Dell EMC PowerEdge FC640: характеристики и спецификации

System dimensions

Table 1. System dimensions of the Dell EMCPowerEdgeFC640systemSystem dimensions
System	X	Y	Z (handle closed)
Dell EMCPowerEdgeFC640	211.0 mm (8.3-inches)	40.25 mm (1.58-inches)	535.75 mm (21.09-inches)

System weight

Table 1. Dell EMC PowerEdge FC640 system weightSystem weight
System	Maximum weight
2 x 2.5-inch drive	5.8 kg (12.79 lb)

Processor specifications

The Dell EMC PowerEdge FC640 system supports up to two Intel Xeon Scalable Processors.

Supported operating systems

The PowerEdge FC640 supports the following operating systems:

Canonical Ubuntu LTS
Citrix XenServer
Microsoft Windows Server
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware

For more information, go to www.dell.com/ossupport

System battery specifications

The Dell EMC PowerEdge FC640 system supports CR 2032 3.0-V lithium coin cell system battery.

Memory specifications

Table 1. Memory specificationsThe table below shows the memory specifications.
Memory module sockets	DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processors
Memory module sockets	DIMM type	DIMM rank	DIMM capacity	Minimum RAM	Maximum RAM	Minimum RAM	Maximum RAM
Sixteen 288-pins	LRDIMM	Octa rank	128 GB	128 GB	1024 GB	256 GB	2048 GB
	LRDIMM	Quad rank	64 GB	64 GB	512 GB	128 GB	1024 GB
	RDIMM	Single rank	8 GB	8 GB	64 GB	16 GB	128 GB
		Dual rank	16 GB	16 GB	128 GB	32 GB	256 GB
		Dual rank	32 GB	32 GB	256 GB	64 GB	512 GB
		Dual rank	64 GB	64 GB	512 GB	128 GB	1024 GB

Mezzanine card specifications

The Dell EMC PowerEdge FC640 system supports two PCIe x8 Gen 3 slots mezzanine card supporting dual port 10 Gb Ethernet, quad port 1 Gb, FC8 Fibre Channel, FC16 Fibre Channel, or Infiniband mezzanine cards.

Storage controller specifications

The Dell EMC PowerEdge FC640 system supports:

Internal Controllers: Software RAID S140,PERC9 H330,H730P

Boot Optimized Storage Subsystem:

HWRAID 2 x M.2 SSDs 120GB, 240 GB
Internal Dual SD Module optional

Hard drives

The Dell EMC PowerEdge FC640 system supports up to two 2.5-inch SAS or SATA hard drives or PCIe SSDs. The hard drives or SSDs are supplied in a hot-swappable drive carriers that fit in the drive bays and these drives connect to the system board through the drive backplane.

USB ports

The Dell EMC PowerEdge FC640 system supports:

One USB 3.0-compliant port on the front of the system
One micro USB/iDRAC direct USB 2.0-compliant port on the front of the system
One USB 3.0-compliant internal port

NOTE The micro USB 2.0-compliant port on the front of the system can only be used as an iDRAC Direct or a management port.

Internal Dual SD Module

The Dell EMC PowerEdge FC640 system supports two internal micro SD cards dedicated for the hypervisor. This card offers the following features:

Dual card operation — maintains a mirrored configuration by using micro SD cards in both slots and provides redundancy.
Single card operation — single card operation is supported, but without redundancy.

NOTE One IDSDM card slot is dedicated for redundancy. It is recommended to use Dell branded micro SD cards associated with the IDSDM/micro SD vFlash configured systems.

Micro SD vFlash connector

The Dell EMC PowerEdge FC640 system supports one dedicated micro SD card for vFlash support.

Video specifications

Table 1. Video specificationsThe following table provides the video specifications for the Dell EMC PowerEdge FC640 system.
Features	Specifications
Video type	Matrox G200eW3 graphics controller integrated with iDRAC
Video memory	4 GB DDR4 shared with iDRAC application memory

Environmental specifications

NOTE For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/poweredgemanuals

Table 1. Temperature specificationsWhen the system is in continuous operation (for altitude less than 950 m or 3117 ft), the temperature specification ranges from 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment. NOTE: Maximum of 145 W 22 core processor is supported in systems with eight 2.5-inches drives, two PCI slot chassis, and 75 W single wide active GPU. When the system is not in operation, the temperature specification is –40°C to 65°C (–40°F to 149°F). The Maximum temperature gradient for both opertaion and non-opertaional systems is 20°C/h (36°F/h).
Temperature	Specifications
Storage	–40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft)	10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Maximum temperature gradient (operating and storage)	20°C/h (68°F/h)

Table 2. Relative humidity specificationsFor a non-operational system, the ambient relative humidity ranges from 5% to 95% with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times. For an operational system, the ambient relative humidity ranges from 10% to 80% with 29°C (84.2°F) maximum dew point.
Relative humidity	Specifications
Storage	5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating	10% to 80% relative humidity with 26°C (78.8°F) maximum dew point.

Table 3. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum vibration specification of a non-operational system is 1.87 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum vibration	Specifications
Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations).
Storage	1.87 G_rms at 10 Hz to 500 Hz for 15 min (all six sides tested).

Table 4. Maximum shock specificationsThe maximum shock specification of an operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms. The maximum shock specification of a non-operational system is six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 6 G for up to 11 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.

Table 5. Maximum altitude specificationsThe maximum altitude specification for an operational system is 3048 m (10,000 ft). The maximum altitude specification for a non-operational system is 12,000 m (39,370 ft).
Maximum altitude	Specifications
Operating	3048 m (10,000 ft)
Storage	12,000 m (39,370 ft)

Table 6. Operating temperature de-rating specificationsIf the operating temerature of a system is up to 35 °C (95 °F), the maximum temperature is reduced by 1 °C/300 m (1 °F/547 ft) above 950 m (3,117 ft). If the operating temperature of a system ranges from 35 °C to 40 °C (95 °F to 104 °F), the maximum temperature is reduced by 1 °C/175 m (1 °F/319 ft) above 950 m (3,117 ft). If the operating temperature of a system ranges from 40 °C to 45 °C (104 °F to 113 °F), the maximum temperature is reduced by 1 °C/125 m (1 °F/228 ft) above 950 m (3,117 ft).
Operating temperature de-rating	Specifications
Up to 35°C (95°F)	Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
35°C to 40°C (95°F to 104°F)	Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
40°C to 45°C (104°F to 113°F)	Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specificationsAir filtration specification: Data center air filtration as defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence limit. Note: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Note: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust specification: Air must be free of conductive dust, zinc whiskers, or other conductive particles. Note: This condition applies to data center and non-data center environments. Corrosive dust specification: Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. Note: This condition applies to data center and non-data center environments.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specificationsThe copper coupon corrosion rate is <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate	<200 Å/month as defined by AHSRAE TC9.9.

NOTE Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Standard operating temperature

Table 1. Standard operating temperature specificationsThe standard operating temperature for altitude less than 950 metres or 3117 feet ranges from 10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment. Note: The 2.5-inch hard drive chassis supports a maximum of 145 W processors.
Standard operating temperature	Specifications
Continuous operation (for altitude less than 950 m or 3117 ft)	10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Humidity percentage range	10% to 80% Relative Humidity with 26°C (78.8°F) maximum dew point.

Expanded operating temperature

Table 1. Expanded operating temperature specificationsWhen the system is in continuous operation, the expanded operating temperature ranges from 5°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, de-rate maximum allowable dry bulb temperature by 1°C per 175 m above 950 m (1°F per 319 ft). When the system is operating at < 1% of annual operating hours, the expanded operating temperature is –5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Expanded operating temperature	Specifications
Continuous operation	5°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE Outside the standard operating temperature (10°C to 35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, de-rate maximum allowable dry bulb temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
Less than or equal to 1% of annual operating hours	–5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE Outside the standard operating temperature (10°C to 35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE When operating in the expanded temperature range, system performance may be impacted.

NOTE When operating in the expanded temperature range, ambient temperature warnings maybe reported on the LCD panel and in the System Event Log.

Expanded operating temperature restrictions

The expanded operating temperature restrictions for the FC640 system are listed here:

Do not perform a cold startup below 5°C.
The operating temperature specified is for a maximum altitude of 3048 metres (10,000 feet ).
NVME drives are not supported.
AEP DIMMs are not supported.
105 W/4 C, 115 W/6 C, 130 W/8 C, 140 W/14 C or higher wattage processor (TDP>140 W) are not supported.
NEBS SKU processors higher than 85 W are not supported.
Peripheral cards and /or peripheral cards greater than 25 W, that are not verified by Dell, are not supported.

Thermal Restriction matrix

Table 1. Thermal restrictions matrixThe following table describes the configuration required for efficient cooling.
Thermal Design Power (TDP) for the processor	Core count	Processors	Ambient restriction
Thermal Design Power (TDP) for the processor	Core count	Processors	M1000e	VRTX	FX2
205W	28/24	8180; 8168	Not supported	C25, _{DIMM limit 2*}	C25, _{Special limit*}
205W	28/26/24	8280; 8270;8268;8280M;8280L	Not supported	C25, _{DIMM limit 2*}	C25, _{Special limit*}
205W	24/16/20	6248R;6246R;6242R	Not supported*	Not supported*	Not supported*
200W	18	6154;6254	Not supported	C25, _{DIMM limit 2*}	C25, _{Special limit*}
165W	28/26/18	8176; 8170; 6150	C30, _{DIMM limit 1*}	C35, _{DIMM limit 1*}	C30, _{DIMM limit 1*}
165W	12	6246	C25, _{Special limit*}	C30, _{DIMM limit 1*}	C25, _{Special limit*}
165W	28/24	6240R;6238R;6212U;8276; 8260;8260M;8260L;8276M;8276L	C30	C35	C30
150W	26/24/20	8164; 8160; 6148	C30	C35	C30
150W	16/12	6142; 6136; 8158	C30	C35	C30
150W	24	8160T	C25, _{DIMM limit 2*}	C25, _{DIMM limit 2*}	C25, _{DIMM limit 2*}
150W	8	6244	C25, _{Special limit*}	C30, _{DIMM limit 1*}	C25, _{Special limit*}
150W	24/20/18/16	6248;6240;6242;6252;6210U;6240M	C30	C35	C30
150W	24/16/8	6252N	C25, _{Special limit*}	C30, _{DIMM limit 1*}	C25, _{Special limit*}
150W	16/26/16/24	6226R/6230R/6208U/5220R	C30	C35	C30
140W	22/8	6152; 6140	C40E45	C40E45	C35
140W	14	6132	C30	C35	C30
140W	22	6238;6238M	C40E45	C40E45	C35
135W	24	6262V	C40E45	C40E45	C35
130W	8	6234	C40E45	C40E45	C35
130W	8	6134	C30	C35	C30
130W	8	4215R	C30	C35	C30
125W	20/16	6138; 6130; 8153	C40E45	C40E45	C35
125W	12	6126	C40E45	C40E45	C35
125W	20	6138T	C30	C35	C30
125W	16	6130T	C30	C35	C30
125W	12	6126T	C30	C35	C30
125W	20/18/16/12	6209U;6230;5220S;5218;8253;6226;5220	C40E45	C40E45	C35
125W	20/16/4	6230N	C35	C35	C35
125W	20	5218R	C40E45	C40E45	C35
115W	6	6128	C30	C35	C30
115W	8	5217	C35	C35	C35
115W	20	6222V	C35	C35	C35
105W	4	5122; 8156	C30	C35	C30
105W	14/12	5120; 5118	C40E45	C40E45	C40E45
105W	14	5120T	C30	C35	C30
105W	4	5222/8256	C30	C35	C30
105W	16	5218T	C30	C30	C30
100W	16	4216	C40E45	C40E45	C40E45
95W	10	4210T	C40E45	C40E45	C40E45
85W	12/10/8/6/4	4116; 5115; 4114; 4110; 4108; 3106; 3104; 4112	C40E45	C40E45	C40E45
85W	14	5119T	C40E45	C40E45	C40E45
85W	12	4116T	C40E45	C40E45	C40E45
85W	10	4114T	C40E45	C40E45	C40E45
85W	12/10/8/6	5215;4215;4214;4216; 4210;4208;3204;5215M;5215L	C40E45	C40E45	C40E45
70W	8	4109T	C40E45	C40E45	C40E45

* DIMM limit 1 – Max 64 GB LRDIMMs. No 128 GB, No AEP(Apache Pass). This is applicable only for systems with dual processors.

* DIMM limit 2– Max 32 GB LRDIMMs. No 128 GB/ 64 GB, No AEP(Apache Pass). This is applicable only for systems with dual processors.

* Special limit – No drives, No Backplane, No PCIe, and Max 64GB LRDIMM

**C indicates that the processor is continuously operating at the specified temperature or lower.

***E indicates the expanded operating temperature specified for the processor.

* Not Supported - Only supported in a 1 socket config at ambient 30C

Dell EMC PowerEdge FC640: технические характеристики и спецификации