Dell PowerVault NX3240 Network Attached Storage System: руководство по обслуживанию

System dimensions

This section describes the physical dimensions of the NX3240 system.

NX3240 system dimensions
System	Xa	Xb	Y	Za (with bezel)	Za (without bezel)	Zb	Zc
NX3240	482.0 mm (18.98 inches)	434.0 mm (17.09 inches)	86.8 mm (3.42 inches)	35.84 mm (1.41 inches)	22.0 mm (0.87 inches)	678.8 mm (26.72 inches)	715.5 mm (28.17 inches)

Chassis weight

The maximum weight of the NX3240 system with all drives installed is 33.1 kg (72.91 lb).

Processor specifications

The NX3240 system supports up to two Intel Xeon Processor Scalable Family processors.

PSU specifications

The NX3240 system supports up to two AC power supply units (PSUs).

Table 1. PSU specifications
The table below provides the specifications for 750 W and 1100 W power supplies:
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	High line 200 – 240 V	Low line 100– 120 V	Current
750 W AC	Platinum	2891 BTU/hr	50/60 Hz	100–240 V AC, autoranging	750 W	750 W	10 A–5 A
1100 W AC	Platinum	4100 BTU/hr	50/60 Hz	100–240 V AC, autoranging	1100 W	1050 W	12 A–6.5 A

NOTE Heat dissipation is calculated using the PSU wattage rating.

NOTE This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 240 V.

System battery specifications

The NX3240 system contains a CR 2032 3.0-V lithium coin cell system battery.

Expansion bus specifications

The NX3240 system supports up to four PCI express (PCIe) 3.0 expansion cards which are installed on the system board using expansion card risers. This system supports 1B and 2B expansion card risers.

Memory specifications

The NX3240 system supports up to twenty four 288-pins RDIMMS with speeds of 3200 MT/s or 2666 MT/s with support for memory optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications for the NX3240 system:
DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processors
DIMM type	DIMM rank	DIMM capacity	Minimum RAM	Maximum RAM	Minimum RAM	Maximum RAM
RDIMM	Single rank	8 GB	8 GB	96 GB	16 GB	192 GB
RDIMM	Dual rank	16 GB	16 GB	192 GB	32 GB	384 GB

Storage controller specifications

The NX3240 system supports:

Internal storage controller cards:
- PowerEdge RAID Controller (PERC) H730P mini
External storage controller cards:
- PERC H840
- 12 Gbps SAS HBA
- JBOD such as MD1400 and MD1420
- SC series
- LTO External drives such as PV114x, TL1000, TL2000, TL4000, ML6000
- Dell EMC ML3 (Base Module) and Dell EMC ML3E (Expansion Module) Tape Libraries

Drive specifications

The NX3240 system supports 18 SAS and SATA hard drives.

Up to 12 3.5-inch (SAS or SATA) front accessible drives in slots 0 to 11
Up to four 3.5-inch (SAS or SATA) mid drives in slots 14 to 17
Up to two 3.5-inch (SAS or SATA) rear accessible drives in slots 12 to 13

NOTE The rear accessible drives can also be 2.5-inch (SAS or SATA) in a hybrid carrier.

NOTE Universal slots are slots that support SAS, and SATA hard drives in the same slot.

Ports and connectors specifications

The NX3240 system supports USB ports, NIC ports, VGA ports, and a serial connector.

USB ports

The NX3240 supports both USB 2.0 and USB 3.0-compliant ports.

Description of USB port location, type, and quantity
Location	Type	Quantity
Front panel	USB 2.0-compliant port	Two
Front panel	Micro USB 2.0-compliant port for iDRAC Direct	One
Back panel	USB 3.0-compliant port	Two
Internal	USB 3.0-compliant port	One

NOTE The micro USB 2.0-compliant port on the front panel can only be used as an iDRAC Direct or a management port.

NIC ports

The NX3240 system supports up to four Network Interface Controller (NIC) ports that are integrated on the network daughter card (NDC). The ports are available in the following configurations.

Four RJ-45 ports that support 10, 100 and 1000 Mbps
Four RJ-45 ports that support 100 M, 1 G and 10 Gbps
Four RJ-45 ports, where two ports support maximum of 10 G and the other two ports maximum of 1 G
Two RJ-45 ports that support up to 1 Gbps and 2 SFP+ ports that support up to 10 Gbps
Four SFP+ ports that support up to 10 Gbps
Two SFP28 ports that support up to 25 Gbps

Serial connector

The NX3240 system supports one serial connector on the back panel. This port is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display.

The NX3240 system supports two 15-pin VGA ports on the front and back panels.

Video specifications

The NX3240 system supports an integrated Matrox G200eW3 graphics controller with 16 MB of video frame buffer.

Table 1. Supported video resolution optionsThis table describes the supported video resolution options:
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

NOTE 1920 x 1080 and 1920 x 1200 resolutions are only supported in reduced blanking mode.

Environmental specifications

For additional information about environmental measurements for specific system configurations, see dell.com/environmental_datasheets.

List of environmental specs
Temperature
Operating (Continuous, for altitude less than 950 m or 3117 ft)	10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Storage	–40° to 65°C (–40° to 149°F) at a maximum altitude of 12,000 m (39,370 ft)
Fresh Air	For information on fresh air, see Expanded Operating Temperature section.
Maximum temperature gradient (operating and storage)	20°C/h (68°F/h)
Relative humidity
Operating	10% to 80% (noncondensing) with 29°C (84.2°F) maximum dew point
Storage	5% to 95% (noncondensing) with 33°C (91°F) maximum dew point
Maximum vibration
Operating	0.26 G_rms at 5–350 Hz (all operation orientation)
Storage	1.88 G_rms at 10–500 Hz for 15 min (all six sides tested)
Maximum shock
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 40 G for up to 2.3 ms
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms
Altitude
Operating	3,048 m (10,000 ft)
Storage	12,000 m (39,370 ft)
Operating temperature de-rating
Up to 35 °C (95 °F)	Maximum temperature is reduced by 1°C/300 m (33.8°F/984.25 ft) above 950 m (3,117 ft)
35 °C to 40 °C (95 °F to 104 °F)	Maximum temperature is reduced by 1°C/175 m (1°F/574.14 ft) above 950 m (3,117 ft).
40 °C to 45 °C (104 °F to 113 °F)	Maximum temperature is reduced by 1°C/125 m (1°F/410.1 ft) above 950 m (3,117 ft)

Expanded operating temperature

List of expanded operating temperature requirements.
Expanded operating temperature	Specifications
Continuous operation	5°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE Outside the standard operating temperature (10°C to 35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C to 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours	–5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE Outside the standard operating temperature (10°C to 35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE When operating in the expanded temperature range, system performance may be impacted.

NOTE When operating in the expanded temperature range, ambient temperature warnings may be reported in the System Event Log.

Expanded operating temperature restrictions

Do not perform a cold startup below 5°C.
The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
150 W/8 core, 165 W/12 core and higher wattage processor [Thermal Design Power (TDP)>165 W] are not supported.
Redundant power supply unit is required.
Non-Dell EMC qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
Mid drive tray is not supported.
Rear storage devices or drives are not supported.
Tape backup unit is not supported.

Thermal restrictions

The following table lists the configuration required for efficient cooling.

The following table describes the configuration required for efficient cooling.
Configuration	Number of processors	Heatsink	Processor/DIMM blank	DIMM blanks	Type of air shroud	Fan
NX3240 system with mid bay	1	One 1U high performance heat sink	Required	Required	Not required	Six high performance fans
NX3240 system with mid bay	2	Two 1U high performance heat sink	Not required	Required	Not required	Six high performance fans

Ambient temperature limitations

The following table lists configurations that require ambient temperature less than 35°C.

NOTE The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess CPU throttling, which may impact system performance.

The following table lists configurations that require ambient temperature less than 35°C.
System	Backplane	CPU Thermal Design Power (TDP)	CPU heat sink	Fan type	Ambient restriction
NX3240 system	12 x 3.5-inch SAS/SATA + 4 x 3.5-inch + 2 x 3.5-inch	150 W/8 core, 165 W/12 core, 200 W, 205 W	1U high performance	High performance fan	25°C

Particulate and gaseous contamination specifications

This section defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Air filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have the MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE This condition applies to data center and non-data center environments.

Table 1. Gaseous contamination specifications
The copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04-2013.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013.
Silver coupon corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013.

NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.