Dell EMC PowerEdge MX840c: характеристики и спецификации

Sled dimensions

This image shows dimensions of the PowerEdge MX840c sled — Figure 1. Dimensions of the PowerEdge MX840c sled

Table 1. Dimensions of the PowerEdge MX840c sledThis table gives details of the dimensions of the Dell EMC PowerEdge MX840c sled.
X	Y	Z (handle closed)
250.2 mm (9.85 inches)	85.5 mm (3.37 inches)	618 mm (24.33 inches)

Chassis weight

Table 1. Chassis weightThe table below shows the maximum weight of the PowerEdge MX840c.
Sled	Maximum weight (with all drives/SSDs)
8 x 2.5 inch	17 kg (37.47 lb)
6 x 2.5 inch	16.8 kg (37.04 lb)

Processor specifications

The PowerEdge MX840c sled supports up to four Intel Xeon Scalable Processors.

Intel Quick Assist Technology

The Intel® Quick Assist Technology (QAT) on the Dell EMC PowerEdge MX840c is supported with chipset integration and is enabled through an optional license. The license files are enabled on the sleds through iDRAC.

For more information about iDRAC, see the Dell Integrated Remote Access Controller User's Guide at www.dell.com/poweredgemanuals

For more information about drivers, documentation, and white papers on the Intel® QAT, see https://01.org/intel-quickassist-technology

Supported operating systems

The PowerEdge MX840c supports the following operating systems:

Red Hat® Enterprise Linux

SUSE® Linux Enterprise Server

Canonical® Ubuntu® LTS

Microsoft Windows Server® with Hyper-V

Virtualization options:

VMware® ESXi

Citrix® XenServer®

NOTE For more information about the specific versions and additions, go to https://www.dell.com/ossupport.

System battery specifications

The PowerEdge MX840c sled supports CR 2032 3.0-V Nickel-Plated lithium coin cell system battery.

Memory specifications

The Dell EMC PowerEdge MX840c system supports the following memory specifications for optimized operation.

Table 1. Memory specificationsThe table below shows the memory specifications for the Dell EMC PowerEdge MX840c system:
DIMM type	DIMM rank	DIMM capacity	Dual processors		Quad processors
DIMM type	DIMM rank	DIMM capacity	Minimum RAM	Maximum RAM	Minimum RAM	Maximum RAM
LRDIMM	Octa rank	128 GB	256 GB	3 TB	512 GB	6 TB
LRDIMM	Quad rank	64 GB	128 GB	1.5 TB	256 GB	3 TB
RDIMM	Single rank	8 GB	16 GB	192 GB	32 GB	384 GB
	Dual rank	16 GB	32 GB	384 GB	64 GB	768 GB
	Dual rank	32 GB	64 GB	768 GB	128 GB	1.5 TB
	Dual rank	64 GB	64 GB	768 GB	128 GB	1.5 TB
NVDIMM-N	Single rank	16 GB	16 GB	192 GB	Supported on the system board only (No NVDIMM-N on PEM)
DCPMM	NA	128 GB	RDIMM: 384 GB	LRDIMM: 1536 GB	RDIMM: 384 GB		LRDIMM: 3072 GB
	NA	128 GB	DCPMM: 1536 GB	DCPMM: 1536 GB	DCPMM: 248 GB		DCPMM: 3072 GB
	NA	256 GB	RDIMM: 192 GB	LRDIMM: 1536 GB	RDIMM: 384 GB		LRDIMM: 3072 GB
	NA	256 GB	DCPMM: 2048 GB	DCPMM: 3072 GB	DCPMM: 4096 GB		DCPMM: 6144 GB
	NA	512 GB	RDIMM: 384 GB	LRDIMM: 1536 GB	RDIMM: 768 GB		LRDIMM: 3072 GB
	NA	512 GB	DCPMM: 4096 GB	DCPMM: 6144 GB	DCPMM: 8192 GB		DCPMM: 12,288 GB

Table 2. Memory module socketsThe table below shows the memory module sockets for the Dell EMC PowerEdge MX840c system:
Memory module sockets	Speed
Sixteen 288-pin	2933 MT/s, 2666 MT/s

NOTE 8 GB RDIMMs and NVDIMM-N must not be mixed.

NOTE 64 GB LRDIMMs and 128 GB LRDIMMs must not be mixed.

NOTE Minimum of two processors are required for any configurations that support NVDIMM-N.

NOTE DCPMM can be mixed with RDIMMs and LRDIMMs.

NOTE Mix of Intel DCPMM operating modes (App Direct, Memory Mode) is not supported within socket or across sockets.

Drives

Table 1. Supported drive options for the PowerEdge MX840c sled The table lists out the supported drives for the PowerEdge MX840c sled.
Drives	Specifications
Eight drives	Up to eight 2.5 inch (SAS, SATA, Nearline SAS, or NVMe) front accessible drives in slots 0 to 7.
Dual processor sled	NVMe drives are supported in the slots 4 to 7. NOTE NVMe is not supported in the slots 0 to 3.
Quad processor sled	NVMe drives are supported in the slots 0 to 7.
Six drives	Up to six 2.5 inch (SAS, SATA, Nearline SAS, or NVMe) front accessible drives in slots 0 to 5.
Dual processor sled	NVMe drives are supported in the slots 2 to 5. NOTE NVMe is not supported in the slots 0 to 1.
Quad processor sled	NVMe drives are supported in the slots 0 to 5.

USB ports

The PowerEdge MX840c sled supports:

One USB 3.0-compliant port on the front of the sled
One USB 3.0-compliant port internal port
One USB 2.0-compliant management port to iDRAC on the front of the sled
One port for IDSDM (USB 3.0 + USB 2.0 for Cypress solution)

Internal Dual SD Module

The PowerEdge MX840c sled supports optional Internal Dual SD module (IDSDM). The IDSDM module is placed in the front of the sled, in a Dell-proprietary slot. The IDSDM module supports two MicroSD cards. The MicroSD cards capacity for IDSDM are 16, 32, 64 GB.

The IDSDM module is available with single MicroSD card in either slot or in redundant mode with two MicroSD cards installed.

NOTE The dip switch is on the IDSDM module for write-protection.

NOTE One IDSDM card slot is dedicated for redundancy.

NOTE It is recommended to use Dell branded MicroSD cards associated with the IDSDM configured systems.

PERC controller cards

The PowerEdge MX840c sled supports PERC9/10 solutions. The PERC provides a base RAID hardware controller without a PCIe slot by using small form factor and high density connector to the system board.

Table 1. Supported PERC controllersThe table describes the supported PERC controllers for the PowerEdge MX840c.
Performance Level	Controller and Description
Entry	S140 (SATA, NVMe)
Entry	SW RAID SATA
Value	HBA330 (non-RAID Internal)
	Fury IOC
	Memory: None
	x8 12 Gb/s SAS
	x8 PCIe 3.0/2.0
	HBA330 MX(non-RAID External)
	Memory: None
	x8 12 Gb/s SAS
	x8 PCIe 3.0
	HBA330 Mini-Mezzanine (non-RAID Internal)
	Memory: None
	x8 12 Gb/s SAS
	PCIe 3.0
Value Performance	H730P (Internal)
	Invader ROC
	Memory: 2 GB, NV 72-bit, 866MHz
	x8 12 Gb SAS, 6 Gb/s SATA
	x8 PCIe 3.0/2.0
	H745P (Internal)
	Memory: 8 GB
	x8 12 Gb SAS
	x8 PCIe 3.0/2.0
	H730P MX (External)
	Memory: 8 GB
	x8 12 Gb SAS, 6 Gb/s SATA/SAS, 3 Gb/s SATA
	x8 PCIe 3.0
	H745P MX (External)
	Memory: 8 GB
	12 Gb/s SAS, 6 Gb/s SATA/SAS, 3 Gb/s SATA
	x8 PCIe 3.0

Mezzanine cards

The PowerEdge MX840c sled supports:

Table 1. Supported mezzanine cardsThe table list the supported mezzanine cards for the PowerEdge MX840c sled.
Type	Connection
Two x16 PCIe Gen3 for mini mezzanine cards	Connected to processor 2 and processor 4
Four x16 PCIe Gen3 for mezzanine cards	Mezzanine A is connected to processor 1 and processor 3
Four x16 PCIe Gen3 for mezzanine cards	Mezzanine B is connected to processor 2 and processor 4

Video specifications

Table 1. Video specificationsThe following table provides the video specifications for the Dell EMC PowerEdge MX740c systems.
Type	Description
Video type	Matrox G200eW3 graphics controller integrated with iDRAC
Video memory	4 Gb DDR4 shared with iDRAC application memory

Environmental specifications

NOTE For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on support.dell.com.

Table 1. Temperature specificationsThe table below shows the optimal working temperature specifications.
Temperature	Specifications
Storage	–40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft)	10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Fresh air	For information about fresh air, see the Expanded Operating Temperature section.
Maximum temperature gradient (operating and storage)	20°C/h (68°F/h)

Table 2. Relative humidity specificationsThe table below shows the relative humidity specification during operations and storage.
Relative humidity	Specifications
Storage	5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating	10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.

Table 3. Maximum vibration specificationsThe table below shows the maximum vibration specifications during operations and storage.
Maximum vibration	Specifications
Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations).
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 min (all six sides tested).

Table 4. Maximum shock specificationsThe table below shows the maximum shock specifications during operations and storage.
Maximum shock	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.

Table 5. Maximum altitude specificationsThe table below shows the maximum altitude specifications during operations and storage.
Maximum altitude	Specifications
Operating	30482000 m (10,0006560 ft)
Storage	12,000 m (39,370 ft)

Table 6. Operating temperature derating specificationsThe table below shows the operating temperature derating specifications.
Operating temperature derating	Specifications
Up to 35°C (95°F)	Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
35°C to 40°C (95°F to 104°F)	Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
40°C to 45°C (104°F to 113°F)	Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate	<200 Å/month as defined by AHSRAE TC9.9.

NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Standard operating temperature

Table 1. Standard operating temperature specificationsThe standard operating temperature for altitude less than 950 metres or 3117 feet ranges from 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Standard operating temperature	Specifications
Continuous operation (for altitude less than 950 m or 3117 ft)	10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Humidity percentage range	10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.

Expanded operating temperature

Table 1. Expanded operating temperature specificationsWhen the system is in continuous operation, the expanded operating temperature ranges from 10°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 40°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft). When the system is operating at < 1% of annual operating hours, the expanded operating temperature is –5°C to 45°C at 5% to 90% RH with 29°C dew point.
NOTE: Outside the standard operating temperature (10°C to 40°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Expanded operating temperature	Specifications
Continuous operation	5°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE Outside the standard operating temperature (10°C to 40°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours	–5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE Outside the standard operating temperature (10°C to 40°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE When operating in the expanded temperature range, system performance may be impacted.

NOTE When operating in the expanded temperature range, ambient temperature warnings may be reported on the bezel's LCD panel and in the System Event Log.

Expanded operating temperature restrictions

Do not perform a cold startup below 5°C.
The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
Low core count processors [Gold 6240Y, 6146, 6144] and higher wattage processors [Thermal Design Power (TDP)>=165 W] are not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 30 W are not supported.
PCIe SSD is not supported.
NVDIMM is not supported.
DCPMM is not supported.

Thermal

PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate temperature thereby reducing server noise and power consumption. The sensors in the MX840c interact with the chassis management services module which regulates fan speed. All fans which cool the MX840c are contained in the MX7000 chassis.

Thermal management of PowerEdge MX840c delivers high performance for the right amount of cooling to components at the lowest fan speeds across a wide range of ambient temperatures from 10°C to 35°C (50°F to 95°F) and to extended ambient temperature ranges (see Environmental Specifications). The benefits to you are lower fan power consumption (lower server system power and data center power consumption) and greater acoustical versatility.

Table 1. Thermal restrictions matrixThe following table describes the thermal restriction matrix for the PowerEdge MX840c.
Ambient support	25°C	30°C	35°C	40°C-45°C Expanded operating temperature
Processor	No restriction	No restriction	No restriction	No support for 165 W processors and above. No support for Gold 6144(150W8c) 6146(165W12c) 6240Y(150W8c)
DIMM	No restriction	No restriction	No restriction	No support for NVDIMM
Drive	No restriction	No restriction	No restriction	No support for NVMe drive
Card	No restriction	No restriction	No restriction	No support for card power above 30 W

Dell EMC PowerEdge MX840c: технические характеристики и спецификации