Enclosure dimensions and weight — Tower
- Physical
- Dimensions
- Height
- 484.4 mm (19.07 inch) with system feet
- 46.38 (cm) (18.26 inch) without system feet
- Width
- 219.2 mm (8.62 inch) without system feet
- 30.96 cm (12.18 inch) with system feet opened
- Depth
- 729.8 mm (28.72 inch) with or without bezel
- Weight (maximum)
- 74.79 kg (164.88 lb)
- Weight (empty)
- 31.70 kg (69.70 lbs)
Enclosure dimensions and weight — Rack
- Physical
- Dimensions
- Height
- 219.2 mm ( 8.62 inch)
- Width
- 446.3 mm ( 17.57 inch) without rack ears
- 48.24 cm (19.0 inch) with rack ears
- Depth
- 729.8 mm (28.72 inch) with or without bezel
- Weight (maximum)
- 68.72 kg (151.50 lbs)
- Weight (empty)
- 24.70 kg (54.45 lbs)
Server module specifications
- Server module
- Specification
- Model
- Up to four PowerEdge M520, M620, or M630 server modules, or Up
to two PowerEdge M820 server modules, or A mix of two PowerEdge M520,
M620, or M630 server modules and one PowerEdge M820 server module.NOTE:For more information about the technical specifications for the server modules, see the server module Owner's Manual at Dell.com/poweredgemanuals.
Expansion bus specifications
- PCI Express expansion slots
- Specification
- Slot 1
- One standard height, full-length x8 PCIe Gen2 card slot connected to riser
- Slot 2
- One standard height, full-length x8 PCIe Gen2 card slot connected to riser
- Slot 3
- One standard height, full-length x8 PCIe Gen2 card slot connected to riser
- Slot 4
- One low profile, half-length x8 PCIe Gen2 card slot connected to system board
- Slot 5
- One low profile, half-length x8 PCIe Gen2 card slot connected to system board
- Slot 6
- One low profile, half-length x8 PCIe Gen2 card slot connected to system board
- Slot 7
- One low profile, half-length x8 PCIe Gen2 card slot connected to system board
- Slot 8
- One low profile, half-length x8 PCIe Gen2 card slot connected to system board
Power specifications
- AC Power supply unit
- Specification
- Wattage
- Up to four 1100 W
- 1600 W (800 W low line intended usage 100 – 127 V AC)
- Connector
- IEC C14
- Heat dissipation
- 4100 BTU/hr (maximum for 1100 W power supply unit (PSU))
3000 BTU/Hr (maximum for the 1600 W PSU de-rated to 800 W for low line operation)
6000 BTU/Hr (maximum for the 1600 W PSU for high line operation)
- System voltage requirements
- 100 – 240 V AC, 50/60 Hz (1100 W PSU)
100 – 127 V AC, 50/60 Hz (1600 W PSU de-rated to 800 W)
200 – 240 V AC, 50/60 Hz (1600 W PSU)
- Battery
- 3 V CR2032 Lithium coin cell
Drive specifications
- Drives
- Specification
- Controller type
- Shared PERC 8
- 12 hard drive systems
- Up to twelve 3.5-inch, hot-swappable SAS, SAS SSD, or Nearline SAS hard drives.
- 25 hard drive systems
- Up to twenty-five 2.5-inch, hot-swappable SAS, SAS SSD, or Nearline SAS hard drives.
- Optical drive
- One optional SATA DVD-ROM drive or DVD+RW drive.NOTE: DVD devices are data only.
Chassis Management Controller specifications
- Externally accessible connectors
- Specification
- Remote management
- Two dedicated 10/100/1000 Mb RJ-45 (for integrated Ethernet remote access controller).
- Serial
- 9-pin, DTE, 16550-compatible
Enclosure control panel specifications
- Externally accessible connectors
- Specification
- USB
- Two 4-pin, USB 2.0-compliant connectors for keyboard and mouse support
- Video
- 15-pin VGA
- LCD panel features
- Four cursor control keys, one select key, LCD screen
I/O Module specifications
Environmental specifications
- Temperature
- Specifications
- Continuous operation (for altitude less than 950 m or 3117 ft)
- 10 °C to 35 °C (50 °F to 95 °F) with no direct sunlight on the equipment.
- Maximum temperature gradient (operating and storage)
- 20 °C/h (36 °F/h)
- Storage temperature limits
- –40 °C to 65 °C (–40 °F to 149 °F)
- Relative humidity
- Specifications
- Storage
- 5% to 95% RH with 33 °C (91 °F) maximum dew point. Atmosphere must be non-condensing at all times.
- Operating
- 10% to 80% Relative Humidity with 26 °C (78.8 °F) maximum dew point.
- Maximum vibration
- Specifications
- Operating
- 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).
- Storage
- 1.87 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
- Maximum shock
- Specifications
- Operating
- One shock pulse in the positive z axis of 31 G for 2.6 ms in all operational orientations.
- Storage
- Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
- Maximum altitude
- Specifications
- Operating
- 3,048 m (10,000 ft)
- Storage
- 12,000 m (39,370 ft).
- Operating Altitude De-rating
- Specifications
- Up to 35 °C (95 °F)
- Maximum temperature is reduced by 1 °C/300 m (1 °F/547 ft) above 950 m (3,117 ft).
- 35 °C to 40 °C (95 °F to 104 °F)
- Maximum temperature is reduced by 1 °C/175 m (1 °F/319 ft) above 950 m (3,117 ft).
- 40 °C to 45 °C (104 °F to 113 °F)
- Maximum temperature is reduced by 1 °C/125 m (1 °F/228 ft) above 950 m (3,117 ft).
The following section defines the limits to help avoid IT equipment damage and/or failure from particulates and gaseous contamination. If it is determined that levels of particulates or gaseous pollution are beyond the limits specified below and are the reason for the damage and/or failures to your equipment, it may be necessary for you to re-mediate the environmental conditions that are causing the damage and/or failures. Re-mediation of environmental conditions will be the responsibility of the customer.
- Particulate contamination
- Specifications
- Air filtration
- Data center air filtration as defined by ISO Class
8 per ISO 14644-1 with a 95% upper confidence limit.NOTE:Applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.NOTE:Air entering the data center must have MERV11 or MERV13 filtration.
- Conductive Dust
- Air must be free of conductive dust, zinc whiskers,
or other conductive particles.NOTE:Applies to data center and non-data center environments.
- Corrosive Dust
- Air must be free of corrosive dust.
- Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:Applies to data center and non-data center environments.
- Gaseous contamination
- Specifications
- Copper coupon corrosion rate
- <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
- Silver coupon corrosion rate
- <200 Å/month as defined by AHSRAE TC9.9.
Expanded operating temperature
- Expanded operating temperature
- Specifications
- < 10% of annual operating hours
- 5 °C to 40 °C at 5% to 85% RH with 26 °C dew point.NOTE:Outside the standard operating temperature (10 °C to 35 °C), the system can operate down to 5 °C or up to 40 °C for a maximum of 10% of its annual operating hours.For temperatures between 35 °C and 40 °C, de-rate maximum allowable dry bulb temperature by 1 °C per 175 m above 950 m (1 °F per 319 ft).
- < 1% of annual operating hours
- –5 °C to 45 °C at 5% to 90% RH with 26 °C dew point.NOTE:Outside the standard operating temperature (10 °C to 35 °C), the system can operate down to –5 °C or up to 45 °C for a maximum of 1% of its annual operating hours.For temperatures between 40 °C and 45 °C, de-rate maximum allowable dry bulb temperature by 1 °C per 125 m above 950 m (1 °F per 228 ft).
- Expanded Operating Temperature Restrictions
- Do not perform a cold startup below 5 °C.
- The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
- Four redundant power supply units are required.
- Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
NOTE:For more information about the server module-specific restrictions for the expanded operating temperature range, see the technical specifications in the server module Owner's Manual at Dell.com/poweredgemanuals.




























