Dell EMC PowerEdge R250: технические характеристики и спецификации

Table 1. PowerEdge R250 system weight The table below shows the maximum weight of the PowerEdge R250 system.

System configuration	Maximum weight (with all drives/SSDs)
4 x 3.5-inch system 2 x 3.5-inch system	12.48 kg (27.51 lbs.)

The PowerEdgeR250system supports one AC cabled power supply unit (PSU).

Table 1. PowerEdgeR250 PSU specificationsThe table lists the specifications for 450 W, and 450 W cabled power supplies.

PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	AC		DC Input	AC Current	DC Current
					High line 200–240 V	Low line 100–120 V
450 W	Bronze	1871 BTU/hr	50/60 Hz	100–240 V AC, autoranging	450 W	450 W	N/A	6.5 A-3.5 A	N/A
450 W	Platinum	1725 BTU/hr	50/60 Hz	100–240 V AC, autoranging	450 W	450 W	N/A	6.5 A-3.5 A	N/A
700 W	Titanium	2625 BTU/hr	50/60 Hz	200–240 V AC, autoranging	700 W	N/A	240 V DC	4.1 A	3.4 A

The PowerEdge R250 system supports the following operating systems:

• Canonical Ubuntu Server LTS
• VMware ESXi
• Microsoft Windows Server with Hyper-V
• SUSE Linux Enterprise Server
• Red Hat Enterprise Linux

For more information, go to Operating System Manuals.

The PowerEdge R250 system supports up to three non hot plug system fans and one optional non hot plug PCIe fan connected to the system board.

The PowerEdge R250 system supports CR 2032 3.0-V lithium coin cell system battery.

The PowerEdge R250 system supports up to two PCI express (PCIe) Gen 4 expansion cards.

Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.

PCIe slot	Form factor	Processor	PCIe slot bandwidth	PCIe slot connector
Slot 1	Half Height	Processor 1	Gen4 x8 lanes	x8
Slot 2	Half Height	Processor 1	Gen4 x8 lanes	x16

Table 2. Riser Configuration 0This table provides information for riser configuration 0 supported on the system.

PCIe slot	Risers	Riser width	PCIe slot height	PCIe slot length	PCIe slot width
Slot 1	Butterfly Riser	Single Wide	Half Height	Half Length	x8
Slot 2	Butterfly Riser	Single Wide	Half Height	Half Length	x8

The PowerEdge R250 system supports the following memory specifications for optimized operation.

Table 1. PowerEdge R250 system memory specificationsThe table below shows the memory specifications:

DIMM type	DIMM rank	DIMM capacity	Single processor
			Minimum DIMM capacity	Maximum DIMM capacity
ECC UDIMM	Single rank	8 GB	8 GB	32 GB
		16 GB	16 GB	64 GB
	Dual rank	32 GB	32 GB	128 GB

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:

Memory module sockets	Speed
4, 288-pin	3200 MT/s, 2933 MT/s, 2666 MT/s

The PowerEdge R250 system supports the following controller cards:

Table 1. PowerEdge R250 storage controller cardsThis table provides the controller cards supported on the system:

Internal controllers	External controllers
H345 H355 H755 HBA355i S150	HBA355e

The PowerEdgeR250system supports:

• 4 x 3.5-inch non-hot plug SAS, SATA (HDD/SSD) drives.
• 4 x 3.5-inch hot plug SAS, SATA drives
• 2 x 3.5-inch cabled SAS, SATA drives

Table 1. PowerEdge R250 USB ports specifications The following table shows the PowerEdge R250 USB ports specifications :

Front		Rear		Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 3.0 port	One	Internal USB 3.0-compliant port	One
iDRAC Direct port (Micro-AB USB 2.0-compliant port)	One	USB 2.0 port	One

The PowerEdge R250 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the Motherboard.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.

Feature	Specifications
LOM	Onboard LOM 1GbE x2

The PowerEdge R250 system supports one serial connector on rear of the system, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The PowerEdge R250 system supports one DB-15 VGA port on the rear panel of the system.

The PowerEdge R250 system supports Internal Dual SD module (IDSDM).

The IDSDM supports two SD cards and is available in the following configurations:

Table 1. Supported SD card storage capacityThis table lists the storage capacity of the supported SD cards

IDSDM card
16 GB 32 GB 64 GB

Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.

Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

Table 2. Shared requirements across all categories This table describes the shared requirements across all categories.

Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-40 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

Table 3. Maximum vibration specifications

Maximum vibration	Specifications
Operating	0.21 Grms at 5 Hz to 500 Hz for 10 minutes (all x, y, and z axis)
Storage	1.88 G rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 4. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6G for up to 11ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

The following table defines the limitations that prevent the damage to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.

Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE:This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.

Gaseous contamination	Specifications
Copper Coupon Corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

• Four fans population is required.
• Non Dell qualified peripheral cards or peripheral cards greater than 25 W are not supported.