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Dell EMC PowerEdge MX750c: технические характеристики и спецификации
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Dell EMC PowerEdge MX750c: технические характеристики и спецификации

Sled dimensions

Figure 1. PowerEdgeMX750c sled dimensions
This image shows System dimensions
Table 1. Sled dimensions of the PowerEdgeMX750c systemThis table provides the dimensions of the PowerEdgeMX750c sled:
X Y Z (handle closed).
250.2 mm (9.85 inches)42.15 mm (1.65 inches)594.99 mm (23.42 inches)

Sled weight

Table 1. PowerEdge MX750c sled weightThe table below shows the maximum weight of the PowerEdge MX750c sled.
System configuration Maximum weight
6 x 2.5-inch 8.3 kg (18.29 pound)
4 x 2.5-inch 8.1 kg (17.85 pound)

Processor specifications

Table 1. PowerEdge MX750c processor specificationsThis table provides PowerEdge MX750c processor specifications.
Supported processor Number of processors supported
3rd Generation Intel Xeon Scalable processors with up to 40 cores Up to two

Supported operating systems

The PowerEdge MX750c system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi/vSAN
  • Citrix Hypervisor

For more information, go to www.dell.com/ossupport.

System battery specifications

The PowerEdge MX750c system supports CR 2032 3.0-V lithium coin cell system battery.

Memory specifications

The PowerEdge MX750c system supports the following memory specifications for optimized operation.
Table 1. PowerEdge MX750c memory specificationsThe table below shows the memory specifications of PowerEdge MX750c system:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
RDIMM Single rank 8 GB 8 GB 128 GB 16 GB 256 GB
Dual rank 16 GB 16 GB 256 GB 32 GB 512 GB
32 GB 32 GB 512 GB 64 GB 1 TB
64 GB 64 GB 1 TB 128 GB 2 TB
LRDIMM Quad rank 128 GB 128 GB 2 TB 256 GB 4 TB
Octa rank 256 GB 256 GB 4 TB 512 GB 8 TB
Table 2. Memory module socketsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
32, 288-pin 3200 MT/s, 2933 MT/s, 2666 MT/s
NOTE 8 GB RDIMM is not supported with Intel Optane PMem 200 Series configurations.
NOTE 256 GB LRDIMM is only supported on X4 universal backplane configuration. It cannot be mixed with Intel Optane PMem 200 Series configurations.
NOTE PMem can be mixed with RDIMMs and LRDIMMs.
NOTE PMem cannot be mixed with 256GB LRDIMM.
NOTE Mix of Intel Data center persistent memory module operating modes (App Direct, Memory Mode) is not supported within socket or across sockets.
NOTE Memory DIMM slots are not hot pluggable.
NOTE For more information about Intel Optane PMem 200 Series installation guidelines, see the system Installation and Service Manual at www.dell.com/poweredgemanuals.

PERC, Mezzanine and Mini Mezzanine slots specifications

The PowerEdge MX750c system supports:

  • One x16 PCIe Gen4 slot for PERC – connected to processor 1
  • One x16 PCIe Gen4 slot for Mezz A – connected to processor 1
  • One x16 PCIe Gen4 slot for Mezz B – connected to processor 2
  • One x16 PCIe Gen4 slot for mini-Mezz card – connected to processor 2
NOTE For information on the expansion card installation guidelines, see the system Installation and Service Manual at www.dell.com/poweredgemanuals.

Drives

The Dell EMC PowerEdge MX750c system supports:
  • 6 x 2.5-inch hot-swappable SAS, SATA drives supported on X6 SAS/SATA BP configuration.
  • 6 x 2.5-inch hot-swappable NVMe, SATA supported on X6 universal BP configuration.
  • 4 x 2.5-inch hot-swappable NVMe, SAS, SATA drives supported on X4 universal BP configuration.
NOTE For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at https://www.dell.com/support > Browse all products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

Storage controller specifications

The system supports the following controller cards:
Table 1. Storage controller cards of the PowerEdge MX750c systemThis table provides the controller cards supported on the PowerEdge MX750c system:
Internal controllers External controllers
  • PERC H745P MX
  • PERC H755 MX
  • HBA350i MX
  • Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs 240 GB or 480 GB
  • PERC H745P MX
  • HBA330 MMZ

USB ports specifications

Table 1. PowerEdge MX750c USB specificationsThe following table shows the USB specifications for PowerEdge MX750c system :
Front Internal
USB port type No. of ports USB port type No. of ports
USB 3.0-compliant port One Internal USB 3.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0-compliant port) One
NOTE The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

IDSDM

The PowerEdge MX750c system supports Internal Dual SD module (IDSDM).

The IDSDM supports two microSD cards and is available in the following configurations:

Table 1. PowerEdge MX750c supported microSD card storage capacityThis table lists the storage capacity of the PowerEdge MX750c supported microSD cards.
IDSDM card
  • 16 GB
  • 32 GB
  • 64 GB
NOTE One IDSDM card slot is dedicated for redundancy.
NOTE Use Dell EMC branded microSD cards that are associated with the IDSDM configured systems.

Video specifications

The PowerEdge MX750c System supports Matrox G200 W3 graphics controller integrated with iDRAC with 16 MB of video frame buffer.

Table 1. Supported video resolution optionsThis table describes the supported video resolution options of the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the manuals & documents on www.dell.com/support/home.
Table 1. Operational climatic range category A2 This table describes the operational climatic range for category A2.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/300 m (33.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Operational climatic range category A3 This table describes the operational climatic range for category A3.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Operational climatic range category A4 This table describes the operational climatic range for category A4.
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude de-rating Maximum temperature is reduced by 1°C/125 m (33.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Shared requirements across all categories This table describes the shared requirements across all categories.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE * - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-104 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 5. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 6. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal restriction matrix

Table 1. PowerEdge MX750c thermal restriction - processor configuration This table describes the thermal restriction of processor configuration for PowerEdge MX750c system:
ASHRAE A2 A3/A4
Ambient Support 30 ° C 35 ° C 40 ° C (ASHRAE A3) / 45 ° C (ASHRAE A4)
Processor 270 W processor in 4 drives backplane configuration with 4 NVMes Processor with 220 W and above has to be limited in 4 drives backplane configuration. Not supported for processor TDP >140 W in A3

Not supported for processor TDP >135 W in A4

Table 2. Thermal restriction matrixThe table describes thermal restriction matrix:
Configuration 6 x 2.5-inch BP w/6 drives and 32 DIMMs 4 x 2.5-inch BP w/4 drives and 32 DIMMs
Test storage SAS drive NVMe drive SAS drive NVMe drive
Ambient temperature
Processor TDP 105 W 45°C 35°C 45°C 35°C
120 W 45°C 35°C 45°C 35°C
125 W 45°C 35°C 45°C 35°C
135 W 45°C 35°C 45°C 35°C
150 W 35°C 35°C 35°C 35°C
165 W 35°C 35°C 35°C 35°C
185 W 35°C 35°C 35°C 35°C
205 W 35°C 35°C 35°C 35°C
220 W Not supported Not supported 35°C 35°C
250 W Not supported Not supported 35°C 35°C
270 W Not supported Not supported 35°C 30°C
Memory 128 GB LRDIMM 3200, 9.4 W, 2 DPC 45°C 35°C 45°C 35°C
Intel Optane PMem 200 Series, 15-18 W 30°C 30°C 35°C 35°C
PCIe card Mezzanine card, Tier2, ≤ 30 W 45°C 35°C 45°C 35°C
Mini Mezzanine card 45°C 35°C 45°C 35°C

Thermal air restrictions

Thermal

PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate temperature thereby reducing server noise and power consumption. The sensors in the MX750c interact with the chassis management services module which regulates fan speed. All fans which cool the MX750c are contained in the MX7000 chassis.

Thermal management of PowerEdge MX750c delivers high performance for the right amount of cooling to components at the lowest fan speeds across a wide range of ambient temperatures from 10°C to 35°C (50°F to 95°F) and to extended ambient temperature ranges (see Environmental Specifications section). The benefits to you are lower fan power consumption (lower server system power and data center power consumption) and greater acoustical versatility.

For detailed information about thermal please consult the MX7000 Technical Guide.

ASHRAE A3 environment

  • Do not perform a cold startup below 5°C.
  • The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
  • Higher wattage processors, Thermal Design Power(TDP)>140 W are not supported.
  • Non-Dell qualified peripheral cards or peripheral cards greater than 30 W are not supported.
  • PCIe SSD is not supported.
  • Intel Optane PMem 200 Series is not supported.
  • 128 GB LRDIMM is not supported.

ASHRAE A4 environment

  • Do not perform a cold startup below 5°C.
  • The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
  • Higher wattage processors, Thermal Design Power(TDP)>135 W are not supported.
  • Non-Dell qualified peripheral cards or peripheral cards greater than 30 W are not supported.
  • PCIe SSD is not supported.
  • Intel Optane PMem 200 Series is not supported.
  • 128 GB LRDIMM is not supported.