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Dell OptiPlex 7770 All-in-One: технические характеристики и спецификации

Processor

Global Standard Products (GSP) are a subset of Dell’s relationship products that are managed for availability and synchronized transitions on a worldwide basis. They ensure the same platform is available for purchase globally. This allows customers to reduce the number of configurations managed on a worldwide basis, thereby reducing their costs. They also enable companies to implement global IT standards by locking in specific product configurations worldwide. The following GSP processors identified below will be made available to Dell customers.

Device Guard (DG) and Credential Guard (CG) are the security features available on Windows 10 Enterprise. Device Guard is a combination of enterprise-related hardware and software security features, when configured together, will lock a device down so that it can only run trusted applications. Credential Guard uses virtualization-based security to isolate secrets (credentials) so that only privileged system software can access them. Unauthorized access to these secrets can lead to credential theft attacks. Credential Guard prevents these attacks by protecting NTLM password hashes and Kerberos Ticket Granting Tickets.

NOTE: : Processor numbers are not a measure of performance. Processor availability is subject to change and may vary by region/country.

Table 1. 9th Generation Intel Core Processor specificationsProcessor specifications

Type

lntel Core i3 - 9100 (4 Cores/6MB/4T/up to 4.2GHz/65W)
lntel Core i3 - 9300 (4 Cores/8MB/4T/up to 4.3GHz/65W)
lntel Core i5 - 9400 (6 Cores/9MB/6T/up to 4.1GHz/65W)
lntel Core i5 - 9500 (6 Cores/9MB/6T/up to 4.4GHz/65W)
Intel Core i5 - 9600 (6 Cores/9MB/6T/up to 4.6GHz/95W)
Intel Core i7 - 9700 (8 Cores/12MB/8T/up to 4.9GHz/95W)
Intel Core i9 - 9900 (8 Cores/16MB/16T/up to 5.0GHz/95W)
Table 2. 8th Generation Intel Core Processor specificationsProcessor specifications

Type

Intel Core i3 - 8100 (4 Cores/6MB/4T/3.6GHz/65W)
Intel Core i3 - 8300 (4 Cores/8MB/4T/3.7GHz/65W)
Intel Core i5 - 8400 (6 Cores/9MB/6T/up to 4.0GHz/65W)
Intel Core i5 - 8500 (6 Cores/9MB/6T/up to 4.1GHz/65W)
Intel Core i5 - 8600 (6 Cores/9MB/6T/up to 4.3GHz/65W)
Intel Core i7 - 8700 (6 Cores/12MB/12T/up to 4.6GHz/65W)

Memory

Table 1. Memory specificationsMemory specifications

Minimum memory configuration

4 GB (1 x 4GB module)

Maximum memory configuration

32 GB

Number of slots

2 SODIMM

Maximum memory supported per slot

16 GB

Memory options

  • 4 GB - 1 x 4 GB
  • 8 GB - 1 x 8 GB
  • 8 GB - 2 x 4 GB
  • 16 GB - 1 x 16 GB
  • 16 GB - 2 x 8 GB
  • 32 GB - 2 x 16 GB

Type

DDR4 SDRAM Non-ECC memory

Speed

  • 2666 MHz
  • 2400 MHz on i3 processor

NOTE: : Intel Optane Memory does not replace DDR memory or add to RAM capacity.

Storage

Table 1. Storage specificationsStorage specifications

Primary/Boot drive

Form Factor

Capacity

One Solid-State Drive (SSD)

M.2 2280

Up to 2 TB

One 2.5 inch Hard-Disk Drive (HDD)

Approximately (2.760 x 3.959 x 0.374 inches)

Up to 2 TB

One 2.5 inch Solid-State Hybrid Drive (SSHD)

Approximately (2.760 x 3.959 x 0.276 inches)

Up to 1 TB

Intel Optane memory M.2 228016 GB and 32 GB
Table 2. Storage configurationsStorage combinations
Primary/Boot driveForm Factor
1 x M.2 DriveNA
1 x M.2 Drive1 x 2.5 inch Drive
1 x 2.5 inch DriveNA
1 x 2.5 inch HDD with M.2 OptaneNA

NOTE: : Supports RAID 0 and 1 with M.2 SATA SSD and 2.5" SSD/HDD. RAID 0 and 1 are not supported with M.2 PCIe SSD and 2.5" SSD/HDD due to different interface types. It is not available with Optane memory (Available from August 2019).

For optimal performance when configuring drives as a RAID volume, Dell recommends drive models that are identical.

RAID 0 (Striped, Performance) volumes benefit from higher performance when drives are matched because the data is split across multiple drives: any IO operations with block sizes larger than the stripe size will split the IO and become constrained by the slowest of the drives. For RAID 0 IO operations where block sizes are smaller than the stripe size, whichever drive the IO operation targets will determine the performance, which increases variability and results in inconsistent latencies. This variability is particularly pronounced for write operations and it can be problematic for applications that are latency sensitive. One such example of this is any application that performs thousands of random writes per second in very small block sizes.

RAID 1 (Mirrored, Data Protection) volumes benefit from higher performance when drives are matched because the data is mirror across multiple drives: all IO operations must be performed identically to both drives, thus variations in drive performance when the models are different results in the IO operations completing only as fast as the slowest drive. While this does not suffer the variable latency issue in small random IO operations as with RAID 0 across heterogeneous drives, the impact is nonetheless large because the higher performing drive becomes limited in all IO types. One of the worst examples of constrained performance here is when using unbuffered IO. To ensure writes are fully committed to non-volatile regions of the RAID volume, unbuffered IO bypasses cache (for example by using the Force Unit Access bit in the NVMe protocol) and the IO operation will not complete until all the drives in the RAID volume have completed the request to commit the data. This kind of IO operation completely negates any advantage of a higher performing drive in the volume.

Care must be taken to match not only the drive vendor, capacity, and class, but also the specific model. Drives from the same vendor, with the same capacity, and even within the same class, can have very different performance characteristics for certain types of IO operations. Thus, matching by model ensures that the RAID volumes is comprised of an homogeneous array of drives that will deliver all the benefits of a RAID volume without incurring the additional penalties when one or more drives in the volume are lower performing.

When RAID is used for two non-identical drives (i.e. M.2 + 2.5 inch), performance will be at the speed of the slower drive in the array.

Audio

Table 1. AudioAudio

Integrated Realtek ALC3289 High Definition Audio

High Definition Stereo supportYes
Number of channels2
Number of Bits / Audio resolution16, 20, and 24-bit resolution
Sampling rate (recording/playback)Support 44.1K/48K/96K/192 kHz sample rates
Signal to Noise Ratio98 dB DAC outputs, 92 dB for ADC inputs
Analog AudioYes
Waves MaxxAudio ProYes
Audio Jack Impedance
Microphone40K ohm~60K ohm
Line-InN/A
Line-Out100~150 ohm
Headphone1~4 ohm
Internal Speaker Power Rating

3 Watt (average) / 4 Watt (peak)

Video controller

Table 1. VideoVideo

Controller

Type

Graphics memory type

Intel UHD Graphics 630

UMA

Integrated

NVIDIA GeForce GTX 1050, 4GB

Discrete

GDDR5

Table 2. Video port resolution matrixVideo
DisplayPort 1.2HDMI 1.4HDMI 2.0b
Max resolution - Single display 4096x2160

2560x1600 @ 24Hz

4096x2160 @ 24Hz

2560x1600 @ 24Hz

4096x2160 @ 24Hz

Max resolution - Dual MST

2560x1600

3440x1440

2560x1080

N/AN/A
All resolutions shown at 24bpp and unless specifically stated are @ 60 Hz refresh

Web camera

Table 1. Web camera(optional)Web camera
Maximum Resolution2.0 MP
Camera type
  • FHD
  • FHD + Infrared (IR)
Video Resolution
  • FHD - 1080p
  • FHD + IR - 1080p + VGA
Diagonal Viewing Angle
  • FHD - 74.9°
  • IR - 88°
Power Saving SupportSuspend, Hibernation
Automatic Image Control

Automatic Exposure Control (AE)

Automatic White Balance Control (AWB)

Automatic Gain Control (AGC)

Webcam Mechanical PrivacyPop up camera

Communications - Integrated

Table 1. Communications - IntegratedCommunications

Network adapter

Integrated Intel i219-LM 10/100/1000 Mb/s Ethernet (RJ-45 ) with Intel Remote Wake UP and PXE

External ports and connectors

Table 1. External ports and connectorsExternal ports and connectors

USB 3.1 Type A Gen1(Side/Rear/Internal)

1/4/0

  • 1xUSB 3.1 Type A Gen 1 with PowerShare (side)
  • 2xUSB 3.1 Type A Gen 1 (rear)
  • 2xUSB 3.1 Type A Gen 2 (rear)

USB 3.1 Type C Gen 2 (Side/Rear/Internal)

1/0/0

One USB 3.1 Gen 2 Type-C port (side)

Network Connector (RJ-45)

1 Rear

HDMI 1.4 Out

1 Rear (Integrated graphics configurations)

HDMI-In (Optional)

1 Rear

HDMI 2.0 Out

1 Rear (Discrete graphics configurations)

DisplayPort 1.2

1 Rear

Universal Audio Jack

1 Side

Line-Out for headphones or speakers

1 Rear

Display

Table 1. Display specificationsDisplay specifications

Type

  • Full HD (FHD) touch
  • Full HD (FHD) Non-Touch
  • 4K Ultra HD non-touch

Screen size (Diagonal)

27 inch

Screen technology

IPS

Display

WLED

Native resolution

  • FHD - 1920 x 1080
  • 4K UHD - 3840 x 2160

High definition

  • Full HD
  • Ultra HD

Luminance

  • FHD Touch - 200 cd/m
  • FHD Non-touch - 250 cd/m
  • 4K UHD Non-touch - 350 cd/m

Active area dimensions

  • FHD - 597.89 mm x 336. 31 mm
  • UHD - 596.74 mm x 335.66 mm

Height

  • FHD - 336.31 mm
  • UHD - 335.66 mm

Width

  • FHD - 597.89 mm
  • UHD - 596.74 mm

Megapixels

  • FHD - 2M
  • 4K UHD - 8.3M

Pixels Per Inch (PPI)

  • FHD - 82
  • 4K UHD - 163

Pixel pitch

  • FHD - 0.3114 mm x 0.3114 mm
  • 4K UHD - 0.1554 mm x 0.1554 mm

Color depth

  • FHD - 16.7 M
  • 4K UHD - 1.07 B

Contrast ratio (min)

  • FHD - 600
  • 4K UHD - 910

Contrast ratio (typical)

  • FHD - 1000
  • 4K UHD - 1350

Response time (max)

25 mil sec

Typical Response time

14 mil sec

Refresh rate

60 Hhz

Horizontal viewing angle

178°

Vertical viewing angle

178°

Power

Table 1. PowerPower
Power Supply Wattage 240W EPA Platinum 155W EPA Bronze
AC input Voltage Range 100 – 240 Vac 100 – 240 Vac
AC input current (low AC range/high AC range) 3.6A/1.8A 3.6A/1.8A
AC input Frequency 47HZ - 63HZ 47HZ - 63HZ
AC holdup time (80% load) 16 mini sec 16 mini sec
Average Efficiency 90-92-89% @ 20-50-100% load 82-85-82% @ 20-50-100% load
Typical Efficiency (Active PFC) N/A N/A

NOTE: : The typical efficiency of Active PFC Power Supply is 70%. APFC Power Supply is not offered with OptiPlex AIO

DC parameters
+12.0 v output NA NA
+19.5 v output 19.5VA - 8.5A and 19.5VB - 10.5A 19.5VA - 7.5A and 19.5VB - 7.0A
+19.5 v output auxiliary output 19.5VA - 0.5A and 19.5VB - 1.75A

Standby mode 19.5VA - 0.5A and 19.5VB - 1.75a

19.5VA - 0.5A and 19.5VB - 1.75A

Standby mode 19.5VA - 0.5A and 19.5VB - 1.75a

Max total power 240 W 155 W
Max combined 12.0 v power (note: only if more than one 12 v rail) N/A N/A
BTUs/h (based on PSU max wattage) 819 BTU 529 BTU
Power Supply Fan N/A N/A
Compliance
Erp Lot6 Tier 2 0.5watt requirement Yes Yes
Climate Savers / 80Plus Compliant Yes Yes
Energy Star 7.0/7.1 Qualified Yes Yes
FEMP Standby Power Compliant Yes Yes
Table 2. Thermal DissipationPower
Power Graphics Heat dissipation Voltage
155 W Integrated gfx 155 * 3.4125 = 529 BTU/hr 100 to 240 VAC , 50 to 60 Hz , 3 A/1.5 A
240WDiscrete gfx240 * 3.4125 = 819 BTU/hr100 to 240 VAC , 50 to 60 Hz , 3.6A/1.8 A
Table 3. CMOS batteryPower
3.0v CMOS battery (Type and estimated battery life)
Brand Type Voltage Composition Life
VIC-DAWN CR-2032 3V Lithium Continuous Discharge Under 30 kΩ Load till 2.0V End-Voltage at the temperature of 23°C±3°C. The batteries should be submitted to 150 temperature cycles from 60°C~-10°C, and then be stored for more than 24hours at 23°C±3°C
JHIH HONG CR-2032 3V Lithium

Continuous Discharge Under 15 kΩ Load to 2.5V End-Voltage.

20°C±2°C: 940Hrs or longer; 910Hrs or longer after 12 months.

MITSUBISHI CR-2032 3V Lithium

Continuous Discharge Under 15 kΩ Load to 2.0V End-Voltage.

20°C±2°C: 1000Hrs or longer; 970Hrs or longer after 12 months.

0°C±2°C: 910Hrs or longer; 890Hrs or longer after 12 months.

Physical system dimensions

NOTE: : System weight and shipping weight is based on a typical configuration and may vary based on PC configuration. A typical configuration includes: integrated graphics and one hard drive.

Table 1. System dimensionsSystem dimensions

Non-touch chassis weight without stand (pounds / kilograms)

18.54 / 8.41

Touch chassis weight without stand (pounds / kilograms)

19.03 / 8.63

Non-touch chassis dimensions (system without stand):

Height (inches / centimeters)

15.31 / 38.90

Width (inches / centimeters)

24.17 / 61.40

Depth (inches / centimeters)

  • 2.28 / 5.80 (UHD)
  • 2.27 / 5.77 (FHD)

Touch chassis dimensions (system without stand):

Height (inches / centimeters)

15.31 / 38.9

Width (inches / centimeters)

24.17 / 61.4

Depth (inches / centimeters)

  • 2.28 / 5.8 (UHD)
  • 2.27 / 5.77 (FHD)

Height adjustable stand dimensions

Width x Depth (inches / centimeters)

11.30 x 10.03 / 28.70 x 25.48

Weight (pounds / kilograms)

7.10 / 3.22

Articulating stand dimensions

Height (inches / centimeters)

23.35 cm

Width x Depth (inches / centimeters)

10.69 x 10.68 / 27.15 x 27.13

Weight (pounds / kilograms)

9.79 / 4.44

Packaging parameters with height adjustable stand

Height (inches / centimeters)

21.57 / 54.80

Width (inches / centimeters)

36.14 / 91.80

Depth (inches / centimeters)

8.50 / 21.60

Shipping weight (pounds / kilograms - includes packaging materials)

35.27 / 16.0

Packaging parameters with articulating stand

Height (inches / centimeters)

21.77 x 55.30

Width (inches / centimeters)

28.50 / 72.40

Depth (inches / centimeters)

10.20 / 25.90

Shipping weight (pounds / kilograms - includes packaging materials)

37.48 / 17.00

Environmental

NOTE: : For more details on Dell Environmental features, please to go to Environmental Attributes section. See your specific region for availability.

Table 1. EnvironmentalEnvironmental
Recyclable packaging   Yes
BFR/PVC—free chassisNo
Vertical orientation packaging supportYes
MultiPack packaging

Select countries

Energy Efficient Power Supply Yes