Пришлите SKU, спецификацию или список требований. Специалист Apltech проверит совместимость компонентов и найдёт актуальные артикулы
Получить консультацию →
Dell DR4300 System: руководство по обслуживанию
Chassis dimensions
This section
describes the physical dimensions of the system.Figure 1. Chassis dimensions
of your Dell DR4300 system
Table 1. Dimensions of
your systemThis table gives details of the dimensions of the
Dell DR4300 system. The dimensions
are as follows: Xa=482.4 mm, Xb=444.0 mm, Y=87.3 mm, Za (with bezel)
=32.0 mm, Za (without bezel) =18.0 mm, Zb=684.0 mm, and Zc=723.0 mm.
Xa
Xb
Y
Za (with bezel)
Za (without bezel)
Zb
Zc
482.4 mm
444.0 mm
87.3 mm
32.0 mm
18.0 mm
684.0 mm
723.0 mm
Chassis weight
This section
describes the weight of the system.
Table 1. Chassis weightFor Dell DR4300 systems 3.5–inch
hard drive system, the maximum chassis weight is 36.5 kg (80.47 lb).
System
Maximum weight (with all hard drives/SSDs)
Dell DR4300 system
36.5 kg (80.47 lb)
(3.5-inch hard drive systems)
Processor specifications
Your Dell DR4300 system
supports up to two Intel Xeon E5-2660 v3 processors.
PSU specifications
Your Dell DR4300 system supports
up to two AC redundant power supply units (PSUs).
Table 1. PSU specificationsFor 1100 W AC platinum PSU, the maximum heat dissipation
is 4100 BTU/hr, frequency is 50/60 Hz, and voltage range is 100-240
V AC autoranging.
PSU
Class
Heat dissipation (maximum)
Frequency
Voltage
1100 W AC
Platinum
4100 BTU/hr
50/60 Hz
100–240 V AC, autoranging
NOTE: Heat
dissipation is calculated using the PSU wattage rating.
NOTE: This system is also
designed to connect to the IT power systems with a phase to phase
voltage not exceeding 230 V.
System battery
specifications
Your Dell DR4300 system supports
CR 2032 3.0-V lithium coin cell system battery.
Expansion bus
specifications
The Dell DR4300 system supports
PCI express (PCIe) generation 3 expansion cards, which need to be
installed on the system board using expansion card risers. This system
supports three types of expansion card risers. The following table
provides the expansion card riser specifications:
Table 1. Expansion card
riser specificationsThis table describes the details of the PICe slots
on the expansion card risers. Riser 1 supports PCIe slots 1 through
3, with half height, low profile, x8 link speed cards. Riser 2 supports
two PCIe cards on slots 4 and 5. PCIe slot 4 supports a full height,
full length, x16 card and PCIe slot 5 supports a full height, full
length x8 card. Riser 3 has two card options. The alternate Riser
3 option supports a single PCIe card on PCIe slot 6. The PCIe slot
6 supports a full height, full length x16 card.
Expansion card riser
PCIe slots on the riser
Height
Length
Link
Riser 1
Slot 1
half-height
low-profile
x8
Riser 1
Slot 2
half-height
low-profile
x8
Riser 1
Slot 3
half-height
low-profile
x8
Riser 2
Slot 4
full-height
full-length
x16
Riser 2
Slot 5
full-height
full-length
x8
Riser 3 (alternate)
Slot 6
full-height
full-length
x16
NOTE: When
using slots 1 through 4 on the riser, ensure that both the processors
are installed on the system.
Memory specifications
The Dell DR4300 system supports
DDR4 registered DIMMs (RDIMMs). Supported memory bus frequencies are
1333MT/s, 1600 MT/s, 1866 MT/s, 2133MT/s, or 2400 MT/s.
Table 1. Memory specificationsYour system supports 24 memory module sockets of
288-pins each. The system supports RDIMMs of memory capacity 4 GB,
8 GB, or 16GB single rank, and RDIMMs of memory capacity 8 GB, 16
GB, or 32 GB dual rank. For system with single processor, the minimum
RAM is 4 GB and for dual processor systems the minimum RAM is 8 GB.
Memory module sockets
Memory capacity
Minimum RAM
Maximum RAM
Twenty-four 288–pin
4 GB
single-ranked or 8 GB dual-ranked RDIMMs
4 GB with single processor
8 GB with dual processors (minimum one memory module
per processor)
64 GB with two processors
Hard drives
The Dell DR4300 system supports
up to twelve 3.5-inch hard drives and two optional 2.5-inch back-accessible
SAS, SATA, or Nearline SAS hard drives.
USB ports
The Dell DR4300 system supports:
USB 2.0-compliant ports on the front panel
USB 3.0-complaint ports on the back panel
internal USB 3.0-compliant port
The following table provides more information about the USB specifications:
Table 1. USB specificationsThe Dell DR4300 system supports
one 4-pin, USB 2.0-compliant port on the front panel. Your system
supports two 9-pin, USB 3.0-compliant ports on the back panel and
one 9-pin, USB 3.0-compliant internal port.
System
Front panel
Back panel
Internal
Dell DR4300 system
One USB management port/iDRAC Direct
Two 9-pin, USB 3.0-compliant ports
One 9-pin, USB 3.0-compliant port
NIC ports
The Dell DR4300 system supports
four Network Interface Controller (NIC) ports on the back panel, which
is available in one of the following three NIC configurations:
Four 1 Gbps
Two 1 Gbps and two 10 Gbps
Four 10 Gbps
Serial connector
The serial
connector connects a serial device to the system. The Dell DR4300 system supports
one serial connector on the back panel, which is a 9-pin connector,
Data Terminal Equipment (DTE), 16550-compliant.
VGA ports
The Video
Graphic Array (VGA) port enables you to connect the system to a VGA
display. The Dell DR4300 system supports
two 15-pin VGA ports on the front and back panels.
Internal Dual
SD Module
The Dell DR4300 system supports
two optional flash memory card slots with an internal dual SD module.
NOTE: One card slot is dedicated
for redundancy.
Video specifications
The Dell DR4300 system supports
Matrox G200eR2 graphics card with 16 MB capacity.
Environmental
specifications
NOTE: For additional information
about environmental measurements for specific system configurations,
see Dell.com/environmental_datasheets.
Table 1. Temperature
specificationsWhen the system is in continuous operation (for altitude less
than 950 m or 3117 ft), the temperature specification ranges from
10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
NOTE: Maximum of 145 W 22 core processor is supported in systems with
eight 2.5-inches drives, two PCI slot chassis, and 75 W single wide
active GPU. When the system is not in operation, the temperature specification
is –40°C to 65°C (–40°F to 149°F). The Maximum temperature gradient
for both opertaion and non-opertaional systems is 20°C/h (36°F/h).
Information about fresh air specification is described in the Expanded
Operating Temperature section.
Temperature
Specifications
Storage
–40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950
m or 3117 ft)
10°C to 35°C (50°F to 95°F) with no direct sunlight
on the equipment.
Fresh air
For information about fresh air, see Expanded
Operating Temperature section.
Maximum temperature gradient (operating and storage)
20°C/h (68°F/h)
Table 2. Relative humidity
specificationsFor a non-operational system, the ambient relative humidity
ranges from 5% to 95% with 33°C (91°F) maximum dew point. Atmosphere
must be non-condensing at all times. For an operational system, the
ambient relative humidity ranges from 10% to 80% with 29°C (84.2°F)
maximum dew point.
Relative humidity
Specifications
Storage
5% to 95% RH with 33°C (91°F) maximum dew point.
Atmosphere must be non-condensing at all times.
Operating
10% to 80% relative humidity with 29°C (84.2°F)
maximum dew point.
Table 3. Maximum vibration
specificationsThe maximum vibration specification of an operational system
is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).The maximum
vibration specification of a non-operational system is 1.88 Grms
at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum vibration
Specifications
Operating
0.26 Grms at 5 Hz to 350 Hz (all operation
orientations).
Storage
1.88 Grms at 10 Hz to 500 Hz for 15
min (all six sides tested).
Table 4. Maximum shock
specificationsThe maximum shock specification of an operational system is
six consecutively executed shock pulses in the positive and negative
x, y, and z axes of 40 G for up to 2.3 ms. The maximum shock specification
of a non-operational system is six consecutively executed shock pulses
in the positive and negative x, y, and z axes (one pulse on each side
of the system) of 71 G for up to 2 ms.
Maximum vibration
Specifications
Operating
Six consecutively executed shock pulses in the
positive and negative x, y, and z axes of 40 G for up to 2.3 ms.
Storage
Six consecutively executed shock pulses in the
positive and negative x, y, and z axes (one pulse on each side of
the system) of 71 G for up to 2 ms.
Table 5. Maximum altitude
specificationsThe maximum altitude specification for an operational system
is 3048 m (10,000 ft). The maximum altitude specification for a non-operational
system is 12,000 m (39,370 ft).
Maximum altitude
Specifications
Operating
30482000 m (10,0006560 ft)
Storage
12,000 m (39,370 ft)
Table 6. Operating temperature
de-rating specificationsIf the operating temerature of a system is up to 35 °C (95 °F),
the maximum temperature is reduced by 1 °C/300 m (1 °F/547 ft) above
950 m (3,117 ft). If the operating temperature of a system ranges
from 35 °C to 40 °C (95 °F to 104 °F), the maximum temperature is
reduced by 1 °C/175 m (1 °F/319 ft) above 950 m (3,117 ft). If the
operating temperature of a system ranges from 40 °C to 45 °C (104
°F to 113 °F), the maximum temperature is reduced by 1 °C/125 m (1
°F/228 ft) above 950 m (3,117 ft).
Operating temperature de-rating
Specifications
Up to 35°C (95°F)
Maximum temperature is reduced by 1°C/300 m (1°F/547
ft) above 950 m (3,117 ft).
35°C to 40°C (95°F to 104°F)
Maximum temperature is reduced by 1°C/175 m (1°F/319
ft) above 950 m (3,117 ft).
40°C to 45°C (104°F to 113°F)
Maximum temperature is reduced by 1°C/125 m (1°F/228
ft) above 950 m (3,117 ft).
Particulate
and gaseous contamination specifications
The following
table defines the limitations that help avoid any equipment damage
or failure from particulates and gaseous contamination. If the levels
of particulates or gaseous pollution exceed the specified limitations
and result in equipment damage or failure, you may need to rectify
the environmental conditions. Re-mediation of environmental conditions
is the responsibility of the customer.
Table 1. Particulate
contamination specificationsAir filtration specification: Data center air filtration as
defined by ISO Class 8 per ISO 14644-1 shpuld have a 95% upper confidence
limit. Note: This condition applies only to data center environments.
Air filtration requirements do not apply to IT equipment designed
to be used outside a data center, in environments such as an office
or factory floor. Note: Air entering the data center must have MERV11
or MERV13 filtration. Conductive dust specification: Air must be free
of conductive dust, zinc whiskers, or other conductive particles.
Note: This condition applies to data center and non-data center environments.
Corrosive dust specification: Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less
than 60% relative humidity. Note: This condition applies to data center
and non-data center environments.
Particulate contamination
Specifications
Air filtration
Data center air filtration as defined by ISO Class
8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE: This condition applies
to data center environments only. Air filtration requirements do not
apply to IT equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE: Air entering the data
center must have MERV11 or MERV13 filtration.
Conductive dust
Air must be free of conductive dust, zinc whiskers,
or other conductive particles.
NOTE: This condition applies
to data center and non-data center environments.
Corrosive dust
Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE: This condition
applies to data center and non-data center environments.
Table 2. Gaseous contamination
specificationsThe copper coupon corrosion rate is <300 Å/month per Class
G1 as defined by ANSI/ISA71.04-1985. The silver coupon corrosion rate
is <200 Å/month as defined by AHSRAE TC9.9.
Gaseous contamination
Specifications
Copper coupon corrosion rate
<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate
<200 Å/month as defined by AHSRAE TC9.9.
NOTE: Maximum
corrosive contaminant levels measured at ≤50% relative humidity.
Standard operating
temperature
Table 1. Standard operating
temperature specificationsThe standard operating temperature for altitude less than 950
metres or 3117 feet ranges from 10°C to 35°C (50°F to 95°F) with no
direct sunlight on the equipment. Note: The 2.5-inch hard drive chassis
supports a maximum of 145 W processors.
Standard operating temperature
Specifications
Continuous operation (for altitude less than 950
m or 3117 ft)
10°C to 35°C (50°F to 95°F) with no direct sunlight
on the equipment.
Expanded operating
temperature
Table 1. Expanded operating
temperature specificationsWhen the system is in continuous operation, the
expanded operating temperature ranges from 5°C to 40°C at 5% to 85%
RH with 29°C dew point. NOTE: Outside the standard operating temperature
(10°C to 35°C), the system can operate continuously in temperatures
as low as 5°C and as high as 40°C. For temperatures between 35°C and
40°C, de-rate maximum allowable temperature by 1°C per 175 m above
950 m (1°F per 319 ft). When the system is operating at < 1% of
annual operating hours, the expanded operating temperature is –5°C
to 45°C at 5% to 90% RH with 29°C dew point. NOTE: Outside the standard
operating temperature (10°C to 35°C), the system can operate down
to –5°C or up to 45°C for a maximum of 1% of its annual operating
hours. For temperatures between 40°C and 45°C, de-rate maximum allowable
temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
Expanded operating temperature
Specifications
Continuous operation
5°C to 40°C at 5% to 85% RH with 29°C dew point.
NOTE: Outside the standard
operating temperature (10°C to 35°C), the system can operate continuously
in temperatures as low as 5°C and as high as 40°C.
For temperatures between 35°C and 40°C, de-rate maximum allowable
temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours
–5°C to 45°C at 5% to 90% RH with 29°C dew point.
NOTE: Outside the standard
operating temperature (10°C to 35°C), the system can operate down
to –5°C or up to 45°C for a maximum of 1% of its annual operating
hours.
For temperatures between 40°C and 45°C,
de-rate maximum allowable temperature by 1°C per 125 m above 950 m
(1°F per 228 ft).
NOTE: When
operating in the expanded temperature range, system performance may
be impacted.
NOTE: When operating in the expanded temperature range, ambient temperature
warnings maybe reported on the LCD panel and in the System Event Log.
Expanded operating
temperature restrictions
Do not perform a cold startup below 5°C.
The operating temperature specified is for a maximum
altitude of 3050 m (10,000 ft).
160 W or higher wattage processor is not supported.
Redundant power supply units are required.
Non-Dell qualified peripheral cards and/or peripheral
cards greater than 25 W are not supported.
The 3.5-inch hard drive chassis supports a maximum
of 120 W processor.
The 2.5-inch hard drive chassis supports a maximum
of 145 W processor.
Only SSDs are allowed in the hard drive slots at
the back of the 3.5-inch hard drive chassis.
Mid drive configurations, eight 3.5-inch and eighteen
1.8-inch SSD configurations are not supported.
