Dell Storage NX3230 Systems: руководство по обслуживанию

Technical specifications

Table 1. Processor specificationsThis table lists the processor specification for your system.
Processor
Processor type		One or two Haswell processor E5-2600 v3 product family

Table 2. Power specificationsThis table lists the power specification for this system.
Power
AC power supply (per power supply)
	Wattage	750 W, or 1100 W
	Heat dissipation NOTE: Heat dissipation is calculated using the power supply wattage rating.	2891 BTU/hr maximum (750 W power supply) 2843 BTU/hr maximum (750 W Titanium power supply) 4100 BTU/hr maximum (1100 W power supply) 4416 BTU/hr maximum (DC1100W power supply) 2891 BTU/hr maximum (750 W mixed mode power supply)
	Voltage NOTE: This system is also designed to be connected to IT power systems with a phase to phase voltage not exceeding 230 V.	100–240 V AC, autoranging, 50/60 Hz Or 200–240 V AC, autoranging, 50/60 Hz, for 750 W Titanium power supply
DC power supply (per power supply)
	Wattage	1100 W or 750 W (Platinum power supply for China only)
	Heat dissipation NOTE: Heat dissipation is calculated using the power supply wattage rating.	4416 BTU/hour maximum
	Voltage NOTE: This system is also designed to be connected to IT power systems with a phase to phase voltage not exceeding 230 V.	–(48–60) V DC
System battery		CR 2032 3.0-V lithium coin cell

Table 3. Expansion bus specificationThis table lists the expansion bus specifications for your system.
Expansion Bus
Bus type			PCI Express Generation 3
Expansion cards			For a list of supported expansion cards, see the Expansion cards and expansion-card risers section in this document.
Expansion slots using riser card:
	Riser 1		(Slot 1) One half-height, low-profile x8 link
			(Slot 2) One half-height, low-profile x8 link
			(Slot 3) One half-height, low-profile x8 link
	Riser 2		(Slot 4) One full-height, full-length x16 link
			NOTE: To use slots 1–4, both the processors must be installed.
			(Slot 5) One full-height, full-length x8 link
	Riser 3 (default)		(Slot 6) One full-height, full-length x8 link
			(Slot 7) One full-height, full-length x8 link
		Riser 3 (alternate for GPU)	(Slot 6) One full-height, full-length x16 link

Table 4. Memory specificationsThis table lists the memory specifications of this system.
Memory
Architecture		1333 MT/s, 1600 MT/s, 1866 MT/s, or 2133 MT/s DDR4 registered, load-reduced Error Correcting Code (ECC) DIMMs
		Support for advanced ECC or memory optimized operation
Memory module sockets		Twenty-four 288-pin
Memory module capacities
	LRDIMMs	32 GB quad-ranked
	RDIMMs	4 GB single-ranked, 8 GB, or 16 GB dual-ranked
Minimum RAM		4 GB with a single processor
		8 GB with a dual processor (minimum one memory module per processor)
Maximum RAM		Up to 768 GB with a dual processor
		Up to 384 GB with a single processor

Table 5. Drive specificationThis table lists the drive specification of this system.
Hard Drives
Twelve plus two–hard-drive systems	Up to twelve 3.5 inch and two optional 2.5 inch back-accessible, internal, hot-swappable SAS, SATA, SAS/SATA SSD, or Nearline SAS drives in hard-drive slots 0–11 and 12–13.

Table 6. Connector specificationThis table lists the connector specification of this system.
Connectors
Back
	NIC	Four 1 Gbps, two 1 Gbps plus two 10 Gbps, or four 10 Gbps
	Serial	9-pin, DTE, 16550-compatible
	USB	Two 4-pin, USB 3.0-compliant
	Video	15-pin VGA
	External vFlash card	One flash memory card slot with iDRAC8 Enterprise card NOTE: The card slot is available for use only if the iDRAC8 Enterprise license is installed on your system.
Front
	USB	One 4-pin, USB 2.0-compliant One USB management port/iDRAC Direct
	Video	15-pin VGA
Internal
	USB	One 4-pin, USB 3.0-compliant
	Internal Dual SD Module	Two optional flash memory card slots with the internal SD module NOTE: One card slot is dedicated for redundancy.

Table 7. Video specificationThis table lists the video specification of this system.
Video
Video type		Matrox G200eR2
Video memory		16 MB

Table 8. Dimensions and weight This table provides information about dimension and weight of your system.
Physical
Height		8.73 cm (3.44 inch)
Width		48.2 cm (18.98 inch)
Depth		75.58 cm (29.75 inch)
Maximum configuration weight		30.4 kg (67.02 lb) (2.5-inch hard drive systems) 36.5 kg (80.47 lb) (3.5-inch hard drive systems)
Empty weight		19 kg (41.89 lb) (2.5-inch hard drive systems) 23.2 kg (51.15 lb) (3.5-inch hard drive systems)

Table 9. Expanded operating temperatureThis table lists the expanded operating temperature range.
Expanded Operating Temperature
NOTE: When operating in the expanded temperature range, system performance may be impacted. NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD and in the System Event Log.
	< 10% of annual operating hours	Continuous Operation 5 °C–40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C–35°C), the system can operate continuously down to 5°C or as high as 40°C. For temperatures between 35°C- 40°C, derate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
	< 1% of annual operating hours	–5 °C–45°C at 5% to 90% RH with 29°C (84.2°F) maximum dew point. NOTE: Outside the standard operating temperature (10°C–35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40 °C–45 °C, derate maximum allowable dry bulb temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
	Expanded Operating Temperature Restrictions	Do not perform a cold startup below 5°C. The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft). 160 W (10 core) processor is not supported. Tape Backup Unit (TBU) is not supported. Redundant power supplies are required. Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported. PCIe SSD and GPU is not supported. Maximum 120 W processor supported on 3.5 inch hard drive chassis. Maximum 145 W processor supported on 2.5 inch hard drive chassis. Only SSDs are allowed in the hard drive slots at the back of the 3.5 inch hard drive chassis.

Table 10. Environmental specificationThis table lists the environmental specification of the system.
Environmental
NOTE: For additional information about environmental measurements for specific system configurations, see Dell.com/environmental_datasheets.
Temperature
	Storage	–40°C–65°C (–40°F–149°F)
	Continuous operation (for altitude less than 950 m or 3117 ft)	10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
	Fresh air	For information on fresh air, see Expanded Operating Temperature section.
	Maximum temperature gradient (operating and storage)	20°C/h (36°F/h)
Relative humidity
	Storage	5% to 95% RH with 33°C (91 °F) maximum dew point. Atmosphere must be non-condensing always.
	Operating	10% to 80% Relative Humidity with 29°C (84.2°F) maximum dew point.
Maximum vibration
	Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations).
	Storage	1.87 G_rms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum shock
	Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 40 G for up to 2.3 ms.
	Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum altitude
	Operating	3,048 (10,000 ft)
	Storage	12,000 m (39,370 ft).
Operating altitude de-rating
	Up to 35°C (95°F)	Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
	35 °C–40°C (95 °F–104°F)	Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
	40 °C–45°C (104 °F–113°F)	Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).
Particulate contamination NOTE: This section defines the limits to help avoid IT equipment damage and/or failure from particulates and gaseous contamination. If it is determined that levels of particulates or gaseous pollution are beyond the limits specified below and are the reason for the damage and/or failures to your equipment, it may be necessary for you to re-mediate the environmental conditions that are causing the damage and/or failures. Re-mediation of environmental conditions will be the responsibility of the customer.
	Air filtration NOTE: Applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95 percent upper confidence limit. NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
	Conductive dust NOTE: Applies to data center and non-data center environments.	Air must be free from conductive dust, zinc whiskers, or other conductive particles.
	Corrosive dust NOTE: Applies to data center and non-data center environments.	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
Gaseous contamination
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
	Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
	Silver coupon corrosion rate	<200 Å/month as defined by AHSRAE TC9.9.