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Dell PowerEdge MX760c: руководство по обслуживанию
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Dell PowerEdge MX760c: руководство по обслуживанию

Sled dimensions

Figure 1. Sled dimensions
This image shows System dimensions
Table 1. PowerEdgeMX760c sled dimensionsThis table provides the dimensions of the sled:
System configuration X Y Z (handle closed).
4 x 2.5-inch or 6 x 2.5-inch257.0 mm (10 inches)51.0 mm (2 inches)622.35 mm (24.5 inches)
8 x E3.s257.0 mm (10 inches)51.0 mm (2 inches)631.77 mm (24.8 inches)

Sled weight

Table 1. PowerEdge MX760c sled weightThe table below shows the maximum weight of the PowerEdge MX760c sled .
System configuration Maximum weight (with all drives/SSDs)
4 x 2.5-inch 8.27 kg (18.23 lb)
6 x 2.5-inch 8.38 kg (18.47 lb)
8 x E3.s 8.59 kg (18.93 lb)

Processor specifications

Table 1. PowerEdge MX760c processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
4th Generation Intel Xeon Scalable processors with up to 56 cores or 5thGeneration Intel Xeon Scalable processors with up to 64 cores Up to two

Supported operating systems

The PowerEdge MX760c system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware vSAN/ESXi

For more information, go to OS support.

System battery specifications

The PowerEdge MX760c system supports CR 2032 3.0-V lithium coin cell system battery.

Memory specifications

The PowerEdge MX760c system supports the following memory specifications for optimized operation.
Table 1. Memory specifications for 4th Generation Intel® Xeon® Scalable ProcessorsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
DDR5 RDIMM Single rank 16 GB 16 GB 256 GB 32 GB 512 GB
Dual rank 32 GB 32 GB 512 GB 64 GB 1 TB
Dual rank 64 GB 64 GB 1 TB 128 GB 2 TB
Quad rank 128 GB 128 GB 2 TB 256 GB 4 TB
Octa rank 256 GB 256 GB 4 TB 512 GB 8 TB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
32 (288-pin) 4000,4400,4800,5600
NOTE:MX760c servers manufactured after July 2024 with 4th Generation Intel® Xeon® Scalable Processors will have 5600 MT/s DIMMs for densities of 16 GB, 32 GB, and 64 GB. A minimum BIOS version of 2.2.7 is required to support 5600 MT/s DIMMs with 4th Generation Intel® Xeon® Scalable Processors.
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:The processor may reduce the performance of the rated DIMM speed.
Table 3. Memory specifications for 5th Generation Intel® Xeon® Scalable ProcessorsThe table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
DDR5 RDIMM Single rank 16 GB 16 GB 256 GB 32 GB 512 GB
Dual rank 32 GB 32 GB 512 GB 64 GB 1 TB
Dual rank 64 GB 64 GB 1 TB 128 GB 2 TB
Dual rank 96 GB 96 GB 1.5 TB 192 GB 3 TB
Quad rank 128 GB 128 GB 2 TB 256 GB 4 TB
NOTE: DDR4 memories are not supported in the MX760c.
Table 4. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Rated DIMM speed
32, 288-pin 5600 MT/s
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:The processor may reduce the performance of the rated DIMM speed.

Memory restriction

  • Min configuration: one DIMM required per CPU.
  • Mixing RDIMM with different capacities and types is not supported. Mixing RDIMMs of different speeds will results all RDIMMs to run at the lowest speed.
  • ASHRE A3/A4: DDR5≥ 128GB is not supported. Note: ASHRAE A3 is for 40C ambient support, and A4 is for 45C ambient support.
  • Non-populated DIMM slots should be installed with solid DIMM blanks.
  • Processor 2 has a max DIMM count of 12 when using Processor 2 HPR heat sink. In configurations utilizing the HPR heat sink, the total max DIMM count for Processor 1 and Processor 2 is 24.

PERC, Mezzanine and Mini Mezzanine slots specifications

The PowerEdge MX760c system supports:

  • One x16 PCIe Gen4 slot for PERC – connected to processor 1
  • One x16 PCIe Gen4 slot for Mezz A – connected to processor 1
  • One x16 PCIe Gen5 slot for Mezz B – connected to processor 2
  • One x16 PCIe Gen4 slot for Mini Mezz – connected to processor 1
  • One x4 PCIe Gen4 slot for BOSS-N1 – connected to processor 1

Drives

The PowerEdge MX760c system supports:
  • 4 x 2.5-inch hot-swappable SAS, SATA, NVMe (HDD/SSD) drives on x4 universal backplane configuration.
  • 6 x 2.5-inch hot-swappable SAS, SATA,NVMe (HDD/SSD) drives on x6 universal backplane configuration.
  • 6 x 2.5-inch hot-swappable SAS, SATA (HDD/SSD) drives on x6 SAS/SATA backplane configuration.
  • 8 x E3.s hot-swappable NVMe SSD drives on E3x8 backplane configuration.
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support > Browse all products > Infrastructure > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation > Manuals and Documents.

Storage controller specifications

The PowerEdge MX760c system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers
  • PERC H965i MX
  • HBA350i MX
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 SSDs 480 GB or 960 GB
Software RAID
  • S160

USB ports specifications

Table 1. PowerEdge MX760c USB specificationsThe following table shows the USB specifications for the system:
Front Internal (Optional)
USB port type No. of ports USB port type No. of ports
USB 3.0-compliant port One Internal USB 3.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0-compliant port) One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

Video specifications

The PowerEdge MX760c system supports Matrox G200 W3 graphics controller integrated with iDRAC with 16 MB of video frame buffer.
Table 1. Supported video resolution options This table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1400 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Documentation on Dell Support.
Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Operational climatic range category A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Operational climatic range category A4 This table describes the operational climatic range for category A4.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-40 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,050 meters (10,006 feet)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal restriction matrix

Table 1. Thermal restriction matrix for PowerEdge MX760c with 4th Gen Intel® Xeon® Scalable Processors This table describes the thermal restriction matrix for PowerEdge MX760c with 4th Gen Intel® Xeon® Scalable Processors :
Configuration 6 x 2.5-inch BP 6 x 2.5-inch BP 4 x 2.5-inch BP 8 x E3.s BP Diskless in 4 x 2.5" BP
Adjacent Sled Condition Support Not Limited Optimized* Not Limited Not Limited Not Limited
CPU SKUs TDP SAS drive NVMe drive SAS drive NVMe drive SAS drive NVMe drive E3 drive No drive
6430/6454S 270W Not Supported 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
8461V 300W 1S Not Supported 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
8452Y/8460Y+ 300W Not Supported Not Supported 30°C 30°C 30°C 30°C 35°C 35°C
8468V 330W Not Supported Not Supported 30°C 30°C 30°C 30°C 30°C 30°C
3408U 125W 1S 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C
5416S 150W 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C
4416+ 165W 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C
5418Y/6426Y 185W 40°C 35°C 40°C 35°C 40°C 35°C 35°C 35°C 40°C 40°C
6434 195W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
5420+/6438Y+/6438M 205W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6448Y/6442Y 225W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6444Y 270W Not Supported 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
8462Y+ 300W Not Supported Not Supported 30°C 30°C 30°C 30°C 35°C 35°C
256 GB RDIMM 4800 13.2W, 2 DPC 30°C 30°C 30°C 30°C 35°C 35°C 35°C 35°C 35°C 35°C
128 GB RDIMM 4800 9.7W, 2 DPC 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
64 GB RDIMM 4800 8.5W, 2 DPC 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C
32 GB RDIMM 4800 4.2W, 2 DPC 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C
Mezzanine card, Tier2, ≤ 30 W 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C
Mini Mezzanine card 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C
NOTE: Optimized sled condition is to recommend the nearby sleds population with same storage configuration or sled blank for thermally optimization by air cooling.
NOTE: Wider HPR heatsink is required for > 225W CPUs
NOTE:Max DIMM count support for wider HPR heatsink is 24 pcs depended on DIMM population guidance.
Table 2. Thermal restriction matrix for PowerEdge MX760c with 5th Gen Intel® Xeon® Scalable Processors This table describes the thermal restriction matrix for PowerEdge MX760c with 5th Gen Intel® Xeon® Scalable Processors :
Configuration 6 x 2.5-inch BP 6 x 2.5-inch BP 4 x 2.5-inch BP 8 x E3.s BP Diskless in 4 x 2.5" BP
Adjacent Sled Condition Support Not Limited Optimized* Not Limited Not Limited Not Limited
Front Storage Type SAS drive NVMe drive SAS drive NVMe drive SAS drive NVMe drive E3 drive No drive
4514Y 150W 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C
6534/6526Y 195W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6548Y+/6542Y 250W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
8562Y 300W Not Supported Not Supported 30°C 30°C 30°C 30°C 35°C 35°C
4509Y 125W 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 35°C 45°C
4510 150W 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 35°C 45°C
6548N 250W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
128 GB RDIMM 5600 11.1W, 2 DPC 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
96 GB RDIMM 5600 8.1W, 2 DPC 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C
64 GB RDIMM 5600 7.4W, 2 DPC 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C
32 GB RDIMM 5600 4.7W, 2 DPC 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C
Mezzanine card, Tier2, ≤ 30 W 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C
Mini Mezzanine card 45°C 35°C 45°C 35°C 45°C 35°C 35°C 35°C 45°C 45°C
NOTE:Optimized sled condition is to recommend the nearby sleds population with same storage configuration or sled blank for thermally optimization by air cooling.
NOTE:Wider HPR heatsink is required for > 225W CPUs
NOTE:Max DIMM count support for wider HPR heatsink is 24 pcs depended on DIMM population guidance.

Extended ambient restrictions

ASHRAE A3 environment

  • Do not perform a cold startup below 5°C
  • The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
  • With Air Cooling Solution, Higher wattage processors, Thermal Design Power (TDP) > 185 W are not supported.
  • Non-Dell qualified peripheral cards or peripheral cards greater than 30 W are not supported.
  • PCIe SSD is not supported.
  • 128 GB or higher capacity RDIMM is not supported.
  • E3.s drive is not supported.

ASHRAE A4 environment

  • Do not perform a cold startup below 5°C.
  • The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
  • With Air Cooling Solution, Higher wattage processors, Thermal Design Power (TDP) > 165 W are not supported.
  • Non-Dell qualified peripheral cards or peripheral cards greater than 30 W are not supported.
  • PCIe SSD is not supported.
  • 128 GB or higher capacity RDIMM is not supported.
  • E3.s drive is not supported.