Technical specifications
| Processor | ||
|---|---|---|
| Intel Xeon E3–1270 v3 (4–core), Intell Xeon E3-1241 v3 (4-core) or Xeon E3–1280 v3 (4–core) | ||
| Expansion Bus | ||
|---|---|---|
| Bus type | PCI Express Generation 3 | |
| Expansion slots using riser card | One half-height, full-length x16 link | |
| Memory | ||
|---|---|---|
| Architecture | 1600 MT/s or 1333 MT/s unbuffered Error Correcting Code (ECC) DIMMs | |
| Memory module sockets | Four 240-pin | |
| Memory module capacities | ||
| UDIMM | 4 GB (single-rank) and 8 GB (dual-rank) | |
| Maximum RAM | 16 GB (non VM model) | |
| 32 GB (VM model) | ||
| Drives | ||
|---|---|---|
| Hard drives |
Up to two 3.5 inch Enterprise Class and Entry Class SATA, SAS, or Nearline SAS hard drives Dell DL1000 1 TB (no VM): 2x 2TB SATA Dell DL1000 2 TB (no VM): 2x 3TB SATA Dell DL1000 3 TB (no VM): 2x 4TB SATA Dell DL1000 3 TB (2 VM): 2x 4TB SATA |
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| Connectors | ||
|---|---|---|
| Back | ||
| NIC | Two 10/100/1000 Mbps | |
| Serial | 9-pin, DTE, 16550-compatible | |
| USB | Two 4-pin, USB 3.0-compliant | |
| Video | 15-pin VGA | |
| Front | ||
| USB | Two 4-pin, USB 2.0-compliant | |
| Video | 15-pin VGA | |
| Internal | ||
| USB | One 4-pin, USB 2.0-compliant | |
| Environmental | ||
|---|---|---|
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| Temperature | ||
| Maximum Temperature Gradient (Operating and Storage) | 10 °C/h (50 °F/h) | |
| Storage Temperature Limits | –40 °C to 65 °C (–40 °F to 149 °F) | |
| Temperature (Continuous Operation) | ||
| Temperature Ranges (for altitude less than 950 m or 3117 ft) | 10 °C to 35 °C (50 °F to 95 °F) with no direct sunlight on the equipment. | |
| Humidity Percentage Range | 10% to 80% Relative Humidity with 29 °C (84.2 °F) maximum dew point. | |
| Relative Humidity | ||
| Storage | 5% to 95% RH with 33 °C (91 °F) maximum dew point. Atmosphere must be non-condensing at all times. | |
| Maximum Vibration | ||
| Operating | 0.26 G rms at 5 Hz to 350 Hz for 15 minutes (all operation orientations). | |
| Storage | 1.88 G rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested). | |
| Maximum Shock | ||
| Operating | One shock pulse (one pulse each side of the system) of 31 G for 2.6 ms in the operational orientation. | |
| Storage |
Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms. Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 32 G faired square wave pulse with velocity change at 270 inches/second (686 centimeters/second). |
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| Maximum Altitude | ||
| Operating |
3048 m (10,000 |
|
| Storage | 12,000 m (39,370 ft). | |
| Operating Altitude De-rating | ||
| ≤ 35 °C (95 °F) | Maximum temperature is reduced by 1 °C/300 m (1 °F/547 ft) above 950 m (3,117 ft). | |
Particulate
Contamination
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| Air Filtration |
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Data center air filtration as defined
by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
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| Conductive Dust |
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| Air must be free of conductive dust, zinc whiskers, or other conductive particles. | ||
| Corrosive Dust |
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| Gaseous Contamination | ||
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| Copper Coupon Corrosion Rate | <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985. | |
| Silver Coupon Corrosion Rate | <200 Å/month as defined by AHSRAE TC9.9. | |




























