Dell PowerEdge M7701/M7725: руководство по обслуживанию

Chassis dimensions

This image shows the dimensions of M7725 system. — Figure 1. Chassis dimensions

Table 1. PowerEdgeM7725 chassis dimensionsThis table provides the dimensions of the system:
Xa	Xb	Y	Za	Zb	Zc
560 mm (22.05 inches) NOTE:The front bezel is not supported and no rack ears	537.0 mm (21.14 inches)	46.45 mm (1.83 inches)	71.81 mm (2.83 inch) NOTE:The front bezel is not supported	789.85 mm (31.10 inches)Hook to chassis rear	848.80 mm (33.41 inches)Hook to IMM module alighment cup

System Weight

Table 1. PowerEdge M7725 system weightThe table below shows the maximum weight of the system.
System Configuration	Maximum Weight (with all drives/SSDs)
4 x16 Full height Riser configuration	26.37 kg (58.13 lb)
4 x8 Low profile + 4 x E3.S configuration	27.9 kg (61.5 lb)

Processor specifications

Table 1. PowerEdge M7725 system processor specifications This table provides processor specifications for the system.
Supported processor	Number of processors supported
5^th Generation AMD EPYC 9005 Series processor	Two per node, four per system

DC-SCM Specifications

The DellPowerEdgeM7725system supports Data Center Secure Control Module (DC-SCM) card. The DC-SCM is a modularized card with System Management and personality functions. This card is designed and follows the DC-SCM 2.0 specification (OCP standard). There is customization of the DC-SCM module for M7725 to accommodate specific feature and layout requirements unique to this new platform.

The new module design uses a Main + Attic board construction with high leverage from the standard design. The DC-SCM module will dock into the SCI connector on the HPM. The module is spec compliant and can be used with future DC-MHS compliant boards as well.

NOTE:Ambient air temperature sensor feature is in the DC-SCM module.

Attic board
rSPI cable connector
Main board
iDRAC10 dedicated RJ-45 GbE port
USB Type C iDRAC direct port
USB Type A
Mini DisplayPort
System ID button
Power button

Power distribution board

The Dell PowerEdgeM7725 system supports one Power Distribution Board (PDB). The rear of the system features a panel-mount blind-mate connection that interfaces with a vertical busbar in the rack, supplying 50 V DC power. A system PDB is required to convert this 50 V DC input into the necessary voltages for the various system components. Energy Smart power supplies have intelligent features, such as the ability to dynamically optimize efficiency while maintaining availability and redundancy. Also featured are enhanced power-consumption reduction technologies, such as high-efficiency power conversion and advanced thermal-management techniques, and embedded power-management features, including high-accuracy power monitoring.

Features and Layout

The PDB is designed to support both the M7725 HPMs and future 12 V HPMs. It features two independent halves, each serving one of the two compute nodes housed within the chassis. The only shared component between the two halves is the 50 V DC busbar cable entry. Each half is dedicated to powering a single compute node and includes:

NOTE:HPM is also called a system board.

HSC (Hot Swap Control) so we can do a virtual AC cycle per node
Two parallel power bricks for 12 V DC output at 3200 W
One leak detect (cold plate) connector
Two leak detect rope connectors
77 mm card edge gold fingers for 12 V output

NOTE:Hot Swap Control (HSC) is a dedicated circuit that is on the PDB, it manages the power flow when a device is plugged in or removed while the system is still powered, preventing large current surges and protecting the system from damage by carefully controlling the power delivery during insertion and removal of the components.

This image shows the PDB board. — Figure 1. Power distribution board

Leak detection rope 2 connector (Node 2)
Fan 2 connector (Node 2)
Node 2 HPM connector
Fan 1 connector (Node 2)
Fan 2 connector (Node 1)
Node 1 HPM connector
Fan 1 connector (Node 1)
Leak detection rope 2 connector (Node 1)
Leak detection rope 1 connector (Node 1)
Leak detection cable connector
Power bus bar PDB connector
Leak detection cable connector
Leak detection rope 1 connector (Node 2)

Cooling fan specifications

The PowerEdgeM7725system supports up to two sets of cabled fan modules of standard (STD) cooling fans or high performance (HPR) gold cooling fans per node.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Also known as	Label color	Label image
Standard (STD) fans	STD	STD	No label
High performance	HPR Gold	HPR	Gold

Supported operating systems

The Dell PowerEdge M7725 supports the following operating systems:

Canonical Ubuntu Server LTS
SUSE Linux Enterprise Server
Red Hat Enterprise Linux

For specifications and interoperability details, see OS support. .

System battery specifications

The PowerEdge M7725 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge M7725 system supports PCI express (PCIe) slots on risers. The M7725 supports up to two Full Height, Half Length (FH, HL) or two Low profile (LP) PCIe slots per node.

Table 1. Expansion card slots are supported on the HPM boardThe table shows Expansion card slots are supported on the HPM board.
Config		Riser/OCP	Category	Slot	Form Factor	Slot's electrical bandwidth/ physical connector	Power
RC0	1x OCP (x16) + 2x FH (x16) per node	F1B	Cabled Riser	1	Full Height	PCIe Gen5 x16 (x16 connector)	75 W
		F2B	Cabled Riser	3	Full Height	PCIe Gen5 x16 (x16 connector)	75 W
		OCP	Cabled Riser	2	OCP	PCIe Gen5 x16 (OCP 4C+ connector)	75 W
RC1	1x OCP (x16) + 2x LP (x16) + 2x E3 (x4) per node	F1A	Cabled Riser	1	Low Profile	PCIe Gen5 x16 (x16 connector)	75 W
		F2A	Cabled Riser	3	Low Profile	PCIe Gen5 x16 (x16 connector)	75 W
		Onboard OCP	Cabled Riser	2	OCP	PCIe Gen5 x16 (OCP 4C+ connector)	75 W

Memory specifications

The PowerEdge M7725 system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications:
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity
DDR5 ECC RDIMM	Dual rank	32 GB	32 GB	768 GB
	Dual rank	64 GB	64 GB	1.5 TB
	Dual rank	96 GB	96 GB	2.3 TB
	Dual rank	128 GB	128 GB	3 TB

NOTE:The maximum memory capacity that is mentioned above is of both nodes combined.

NOTE:DIMM mixing configurations are not allowed. All DIMM slots must be populated with the exact same DIMMs (one Dell PN).

Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets	Speed
24 DDR5 DIMM slots	6400 MT/s

NOTE:Memory DIMM slots are not hot pluggable.

NOTE:The processor may reduce the performance of the rated DIMM speed.

Storage controller specifications

The PowerEdge M7725 system supports the following controller cards:

Table 1. Storage controller cards This table provides the controller cards that are supported on the system:
Supported storage controller cards
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1 Modular DC-MHS): HWRAID 2 x M.2 NVMe SSDs

NIC port specifications

The PowerEdge M7725 system supports up to two 10/ 25 GbE integrated on the optional Open Compute Project (OCP) card.

Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature	Specifications
OCP 3.0 Card	10 GbE x 2, 25 GbE x 2

USB ports specifications

Table 1. PowerEdge M7725 USB specificationsThe following table shows the USB specifications for the system:
Front		Internal
USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port on DC-SCM	One	Internal USB 3.0-compliant port	One
Type-C USB 2.0-compliant port on DC-SCM	One	Internal USB 3.0-compliant port	One

Video ports specifications

The PowerEdge M7725 system supports one Mini-DisplayPort on DC-SCM module.

Video specifications

The PowerEdge M7725 system supports the following resolution and refresh rates.

Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Common video mode	Timing name	Pixel frequency	Refresh rate
VGA	640 x 480	25.2 MHz	60 Hz
SVGA	800 x 600	40 MHz	60 Hz
XGA	1024x768	65 MHz	60 Hz
WXGA	1280x768 reduced blanking	68.25 MHz	60 Hz
HDTV	1280 x 720 P	74.25 MHz	60 Hz
HDTV	1280 x 720 P	74.25 MHz	60 Hz
HDTV	1280 x 720 P	74.25 MHz	60 Hz
HDTV	1920 x 1080i	74.25 MHz	60 Hz
HDTV	1920 x 1080p	74.25 MHz	60 Hz
HD	1360 x 768	85.5 MHz	60 Hz
SXGA	1280 x 1024	108 MHz	60 Hz
SXGA+	1400 x 1050 reduced blanking	101 MHz	60 Hz
WSXGA+	1680 x 1050 reduced blanking	119 MHz	60 Hz
UXGA	1600 x 1200	162 MHz	60 Hz
FHD	1920 x 1080 P	148.5 MHz	60 Hz
FHD	1920 x 1080 P	148.5 MHz	60 Hz
WUXGA	1920 x 1200 reduced blanking	154 MHz	60 Hz
QXGA	2048 x 1536	266.9 MHz	60 Hz
WQXGA	2560 x 1600 reduced blanking	268.5 MHz	60 Hz

Environmental specifications

Table 1. Operational Climatic Range CategoriesThe table shows Operational Climatic Range Categories.
Category A2	Allowable Operation
Temperature Ranges (For Altitude <900 meters or 2953 feet)	10 °C–35°C (50°F – 95°F) with no direct sunlight on the platform
Humidity Percent Ranges (Non-Condensing at all times)	8%RH with -12°C minimum dew point to 80%RH with 21°C (69.8°F) maximum dew point
Operational Altitude De-Rating	Maximum temperature is reduced by 1°C/300 meters (1.8°F/984 feet) above 900 meters (2,953 feet)

Table 2. Category A2The table shows Category A2 allowable operations.
Allowable Operation
Maximum Temperature Gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware
Non-Operational Temperature Limits	-40°(-5)** C to 65°C (-40°(23) F to 149°F
Non-Operational Humidity Limits (Non-Condensing at all times)	5% to 95%RH with 27°C (80.6°F) maximum dew point.
Maximum Non-Operational Altitude	12,000 meters (39,370 feet)
Maximum Operational Altitude	3,048 meters (10,000 feet)

NOTE:*ASHARE thermal guidelines, these are not instantaneous rates of temperature change.

NOTE:**Liquid-filled components, or systems/solutions containing liquid-filled components are limited to approximately 5°C above their freeze point. At this time, the only authorized liquid coolant is Recohem PG25 with a freeze point between -9°C and -13°C, therefore the lower non-operational temperature limit is -5°C. Components and systems/solutions that can contain liquid but do not at the time of testing shall be tested to the -40°C lower non-operational temperature limit.

Table 3. Maximum vibration specificationsThe table shows maximum vibration specifications.
Maximum vibration specifications
Operating	0.21 Grms at 5 Hz to 500 Hz (x, y, and z axes)
Storage	1.38 Grms at 7 Hz to 250 Hz for 15 min (all six sides tested)

Table 4. Maximum shock specificationsThe table shows maximum shock specifications.
Maximum shock specifications
Operating	Six consecutively performed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms
Storage	Six consecutively performed Long Duration Half Sine Shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 35 G for up to 25 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 should have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE:The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE:Air entering the data center must have MERV11 or MERV13 filtration
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE:This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE:This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04. The silver coupon corrosion rate is <200 Å/month as defined by ANSI/ISA71.04.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300A/month per class G1 as defines by ANSI/ISA71.04-2013
Silver coupon corrosion rate	<200A/month as defined by ANSI/ISA71.04-2013

Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label	Description
HPR GOLD	High performance Gold (HPR Gold) fan
LP	Low profile
FH	Full height
DLC	Direct Liquid Cooling

Table 2. Thermal solution matrix The table describes the thermal solution matrix
Configurations	DPU	CPU	DIMM	Fan type	DIMM blank	Air Shroud	LP/FH PCIe Filler	Fan quantities
SM Config	DPU	TDP	Capacity	Fan type	DIMM blank	Air Shroud	LP/FH PCIe Filler	Fan quantities
Full height configuration	Yes	All TDP	All capacities	HPR Gold Fan	Required for all empty DIMM slots	Required for all configs	Required for all empty PCIe slots	4x fan modules and 8x fans for all configs
	No	TDP <= 400 W	DIMM <64G	VHP Fan
		TDP <= 400 W	DIMM = >64G	HPR Gold Fan
		TDP > 400 W	DIMM < 64G	HPR Gold Fan
		TDP > 400 W	DIMM = >64G	HPR Gold Fan
Low profile +E3.S configuration	N/A	TDP <= 400 W	DIMM < 64G	VHP Fan
		TDP <= 400 W	DIMM = >64G	HPR Gold Fan
		TDP > 400 W	DIMM < 64G	HPR Gold Fan
		TDP > 400 W	DIMM = > 64G	HPR Gold Fan

Table 3. Thermal restriction matrix This table describes the processor and heat sink restriction matrix.
M7725
PPCM Config		Full height configuration				Low profile + E3.S configurationN/A
DPU		With DPU	Without DPU
DIMM		All capacities	< 64 GB	64 GB <= DIMM <=128 GB	*256 GB
M7725	320 W	HPR Gold fan	STD fan	HPR Gold fan	HPR Gold fan	STD fan	HPR Gold fan	HPR Gold fan
	360 W	HPR Gold fan	STD fan	HPR Gold fan	HPR Gold fan	STD fan	HPR Gold fan	HPR Gold fan
	400 W	HPR Gold fan	STD fan	HPR Gold fan	HPR Gold fan	STD fan	HPR Gold fan	HPR Gold fan
	500 W	HPR Gold fan	HPR Gold fan	HPR Gold fan	HPR Gold fan	HPR Gold fan	HPR Gold fan	HPR Gold fan

Table 4. ASHRAE thermal restriction for FH configurationThis table shows ASHRAE thermal restriction for FH configuration.
Dell PowerEdge server standard operating support (ASHRAE A2 compliant) All options supported unless otherwise noted	Dell PowerEdge server extended Inletient 40°C Operating Support (ASHRAE A3 compliant)	Dell PowerEdge server extended Inletient 45°C Operating Support (ASHRAE A4 compliant)
HPR Gold fan is required for FH configuration system with DPU CPU > 400 W DIMM => 64 GB Air shroud is required for all the configs DIMM Blanks are required for all the empty DIMM slots Each node requires 2x fan module which has 4x fans One OU requires 4x fan module which has 8x fans Delta DLC loop and CoolerMaster DLC loop could be installed in the different node in one OU system FH PCIe filler is required for empty PCIe slots All configs support ASHRAE A2	Not supported	Not supported

Table 5. ASHRAE thermal restriction for LP + E3.S configurationThis table shows ASHRAE thermal restriction for LP + E3.S configuration.
Dell PowerEdge server standard operating support (ASHRAE A2 compliant) All options supported unless otherwise noted	Dell PowerEdge server extended Inletient 40°C Operating Support (ASHRAE A3 compliant)	Dell PowerEdge server extended Inletient 45°C Operating Support (ASHRAE A4 compliant)
HPR Gold fan is required for FH configuration system with CPU > 400 W DIMM => 64 GB Air shroud is required for all the configs DIMM Blanks are required for all the empty DIMM slots Each node requires 2x fan module which has 4x fans One OU requires 4x fan module which has 8x fans Delta DLC loop and CoolerMaster DLC loop could be installed in the different node in one OU system LP PCIe filler is required for empty PCIe slots All configs support ASHRAE A2	Not supported	Not supported