Dell Storage NX3330: руководство по обслуживанию

Technical specifications

Table 1. Processor specificationThis table lists the supported processor for this system.
Processor
Processor type		Two Intel Haswell processor E5-2600 v3 product family

Table 2. Expansion bus specificationThis table lists the supported Expansion Bus for this system.
Expansion Bus
Bus type		PCIe Generation 3
Expansion cards		For a list of supported expansion cards, see the Expansion card installation guidelines section in this document.
Expansion slots using riser card:
	Riser 1	(Slot 1) One half-height, three fourth-length x8 link
		(Slot 2) One half-height, half-length x16 link
	Riser 2	(Slot 1) One half-height, half-length x8 link or one half-height, half-length x8 link NOTE: Both processors must be installed to use the slots on riser 1 and the x16 link on riser 2. (Slot 2) One half-height, half-length x8 link or one half-height, half-length x16 link
	Riser 3	(Slot 2) One half-height, half-length x8 link or one half-height, half-length x16 link

Table 3. Power specificationThis table lists the power specification for this system.
Power
AC PSU (per PSU)
	Wattage	750 W
	Heat dissipation NOTE: Heat dissipation is calculated using the PSU wattage rating.	2891 BTU/hr maximum (750 W PSU) 2843 BTU/hr maximum (750 W Titanium PSU)
	Voltage NOTE: This system is also designed to be connected to IT power systems with a phase to phase voltage not exceeding 230 V.	100–240 V AC, autoranging, 50/60 Hz Or 200–240 V AC, autoranging, 50/60 Hz, for 750 W Titanium PSU

Table 4. Memory specificationThis table lists the memory specifications of this system.
Memory
Architecture		1866 MT/ and 2133 MT/s registered Error Correcting Code (ECC) DIMMs
		Support for Advanced ECC or memory-optimized operation
		Support for LRDIMMs
Memory module sockets		Twenty-four 288-pin
Memory module capacities
	LRDIMM	4 GB, 8 GB, 16 GB, or 32 GB single-, dual-, or quad-ranked
	RDIMM	4 GB, 8 GB, or 32 GB single-, dual-, or quad-ranked 16 GB single- or dual-ranked
Minimum RAM		2 GB with a single processor
		4 GB with two processors
Maximum RAM
	LRDIMM	Up to 768 GB
	RDIMM	Up to 512 GB

Table 5. Drive specificationThis table lists the drive specification of this system.
Drives
HDDs
	8—HDD systems	Up to eight 2.5 inch, internal, hot-swappable SAS, SATA, or Nearline SAS HDDs
Optical drive		One optional SATA DVD-ROM drive or DVD+/-RW drive NOTE: DVD devices are data only.

Table 6. Connector specificationThis table lists the connector specification of this system.
Connectors
Back
	NIC	Four 10/100/1000 Mbps or two 10/100/1000 Mbps and two 100 Mbps/1 Gbps/10 Gbps
	Serial	DB-9 Serial Port connector
	USB	Two 4-pin, USB 3.0-compliant
	Video	15-pin VGA
Front
8 HDD systems
	USB	Two 4-pin, USB 3.0-compliant
	Video	15-pin VGA
	External vFlash card	vFlash memory card slot NOTE: The card slot is available for use only if the iDRAC8 Enterprise license is installed on your system.
Internal
	USB	One 4-pin, USB 3.0-compliant
	Internal Dual SD Module (IDSDM)	Two optional flash memory card slots with the internal SD module NOTE: One card slot is dedicated for redundancy.

Table 7. Video specificationThis table lists the video specification of this system.
Video
Video type		Integrated VGA controller
Video memory		16 MB shared

Table 8. Expanded operating temperatureThis table lists the expanded operating temperature range.
Expanded Operating Temperature
NOTE: When operating in the expanded temperature range, system performance may be impacted. NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD and in the System Event Log.
	< 10% of annual operating hours	Continuous Operation 5 °C–40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C–35°C), the system can operate continuously down to 5°C or as high as 40°C. For temperatures between 35°C- 40°C, derate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
	< 1% of annual operating hours	–5 °C–45°C at 5% to 90% RH with 29°C (84.2°F) maximum dew point. NOTE: Outside the standard operating temperature (10°C–35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40 °C–45 °C, derate maximum allowable dry bulb temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
	Expanded Operating Temperature Restrictions	Do not perform a cold startup below 5°C. The operating temperature specified is for a maximum altitude of 30482000 m (10,0006560 ft). PCIe SSD and 1.8-inch SSDs are not supported. GPU is not supported. 145 W and Workstation CPU (160 W) processors are not supported. Two PSUs are required and one PSU failure is not supported. Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.

Table 9. Environmental specificationThis table lists the environmental specification of the system.
Environmental
NOTE: For additional information about environmental measurements for specific system configurations, see Dell.com/environmental_datasheets.
Temperature
	Maximum temperature gradient (operating and storage)	20°C/h (36°F/h)
	Storage temperature limits	–40°C–65°C (–40°F–149°F)
Relative humidity
	Storage	5% to 95% RH with 33°C (91 °F) maximum dew point. Atmosphere must be non-condensing always.
Temperature (continuous operation)
	Temperature ranges (for altitude less than 950 m or 3117 ft)	10 °C–35°C (50 °F–95°F) with no direct sunlight on the equipment.
	Humidity percentage range	10% to 80% Relative Humidity with 26°C (78.8°F) maximum dew point.
Maximum vibration
	Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations).
	Storage	1.87 G_rms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum shock
	Operating	One shock pulse in the positive z axis of 31 G for 2.6 ms in all operational orientations.
	Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum altitude
	Operating	3,0482000 m (10,0006560 ft)
	Storage	12,000 m (39,370 ft).
Operating altitude de-rating
	Up to 35°C (95°F)	Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
	35 °C–40°C (95 °F–104°F)	Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
	40 °C–45°C (104 °F–113°F)	Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).
Particulate contamination NOTE: This section defines the limits to help avoid IT equipment damage and/or failure from particulates and gaseous contamination. If it is determined that levels of particulates or gaseous pollution are beyond the limits specified below and are the reason for the damage and/or failures to your equipment, it may be necessary for you to re-mediate the environmental conditions that are causing the damage and/or failures. Re-mediation of environmental conditions will be the responsibility of the customer.
	Air filtration NOTE: Applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95 percent upper confidence limit. NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
	Conductive dust NOTE: Applies to data center and non-data center environments.	Air must be free from conductive dust, zinc whiskers, or other conductive particles.
	Corrosive dust NOTE: Applies to data center and non-data center environments.	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
Gaseous contamination
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
	Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
	Silver coupon corrosion rate	<200 Å/month as defined by AHSRAE TC9.9.