Dell OptiPlex 7470 All-in-One: характеристики и спецификации

Processor

Global Standard Products (GSP) are a subset of Dell’s relationship products that are managed for availability and synchronized transitions on a worldwide basis. They ensure the same platform is available for purchase globally. This allows customers to reduce the number of configurations managed on a worldwide basis, thereby reducing their costs. They also enable companies to implement global IT standards by locking in specific product configurations worldwide. The following GSP processors identified below will be made available to Dell customers.

Device Guard (DG) and Credential Guard (CG) are the security features available on Windows 10 Enterprise. Device Guard is a combination of enterprise-related hardware and software security features, when configured together, will lock a device down so that it can only run trusted applications. Credential Guard uses virtualization-based security to isolate secrets (credentials) so that only privileged system software can access them. Unauthorized access to these secrets can lead to credential theft attacks. Credential Guard prevents these attacks by protecting NTLM password hashes and Kerberos Ticket Granting Tickets.

NOTE:Processor numbers are not a measure of performance. Processor availability is subject to change and may vary by region/country.

Table 1. 9th Generation Intel Core Processor specificationsProcessor specifications
Type
lntel Core i3 - 9100 (4 Cores/6MB/4T/up to 4.2GHz/65W)
lntel Core i3 - 9300 (4 Cores/8MB/4T/up to 4.3GHz/65W)
lntel Core i5 - 9400 (6 Cores/9MB/6T/up to 4.1GHz/65W)
lntel Core i5 - 9500 (6 Cores/9MB/6T/up to 4.4GHz/65W)
Intel Core i5 - 9600 (6 Cores/9MB/6T/up to 4.6GHz/95W)
Intel Core i7 - 9700 (8 Cores/12MB/8T/up to 4.9GHz/95W)
Intel Core i9 - 9900 (8 Cores/16MB/16T/up to 5.0GHz/95W)

Table 2. 8th Generation Intel Core Processor specificationsProcessor specifications
Type
Intel Core i3 - 8100 (4 Cores/6MB/4T/3.6GHz/65W)
Intel Core i3 - 8300 (4 Cores/8MB/4T/3.7GHz/65W)
Intel Core i5 - 8400 (6 Cores/9MB/6T/up to 4.0GHz/65W)
Intel Core i5 - 8500 (6 Cores/9MB/6T/up to 4.1GHz/65W)
Intel Core i5 - 8600 (6 Cores/9MB/6T/up to 4.3GHz/65W)
Intel Core i7 - 8700 (6 Cores/12MB/12T/up to 4.6GHz/65W)

Memory

Table 1. Memory specificationsMemory specifications
Description	Values
Minimum memory configuration	4 GB (1 x 4GB module)
Maximum memory configuration	32 GB
Number of slots	Two SODIMM
Maximum memory supported per slot	16 GB
Memory options	4 GB - 1 x 4 GB 8 GB - 1 x 8 GB 8 GB - 2 x 4 GB 16 GB - 1 x 16 GB 16 GB - 2 x 8 GB 32 GB - 2 x 16 GB
Type	DDR4 SDRAM Non-ECC memory
Speed	2666 MHz 2400 MHz on i3 processor

NOTE:Intel Optane Memory does not replace DDR memory or add to RAM capacity.

Storage

Table 1. Storage specificationsStorage specifications
Primary/Boot drive	Form Factor	Capacity
One Solid-State Drive (SSD)	M.2 2280	Up to 2 TB
One 2.5 inch Hard-Disk Drive (HDD)	Approximately (2.760 x 3.959 x 0.374 inches)	Up to 2 TB
One 2.5 inch Solid-State Hybrid Drive (SSHD)	Approximately (2.760 x 3.959 x 0.276 inches)	Up to 1 TB
Intel Optane memory	M.2 2280	16 GB and 32 GB

NOTE:Optical disk drive is offered separately through the height adjustable stand.

Table 2. Storage configurationsStorage combinations
Primary/Boot drive	Form Factor
1 x M.2 Drive	NA
1 x M.2 Drive	1 x 2.5 inch Drive
1 x 2.5 inch Drive	NA
1 x 2.5 inch HDD with M.2 Optane	NA

NOTE: Supports RAID 0 and 1 with M.2 SATA SSD and 2.5" SSD/HDD. RAID 0 and 1 are not supported with M.2 PCIe SSD and 2.5" SSD/HDD due to different interface types. It is not available with Optane memory (Available from August 2019).

For optimal performance when configuring drives as a RAID volume, Dell recommends drive models that are identical.

RAID 0 (Striped, Performance) volumes benefit from higher performance when drives are matched because the data is split across multiple drives: any IO operations with block sizes larger than the stripe size will split the IO and become constrained by the slowest of the drives. For RAID 0 IO operations where block sizes are smaller than the stripe size, whichever drive the IO operation targets will determine the performance, which increases variability and results in inconsistent latencies. This variability is particularly pronounced for write operations and it can be problematic for applications that are latency sensitive. One such example of this is any application that performs thousands of random writes per second in very small block sizes.

RAID 1 (Mirrored, Data Protection) volumes benefit from higher performance when drives are matched because the data is mirror across multiple drives: all IO operations must be performed identically to both drives, thus variations in drive performance when the models are different results in the IO operations completing only as fast as the slowest drive. While this does not suffer the variable latency issue in small random IO operations as with RAID 0 across heterogeneous drives, the impact is nonetheless large because the higher performing drive becomes limited in all IO types. One of the worst examples of constrained performance here is when using unbuffered IO. To ensure writes are fully committed to non-volatile regions of the RAID volume, unbuffered IO bypasses cache (for example by using the Force Unit Access bit in the NVMe protocol) and the IO operation will not complete until all the drives in the RAID volume have completed the request to commit the data. This kind of IO operation completely negates any advantage of a higher performing drive in the volume.

Care must be taken to match not only the drive vendor, capacity, and class, but also the specific model. Drives from the same vendor, with the same capacity, and even within the same class, can have very different performance characteristics for certain types of IO operations. Thus, matching by model ensures that the RAID volumes is comprised of an homogeneous array of drives that will deliver all the benefits of a RAID volume without incurring the additional penalties when one or more drives in the volume are lower performing.

When RAID is used for two non-identical drives (i.e. M.2 + 2.5 inch), performance will be at the speed of the slower drive in the array.

Audio

Table 1. AudioAudio
Integrated Realtek ALC3289 High Definition Audio
Description	Values
High Definition Stereo support	Yes
Number of channels	2
Number of Bits / Audio resolutions	16, 20, and 24-bit resolution
Sampling rate (recording/playback)	Support 44.1K/48K/96K/192 kHz sample rates
Signal to Noise Ratio	98 dB for DAC outputs, 92 dB for ADC inputs
Analog Audio	Yes
Waves MaxxAudio Pro	Yes
Audio Jack Impedance
Microphone	40 K ohm~60 K ohm
Line-In	N/A
Line-Out	100 ohm~150 ohm
Headphone	1 ohm~4 ohm
Internal Speaker Power Rating	3 Watt (average) / 4 Watt (peak)

Video controller

Table 1. VideoVideo
Controller	Type	Graphics memory type
Intel UHD Graphics 630	UMA	Integrated
NVIDIA GeForce GTX 1050, 4GB	Discrete	GDDR5

Table 2. Video port resolution matrixVideo
	DisplayPort 1.2	HDMI 1.4	HDMI 2.0b
Max resolution - Single display	4096x2160	2560x1600 @ 24Hz 4096x2160 @ 24Hz	2560x1600 @ 24Hz 4096x2160 @ 24Hz
Max resolution - Dual MST	2560x1600 3440x1440 2560x1080	N/A	N/A
All resolutions shown at 24bpp and unless specifically stated are @ 60 Hz refresh

Web camera

Table 1. Web camera(optional)Web camera
Description	Value
Maximum Resolution	2.0 MP
Camera type	FHD FHD + Infrared (IR)
Video Resolution	FHD - 1080p FHD + IR - 1080p + VGA
Diagonal Viewing Angle	FHD - 74.9° IR - 88°
Power-Saving Support	Suspend, Hibernation
Automatic Image Control	Automatic Exposure Control (AE) Automatic White Balance Control (AWB) Automatic Gain Control (AGC)
Webcam Mechanical Privacy	Pop up camera

Communications - Integrated

Table 1. Communications - IntegratedCommunications
Description	Values
Network adapter	Integrated Intel i219-LM 10/100/1000 Mb/s Ethernet (RJ45 ) with Intel Remote Wake UP and PXE

Communications – wireless

NOTE:Wireless card must be selected at the time of purchase.

Table 1. Communications – wirelessOptional wireless cards
Description	Values
Qualcomm QCA6174A Dual-band 2x2 802.11ac Wireless with MU-MIMO + Bluetooth 4.2	Optional
Intel Wi-Fi AX200, Dual-band 2 x 2 802.11ac with MU-MIMO, Bluetooth 5.0	Optional
Intel Wireless-AC 9560, Dual-band 2x2 802.11ac Wi-Fi with MU-MIMO + Bluetooth 5	Optional

External ports and connectors

Table 1. External ports and connectorsExternal ports and connectors
Description	Values
USB 3.1 Type A Gen1 (Side/Rear/Internal)	1/4/0 1xUSB 3.1 Type A Gen 1 with PowerShare (side) 2xUSB 3.1 Type A Gen 1 (rear) 2xUSB 3.1 Type A Gen 2 (rear)
USB 3.1 Type C Gen 2 (Side/Rear/Internal)	1/0/0 One USB 3.1 Gen 2 Type-C port (side)
Network Connector (RJ-45)	One Rear
HDMI 1.4 Out	One Rear (Integrated graphics configurations)
HDMI-In (Optional)	One Rear
HDMI 2.0 Out	One Rear (Discrete graphics configurations)
DisplayPort 1.2	One Rear
Universal Audio Jack	One Side
Line-Out for headphones or speakers	One Rear

Display

Table 1. Display specificationsDisplay specifications
Description	Values
Type	Full HD (FHD) touch Full HD (FHD) Non-Touch
Screen size (Diagonal)	24 inch
Screen technology	IPS
Display	WLED
Native resolution	1920 x 1080
High definition	Full HD
Luminance	FHD Touch - 200 cd/m FHD Non-touch - 250 cd/m
Active area dimensions	527.04 mm x 296.46 mm
Height	296.46 mm
Width	527.04 mm
Megapixels	2M
Pixels Per Inch (PPI)	82
Pixel pitch	0.2745 mm x 0.2745 mm
Color depth	16.7 M
Contrast ratio (min)	600
Contrast ratio (typical)	1000
Response time (max)	25 mil sec
Typical Response time	14 mil sec
Refresh rate	60 Hhz
Horizontal viewing angle	178°
Vertical viewing angle	178°

Power

Table 1. PowerPower
Description	Option one	Option two
Power Supply Wattage	240 W EPA Platinum	155 W EPA Bronze
AC input Voltage Range	100 Vac–240 Vac	100 Vac–240 Vac
AC input current (low AC range/high AC range)	3.6A/1.8A	3.6A/1.8A
AC input Frequency	47 HZ - 63 HZ	47 HZ - 63 HZ
AC holdup time (80% load)	16 mini sec	16 mini sec
Average Efficiency	90-92-89% @ 20-50-100% load	82-85-82% @ 20-50-100% load
Typical Efficiency (Active PFC)	N/A	N/A
NOTE:The typical efficiency of an Active PFC Power Supply is 70%. APFC Power Supply is not offered with OptiPlex 7470 AIO
DC parameters
+12.0 v output	N/A	N/A
+19.5 v output	19.5 VA - 8.5A and 19.5VB - 10.5A	19.5 VA - 7.5A and 19.5VB - 7.0A
+19.5 v output auxiliary output	19.5 VA - 0.5A and 19.5VB - 1.75A Standby mode 19.5 VA - 0.5A and 19.5VB - 1.75a	19.5 VA - 0.5A and 19.5VB - 1.75A Standby mode 19.5 VA - 0.5A and 19.5VB - 1.75a
Max total power	240 W	155 W
Max combined 12.0 v power (note: only if more than one 12 v rail)	N/A	N/A
BTUs/h (based on PSU max wattage)	819 BTU	529 BTU
Power Supply Fan	N/A	N/A
Compliance
Erp Lot6 Tier 2 0.5watt requirement	Yes	Yes
Climate Savers / 80 Plus Compliant	Yes	Yes
Energy Star 7.0/7.1 Qualified	Yes	Yes
FEMP Standby Power Compliant	Yes	Yes

Table 2. Thermal DissipationPower
Power	Graphics	Heat dissipation	Voltage
155 W	Integrated gfx	155 * 3.4125 = 529 BTU/hr	100 VAC–240 VAC , 50 Hz–60 Hz , 3 A/1.5 A
240 W	Discrete gfx	240 * 3.4125 = 819 BTU/hr	100 VAC–240 VAC , 50 Hz–60 Hz , 3.6A/1.8 A

Table 3. CMOS batteryPower
3.0v CMOS battery (Type and estimated battery life)
Brand	Type	Voltage	Composition	Life
VIC-DAWN	CR-2032	3 V	Lithium	Continuous Discharge Under 30 kΩ Load till 2.0 V End-Voltage at the temperature of 23°C±3°C. The batteries should be submitted to 150 temperature cycles from 60°C~-10°C, and then be stored for more than 24 hours at 23°C±3°C
JHIH HONG	CR-2032	3 V	Lithium	Continuous Discharge Under 15 kΩ Load to 2.5 V End-Voltage. 20°C±2°C: 940 Hrs or longer; 910 Hrs or longer after 12 months.
MITSUBISHI	CR-2032	3 V	Lithium	Continuous Discharge Under 15 kΩ Load to 2.0 V End-Voltage. 20°C±2°C: 1000 Hrs or longer; 970 Hrs or longer after 12 months. 0°C±2°C: 910 Hrs or longer; 890 Hrs or longer after 12 months.

Physical computer dimensions

NOTE:System weight and shipping weight are based on a typical configuration and may vary based on personal computer configuration. A typical configuration includes: integrated graphics and one hard drive.

Table 1. System dimensionsSystem dimensions
Description	Values
Non-touch chassis weight without stand (pounds / kilograms)	13.32 / 6.04
Touch chassis weight without stand (pounds / kilograms)	13.34 / 6.05
Nontouch chassis dimensions (computer without stand):
Height (inches / centimeters)	13.54 / 34.40
Width (inches / centimeters)	21.27 / 54.02
Depth (inches / centimeters)	2.08 / 5.28
Touch chassis dimensions (computer without stand):
Height (inches / centimeters)	13.54 / 34.40
Width (inches / centimeters)	21.27 / 54.02
Depth (inches / centimeters)	2.08 / 5.28
Basic stand dimensions
Height (inches/centimeters)	25.26 cm
Width x Depth (inches / centimeters)	9.21x 7.61 / 23.40 x 19.32
Weight (pounds / kilograms)	5.27 / 2.39
Height adjustable stand dimensions
Width x Depth (inches / centimeters)	10.12 x 8.86 / 25.70 x 22.50
Weight (pounds / kilograms)	6.70 / 3.04
Height-adjustable stand with optical drive dimensions
Height (inches/centimeters)	36.67 cm
Width x Depth (inches/centimeters)	11.34 x 10.77/ 28.8 x 27.35
Weight (pounds/kilograms)	8.27 / 3.75
Articulating stand dimensions
Height (inches/centimeters)	23.35 cm
Width x Depth (inches / centimeters)	10.01 x 10.00 / 25.43 x 25.39
Weight (pounds / kilograms)	7.56 / 3.43
Packaging parameters with basic stand (includes packaging material)
Height (inches / centimeters)	19.09 / 48.50
Width (inches / centimeters)	32.56 / 82.70
Depth (inches / centimeters)	7.76 / 19.70
Shipping weight (pounds / kilograms - includes packaging materials)	28.04 / 12.72
Packaging parameters with height adjustable stand
Height (inches / centimeters)	19.09 / 48.50
Width (inches / centimeters)	32.56 / 82.70
Depth (inches / centimeters)	7.76 / 19.70
Shipping weight (pounds / kilograms - includes packaging materials)	31.09 /14.1
Packaging parameters with height adjustable stand with optical drive
Height (inches / centimeters)	19.09 / 48.50
Width (inches / centimeters)	34.53 / 87.70
Depth (inches / centimeters)	7.76 / 19.7
Shipping weight (pounds / kilograms - includes packaging materials)	31.09 /14.1
Packaging parameters with articulating stand
Height (inches / centimeters)	19.09 / 48.50
Width (inches / centimeters)	26.10 / 66.30
Depth (inches / centimeters)	7.76 / 19.70
Shipping weight (pounds / kilograms - includes packaging materials)	29.76 / 13.50

Environmental

NOTE:For more details on Dell Environmental features, please to go to Environmental Attributes section. See your specific region for availability.

Table 1. EnvironmentalEnvironmental
Description	Values
Recyclable packaging	Yes
BFR/PVC—free chassis	No
Vertical orientation packaging support	Yes
MultiPack packaging	Select countries
Energy Efficient Power Supply	Yes

Dell OptiPlex 7470 All-in-One: технические характеристики и спецификации