Dell PowerVault NX3340 Network Attached Storage System: руководство по обслуживанию

System dimensions

This section provides details of the dimensions of the NX3340 system.


System	Xa	Xb	Y	Za (with bezel)	Za (without bezel)	Zb^*	Zc
8 x 2.5 inch	482.0 mm (18.97 inches)	434.0 mm (17.08 inches)	42.8 mm (1.68 inches)	35.84 mm (1.41 inches)	22.0 mm (0.87 inches)	683.05 mm (26.89 inches)	721.91 (28.42 inches)

NOTE^* indicates that Zb goes to the nominal rear wall external surface, where the system board I/O connectors are located.

Chassis weight

The maximum chassis weight is 21.9 kg (48.28 lbs).

Processor specifications

The NX3340 system supports up to two Intel Xeon Processor Scalable Family processors.

PSU specifications

The NX3340 system supports up to two AC power supply units (PSUs).

Table 1. PSU specifications
The table below are the specifications for the supported power supplies:
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage
750 W AC	Platinum	2891 BTU/hr	50/60 Hz	100–240 V AC, autoranging

NOTE Heat dissipation is calculated using the PSU wattage rating.

NOTE This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 230 V.

System battery specifications

The NX3340 system contains a CR 2032 3.0-V lithium coin cell system battery.

Expansion bus specifications

The NX3340 system supports up to four three PCI express (PCIe) 3.0 expansion cards which are installed on the system board using expansion card risers. This system supports 1A and 2A expansion card risers.

Memory specifications

The NX3340 system supports up to twenty four 288-pins RDIMMS with speed of 3200 MT/s or 2666 MT/s with support for memory optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications for the NX3340 system:
DIMM type	DIMM rank	DIMM capacity	Dual processors
DIMM type	DIMM rank	DIMM capacity	Minimum RAM	Maximum RAM
RDIMM	Single rank	8 GB	32 GB	192 GB

Storage controller specifications

The NX3340 system supports:

Internal storage controller cards: PowerEdge RAID Controller (PERC) H730P Mini.
External storage controller cards: PERC H840 and 12 GB SAS HBA.
External storage:
- Two external enclosures for clustering: 12 Gbp/s MD JBOD - MD1400, MD1420, and SC Series.
- External Tape: LTO external drive, PV114x, TL1000, TL2000, TL4000, ML6000

Drive specifications

The NX3340 system supports up to eight 2.5" SAS, and SATA hard drives and an optional optical drive.

The system ships with either two or four OS drives. Additional data drives must be ordered separately from the factory.

Ports and connectors specifications

The NX3340 system supports USB ports, NIC ports, VGA ports, and a serial connector.

USB ports

The NX3340 supports both USB 2.0 and USB 3.0-compliant ports.

Description of USB port location, type, and quantity
Location	Type	Quantity
Front panel	USB 2.0-compliant port	One
Front panel	Micro USB 2.0-compliant port for iDRAC Direct	One
Back panel	USB 3.0-compliant port	Two
Internal	USB 3.0-compliant port	One

NOTE The micro USB 2.0-compliant port on the front panel can only be used as an iDRAC Direct or a management port.

NIC ports

The NX3340 system supports up to four Network Interface Controller (NIC) ports that are integrated on the network daughter card (NDC). The ports are available in the following configurations.

Four RJ-45 ports that support 10, 100 and 1000 Mbps
Four RJ-45 ports that support 100 M, 1 G and 10 Gbps
Four RJ-45 ports, where two ports support maximum of 10 G and the other two ports maximum of 1 G
Two RJ-45 ports that support up to 1 Gbps and 2 SFP+ ports that support up to 10 Gbps
Four SFP+ ports that support up to 10 Gbps
Two SFP28 ports that support up to 25 Gbps

NOTE You can install up to three PCIe add-on NIC cards.

Serial connector

The NX3340 system supports one serial connector on the back panel. This port is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display.

The NX3340 system supports one 15-pin VGA port on the front and back of the system.

Video specifications

The NX3340 system supports integrated VGA controller with 4 MB SPI capacity.

Table 1. Supported video resolution optionsThis table describes the supported video resolution options:
Resolution	Refresh rate (Hz)	Color depth (bits)
640 x 480	60, 70	8, 16, 32
800 x 600	60, 75, 85	8, 16, 32
1024 x 768	60, 75, 85	8, 16, 32
1152 x 864	60, 75, 85	8, 16, 32
1280 x 1024	60, 75	8, 16, 32
1440 x 900	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

For additional information about environmental measurements for specific system configurations, see dell.com/environmental_datasheets.

List of environmental specs
Temperature
Operating (Continuous, for altitude less than 950 m or 3117 ft)	10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment. NOTE Maximum of 205 W, 28 core processor is supported in systems with eight 2.5 inch processor direct attached PCIe SSD drives, and three PCIe slot chassis.
Storage	–40° to 65°C (–40° to 149°F) at a maximum altitude of 12,000 m (39,370 ft)
Fresh Air	For information on fresh air, see Expanded Operating Temperature section.
Maximum temperature gradient (operating and storage)	20°C/h (68°F/h)
Relative humidity
Operating	10% to 80% (noncondensing) with 29°C (84.2°F) maximum dew point
Storage	5% to 95% (noncondensing) with 33°C (91°F) maximum dew point
Maximum vibration
Operating	0.26 G_rms at 5–350 Hz (all operation orientation)
Storage	1.88 G_rms at 10–500 Hz for 15 min (all six sides tested)
Maximum shock
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 40 G for up to 2.3 ms
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms
Altitude
Operating	3,048 m (10,000 ft)
Storage	12,000 m (39,370 ft)
Operating temperature de-rating
Up to 35 °C (95 °F)	Maximum temperature is reduced by 1°C/300 m (33.8°F/984.25 ft) above 950 m (3,117 ft)
35 °C to 40 °C (95 °F to 104 °F)	Maximum temperature is reduced by 1°C/175 m (1°F/574.14 ft) above 950 m (3,117 ft).
40 °C to 45 °C (104 °F to 113 °F)	Maximum temperature is reduced by 1°C/125 m (1°F/410.1 ft) above 950 m (3,117 ft)

Expanded operating temperature

List of expanded operating temperature requirements.
Expanded operating temperature	Specifications
Continuous operation	5°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE Outside the standard operating temperature (10°C to 35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C to 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours	–5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE Outside the standard operating temperature (10°C to 35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE When operating in the expanded temperature range, system performance may be impacted.

NOTE When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD panel and in the System Event Log.

Expanded operating temperature restrictions

Do not perform a cold startup below 5°C.
The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
150 W/8 core, 165 W/12 core and higher wattage processor [Thermal Design Power (TDP)>165 W] are not supported.
Redundant power supply unit is required.
Non-Dell EMC qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
PCIe SSD is not supported.
Tape backup unit is not supported.

Particulate and gaseous contamination specifications

This section defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have the MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE This condition applies to data center and non-data center environments.

Table 1. Gaseous contamination specifications
The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013.
Silver coupon corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013.

NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.