Dell DL4300 Appliance: руководство по обслуживанию

Dimensions and weight

Physical	Dimensions
Height	8.73 cm (3.44 inch)
Width	48.2 cm (18.98 inch)
Depth	75.58 cm (29.75 inch)
Maximum configuration weight	36.5 kg (80.47 lb) (3.5–inch hard drive systems)
Empty weight	23.2 kg (51.15 lb) (3.5–inch hard drive systems)

Processor specifications

Processor Type	Specification
Standard Edition	One or two Intel Xeon processors E5-2640 v4 product family
High Capacity Edition	One or two Intel Xeon processors E5–2660 v3 product family

Expansion bus specifications

The Dell DL4300 system supports PCI express (PCIe) generation 3 expansion cards, which need to be installed on the system board using expansion card risers. This system supports three types of expansion card risers. The following table provides the expansion card riser specifications:

Table 1. Expansion card riser specifications
Expansion card riser	PCIe slots on the riser	Height	Length	Link
Riser 1	Slot 1	half-height	low-profile	x8
Riser 1	Slot 2	half-height	low-profile	x8
Riser 1	Slot 3	half-height	low-profile	x8
Riser 2	Slot 4	full-height	full-length	x16
Riser 2	Slot 5	full-height	full-length	x8
Riser 3 (default)	Slot 6	full-height	full-length	x8
Riser 3	Slot 7	full-height	full-length	x8

NOTE: When using slots 1 through 4 on the riser, ensure that both the processors are installed on the system.

PSU specifications

Your Dell DL4300 system supports up to two AC redundant power supply units (PSUs).

Table 1. PSU specifications
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage
1100 W AC	Platinum	4100 BTU/hr	50/60 Hz	100–240 V AC, autoranging

NOTE: Heat dissipation is calculated using the PSU wattage rating.

NOTE: This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 230 V.

System battery specifications

Your Dell DL4300 system supports CR 2032 3.0-V lithium coin cell system battery.

Memory specifications

The Dell DL4300 system supports DDR4 registered DIMMs (RDIMMs). Supported memory bus frequency is 2133MT/s.

Table 1. Memory specifications for Standard Capacity Edition
Memory module sockets	Memory capacity	Minimum RAM	Maximum RAM
Twenty-four 288–pin	4 GB single-ranked or 8 GB dual-ranked RDIMMs	64 GB with a dual processor	Up to 128 GB with a dual processor

Table 2. Memory specifications for High Capacity Edition
Memory module sockets	Memory capacity	Minimum RAM	Maximum RAM
Twenty-four 288–pin	16 GB dual-ranked RDIMMs	128 GB with a dual processor	Up to 256 GB with a dual processor

Hard drives

The Dell DL4300 system supports up to twelve 3.5 inch and two 2.5 inch back-accessible and four 3.5 inch (in the hard-drive tray), internal, hot-swappable Nearline SAS drives in hard-drive slots 0 through 11 and 12 through 15.

USB ports

The Dell DL4300 system supports:

USB 2.0-compliant ports on the front panel
USB 3.0-complaint ports on the back panel

The following table provides more information about the USB specifications:

Table 1. USB specifications
System	Front panel	Back panel
Dell DL4300 system	One 4-pin, USB 2.0-compliant	Two 4-pin, USB 3.0-compliant

NIC ports

The Dell DL4300 Standard Edition system supports two Network Interface Controller (NIC) ports on the back panel, which is available in one of the following NIC configurations:

1 Gbps
1 Gbps plus one 10 Gbps

The DL4300 High Capacity Edition system supports two 10 Gbps Network Interface Controller (NIC) ports on the back panel.

Serial connector

The serial connector connects a serial device to the system. The Dell DL4300 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The Dell DL4300 system supports two 15-pin VGA ports on the front and back panels.

Internal Dual SD Module

The Dell DL4300 system supports one flash memory card slot with the internal SD module.

Video specifications

Video	Specification
Video type	Matrox G200eR2
Video memory	16 MB

Environmental specifications

NOTE: For additional information about environmental measurements for specific system configurations, see Dell.com/environmental_datasheets.

Table 1. Temperature specifications
Temperature	Specifications
Storage	–40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or 3117 ft)	10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment.
Fresh air	For information about fresh air, see Expanded Operating Temperature section.
Maximum temperature gradient (operating and storage)	20°C/h (68°F/h)

Table 2. Relative humidity specifications
Relative humidity	Specifications
Storage	5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be non-condensing at all times.
Operating	10% to 80% relative humidity with 29°C (84.2°F) maximum dew point.

Table 3. Maximum vibration specifications
Maximum vibration	Specifications
Operating	0.26 G _rms at 5 Hz to 350 Hz (all operation orientations).
Storage	1.88 G _rms at 10 Hz to 500 Hz for 15 min (all six sides tested).

Table 4. Maximum shock specifications
Maximum vibration	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axes of 40 G for up to 2.3 ms.
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.

Table 5. Maximum altitude specifications
Maximum altitude	Specifications
Operating	3048 m (10,000 ft)
Storage	12,000 m (39,370 ft)

Table 6. Operating temperature de-rating specifications
Operating temperature de-rating	Specifications
Up to 35°C (95°F)	Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 m (3,117 ft).
35°C to 40°C (95°F to 104°F)	Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 m (3,117 ft).
40°C to 45°C (104°F to 113°F)	Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 m (3,117 ft).

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.

Table 1. Particulate contamination specifications
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and non-data center environments.

Table 2. Gaseous contamination specifications
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate	<200 Å/month as defined by AHSRAE TC9.9.

NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Standard operating temperature

Table 1. Standard operating temperature specifications
Standard operating temperature	Specifications
Continuous operation (for altitude less than 950 m or 3117 ft)	10°C to 35°C (50°F to 95°F) with no direct sunlight on the equipment. NOTE: The 2.5-inch hard drive chassis supports a maximum of 145 W processors.

Expanded operating temperature

Table 1. Expanded operating temperature specifications
Expanded operating temperature	Specifications
Continuous operation	5°C to 40°C at 5% to 85% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate continuously in temperatures as low as 5°C and as high as 40°C. For temperatures between 35°C and 40°C, de-rate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours	–5°C to 45°C at 5% to 90% RH with 29°C dew point. NOTE: Outside the standard operating temperature (10°C to 35°C), the system can operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C and 45°C, de-rate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE: When operating in the expanded temperature range, system performance may be impacted.

NOTE: When operating in the expanded temperature range, ambient temperature warnings maybe reported in the System Event Log.

Expanded operating temperature restrictions

Do not perform a cold startup below 5°C.
The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
160 W or higher wattage processor is not supported.
Redundant power supply units are required.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
The 3.5-inch hard drive chassis supports a maximum of 120 W processor.
The 2.5-inch hard drive chassis supports a maximum of 145 W processor.
Only SSDs are allowed in the hard drive slots at the back of the 3.5-inch hard drive chassis.
Mid drive configurations, eight 3.5-inch and eighteen 1.8-inch SSD configurations are not supported.
GPU is not supported
Tape backup unit (TBU) is not supported.