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Dell EMC NX430 System: руководство по обслуживанию

Dimensions and weight

Physical
Dimensions
Height
42.8 mm (1.68 inch)
Width with rack latches
482.38 mm (18.99 inch)
Width without rack latches
434.15 mm (17.09 inch)
Depth without bezel
610 mm (24 inch)
Maximum weight for four hard drive chassis
13.8 kg (30.42 lbs)
Empty weight for four hard drive chassis
6.0 kg (13.22 lbs)

Processor specifications

Processor
Specification
Type
One Intel E3-1200 V5 series

Expansion bus specifications

PCI Express (PCIe) Generation 3 expansion slots (with optional expansion card risers)
Specification
LP SLOT 1
One half-height, half-length x4 link
FH SLOT 2
One full-height, half-length x8 link
PCI Express Generation 3 expansion slots (without expansion card risers)
Specification
PCIE_G3_X4
One half-height, half-length x4 link for PERC card
PCIE_G3_X8
One x8 link for riser

Memory specifications

Memory
Specification
Architecture
1600 MT/s, 1866 MT/s, or 2133 MT/s DDR4 Unbuffered DIMMs
Support for advanced ECC or memory optimized operation
Memory module sockets
Four 288-pin sockets
Memory module capacities (UDIMM)
4 GB (single-rank), 8 GB (single- and dual-rank), 16 GB (single- and dual-rank)
Minimum RAM
4 GB
Maximum RAM
64 GB

Power specifications

Power supply unit
Specification
Power rating per power supply unit
350 W (Platinum) (100–240 V AC, 50/60 Hz, 4.8 A–2.4 A)
Heat dissipation
1357.1 BTU/hr
  • NOTE: Heat dissipation is calculated by using the power supply wattage rating.
Voltage
100-240 V AC, autoranging, 50/60 Hz
  • NOTE: This system is also designed to be connected to IT power systems with a phase-to-phase voltage not exceeding 230 V.

Drive specifications

Drives
Specification
Four hard drive systems

Up to four 3.5-inch hot swappable SAS, SATA, or Nearline SAS hard drives

  • NOTE: For more information about PERC, see the Dell PowerEdge RAID Controller (PERC) documentation at Dell.com/storagecontrollermanuals.
Optical drive
One optional slim SATA DVD-ROM or DVD+/-RW drive.

Connectors specifications

Back connectors
Specification
NIC
Two 10/100/1000 Mbps
Serial
DB-9 Serial Port connector
USB
Two 9-pin, USB 3.0-compliant
Video
15-pin VGA
iDRAC8
One optional 1 GbE Ethernet
External SD vFlash
One optional SD vFlash memory card
  • NOTE: The card slot is available for use only if the iDRAC8 Enterprise license is installed on your system.
Front connectors
Specification
USB
Two 4-pin, USB 2.0-compliant
Video
15-pin VGA
Internal connectors
Specification
USB
One 9-pin, USB 3.0-compliant
Internal Dual SD Module
Two optional flash memory card slots with the internal SD module
  • NOTE: One card slot is dedicated for redundancy.

Video specifications

Video
Specification
Video type
Integrated Matrox G200
Video memory
16 MB shared

Expanded operating temperature

  • NOTE: When operating in the expanded temperature range, system performance may be impacted.
  • NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD and in the System Event Log.
Expanded operating temperature
Specifications
≤ 10% of annual operating hours
5°C to 40°C at 5% to 85% RH with 26°C dew point.
  • NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate down to 5°C or up to 40°C for a maximum of 10% of its annual operating hours.

For temperatures between 35°C and 40°C, de-rate maximum allowable dry bulb temperature by 1°C per 175 m above 950 m (1°F per 319 ft).

≤ 1% of annual operating hours
–5°C to 45°C at 5% to 90% RH with 26°C dew point.
  • NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours.

For temperatures between 40°C and 45°C, de-rate maximum allowable dry bulb temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

Expanded Operating Temperature Restrictions
  • The operating temperature specified is for a maximum altitude of 3048 m (10,000 ft).
  • Non-redundant power supply units are not supported.
  • Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
  • Do not perform a cold startup below 5°C.
  • Enable processor performance degrade.

Environmental specifications

  • NOTE: For additional information about environmental measurements for specific system configurations, see Dell.com/environmental_datasheets.
Temperature
Specifications
Storage
–40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft)
10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Fresh air
For information on fresh air, see Expanded Operating Temperature section.
Maximum temperature gradient (operating and storage)
20°C/h (36°F/h)
Relative humidity
Specifications
Storage
5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating
10% to 80% Relative Humidity with 29°C (84.2°F) maximum dew point.
Maximum vibration
Specifications
Operating
0.26 G rms at 5 Hz to 350 Hz (all operation orientations).
Storage
1.88 G rms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum shock
Specifications
Operating
Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 40 G for up to 2.3 ms.
Storage
Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum altitude
Specifications
Operating

3048 m ( 10,000 ft).

Storage
12,000 m (39,370 ft).
Operating temperature de-rating
Specifications
Up to 35 °C (95 °F)
Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft)

The following section defines the limits to help avoid IT equipment damage and/or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution are beyond the specified limits and cause equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Particulate contamination
Specifications
Air filtration
Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
  • NOTE: Applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
  • NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust
Air must be free of conductive dust, zinc whiskers, or other conductive particles.
  • NOTE: Applies to data center and non-data center environments.
Corrosive dust
  • Air must be free of corrosive dust.
  • Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
  • NOTE: Applies to data center and non-data center environments.
Gaseous contamination
Specifications
Copper coupon corrosion rate
<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate
<200 Å/month as defined by AHSRAE TC9.9.
  • NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.