating temperature

Table 1. Expanded operating temperature specificationsWhen the system is in continuous operation, the expanded operating temperature ranges 5°C to 40°C at 5% to 85% RH with 29°C dew point. Outside the standard operating temperature (10°C to 35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures 35°C to 40°C, derate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft). When the system is operating at < 1% of annual operating hours, the expanded operating temperature is -5°C to 45°C at 5% to 90% RH with 29°C dew point. Outside the standard operating temperature (10°C to 35°C), the system can operate down to -5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures 40°C to 45°C, derate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Expanded operating temperature	Specifications
Continuous operation	5°C–40°C at 5% to 85% RH with 29°C dew point. NOTE Outside the standard operating temperature (10°C–35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures 35°C– 40°C, derate maximum allowable temperature by 1°C per 175 m (1°F per 319 ft) above 950 m (3,1171 ft).
≤ 1% of annual operating hours	-5°C–45°C at 5% to 90% RH with 29°C dew point. NOTE Outside the standard operating temperature (10°C–35°C), the system can operate down to -5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures 40°C– 45°C, derate maximum allowable temperature by 1°C per 125 m (1°F per 228 ft) above 950 m (3.117 ft).

NOTE When operating in the expanded temperature range, the performance of the system may be impacted.

NOTE When operating in the expanded temperature range, ambient temperature warnings may be reported on the System Event Log.

Expanded operating temperature restrictions

Do not perform a cold startup below 5°C.
The operating temperature specified is for a maximum altitude of 950m for Fresh Air Cooling.
Redundant power supply units are required.
Four redundant system fans are required.
GPU is not supported.
Support for up to 80W processor.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
Tape backup unit is not supported.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination	Specifications
Copper Coupon Corrosion	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver Coupon Corrosion	<200 Å/month as defined by AHSRAE TC9.9.

NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Dell EMC PowerEdge R340 Technical: технические характеристики и спецификации