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Dell PowerEdge HS5620: руководство по обслуживанию
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Dell PowerEdge HS5620: руководство по обслуживанию

Chassis dimensions

Figure 1. Chassis dimensions

The image shows system dimensions.

Table 1. PowerEdgeHS5620 chassis dimensionsThis table provides the dimensions of the system:
Xa Xb Y Za Zb Zc
482.0 mm (18.97 inches) 434.0 mm (17.08 inches) 86.8 mm (3.41 inches) 22.0 mm (0.86 inches) Without bezel

35.84 mm (1.41 inches) With bezel

677.44 mm (26.67 inches) Ear to L bracket housing

650.24 mm (25.6 inches) Ear to PSU surface

685.78 mm (26.99 inches) Ear to PSU handle without velcro strap
NOTE:Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight

Table 1. PowerEdge HS5620 systemweightThe table below shows the maximum weight of the chassis
System configuration Maximum weight (with all drives/SSDs/bezel)
16+8 x 2.5-inch 25.92 kg (57.14 lb)
12 x 3.5-inch 28.82 kg (63.53 lb)
8 x 3.5-inch 25.84 kg (54.96 lb)
8 x 2.5-inch 21.56 kg (47.53 lb)
No backplane configuration 19.40 kg (42.76 lb)

Processor specifications

Table 1. PowerEdge HS5620 processor specifications This table provides processor specifications for the system.
Supported processor Number of processors supported
5th Generation Intel Xeon Scalable processors with up to 32 cores Up to two
and 4th Generation Intel Xeon Scalable processors with up to 32 cores

PSU specifications

The PowerEdgeHS5620system supports up to two AC or DC power supply units (PSUs).

Table 1. PSU specifications This table describes PSU specifications for the system.
PSU Class Heat dissipation (maximum) (BTU/hr) Frequency (Hz) AC Voltage DC Voltage Current (A)
100–120 V 200–240 V 277 V 240 V 336 V - (48 V — 60 V)
700 W mixed mode HLAC Titanium 2625 50/60 N/A 700 W N/A N/A N/A N/A 4.1 A
N/A N/A N/A N/A N/A 700 W N/A N/A 3.4 A
800 W mixed mode Platinum 3000 50/60 800 W 800 W N/A N/A N/A N/A 9.2 A - 4.7 A
N/A N/A N/A N/A N/A 800 W N/A N/A 3.8 A
1100 W -48 V DC N/A 4265 N/A N/A N/A N/A N/A N/A 1100 W 27 A
1100 W mixed mode Titanium 4125 50/60 1050 W 1100 W N/A N/A N/A N/A 12 A - 6.3 A
N/A N/A N/A N/A N/A 1100 W N/A N/A 5.2 A
1400 W mixed mode Titanium 5250 50/60 1050 W 1400 W N/A N/A N/A N/A 12 A - 8 A
N/A N/A N/A N/A N/A 1400 W N/A N/A 6.5 A
1400 W mixed mode Platinum 5250 50/60 1050 W 1400 W N/A N/A N/A N/A 12 A - 8 A
N/A N/A N/A N/A N/A 1400 W N/A N/A 6.6 A
1400 W 277 V AC and HVDC Titanium 5250 50/60 N/A N/A 1400 W N/A N/A N/A 5.8 A
5250 N/A N/A N/A N/A N/A 1400 W N/A 5.17 A
1800 W mixed mode HLAC Titanium 6610 50/60 N/A 1800 W N/A N/A N/A N/A 10 A
N/A N/A N/A N/A N/A 1800 W N/A N/A 8.2 A
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:HLAC stands for High-Line AC, with a range of 200 - 240 V AC. HVDC stands for High-Voltage DC, with 336 V DC.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Enterprise Infrastructure Planning Tool available at calc.
Figure 1. PSU power cords
this image shows list of PSU power cords
Figure 2. APP 2006G1 power cord

This image shows APP 2006G1power cord.

Figure 3. Lotes DC PSU connector

This images shows Lotes DC PSU connector

Table 2. PSU power cordsThe table lists the PSU power cords list .
Form factor Output Power cord
Redundant 60 mm 700 W Mixed Mode HLAC C13
800 W Mixed Mode C13
1100 W Mixed Mode C13
1100 W -48 V DC Lotes DC PSU connector
1400 W Mixed Mode C13
1400 W 277 VAC and 336 VDC APP 2006G1
1800 W Mixed Mode HLAC C15
NOTE:C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

Supported operating systems

The PowerEdge HS5620 system supports the following operating systems:

  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware vSAN/ESXi

For more information, go to Operating System Manuals.

Cooling fan specifications

Cooling fan specifications

The PowerEdgeHS5620 system supports up to six Standard (STD) fans , High performance (HPR) gold fans , or Very high performance fans.

Table 1. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
Standard fan STD STD No label This shows the Standard fan image.
High-performance fan (Silver grade) fanHPR SLVR HPR Silver
NOTE:New cooling fans come with the High-Performance Silver Grade label. While the older cooling fans have the High-Performance label.
Figure 1. High performance fan
This image shows High Performance fan
Figure 2. High performance (Silver grade) fan
This image shows High performance fan - Silver Grade
High-performance fan (Gold grade) fanHPR GOLD VHPR - Very High Performance Gold
NOTE:New cooling fans come with the High-Performance Gold Grade label. While the older cooling fans have the High-Performance label.
Figure 3. Very high performance fan
This image shows Very High performance fan
Figure 4. High performance (Gold grade) fan
This image shows Very High Performance fan - Gold Grade

System battery specifications

The PowerEdge HS5620 system uses one CR 2032 3.0-V lithium coin cell battery.

Expansion card riser specifications

The PowerEdge HS5620 system supports up to four PCIe Gen5 cards on the system board.
Table 1. Expansion card slots supported on the system boardThis table provides information about the expansion card slots that are supported on the system.
Slot no Card support CPU1 CPU2
R1C R1D Integrated Integrated R1C
PCIe Slot-1 SW-HL-LP N/A N/A x16 N/A N/A
PCIe Slot-2 SW-HL-LP N/A N/A x8 N/A N/A
PCIe Slot-3 SW-HL-LP x16 (Gen5) x8 (Gen5) N/A N/A N/A
PCIe Slot-4 SW-HL-LP N/A x8 (Gen5) N/A N/A x16 (Gen5)
PCIe Slot-5 SW-HL-LP N/A N/A N/A x16 N/A
PCIe Slot-6 SW-HL-LP N/A N/A N/A x16 N/A
Table 2. Label referenceThis table describes the label references used in the expansion table.
Label Description
SW Single Width
DW Double Wide (Xilinx FPGA accelerator)
FH Full height
HL Half length

Memory specifications

The PowerEdge HS5620 system supports the following memory specifications for optimized operation.
Table 1. Memory specifications for 4th Generation Intel Xeon Scalable Processors The table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum memory capacity Maximum memory capacity Minimum memory capacity Maximum memory capacity
RDIMM Single rank 16 GB 16 GB 128 GB 32 GB 256 GB
Dual rank 32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB
Quad rank 128 GB 128 GB 1 TB 256 GB 2 TB
Table 2. Memory module sockets or 4th Generation Intel Xeon Scalable Processors The table below shows the memory module sockets for the system:
Memory module sockets Speed
16, 288-pin 4000 MT/s, 4400 MT/s, 4800 MT/s
Table 3. Memory specifications for 5th Generation Intel Xeon Scalable Processors The table below shows the memory specifications:
DIMM type DIMM rank DIMM capacity Single processor Dual processors
Minimum memory capacity Maximum memory capacity Minimum memory capacity Maximum memory capacity
RDIMM Single rank 16 GB 16 GB 128 GB 32 GB 256 GB
Dual rank 32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1 TB
96 GB 96 GB 768 GB 192 GB 1.5 TB
Quad rank 128 GB 128 GB 1 TB 256 GB 2 TB
Table 4. Memory module sockets for 5th Generation Intel Xeon Scalable ProcessorsThe table below shows the memory module sockets for the system:
Memory module sockets Speed
16, 288-pin 4000 MT/s, 4400 MT/s, 4800 MT/s, 5200 MT/s, 5600 MT/s
NOTE:Memory DIMM slots are not hot pluggable.
NOTE:The speed of the rated DIMM may reduce depending on the processor installed.

Storage controller specifications

The PowerEdge HS5620 system supports the following controller cards:
Table 1. Storage controller cards This table provides the controller cards supported on the system:
Supported storage controller cards
Internal controllers
  • PERC H755N
  • PERC H755
  • PERC H355
  • HBA355i
  • HBA465i
External controllers
  • HBA355E adapter
  • HBA965e
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 1, 2 x M.2 SSDs
  • USB
Software RAID
  • S160

Drives

The PowerEdge HS5620 system supports:
  • 8 x 3.5-inch SAS/SATA drives
  • 12 x 3.5-inch SAS/SATA drives
  • 8 x 2.5-inch SAS/SATA (HDD/SSD) drives
  • 8 x 2.5-inch NVMe drives
  • 16 x 2.5-inch SAS/SATA (HDD/SSD) drives + 8 x 2.5-inch NVMe drives
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support page >Browse all Products > Data Center Infrastructure >  Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

USB ports specifications

Table 1. PowerEdge HS5620 USB specifications The following table shows the USB specifications :
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 2.0-compliant port One Internal USB 3.0-compliant port One
iDRAC Direct port (Micro-AB USB 2.0- compliant port) One USB 3.0-compliant port One
NOTE:The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
NOTE:The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.
NOTE:The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

Serial connector specifications

The PowerEdge HS5620 system supports one serial port on the system board, which is Data Terminal Equipment (DTE), 16550-compliant .

The serial connector is installed as default on the system board.

NIC port specifications

The PowerEdge HS5620 supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.
Table 1. NIC port specification for the systemThis table describes the NIC port specification for the system.
Feature Specifications
LOM 1 GB x 2
OCP card (OCP 3.0) (optional) 1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4

VGA ports specifications

The PowerEdge HS5620 system supports two DB-15 VGA ports, one each on the front and rear panels of the system.

Video specifications

The PowerEdge HS5620 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 1. Supported video resolution options for the systemThis table describes the supported front video resolution options for the system.
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, see the Product Environmental Datasheet that are located with the Documentation on Dell Support page.
Table 1. Continuous Operation Specifications for ASHRAE A2 This table describes the operational climatic range for category A2.
Temperature, humidity and, operational altitude Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C (10.4°F) minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude derating Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
Table 2. Continuous Operation Specifications for ASHRAE A3 This table describes the operational climatic range for category A3.
Temperature, humidity and, operational altitude Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C (10.4°F) minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point
Operational altitude derating Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)
Table 3. Continuous Operation Specifications for ASHRAE A4 This table describes the operational climatic range for category A4.
Temperature, humidity and, operational altitude Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude derating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
Table 4. Continuous Operation Specifications for Rugged Environment This table describes the operational climatic range for category A4.
Temperature, humidity and, operational altitude Allowable continuous operations
Temperature range for altitudes <= 900 m (<= 2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent range (non-condensing at all times) 8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C (75.2°F) maximum dew point
Operational altitude derating Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
Table 5. Common Environmental Specifications for ASHRAE A2, A3, A4, and Rugged This table describes the shared requirements across all categories.
Temperature, humidity and, operational altitude Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE:* - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits -40°C to 65°C (-104°F to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 6. Maximum vibration specificationsThe maximum vibration specification of an operational system is 0.26 Grms at 5 Hz to 350 Hz (all operation orientations). The maximum vibration specification of a nonoperational system is 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested).
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 7. Maximum shock pulse specificationsThe maximum shock specification of an operational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis of 40 G for up to 2.3 ms. The maximum shock specification of a nonoperational system is six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Maximum shock pulse Specifications
Operating Six consecutively performed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms.
Storage Six consecutively performed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.
Table 8. Particulate and gaseous contamination specifications This table shows particulate and gaseous contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
NOTE:The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust zinc whiskers, or other conductive particles.
NOTE: This condition applies to data center and non-data center environments.
Corrosive dust

Air must be free of corrosive dust.

Residual dust present in the air must have a deliquescent point less than 60% relative humidity.

NOTE:This condition applies to data center and non-data center environments.
Table 9. Gaseous contamination specificationsThis table shows gaseous contamination specifications
Gaseous contamination Specification
Copper coupon corrosion rate <300A/month per class G1 as defines by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200A/month as defined by ANSI/ISA71.04-2013

Thermal restriction matrix

Table 1. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Processor TDP
STD HSK < 185 W CPU SKUs
HPR HSK 185 W-250 W CPU SKUs (12 x 3.5-inch drive configuration not supported)
125W-250W CPU SKUs (12 x 3.5-inch drive configuration supported)
Table 2. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HPR (Silver) High Performance Silver (HPR) fan
HPR (Gold) High Performance Gold (VHP) fan
HSK Heat sink
NOTE:The ambient temperature of the configuration is determined by the critical component in that configuration. For example, if the processor's supported ambient temperature is 35°C, the DIMM is 35°C, and the GPU is 30°C, the combined configuration can only support 30°C.
Table 3. Supported ambient temperature for processors for HS5620 with iDRACThis table shows supported ambient temperature for processors for HS5620 with iDRAC.
HS5620
configuration No backplane 8 x 3.5-inch SAS configuration 12 x 3.5-inch SAS configuration 12 x 3.5-inch configuration with rear drive module 8 x 2.5-inch SAS configuration 8 x 2.5-inch NVMe configuration 16 x 2.5-inch SAS configuration 16 x 2.5-inch + 8 x 2.5-inch NVMe configuration
EMR MCC CPU 4514Y 150 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
5512U 185 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
6526Y/6534 195 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6548+/6542Y/6548N 250 W 35°C 35°C 30°C 30°C 35°C 35°C 35°C 35°C
SPR LCC CPU 4509Y 125W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
4510 150 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
SPR MCC CPU 3408U 125 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
4410Y/5415+ 150 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
4416+ 165 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
5418Y/5412U/6426Y 185 W 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
6438M/5420+/6434/6438Y+ 205 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6448Y/6442Y 225 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6414U/6444Y 11 250 W 35°C 35°C 30°C 30°C 35°C 35°C 35°C 35°C
Memory 128 GB RDIMM 5200 9 W, 1DPC 35°C 35°C 30°C 30°C 35°C 35°C 35°C 35°C
96 GB RDIMM 5200 8.1 W, 1DPC 35°C 35°C 30°C 30°C 35°C 35°C 35°C 35°C
64 GB RDIMM 5200 7.7 W, 1DPC 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
32 GB RDIMM 5200 5.1 W, 1DPC 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
128 GB RDIMM 4800 14.2 W, 1DPC 35°C 35°C 30°C 30°C 35°C 35°C 35°C 35°C
64 GB RDIMM 4800 12 W, 1DPC 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
32 GB RDIMM 4800 10 W, 1DPC 45°C 40°C 35°C 35°C 40°C 40°C 40°C 40°C
PCIe 45°C 40°C 35°C1 35°C1 40°C 40°C 40°C 40°C
A2 GPU6 35°C 30°C Not supported Not supported 35°C 35°C 30°C 30°C
OCP 45°C 40°C 35°C2 35°C2 40°C 40°C 40°C 40°C
BOSS 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
NOTE:
  1. Max supported thermal tier of PCIe card is Tier 5.
  2. Max supported thermal tier of OCP is Tier 5.
  3. HPR Sliver fan is required from fan zone 2 to fan zone 6 for 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA + 8 x 2.5-inch NVMe, 12 x 3.5-inch drives or GPU configurations.
  4. Optional fan zone 1 has to be populated with HPR Gold fan is for BOSS, GPU or rear drive module populations.
  5. PCIe slot priority of Nvidia A2 GPU is constrained on slot #3, #4, #6.
  6. HPR heatsink is required for ≥ 185 W CPUs, 12 x 3.5-inch drives or 12 x 3.5-inch drives with rear storage module configurations.
  7. DIMM blank is required for 12 x 3.5-inch SAS/SATA with rear storage module.
  8. Fan blank is required on fan zone 1 when no fan population.
  9. OCP shroud is required for OCP card population without PCIe riser module installed.
  10. CPU blank is required for single processor configuration.
  11. Due to HW limitation, 6444Y is clamped to 250 W.
  12. Rear drive module does not support Kioxia CM6 series, Samsung PM1735 series, Hynix PE8010/PE8110 ≥ 7.68 TB, Samsung PM1733a > 1.92 TB, Samsung PM1735a > 1.6 TB and Redtail NVMe drive.
NOTE: The fan speed in the 3.5-inch chassis is limited to 90% due to the drive dynamic profile.
Table 4. Supported ambient temperature for processors for HS5620 with Open Server Manager (OSM)This table shows supported ambient temperature for processors for HS5620 with OSM.
HS5620
configuration No backplane 8 x 3.5-inch SAS configuration 12 x 3.5-inch SAS configuration 12 x 3.5-inch configuration with rear drive module 8 x 2.5-inch SAS configuration 8 x 2.5-inch NVMe configuration 16 x 2.5-inch SAS configuration 24 x 2.5-inch (16 x 2.5-inch + 8 x 2.5-inch NVMe configuration)
SPR MCC CPU 3408U 125 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
4410Y/5415+ 150 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
4416+ 165 W 35°C 35°C Not Supported Not Supported 35°C 35°C 35°C 35°C
5418Y/5412U/6426Y 185 W 35°C 35°C Not Supported Not Supported 35°C 35°C 35°C 35°C
6438M/5420+/6434/6438Y+ 205 W 35°C Not Supported Not Supported Not Supported 35°C 35°C 35°C 35°C
6448Y/6442Y 225 W 35°C Not Supported Not Supported Not Supported 35°C 35°C Not Supported 35°C
6414U / 6444Y 15 250 W 35°C Not Supported Not Supported Not Supported Not Supported 35°C Not Supported Not Supported
Memory 128 GB RDIMM 4800 14.2 W, 1DPC 35°C Not Supported Not Supported Not Supported Not Supported 35°C Not Supported Not Supported
64 GB RDIMM 4800 12 W, 1DPC 35°C 35°C Not Supported Not Supported 35°C 35°C 35°C 35°C
32 GB RDIMM 4800 10 W, 1DPC 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
PCIe 35°C 35°C 2 35°C 1 35°C 1 35°C 2 35°C 35°C 2 35°C 2
A2 GPU6 35°C Not Supported Not Supported Not Supported 35°C 35°C Not Supported Not Supported
OCP 35°C 35°C 4 35°C 3 35°C 3 35°C 4 35°C 35°C 4 35°C 4
BOSS 35°C 35°C 35°C 3 35°C 3 35°C 35°C 35°C 35°C
NOTE:
  1. Max supported thermal tier of PCIe card is Tier 3.
  2. Max supported thermal tier of OCP is Tier 5.
  3. Max supported thermal tier of OCP is Tier 2.
  4. Max supported thermal tier of OCP is Tier 5.
  5. ≥ 960 GB M.2 SSDs are not supported in 12 x 3.5-inch drive configuration.
  6. Only support the optical transceiver with thermal spec. 85°C for network adapter and OCP card.
  7. PERC adapter with BBU is not supported in 3.5-inch drive configurations.
  8. Six fans population is required and fan zone 1 is dedicated to install HPR Gold fan.
  9. HPR Silver fan on fan zone 2 to fan zone 6 is required for front NVMe drives population or 12 x 3.5-inch drive configuration.
  10. HPR Silver fan on fan zone 2 to fan zone 6 is required for GPU population and PCIe slot priority of Nvidia A2 GPU is constrained on slot #3, #4, #6.
  11. HPR heatsink is required for ≥ 185 W CPUs or 12 x 3.5-inch SAS/SATA or 12 x 3.5-inch SAS/SATA with rear storage modules.
  12. DIMM blank is required for 12 x 3.5-inch SAS/SATA and 12 x 3.5-inch SAS/SATA with rear storage modules.
  13. OCP shroud is required for OCP card population without PCIe riser module installed.
  14. CPU blank is required for single processor configuration.
  15. Due to HW limitation, 6444Y is clamped to 250 W.
  16. Rear drive module does not support Kioxia CM6 series, Samsung PM1735 series, Hynix PE8010/PE8110 ≥ 7.68 TB, Samsung PM1733a > 1.92 TB, Samsung PM1735a > 1.6 TB and Redtail NVMe drive.
Table 5. Fan population rule for HS5620This table shows fan population rule for HS5620.
configuration No backplane 8 x 3.5-inch SAS 12 x 3.5-inch SAS 8 x 2.5-inch SAS 8 x 2.5-inch NVMe 24 x 2.5-inch (16 x 2.5-inch + 8 x 2.5-inch NVMe)
Optional HW
Default Fan 2 to Fan 6 with STD fan Fan 2 to Fan 6 with STD fan Fan 2 to Fan 6 with HPR Silver fan Fan 2 to Fan 6 with STD fan Fan 2 to Fan 6 with HPR Silver fan Fan 2 to Fan 6 with HPR Silver fan
Rear Module Not supported Not supported

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

 Not supported Not supported Not supported
BOSS N1

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with STD fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with STD fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with STD fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan
GPU

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan
Table 6. Fan population rule for HS5620 with Open Server Manager (OSM)This table shows fan population rule for HS5620 with Open Server Manager (OSM).
configuration No backplane 8 x 3.5-inch SAS 12 x 3.5-inch SAS 8 x 2.5-inch SAS 8 x 2.5-inch NVMe 24 x 2.5-inch (16 x 2.5-inch + 8 x 2.5-inch NVMe)
Optional HW
Default

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with STD fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with STD fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with STD fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan
Rear Module Not supported Not supported

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

 Not supported Not supported Not supported
BOSS N1

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with STD fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with STD fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with STD fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan
GPU

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

 Not supported

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

Fan 1 with HPR Gold fan

Fan 2 to Fan 6 with HPR Silver fan

 Not supported

Thermal restrictions for PCIe adapter card and others with Open Server Manager (OSM)

  • Cannot support PCIe adapter with the cooling requirement more than 200 LFM at 55C in a 3.5-inch drives configuration.
  • Cannot support PCIe adapter with the cooling requirement more than 300 LFM at 55C in a 2.5-inch drives configuration.
  • Cannot support OCP card with the cooling requirement more than 250 LFM at 55C in a 2.5-inch drives configuration.
  • Only support the optical transceiver with higher temperature spec (≥ 85°C) (M14MK / N8TDR).
  • The rear PERC adapter with BBU is not supported in 12 x 3.5-inch drive configuration.

Thermal Restrictions for PCIe adapter NIC and other network cards with iDRAC

  • Cannot support PCIe cards with the cooling requirement more than 300LFM at 55C in a 12 x 3.5-inch SAS/SATA configuration.
  • Solarflare Melrose DP 25 GBE SFP28 (TTKWY) not supported with 12 x 3.5-inch SAS/SATA configuration.
  • 100 Gb network adapter or 100 Gb OCP is not supported in the 12 x 3.5-inch SAS/SATA configuration.
  • Few 25 GB OCP cards with the cooling requirement more than 250LFM at 55C (3Y64D/4TRD3 / GGGDF/R1KTR / Y4VV5) is not supported in 12x3.5" SAS/SATA configuration.
  • The 12 x 3.5-inch SAS/SATA configuration requires the optical transceiver with higher temperature spec (≥ 85°C) to support (M14MK / N8TDR).
  • Quad port OCP (3Y64D/Y4VV5) requires the optical transceiver with higher temperature spec (≥ 85°C) to support (M14MK).
  • 100 Gb network adapter cannot support the transceivers as 14NV5 / 9JKK2 / QSFP56 (MFS1S00-VxxxE/HxxxE).
  • The h965e is limited to populate in PCI slot 3 in a 12 x 3.5-inch SAS/SATA configuration.
  • Mellanox CX7 NDR200 card has few limitations of PCI slot locations.
    Table 7. Mellanox CX7 NDR200 slot location limitationsThis table shows Mellanox CX7 NDR200 slot location limitations.
    Storage configuration Slots on 3.5-inch configuration Slots on 2.5-inch configuration
    Gen5 PCIe sloit support for CX7 NDR200 3, 4 3, 4
    Gen4 PCIe sloit support for CX7 NDR200 6 5, 6

Thermal restrictions for extended ambient support (ASHRAE A3/A4)

  • Two PSUs are required in redundant mode. Single PSU failure is not supported.
  • 12 x 3.5-inch SAS/SATA configuration is not supported.
  • BOSS(M.2) module is not supported.
  • CPU TDP > 185 W is not supported.
  • PCIe card TDP > 25 W is not supported.
  • OCP cards with transmission rate higher than 25 GB is not supported.
  • OCP transceiver spec ≤ 75°C is not supported.
  • 8 x 3.5-inch SAS/SATA, 8 x 2.5-inch SAS/SATA, 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA, 16 x 2.5-inch SAS/SATA + 8x 2.5-inch NVMe configurations are limited to support A3.
  • .
  • The rear drive is not supported.

Thermal air restrictions

Table 1. Air cooling configurations thermal restriction for AHSRAE A3 and A4This table provides information about ASHRAE A3 and A4 restrictions for air cooling configuration.
ASHRAE A3/40°C (104°F) A4/45°C (113°F)
PSU Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe card Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
Processor CPU TDP > 185W is not supported
Front storage 12 x 3.5-inch SAS/SATA config is not supported 12 x 3.5-inch SAS/SATA configuration is not supported
8 x 3.5-inch SAS/SATA, 8 x 2.5-inch SAS/SATA, 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA, 16 x 2.5-inch SAS/SATA+ 8 x 2.5-inch NVMe configs are limited in A3 0 drive configuration is supported
Rear storage Not supported
OCP OCP card with transmission rate higher than 25G is not supported
OCP transceiver spec ≤ 75C is not supported
BOSS Not supported